Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

NZH series Single Zener diodes Rev. 01 — 27 January 2010 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted Device(SMD) plastic package. 1.2 Features (cid:132) Total power dissipation: ≤500mW (cid:132) Small plastic package suitable for surface-mounted design (cid:132) Wide working voltage range (cid:132) Low differential resistance 1.3 Applications (cid:132) General regulation functions 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V forward voltage I =10mA [1] - - 0.9 V F F P total power dissipation T ≤25°C [2] - - 500 mW tot amb [3] - - 1 W [1] Pulse test: tp≤300μs; δ≤0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1cm2. [3] Device mounted on a ceramicPCB, Al O , standard footprint. 2 3

NZH series NXP Semiconductors Single Zener diodes 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 cathode [1] 2 anode 1 2 1 2 006aaa152 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version NZH3V0B to - plastic surface-mounted package; 2leads SOD123F NZH30C[1] [1] The series consists of 25types with nominal working voltages from 3.0V to 30V. 4. Marking Table 4. Marking codes Type number Marking code Type number Marking code NZH3V0B CH NZH10C CW NZH3V3A CJ NZH11C CX NZH3V6B CK NZH12B CY NZH3V9B CL NZH13B D9 NZH4V3B CM NZH15B D1 NZH4V7B CN NZH16C D2 NZH5V1B CP NZH18C D3 NZH5V6B CQ NZH20C D4 NZH6V2B CR NZH22C D5 NZH6V8B CS NZH24C D6 NZH7V5C CT NZH27C D7 NZH8V2B CU NZH30C DA NZH9V1B CV - - NZH_SER_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 January 2010 2 of 9

NZH series NXP Semiconductors Single Zener diodes 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit I forward current - 250 mA F P total power dissipation T ≤25°C [1] - 500 mW tot amb [2] - 1 W T junction temperature - 150 °C j T ambient temperature −55 +150 °C amb T storage temperature −65 +150 °C stg [1] Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2. [2] Device mounted on a ceramicPCB, Al O , standard footprint. 2 3 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance from in free air [1] - - 250 K/W th(j-a) junction to ambient [2] - - 125 K/W R thermal resistance from [3] - - 70 K/W th(j-sp) junction to solder point [1] Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2. [2] Device mounted on a ceramicPCB, Al O , standard footprint. 2 3 [3] Soldering point of cathode tab. 7. Characteristics Table 7. Characteristics T =25°C unless otherwise specified. j Symbol Parameter Conditions Min Typ Max Unit V forward voltage I =10mA [1] - - 0.9 V F F [1] Pulse test: tp≤300μs; δ≤0.02. Table 8. Characteristics per type; NZH3V0B to NZH10C T =25°C unless otherwise specified. j NZHxxx Working voltage Maximum differential Reverse current Diode V (V); resistance I (μA) capacitance Z R I =20mA r (Ω) C (pF)[1] Z dif d Min Max I =1mA I =20mA Max V (V) Max Z Z R 3V0B 2.85 3.15 1000 80 50 1 450 3V3A 3.16 3.38 1000 70 20 1 450 3V6B 3.42 3.78 1000 60 5 1 450 3V9B 3.71 4.10 1000 50 5 1 450 NZH_SER_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 January 2010 3 of 9

NZH series NXP Semiconductors Single Zener diodes Table 8. Characteristics per type; NZH3V0B to NZH10C …continued T =25°C unless otherwise specified. j NZHxxx Working voltage Maximum differential Reverse current Diode V (V); resistance I (μA) capacitance Z R I =20mA r (Ω) C (pF)[1] Z dif d Min Max I =1mA I =20mA Max V (V) Max Z Z R 4V3B 4.17 4.43 1000 40 5 1 450 4V7B 4.55 4.80 900 25 5 1 300 5V1B 4.94 5.20 800 20 5 1.5 300 5V6B 5.45 5.73 500 13 5 2.5 300 6V2B 5.96 6.27 300 10 5 3 200 6V8B 6.49 6.83 150 8 2 3.5 200 7V5C 7.29 7.67 120 8 0.5 4 150 8V2B 8.02 8.36 120 8 0.5 5 150 9V1B 8.85 9.23 120 8 0.5 6 150 10C 9.70 10.20 120 8 0.2 7 90 [1] f=1MHz; V =0V R Table 9. Characteristics per type; NZH11C to NZH20C T =25°C unless otherwise specified. j NZHxxx Working voltage Maximum differential Reverse current Diode V (V); resistance I (μA) capacitance Z R I =10mA r (Ω) C (pF)[1] Z dif d Min Max I =1mA I =10mA Max V (V) Max Z Z R 11C 10.82 11.38 120 10 0.04 8 85 12B 11.44 12.03 110 12 0.04 9 85 13B 12.35 13.65 110 14 0.04 10 80 15B 14.25 15.75 110 16 0.04 11 75 16C 15.69 16.51 150 18 0.04 12 75 18C 17.42 18.33 150 23 0.04 13 70 20C 19.23 20.22 200 28 0.04 15 60 [1] f=1MHz; V =0V R Table 10. Characteristics per type; NZH22C to NZH30C T =25°C unless otherwise specified. j NZHxxx Working voltage Maximum differential Reverse current Diode V (V); resistance I (μA) capacitance Z R I =5mA r (Ω) C (pF)[1] Z dif d Min Max I =1mA I =5mA Max V (V) Max Z Z R 22C 21.08 22.17 200 30 0.04 17 60 24C 23.12 24.31 200 35 0.04 19 55 27C 25.63 26.95 250 45 0.04 21 50 30C 28.50 31.50 250 55 0.04 23 50 [1] f=1MHz; V =0V R NZH_SER_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 January 2010 4 of 9

NZH series NXP Semiconductors Single Zener diodes mbg781 300 IF (mA) 200 100 0 0.6 0.8 1 VF (V) Tj=25°C Fig 1. Forward current as a function of forward voltage; typical values 006aac010 006aac011 50 30 IZ VZ(nom) (V) = 3.0 IZ (mA) (mA) 3.3 25 40 3.6 3.9 5.1 6.2 7.5 9.1 20 30 VZ(nom) (V) = 12 13 15 16 5.6 6.8 8.2 15 20 10 10 5 0 0 0 2 4 6 8 10 7.5 10.0 12.5 15.0 17.5 VZ (V) VZ (V) Tj=25°C Tj=25°C Fig 2. Working current as a function of working Fig 3. Working current as a function of working voltage; typical values voltage; typical values NZH_SER_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 January 2010 5 of 9

NZH series NXP Semiconductors Single Zener diodes 8. Package outline 1.7 1.2 1.5 1.0 1 0.55 0.35 3.6 2.7 3.4 2.5 2 0.70 0.25 0.55 0.10 Dimensions in mm 04-11-29 Fig 4. Package outline SOD123F 9. Packing information Table 11. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 NZH3V0B to SOD123F 4mm pitch, 8mm tape and reel -115 -135 NZH30C[2] [1] For further information and the availability of packing methods, see Section13. [2] The series consists of 25types with nominal working voltages from 3.0V to 30V. 10. Soldering 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 5. Reflow soldering footprint SOD123F NZH_SER_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 January 2010 6 of 9

NZH series NXP Semiconductors Single Zener diodes 11. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes NZH_SER_1 20100127 Product data sheet - - NZH_SER_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 January 2010 7 of 9

NZH series NXP Semiconductors Single Zener diodes 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 12.2 Definitions damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in Applications — Applications that are described herein for any of these modifications or additions. NXP Semiconductors does not give any products are for illustrative purposes only. NXP Semiconductors makes no representations or warranties as to the accuracy or completeness of representation or warranty that such applications will be suitable for the information included herein and shall have no liability for the consequences of specified use without further testing or modification. use of such information. Limiting values — Stress above one or more limiting values (as defined in Short data sheet — A short data sheet is an extract from a full data sheet the Absolute Maximum Ratings System of IEC60134) may cause permanent with the same product type number(s) and title. A short data sheet is intended damage to the device. Limiting values are stress ratings only and operation of for quick reference only and should not be relied upon to contain detailed and the device at these or any other conditions above those given in the full information. For detailed and full information see the relevant full data Characteristics sections of this document is not implied. Exposure to limiting sheet, which is available on request via the local NXP Semiconductors sales values for extended periods may affect device reliability. office. In case of any inconsistency or conflict with the short data sheet, the Terms and conditions of sale — NXP Semiconductors products are sold full data sheet shall prevail. subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, 12.3 Disclaimers intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such General — Information in this document is believed to be accurate and terms and conditions, the latter will prevail. reliable. However, NXP Semiconductors does not give any representations or No offer to sell or license — Nothing in this document may be interpreted or warranties, expressed or implied, as to the accuracy or completeness of such construed as an offer to sell products that is open for acceptance or the grant, information and shall have no liability for the consequences of use of such conveyance or implication of any license under any copyrights, patents or information. other industrial or intellectual property rights. Right to make changes — NXP Semiconductors reserves the right to make Export control — This document as well as the item(s) described herein changes to information published in this document, including without may be subject to export control regulations. Export might require a prior limitation specifications and product descriptions, at any time and without authorization from national authorities. notice. This document supersedes and replaces all information supplied prior to the publication hereof. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this Suitability for use — NXP Semiconductors products are not designed, document, and as such is not complete, exhaustive or legally binding. authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected 12.4 Trademarks to result in personal injury, death or severe property or environmental Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NZH_SER_1 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 27 January 2010 8 of 9

NZH series NXP Semiconductors Single Zener diodes 14. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information . . . . . . . . . . . . . . . . . . . . . 6 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Contact information. . . . . . . . . . . . . . . . . . . . . . 8 14 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 27 January 2010 Document identifier: NZH_SER_1