NSR0240P2T5G Schottky Barrier Diode Schottky barrier diodes are optimized for very low forward voltage drop and low leakage current and are used in a wide range of dc−dc converter, clamping and protection applications in portable devices. NSR0240P2 in a SOD−923 miniature package enables designers to meet the challenging task of achieving higher efficiency and meeting www.onsemi.com reduced space requirements. Features • 40 V SCHOTTKY Very Low Forward Voltage Drop − 460 mV @ 100 mA • Low Reverse Current − 0.2 (cid:2)A @ 25 V VR BARRIER DIODE • 200 mA of Continuous Forward Current • Power Dissipation of 240 mW with Minimum Trace • Very High Switching Speed 1 2 • Low Capacitance − CT = 7 pF CATHODE ANODE • NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 MARKING Qualified and PPAP Capable • 2 DIAGRAM This is a Pb−Free Device 1 Typical Applications P M(cid:2) SOD−923 (cid:2) • LCD and Keypad Backlighting CASE 514AB 1 2 • Camera Photo Flash • Buck and Boost dc−dc Converters P = Specific Device Code • Reverse Voltage and Current Protection M = Month Code • (cid:2) = Pb−Free Package Clamping & Protection (Note: Microdot may be in either location) Markets • Mobile Handsets ORDERING INFORMATION • MP3 Players • Device Package Shipping† Digital Camera and Camcorders • Notebook PCs & PDAs NSR0240P2T5G SOD−923 8000 / Tape & Reel • (Pb−Free) GPS NSVR0240P2T5G SOD−923 8000 / Tape & Reel MAXIMUM RATINGS (Pb−Free) Rating Symbol Value Unit †For information on tape and reel specifications, Reverse Voltage VR 40 V including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Forward Current (DC) IF 200 mA Brochure, BRD8011/D. Non−Repetitive Peak Forward Surge Current IFSM 2.0 A ESD Rating: Human Body Model ESD Class 1C Machine Model Class A Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: January, 2015 − Rev. 3 NSR0240P2/D

NSR0240P2T5G THERMAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit Thermal Resistance Junction−to−Ambient (Note 1) R(cid:3)JA 520 °C/W Total Power Dissipation @ TA = 25°C PD 240 mW Thermal Resistance Junction−to−Ambient (Note 2) R(cid:3)JA 175 °C/W Total Power Dissipation @ TA = 25°C PD 710 mW Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C 1. Mounted onto a 4 in square FR−4 board 10 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state. 2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Reverse Leakage IR (cid:2)A (VR = 25 V) 0.2 0.55 (VR = 40 V) 0.8 5.0 Forward Voltage (IF = 10 mA) VF 0.34 0.365 V (IF = 100 mA) 0.46 0.50 (IF = 200 mA) 0.54 0.60 Total Capacitance CT 7.0 pF (VR = 1.0 V, f = 1 MHz) 1000 1.0E−02 mA) 100 A)1.0E−03 150°C NT ( 125°C NT (1.0E−04 125°C 85°C E 10 E RR RR1.0E−05 75°C U 150°C U C 1 C1.0E−06 RD SE 25°C A R1.0E−07 W 0.1 E V OR RE1.0E−08 −40°C , FF0.01 I, r1.0E−09 I 85°C 25°C −40°C 0.001 1.0E−10 0 0.1 0.2 0.3 0.4 0.5 0.6 0 5 10 15 20 25 30 35 40 45 VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 1. Forward Voltage Figure 2. Leakage Current 14 pF) 12 TA = 25°C E ( C 10 N A T CI 8 A P A 6 C L A T 4 O T C, T 2 0 0 5 10 15 20 25 30 35 40 45 VR, REVERSE VOLTAGE (V) Figure 3. Total Capacitance www.onsemi.com 2

NSR0240P2T5G PACKAGE DIMENSIONS SOD−923 CASE 514AB ISSUE C −X− D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME −Y− Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. E 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE 1 2 MINIMUM THICKNESS OF BASE MATERIAL. 2Xb 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 0.08 X Y TOP VIEW MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A A 0.34 0.37 0.40 0.013 0.015 0.016 b 0.15 0.20 0.25 0.006 0.008 0.010 c 0.07 0.12 0.17 0.003 0.005 0.007 D 0.75 0.80 0.85 0.030 0.031 0.033 E 0.55 0.60 0.65 0.022 0.024 0.026 HE 0.95 1.00 1.05 0.037 0.039 0.041 L 0.19 REF 0.007 REF c HE L2 0.05 0.10 0.15 0.002 0.004 0.006 SIDE VIEW SOLDERING FOOTPRINT* 2XL 1.20 2X 0.36 2X 0.25 2XL2 PACKAGE BOTTOM VIEW OUTLINE DIMENSIONS: MILLIMETERS See Application Note AND8455/D for more mounting details *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative www.onsemi.com NSR0240P2/D 3

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