NLX2G02 Dual 2-Input NOR Gate The NLX2G02 is an advanced high-speed dual 2-input CMOS NOR gate in ultra-small footprint. The NLX2G02 input structures provide protection when voltages up to 7.0 volts are applied, regardless of the supply voltage. Features www.onsemi.com • High Speed: t 2.5 ns (typical) at V = 5.0 V PD CC • Designed for 1.65 V to 5.5 V VCC Operation MARKING • Low Power Dissipation: I = 1 (cid:2)A (Max) at T = 25°C DIAGRAMS CC A • 24 mA Balanced Output Sink and Source Capability UDFN8 • 1.45 x 1.0 X M Balanced Propagation Delays CASE 517BZ 1 • Overvoltage Tolerant (OVT) Input Pins • This is a Pb−Free Device UDFN8 1.6 x 1.0 X M CASE 517BY 1 UDFN8 A1 1 8 VCC 1.95 x 1.0 X M CASE 517CA 1 B1 2 7 Y1 XX = Specific Device Code M = Date Code (cid:2) = Pb−Free Package Y2 3 6 B2 IEEE/IEC ORDERING INFORMATION A1 ≥1 Y1 B1 See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. A2 GND 4 5 A2 Y2 B2 Figure 1. Pinout Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin Function Y = A + B 1 A1 Inputs Output 2 B1 3 Y2 A B Y 4 GND L L H 5 A2 L H L 6 B2 H L L 7 Y1 H H L 8 VCC H = HIGH Logic Level L = LOW Logic Level © Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: June, 2016 − Rev. 3 NLX2G02/D

NLX2G02 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage (cid:2)0.5 to +7.0 V VIN DC Input Voltage (cid:2)0.5 to +7.0 V VOUT DC Output Voltage (cid:2)0.5 to VCC + 7.0 V IIK DC Input Diode Current VIN < GND (cid:2)50 mA IOK DC Output Diode Current VOUT < GND (cid:2)50 mA IO DC Output Source/Sink Current (cid:3)50 mA ICC DC Supply Current per Supply Pin (cid:3)100 mA IGND DC Ground Current per Ground Pin (cid:3)100 mA TSTG Storage Temperature Range (cid:2)65 to (cid:4)150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C (cid:3) Thermal Resistance (Note 1) N/A °C/W JA PD Power Dissipation in Still Air at 85°C N/A mW MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 2) 2000 V Machine Model (Note 3) > 200 Charged Device Model (Note 4) N/A ILatchup Latchup Performance Above VCC and Below GND at 125°C (Note 5) (cid:3)500 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC Power DC Supply Voltage Operating 1.65 5.5 V Data Retention Only 1.5 5.5 VIN Digital Input Voltage (Note 6) 0 5.5 V VOUT Output Voltage 0 VCC V TA Operating Free−Air Temperature −55 +125 °C (cid:4)t/(cid:4)V Input Transition Rise or Fall Rate VCC = 1.8 V (cid:3)0.15 V 0 20 ns/V VCC = 2.5 V (cid:3)0.2 V 0 20 VCC = 3.3 V (cid:3)0.3 V 0 10 VCC = 5.0 V (cid:3)0.5 V 0 5 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. www.onsemi.com 2

NLX2G02 DC ELECTRICAL CHARACTERISTICS TA = −55(cid:2)C to VCC TA = 25(cid:2)C TA (cid:3) 85(cid:2)C +125(cid:2)C Symbol Parameter Condition (V) Min Typ Max Min Max Min Max Unit VIH High−Level Input 1.65 0.75 x 0.75 x 0.75 x V Voltage VCC VCC VCC 2.3 to 5.5 0.7 x 0.7 x 0.7 x VCC VCC VCC VIL Low−Level Input 1.65 0.25 x 0.25 x 0.25 x V Voltage VCC VCC VCC 2.3 to 5.5 0.3 x 0.3 x 0.3 x VCC VCC VCC VOH High−Level VIN = VIH or VIL, 1.65 to 5.5 VCC − VCC VCC − VCC − V Output Voltage IOH = −100 (cid:2)A 0.1 0.1 0.1 VIN = VIH or VIL IOH = −4 mA 1.65 1.29 1.5 1.29 1.29 IOH = −8 mA 2.3 1.9 2.1 1.9 1.9 IOH = −12 mA 2.7 2.2 2.4 2.2 2.2 IOH = −16 mA 3.0 2.4 2.7 2.4 2.4 IOH = −24 mA 3.0 2.3 2.5 2.3 2.3 IOH = −32 mA 4.5 3.8 4.0 3.8 3.8 VOL Low−Level VIN = VIH or VIL, 1.65 to 5.5 0.1 0.1 0.1 V Output Voltage IOL = 100 (cid:2)A VIN = VIH or VIL IOL = 4 mA 1.65 0.08 0.24 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 0.55 IIN Input Leakage 0 ≤ VIN ≤ 5.5 V 0 to 5.5 (cid:3)0.1 (cid:3)1.0 (cid:3)1.0 (cid:2)A Current IOFF Power−Off Input VIN = 5.5 V 0 1.0 10 10 (cid:2)A Leakage Current ICC Quiescent Supply VIN = VCC or 5.5 1.0 10 10 (cid:2)A Current GND Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns TA = −55(cid:2)C VCC TA = 25(cid:2)C TA (cid:3) 85(cid:2)C to +125(cid:2)C Symbol Parameter (V) Test Condition Min Typ Max Min Max Min Max Unit tPLH Propagation Delay 1.65 to 1.95 RL = 1 M(cid:5)(cid:6) CL = 15 pF 2.0 7.4 9.5 2.0 9.7 ns tPHL Input A to Output 2.3 to 2.7 RL = 1 M(cid:5)(cid:6) CL = 15 pF 1.2 3.3 5.4 1.2 5.8 3.0 to 3.6 RL = 1 M(cid:5)(cid:6) CL = 15 pF 0.8 2.6 3.9 0.8 4.3 RL = 500 (cid:5)(cid:6) CL = 50 pF 1.2 3.2 4.8 1.2 5.2 4.5 to 5.5 RL = 1 M(cid:5)(cid:6) CL = 15 pF 0.5 1.9 3.1 0.5 3.3 RL = 500 (cid:5)(cid:6) CL = 50 pF 0.8 2.5 3.7 0.8 4.0 CIN Input Capacitance 5.5 VIN = 0 V or VCC 2.5 pF CPD Power Dissipation 3.3 10 MHz, VIN = 0V or 9 pF Capacitance (Note 7) 5.5 VCC 11 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD (cid:2) VCC (cid:2) fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD (cid:2) VCC2 (cid:2) fin + ICC (cid:2) VCC. www.onsemi.com 3

NLX2G02 tf = 3 ns tf = 3 ns VCC 90% 90% INPUT INPUT A and B 50% 50% OUTPUT 10% 10% GND RL CL tPHL tPLH VOH A 1−MHz square input wave is recommended for OUTPUT Y 50% 50% propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit ORDERING INFORMATION Device Package Shipping† NLX2G02DMUTCG UDFN8, 1.95 x 1.0, 0.5P 3000 / Tape & Reel (Pb−Free) NLX2G02EMUTCG UDFN8, 1.6 x 1.0, 0.4P 3000 / Tape & Reel (Pb−Free) NLX2G02FMUTCG UDFN8, 1.45 x 1.0, 0.35P 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 4

NLX2G02 PACKAGE DIMENSIONS UDFN8 1.6x1.0, 0.4P CASE 517BY ISSUE O D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED PIN ONE ÉÉÉ TERMINAL AND IS MEASURED BETWEEN REFERENCE E 0.15 AND 0.20 MM FROM TERMINAL TIP. ÉÉÉ 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. 2X 0.10 C ÉÉÉ MILLIMETERS DIM MIN MAX 2X 0.10 C A 0.45 0.55 TOP VIEW A1 0.00 0.05 A3 0.13 REF A3 b 0.15 0.25 0.05 C D 1.60 BSC E 1.00 BSC A e 0.40 BSC L 0.25 0.35 L1 0.30 0.40 0.05 C SIDE VIEW A1 C SEATING RECOMMENDED PLANE SOLDERING FOOTPRINT* 7X e/2 0.49 8X 0.26 e 7XL 1 4 L1 1.24 8 5 1 8Xb 0.53 0.40 PKG 0.10 M C A B OUTLINE PITCH DIMENSIONS: MILLIMETERS BOTTOM VIEW 0.05 M C NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5

NLX2G02 PACKAGE DIMENSIONS UDFN8 1.45x1.0, 0.35P CASE 517BZ ISSUE O D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED PIN ONE ÉÉ TERMINAL AND IS MEASURED BETWEEN REFERENCE E 0.15 AND 0.20 MM FROM TERMINAL TIP. ÉÉ 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. 2X 0.10 C ÉÉ MILLIMETERS DIM MIN MAX 2X 0.10 C A 0.45 0.55 TOP VIEW A1 0.00 0.05 A3 0.13 REF 0.05 C A3 b 0.15 0.25 D 1.45 BSC E 1.00 BSC A e 0.35 BSC L 0.25 0.35 0.05 C L1 0.30 0.40 SIDE VIEW A1 C SEATING RECOMMENDED PLANE SOLDERING FOOTPRINT* 7X e/2 0.48 8X 0.22 e 7XL 1 4 L1 1.18 8 5 1 8Xb 0.53 0.35 0.10 M C A B OUPTKLGINE PITCH BOTTOM VIEW 0.05 M C NOTE 3 *For additional information onD IMouENr SPIbO−NFS:r eMeIL LsItMraEtTeEgRyS and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6

NLX2G02 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE O D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED PIN ONE ÉÉÉ TERMINAL AND IS MEASURED BETWEEN REFERENCE E 0.15 AND 0.20 MM FROM TERMINAL TIP. ÉÉÉ 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. 2X 0.10 C ÉÉÉ MILLIMETERS DIM MIN MAX 2X 0.10 C A 0.45 0.55 TOP VIEW A1 0.00 0.05 A3 0.13 REF A3 b 0.15 0.25 0.05 C D 1.95 BSC E 1.00 BSC A e 0.50 BSC L 0.25 0.35 L1 0.30 0.40 0.05 C SIDE VIEW A1 C SEATING RECOMMENDED PLANE SOLDERING FOOTPRINT* 7X e/2 0.49 8X 0.30 e 7XL 1 4 L1 1.24 8 5 1 8Xb 0.54 0.50 PKG 0.10 M C A B OUTLINE PITCH DIMENSIONS: MILLIMETERS BOTTOM VIEW 0.05 M C NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative www.onsemi.com NLX2G02/D 7