NSR0230P2, NSVR0230P2, Schottky Barrier Diode These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited. http://onsemi.com Features • Extremely Fast Switching Speed 30 V SCHOTTKY • Extremely Low Forward Voltage 0.325 V (max) @ I = 10 mA F BARRIER DIODE • Low Reverse Current • NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 1 2 • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS CATHODE ANODE Compliant MARKING MAXIMUM RATINGS 2 DIAGRAM Rating Symbol Value Unit Reverse Voltage VR 30 Vdc 1 K M(cid:2) (cid:2) SOD−923 Forward Current DC IF 200 mA CASE 514AA 1 2 Forward Current Surge Peak IFSM 1.0 A (60 Hz, 1 cycle) K = Specific Device Code* (Character is rotated 270° clockwise) ESD Rating: Class 3B per Human Body Model ESD Rating: Class C per Machine Model M = Month Code (cid:2) = Pb−Free Package Stresses exceeding Maximum Ratings may damage the device. Maximum (Note: Microdot may be in either location) Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ORDERING INFORMATION THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Device Package Shipping† Total Device Dissipation FR−5 Board, PD 200 mW NSR0230P2T5G SOD−923 2 mm Pitch (Note 1) TA = 25°C (Pb−Free) 8000/Tape & Reel Derate above 25°C 2.0 mW/°C NSVR0230P2T5G SOD−923 2 mm Pitch Thermal Resistance, Junction−to−Ambient R(cid:2)JA 600 °C/W (Pb−Free) 8000/Tape & Reel Junction and Storage TJ, Tstg −55 to °C †For information on tape and reel specifications, Temperature Range +125 including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications 1. FR−5 Minimum Pad. Brochure, BRD8011/D. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Reverse Leakage IR − − 10 (cid:3)A (VR = 10 V) Forward Voltage VF Vdc (IF = 10 mA) − − 0.325 (IF = 200 mA) − − 0.500 © Semiconductor Components Industries, LLC, 2013 1 Publication Order Number: September, 2013 − Rev. 2 NSR0230P2/D

NSR0230P2, NSVR0230P2, TYPICAL CHARACTERISTICS 1 10m TA = 125°C RRENT (A)11000mm TA = 75°C RENT (A)1010m(cid:3) TTAA == 7152°5C°C CU UR 10(cid:3) ARD 1m SE C 1(cid:3) TA = 25°C W100(cid:3) ER OR TA = 25°C EV100n F R I, F 10(cid:3) I, R 10n TA = −25°C TA = −25°C 1(cid:3) 1n 0 0.1 0.2 0.3 0.4 0.5 0.6 0 5 10 15 20 25 30 VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Forward Characteristics Figure 2. Reverse Characteristics 20 18 F) E (p 16 C 14 N A T 12 CI PA 10 A C 8 L TA 6 A O 4 T C, T 2 0 0 5 10 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Total Capacitance http://onsemi.com 2

NSR0230P2, NSVR0230P2, PACKAGE DIMENSIONS SOD−923 CASE 514AA ISSUE E −X− D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME −Y− Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. E 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE 1 2 MINIMUM THICKNESS OF BASE MATERIAL. 2Xb 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 0.08 X Y TOP VIEW MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A A 0.34 0.39 0.43 0.013 0.015 0.017 b 0.15 0.20 0.25 0.006 0.008 0.010 c 0.07 0.12 0.17 0.003 0.005 0.007 D 0.75 0.80 0.85 0.030 0.031 0.033 E 0.55 0.60 0.65 0.022 0.024 0.026 HE 0.95 1.00 1.05 0.037 0.039 0.041 c HE LL2 0.05 0.109.1 R0EF0.15 0.0020.000.70 0R4EF0.006 SIDE VIEW SOLDERING FOOTPRINT* 2XL 1.20 2X 0.36 2X 0.25 2XL2 PACKAGE OUTLINE BOTTOM VIEW DIMENSIONS: MILLIMETERS See Application Note AND8455/D for more mounting details *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com NSR0230P2/D 3

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: NSR0230P2T5G