NX3L1G384 Low-ohmic single-pole single-throw analog switch Rev. 6 — 3 July 2012 Product data sheet 1. General description The NX3L1G384 is a low-ohmic single-pole single-throw analog switch. It has two input/output terminals (YandZ) and an active LOW enable input pin (E). When E is HIGH, the analog switch is turned off. Schmitt trigger action at the enable input (E) makes the circuit tolerant to slower input rise and fall times. The NX3L1G384 allows signals with amplitude up to V to be transmitted CC from Y to Z; or from Z to Y. Its low ON resistance (0.5 ) and flatness (0.13 ) ensures minimal attenuation and distortion of transmitted signals. 2. Features and benefits  Wide supply voltage range from 1.4V to 4.3V  Very low ON resistance (peak): 1.6 (typical) at V =1.4V CC 1.0 (typical) at V =1.65V CC 0.55 (typical) at V =2.3V CC 0.50 (typical) at V =2.7V CC 0.50 (typical) at V =4.3V CC  High noise immunity  ESD protection: HBM JESD22-A114F Class 3A exceeds 7500V MM JESD22-A115-A exceeds 200V CDM AEC-Q100-011 revision B exceeds 1000V IEC61000-4-2 contact discharge exceeds 4000 V for switch ports  CMOS low-power consumption  Latch-up performance exceeds 100mA per JESD 78 Class II Level A  Direct interface with TTL levels at 3.0 V  Control input accepts voltages above supply voltage  High current handling capability (350 mA continuous current under 3.3 V supply)  Specified from 40C to +85C and from 40C to +125C 3. Applications  Cell phone  PDA  Portable media player

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 4. Ordering information Table 1. Ordering info rmation Type number Package Temperature range Name Description Version NX3L1G384GW 40Cto+125C TSSOP5 plastic thin shrink small outline package; 5 leads; SOT353-1 bodywidth 1.25 mm NX3L1G384GM 40C to+125C XSON6 plastic extremely thin small outline package; noleads; SOT886 6 terminals; body 11.450.5mm 5. Marking Table 2. Marking cod es[1] Type number Marking code NX3L1G384GW ML NX3L1G384GM ML [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 6. Functional diagram Y Z E Z Y E 001aag476 001aai598 Fig 1. Logic symbol Fig 2. Logic diagram 7. Pinning information 7.1 Pinning NX3L1G384 NX3L1G384 Y 1 6 VCC Y 1 5 VCC Z 2 5 n.c. Z 2 GND 3 4 E GND 3 4 E 001aai610 001aai609 Transparent top view Fig 3. Pin configuration SOT353-1 (TSSOP5) Fig 4. Pin configuration SOT886 (XSON6) NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 2 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 7.2 Pin description Table 3. Pin descripti on Symbol Pin Description SOT353-1 SOT886 Y 1 1 independent input or output Z 2 2 independent output or input GND 3 3 ground (0V) E 4 4 enable input (active LOW) n.c. - 5 not connected V 5 6 supply voltage CC 8. Functional description Table 4. Function tab le[1] InputE Switch L ON-state H OFF-state [1] H=HIGH voltage level; L=LOWvoltage level. 9. Limiting values Table 5. Limiting valu es In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit V supply voltage 0.5 +4.6 V CC V input voltage enable input E [1] 0.5 +4.6 V I V switch voltage [2] 0.5 V + 0.5 V SW CC I input clamping current V <0.5V 50 - mA IK I I switch clamping current V <0.5V or V >V + 0.5V - 50 mA SK I I CC I switch current V >0.5V or V < V + 0.5V; - 350 mA SW SW SW CC sourceorsink current V >0.5V or V < V + 0.5V; - 500 mA SW SW CC pulsedat1msduration, < 10 % duty cycle; peak current T storage temperature 65 +150 C stg P total power dissipation T =40Cto+125C [3] - 250 mW tot amb [1] The minimum input voltage rating may be exceeded if the input current rating is observed. [2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not exceed 4.6 V. [3] For TSSOP5 package: above 87.5C the value of Ptotderates linearly with 4.0mW/K. For XSON6 package: above 118C the value of Ptotderates linearly with 7.8mW/K. NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 3 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 10. Recommended operating conditions Table 6. Recommend ed operating conditions Symbol Parameter Conditions Min Max Unit V supply voltage 1.4 4.3 V CC V input voltage enable input E 0 4.3 V I V switch voltage [1] 0 V V SW CC T ambient temperature 40 +125 C amb t/V input transition rise and fall rate V =1.4Vto4.3V [2] - 200 ns/V CC [1] To avoid sinking GND current from of terminal Z when switch current flows in terminal Y, the voltage drop across the bidirectional switch must not exceed 0.4V. If the switch current flows into terminal Z, noGND current will flow from terminal Y. In this case, there is no limit for the voltage drop across the switch. [2] Applies to control signal levels. 11. Static characteristics Table 7. Static charac teristics At recommended operating conditions; voltages are referenced to GND (ground 0V). Symbol Parameter Conditions T = 25 C T = 40 C to +125 C Unit amb amb Min Typ Max Min Max Max (85C) (125C) V HIGH-level V =1.4Vto1.95V 0.65V - - 0.65V - - V IH CC CC CC input voltage V =2.3 Vto2.7V 1.7 - - 1.7 - - V CC V =2.7 Vto3.6V 2.0 - - 2.0 - - V CC V =3.6 Vto4.3V 0.7V - - 0.7V - - V CC CC CC V LOW-level V =1.4Vto1.95V - - 0.35V - 0.35V 0.35V V IL CC CC CC CC input voltage V =2.3Vto2.7V - - 0.7 - 0.7 0.7 V CC V =2.7Vto3.6V - - 0.8 - 0.8 0.8 V CC V =3.6 Vto4.3V - - 0.3V - 0.3V 0.3V V CC CC CC CC I input leakage enable input E; - - - - 0.5 1 A I current V =GNDto4.3V; I V =1.4Vto4.3V CC I OFF-state Y port; seeFigure5 S(OFF) leakage V =1.4Vto3.6V - - 5 - 50 500 nA CC current V =3.6Vto4.3V - - 10 - 50 500 nA CC I ON-state Z port; seeFigure6 S(ON) leakage V =1.4Vto3.6V - - 5 - 50 500 nA CC current V =3.6Vto4.3V - - 10 - 50 500 nA CC I supply current V =V orGND; CC I CC V =GNDorV SW CC V =3.6V - - 100 - 690 6000 nA CC V =4.3V - - 150 - 800 7000 nA CC NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 4 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground 0V). Symbol Parameter Conditions T = 25 C T = 40 C to +125 C Unit amb amb Min Typ Max Min Max Max (85C) (125C) C input - 1.0 - - - - pF I capacitance C OFF-state - 35 - - - - pF S(OFF) capacitance C ON-state - 110 - - - - pF S(ON) capacitance 11.1 Test circuits VCC VCC E E VIH VIL Z Y Z Y IS IS VI GND VO VI GND VO 001aag479 001aag480 VI=0.3VorVCC0.3 V; VO=VCC  0.3 V or 0.3 V. VI=0.3VorVCC0.3 V; VO=open circuit. Fig 5. Test circuit for measuring OFF-state leakage Fig 6. Test circuit for measuring ON-state leakage current current 11.2 ON resistance Table 8. ON resistanc e At recommended operating conditions; voltages are referenced to GND (ground = 0V); for graphs see Figure8 to Figure14. Symbol Parameter Conditions T = 40 C to +85 C T = 40 C to +125 C Unit amb amb Min Typ[1] Max Min Max R ON resistance V =GNDtoV ; ON(peak) I CC (peak) I =100mA; seeFigure7 SW V =1.4V - 1.6 3.7 - 4.1  CC V =1.65V - 1.0 1.6 - 1.7  CC V =2.3V - 0.55 0.8 - 0.9  CC V =2.7V - 0.5 0.75 - 0.9  CC V =4.3V - 0.5 0.75 - 0.9  CC NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 5 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch Table 8. ON resistance …continued At recommended operating conditions; voltages are referenced to GND (ground = 0V); for graphs see Figure8 to Figure14. Symbol Parameter Conditions T = 40 C to +85 C T = 40 C to +125 C Unit amb amb Min Typ[1] Max Min Max R ON resistance V =GNDtoV ; [2] ON(flat) I CC (flatness) I =100mA SW V =1.4V - 1.0 3.3 - 3.6  CC V =1.65V - 0.5 1.2 - 1.3  CC V =2.3V - 0.15 0.3 - 0.35  CC V =2.7V - 0.13 0.3 - 0.35  CC V =4.3V - 0.2 0.4 - 0.45  CC [1] Typical values are measured at Tamb=25 C. [2] Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical V and CC temperature. 11.3 ON resistance test circuit and graphs 001aag564 1.6 RON (Ω) 1.2 VSW (1) V 0.8 VCC (2) E (3) VIL 0.4 (4) (5) (6) Z Y Vl GND ISW 0 0 1 2 3 4 5 001aai599 VI (V) R =V / I . (1) V =1.5V. ON SW SW CC (2) VCC=1.8V. (3) VCC=2.5V. (4) V =2.7V. CC (5) VCC=3.3V. (6) VCC=4.3V. Measured at Tamb=25C. Fig 7. Test circuit for measuring ON resistance Fig 8. Typical ON resistance as a function of input voltage NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 6 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 001aag565 001aag564 1.6 1.6 RON RON (Ω) (Ω) 1.2 1.2 (1) (1) 0.8 (2) 0.8 (3) (4) (2) (3) 0.4 0.4 (4) (5) (6) 0 0 0 1 2 3 0 1 2 3 4 5 VI (V) VI (V) (1) Tamb=125C. (1) Tamb=125C. (2) Tamb=85C. (2) Tamb=85C. (3) Tamb=25C. (3) Tamb=25C. (4) Tamb=40C. (4) Tamb=40C. Fig 9. ON resistance as a function of input voltage; Fig 10. ON resistance as a function of input voltage; V =1.5V V =1.8V CC CC 001aag567 001aag568 1.0 1.0 RON RON (Ω) (Ω) 0.8 0.8 0.6 (1) 0.6 (1) (2) (2) (3) (3) (4) (4) 0.4 0.4 0.2 0.2 0 0 0 1 2 3 0 1 2 3 VI (V) VI (V) (1) Tamb=125C. (1) Tamb=125C. (2) Tamb=85C. (2) Tamb=85C. (3) Tamb=25C. (3) Tamb=25C. (4) Tamb=40C. (4) Tamb=40C. Fig 11. ON resistance as a function of input voltage; Fig 12. ON resistance as a function of input voltage; V =2.5V V =2.7V CC CC NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 7 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 001aag569 001aaj896 1.0 1.0 RON RON (Ω) (Ω) 0.8 0.8 0.6 0.6 (1) (1) (2) (2) (3) (3) (4) 0.4 (4) 0.4 0.2 0.2 0 0 0 1 2 3 4 0 1 2 3 4 5 VI (V) VI (V) (1) Tamb=125C. (1) Tamb=125C. (2) Tamb=85C. (2) Tamb=85C. (3) Tamb=25C. (3) Tamb=25C. (4) Tamb=40C. (4) Tamb=40C. Fig 13. ON resistance as a function of input voltage; Fig 14. ON resistance as a function of input voltage; V =3.3V V =4.3V CC CC 12. Dynamic characteristics Table 9. Dynamic cha racteristics At recommended operating conditions; voltages are referenced to GND (ground=0V); for load circuit see Figure16. Symbol Parameter Conditions T = 25 C T = 40 C to +125 C Unit amb amb Min Typ[1] Max Min Max Max (85C) (125C) t enable time E to Z or Y; seeFigure15 en V =1.4Vto1.6V - 27 41 - 44 48 ns CC V =1.65Vto1.95V - 22 35 - 37 40 ns CC V =2.3Vto2.7V - 17 26 - 28 31 ns CC V =2.7Vto 3.6V - 14 24 - 25 27 ns CC V =3.6Vto 4.3V - 14 24 - 25 27 ns CC t disable time E to Z or Y; seeFigure15 dis V =1.4Vto1.6V - 9 17 - 19 21 ns CC V =1.65Vto1.95V - 7 13 - 14 15 ns CC V =2.3Vto2.7V - 4 8 - 9 10 ns CC V =2.7Vto 3.6V - 4 7 - 8 9 ns CC V =3.6Vto 4.3V - 4 7 - 8 9 ns CC [1] Typical values are measured at Tamb=25C and VCC = 1.5 V, 1.8 V, 2.5 V, 3.3 V and 4.3 V respectively. NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 8 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 12.1 Waveform and test circuits VI E input VM VM GND ten tdis VOH Y or Z output VX VX LOW to OFF OFF to LOW GND switch switch switch disabled enabled disabled 001aai600 Measurement points are given in Table10. Logic level: V is the typical output voltage that occurs with the output load. OH Fig 15. Enable and disable times Table 10. Measuremen t points Supply voltage Input Output V V V CC M X 1.4V to 4.3V 0.5V 0.9V CC OH VCC E Y/Z Z/Y G VI V VO RL CL VEXT = 1.5 V 001aai601 Test data is given in Table11. Definitions test circuit: RL = load resistance. C = load capacitance including jig and probe capacitance. L VEXT = external voltage for measuring switching times. Fig 16. Load circuit for switching times Table 11. Test data Supply voltage Input Load V V t, t C R CC I r f L L 1.4V to 4.3V V 2.5ns 35pF 50 CC NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 9 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 12.2 Additional dynamic characteristics Table 12. Additional dy namic characteristics At recommended operating conditions; voltages are referenced to GND (ground=0V); V = GND or V (unless otherwise I CC specified); t = t  2.5ns. r f Symbol Parameter Conditions T = 25 C Unit amb Min Typ Max THD total harmonic f =20Hzto20 kHz; R =32; seeFigure17 [1] i L distortion V =1.4V; V =1V(p-p) - 0.15 - % CC I V =1.65V; V =1.2V (p-p) - 0.10 - % CC I V =2.3V; V =1.5V(p-p) - 0.02 - % CC I V =2.7V; V =2V(p-p) - 0.02 - % CC I V =4.3V; V =2V(p-p) - 0.02 - % CC I f 3 dB frequency R =50; seeFigure18 [1] (3dB) L response V =1.4 V to 4.3V - 60 - MHz CC  isolation (OFF-state) f =100kHz; R =50; seeFigure19 [1] iso i L V =1.4 V to 4.3V - 90 - dB CC V crosstalk voltage between digital inputs and switch; ct f =1MHz;C =50 pF; R =50; seeFigure20 i L L V =1.4 V to 3.6V - 0.2 - V CC V =3.6 V to 4.3V - 0.2 - V CC Q charge injection f =1MHz; C =0.1 nF; R =1 M; V =0V; inj i L L gen R =0; see Figure21 gen V =1.5 V - 3 - pC CC V =1.8 V - 3 - pC CC V =2.5V - 3 - pC CC V =3.3V - 3 - pC CC V =4.3V - 6 - pC CC [1] f is biased at 0.5V . i CC 12.3 Test circuits VCC 0.5VCC E VIL RL Y/Z Z/Y fi D 001aai602 Fig 17. Test circuit for measuring total harmonic distortion NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 10 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch VCC 0.5VCC E VIL RL Y/Z Z/Y fi dB 001aai603 Adjust fi voltage to obtain 0dBm level at output. Increase fi frequency until dB meter reads 3dB. Fig 18. Test circuit for measuring the frequency response when channel is in ON-state VCC 0.5VCC 0.5VCC E RL VIH RL Y/Z Z/Y fi dB 001aai604 Adjust f voltage to obtain 0dBm level at input. i Fig 19. Test circuit for measuring isolation (OFF-state) VCC E Y/Z Z/Y G VI RL RL CL V VO 0.5VCC 0.5VCC 001aai605 a. Test circuit logic off on off input (E) VO Vct 001aai606 b. Input and output pulse definitions Fig 20. Test circuit for measuring crosstalk voltage between digital inputs and switch NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 11 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch VCC E Y/Z Z/Y Rgen G VI V VO RL CL Vgen GND 001aai607 a. Test circuit logic off on off input (E) VO VO 001aai608 b. Input and output pulse definitions Definition: Qinj=VO CL. VO = output voltage variation. R = generator resistance. gen Vgen = generator voltage. Fig 21. Test circuit for measuring charge injection NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 12 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 D E A X c y HE v M A Z 5 4 A2 A A1 (A3) θ 1 3 Lp L e w M bp e1 detail X 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT mAax. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 1.0 0.15 0.30 0.25 2.25 1.35 0.65 1.3 2.25 0.425 0.46 0.3 0.1 0.1 0.60 7° 0 0.8 0.15 0.08 1.85 1.15 2.0 0.21 0.15 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 00-09-01 SOT353-1 MO-203 SC-88A 03-02-19 Fig 22. Package outline SOT353-1 (TSSOP5) NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 13 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4x L1 L (2) e 6 5 4 e1 e1 6x A (2) A1 D E terminal 1 index area 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit A(1) A1 b D E e e1 L L1 max 0.5 0.04 0.25 1.50 1.05 0.35 0.40 mm nom 0.20 1.45 1.00 0.6 0.5 0.30 0.35 min 0.17 1.40 0.95 0.27 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. sot886_po Outline References European Issue date version IEC JEDEC JEITA projection 04-07-22 SOT886 MO-252 12-01-05 Fig 23. Package outline SOT886 (XSON6) NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 14 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 14. Abbreviations Table 13. Abbreviation s Acronym Description CDM Charged Device Model CMOS Complementary Metal Oxide Semiconductor ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model PDA Personal Digital Assistant TTL Transistor-Transistor Logic 15. Revision history T able 14. Revision history Document ID Release date Data sheet status Change notice Supersedes NX3L1G384 v.6 20120703 Product data sheet - NX3L1G384 v.5 Modifications: • Package outline drawing of SOT886 (Figure23) modified. NX3L1G384 v.5 20111109 Product data sheet - NX3L1G384 v.4 Modifications: • Legal pages updated. NX3L1G384 v.4 20110107 Product data sheet - NX3L1G384 v.3 NX3L1G384 v.3 20090817 Product data sheet - NX3L1G384 v.2 NX3L1G384 v.2 20090406 Product data sheet - NX3L1G384 v.1 NX3L1G384 v.1 20080908 Product data sheet - - NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 15 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. 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NXP Semiconductors takes no Limiting values — Stress above one or more limiting values (as defined in responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC60134) will cause permanent source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in In no event shall NXP Semiconductors be liable for any indirect, incidental, the Recommended operating conditions section (if present) or the punitive, special or consequential damages (including - without limitation - lost Characteristics sections of this document is not warranted. Constant or profits, lost savings, business interruption, costs related to the removal or repeated exposure to limiting values will permanently and irreversibly affect replacement of any products or rework charges) whether or not such the quality and reliability of the device. damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards sale, as published at http://www.nxp.com/profile/terms, unless otherwise customer for the products described herein shall be limited in accordance agreed in a valid written individual agreement. In case an individual with the Terms and conditions of commercial sale of NXP Semiconductors. agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to Right to make changes — NXP Semiconductors reserves the right to make applying the customer’s general terms and conditions with regard to the changes to information published in this document, including without purchase of NXP Semiconductors products by customer. limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior No offer to sell or license — Nothing in this document may be interpreted or to the publication hereof. construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 16 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch Export control — This document as well as the item(s) described herein NXP Semiconductors’ specifications such use shall be solely at customer’s may be subject to export control regulations. Export might require a prior own risk, and (c) customer fully indemnifies NXP Semiconductors for any authorization from competent authorities. liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ Non-automotive qualified products — Unless this data sheet expressly standard warranty and NXP Semiconductors’ product specifications. states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested Translations — A non-English (translated) version of a document is for in accordance with automotive testing or application requirements. NXP reference only. The English version shall prevail in case of any discrepancy Semiconductors accepts no liability for inclusion and/or use of between the translated and English versions. non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in 16.4 Trademarks automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the Notice: All referenced brands, product names, service names and trademarks product for such automotive applications, use and specifications, and (b) are the property of their respective owners. whenever customer uses the product for automotive applications beyond 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NX3L1G384 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 6 — 3 July 2012 17 of 18

NX3L1G384 NXP Semiconductors Low-ohmic single-pole single-throw analog switch 18. Contents 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 3 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 10 Recommended operating conditions. . . . . . . . 4 11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 11.1 Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11.2 ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . . 5 11.3 ON resistance test circuit and graphs. . . . . . . . 6 12 Dynamic characteristics. . . . . . . . . . . . . . . . . . 8 12.1 Waveform and test circuits. . . . . . . . . . . . . . . . 9 12.2 Additional dynamic characteristics . . . . . . . . . 10 12.3 Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 13 14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15 15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 18 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 July 2012 Document identifier: NX3L1G384

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: NX3L1G384GM,115 NX3L1G384GM,132 NX3L1G384GW,125