NZF220DFT1G, SNZF220DFT1G EMI Filter with ESD Protection Features http://onsemi.com • 2 EMI/RFI Bi−directional “Pi” Low−Pass Filters • ESD Protection Meets IEC61000−4−2 • CIRCUIT DESCRIPTION Diode Capacitance: 7 − 10 pF • Zener/Resistor Line Capacitance: 22 ±20% pF Pin 4 Pin 5 • Low Zener Diode Leakage: 1 (cid:2)A Maximum • Zener Breakdown Voltage; 6 − 8 V • AEC−Q101 Qualified and PPAP Capable − SNZF220DFT1G • S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements • These are Pb−Free Devices Pin 3 Pin 2 Pin 1 Benefits (GND) • Designed to suppress EMI/RFI Noise in Systems Subjected to Electromagnetic Interference • Nominal Cutoff Frequency of 220 MHz (per Figure 2) • SC−88A Small Package Size Minimizes Parasitic Inductance, Thus a More DF SUFFIX “Ideal” Low Pass Filtering Response CASE 419A Typical Applications • Cellular Phones • Communication Systems MARKING DIAGRAM • Computers 5 4 • Portable Products with Input/Output Conductors FA D (cid:2) MAXIMUM RATINGS Rating Symbol Value Unit 1 2 3 Peak Power Dissipation (Note 1) PPK 14 W 8 × 20 (cid:2)s Pulse FA= Specific Device Code D = Date Code Maximum Junction Temperature TJ 150 °C (cid:2) = Pb−Free Package Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not ORDERING INFORMATION normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Device Package Shipping† 1. Between I/O Pins NZF220DFT1G SC−88A 3000 / Tape & (Pb−Free) Reel SNZF220DFT1G SC−88A 3000 / Tape & (Pb−Free) Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 1 Publication Order Number: November, 2011 − Rev. 9 NZF220DFT1/D

NZF220DFT1G, SNZF220DFT1G ELECTRICAL CHARACTERISTICS Symbol Characteristic Min Typ Max Unit VZ Zener Breakdown Voltage, @ IZT = 1 mA 6.0 − 8.0 V Ir Zener Leakage Current, @ VR = 3 V N/A − 1.0 (cid:2)A VF Zener Forward Voltage, @ IF = 50 mA N/A − 1.5 V Capacitance Zener Internal Capacitance, @ 0 V Bias 7.0 − 10 pF Capacitance Zener/Resistor Array Line Capacitance 17.6 − 26.4 pF Resistor Resistance 90 − 110 (cid:3) FC (Note 2) Cutoff Frequency − 220 − MHz 2. 50 (cid:3) Source and 50 (cid:3) Lead Termination per Figure 2. Applications Information Suppressing Noise at the Source • Filter all I/O signals leaving the noisy environment • Locate I/O driver circuits close to the connector • Use the longest rise/fall times possible for all digital signals Reducing Noise at the Receiver • Filter all I/O signals entering the unit • Locate the I/O filters as close as possible to the connector Minimizing Noise Coupling • Use multilayer PCBs to minimize power and ground inductance • Keep clock circuits away from the I/O connector • Ground planes should be used whenever possible • Minimize the loop area for all high speed signals • Provide for adequate power decoupling ESD Protection • Locate the suppression devices as close to the I/O connector as possible • Minimize the PCB trace length to the suppression device • Minimize the PCB trace length for the ground return for the suppression device http://onsemi.com 2

NZF220DFT1G, SNZF220DFT1G FREQUENCY RESPONSE SPECIFICATION TRACKING SPECTRUM GENERATOR ANALYZER 50 (cid:3) TG OUTPUT RF INPUT NZF220DF 50 (cid:3) VG Vin Vout TEST BOARD NZF220DF Test Conditions: Source Impedance = 50 (cid:3) Load Impedance = 50 (cid:3) Input Power = 0 dB Figure 1. Measurement Conditions 0 −6.3 −10 (cid:3) B) −20 N (d (cid:3)O3 UdBTP =U 2T20 MHz AI G −30 −40 −50 1.0 10 100 1000 3000 f, FREQUENCY (MHz) Figure 2. Typical EMI Filter Response (50 (cid:2) Source and 50 (cid:2) Lead Termination) http://onsemi.com 3

NZF220DFT1G, SNZF220DFT1G OUTLINE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE K A NOTES: 1. DIMENSIONING AND TOLERANCING G PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE 5 4 MOLD FLASH, PROTRUSIONS, OR GATE BURRS. S −B− INCHES MILLIMETERS 1 2 3 DIM MIN MAX MIN MAX A 0.071 0.087 1.80 2.20 B 0.045 0.053 1.15 1.35 C 0.031 0.043 0.80 1.10 D 0.004 0.012 0.10 0.30 D 5 PL 0.2 (0.008) M B M G 0.026 BSC 0.65 BSC H --- 0.004 --- 0.10 J 0.004 0.010 0.10 0.25 N K 0.004 0.012 0.10 0.30 N 0.008 REF 0.20 REF S 0.079 0.087 2.00 2.20 J C K H SOLDERING FOOTPRINT* 0.65 0.65 0.025 0.025 1.9 0.075 0.9 0.035 0.7 0.028 (cid:2) (cid:3) mm SCALE 10:1 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com NZF220DFT1/D 4