NLAS4717EP (cid:2) 4.5(cid:2) High Bandwidth, Dual SPDT Analog Switch The NLAS4717EP is an advanced CMOS analog switch fabricated in sub−micron silicon gate CMOS technology. The device is a dual independent Single Pole Double Throw (SPDT) switch featuring low R of 4.5 (cid:2) at 3.0 V. http://onsemi.com DS(on) The device also features guaranteed Break−Before−Make (BBM) switching, assuring the switches never short the driver. MARKING The NLAS4717EP is available in two small size packages: DIAGRAMS  Microbump: 2.0 x 1.5 mm  WQFN−10: 1.4 x 1.8 mm 4717EP A1 AYWW(cid:2) Features (cid:2)  Low RDS(on): 4.5 (cid:2) @ 3.0 V MCicArSoEb u4m89pA−A10 A1  Matching Between the Switches 0.5 (cid:2) A = Assembly Location  Wide Voltage Range: 1.8 V to 5.5 V Y = Year  High Bandwidth > 90 MHz W, WW = Work Week (cid:2) = Pb−Free Package  1.65 V to 5.5 V Operating Range (Note: Microdot may be in either location)  Low Threshold Voltages on Pins 4 and 8 (CTRL Pins)  Ultra−Low Charge Injection  6.0 pC  Low Standby Current: ICC = 1.0 nA (Max) @ TA = 25C AWM(cid:2) (cid:2)  *OVT on Pins 4 and 8 (CTRL Logic Pins) 1  These are Pb−Free Devices WQFN−10 CASE 488AQ Typical Applications AW = Specific Device Code  Cell Phones M = Date Code (cid:2) = Pb−Free Device  PDAs (Note: Microdot may be in either location)  MP3s  Digital Still Cameras FUNCTION TABLE  USB 2.0 Full Speed (USB1.1) − 12 Mbps Compliant IN_ NO_ NC_ Important Information 0 OFF ON  ESD Protection: 1 ON OFF  Human Body Model (HBM) = 2500 V,  Machine Model (MM) = 200 V ORDERING INFORMATION  Latchup Max Rating: 200 mA (Per JEDEC EIA/JESD78) Device Package Shipping†  Pin−to−Pin Compatible with MAX4717 NLAS4717EPFCT1G Microbump−10 3000 / *OVT (Pb−Free) Tape & Reel  Overvoltage Tolerant (OVT) specific pins operate higher than normal NLAS4717EPMTR2G WQFN−10 3000 / supply voltages, with no damage to the devices or to signal integrity. (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.  Semiconductor Components Industries, LLC, 2011 1 Publication Order Number: October, 2011 − Rev. 7 NLAS4717EP/D

NLAS4717EP NO1 VCC GND 2 1 B1 NC1 C1 A1 NC2 COM1 3 10 NO2 IN1 C2 A2 IN2 IN1 4 9 COM2 COM1 C3 A3 COM2 NC1 5 8 IN2 NO1 C4 A4 NO2 B4 6 7 VCC GND NC2 Microbump WQFN (Top View) (Top View) Figure 1. Device Circuit Diagrams and Pin Configurations MAXIMUM RATINGS Symbol Parameter Value Unit V+ DC Supply Voltage (cid:2)0.5 to (cid:3)7.0 V VIS Analog Input Voltage (VNO, VNC, or VCOM) (Note 1) (cid:2)0.5  VIS  VCC (cid:3)0.5 V VIN Digital Select Input Voltage (cid:2)0.5  VI (cid:3)7.0 V IIK DC Current, Into or Out of Any Pin (Continuous) 100 mA IPK Peak Current (10% Duty Cycle) 200 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Signal voltage on NC, NO, and COM exceeding VCC or GND are clamped by the internal diodes. Limit forward diode current to maximum current rating. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit V+ DC Supply Voltage 1.8 5.5 V VIN Digital Select Input Voltage GND 5.5 V VIS Analog Input Voltage (NC, NO, COM) GND VCC V TA Operating Temperature Range −40 +85 C tr, tf Input Rise or Fall Time, SELECT ns/V VCC = 3.3 V  0.3 V 0 100 VCC = 5.0 V  0.5 V 0 20 http://onsemi.com 2

NLAS4717EP ANALOG SWITCH DC CHARACTERISTICS −40C to +85C Symbol Parameter Condition VCC (V) Min Max Unit VIH Input Logic High Voltage VOUT = 0.1 V 1.65 to 2.2 VCC x 0.55 − V IOUT  20 (cid:3)A 2.7 to 3.6 VCC x 0.5 − 4.5 to 5.5 2.0 − VIL Input Logic Low Voltage VOUT = −VCC − 0.1 V 1.65 to 2.2 − VCC x 0.2 V IOUT  20 (cid:3)A 2.7 to 3.6 − VCC x 0.2 4.5 to 5.5 − 0.8 IIN Input Leakage Current VIN = VCC or GND 5.5 −100 +100 nA VCC Power Supply Range All − 1.65 5.5 V ICC Supply Current VIN = VCC or GND 1.8 − 1.0 (cid:3)A IOUT = 0 (cid:3)A 3.3 − 1.0 5.5 − 1.0 ANALOG SWITCH CHARACTERISTICS − Digital Section (Voltages Referenced to GND) −40C to +85C Symbol Parameter Condition VCC (V) Min Typ Max Unit RON ON Resistance ICOM = 10 mA 3.0 − 3.2 4.5 (cid:2) (Note 2) VIS = 0 to VCC 5.0 − 2.1 3.5 (cid:4)RON ON Resistance ICOM = 10 mA 3.0 − 0.1 0.4 (cid:2) Match Between Channels VIS = 0 to VCC (Note 2 and 3) 5.0 − 0.1 0.4 RFLAT[ON] ON Resistance ICOM = 10 mA 3.0 − 1.12 1.5 (cid:2) Flatness VIS = 0 to VCC (Note 4) 5.0 − 0.55 1.36 INO_[OFF] NO_, NC_ VCOM = 0.3 V or 3.3 V 3.6 −1.0 0.01 +1.0 nA INC_[OFF] Off−Leakage Current VNO or VNC = 0.3 V or 3.3 V (Note 5) VCOM = 0 V or 5.0 V 5.5 −1.0 0.01 +1.0 VNO or VNC = 0 V or 5.0 V ICOM_[ON] COM_ VCOM = 0.3 V or 3.3 V 3.6 −2.0 0.01 +2.0 nA On−Leakage Current VNO or VNC = 0.3 V or 3.3 V (Note 5) VCOM = 0 V or 5.0 V 5.5 −2.0 0.01 +2.0 VNO or VNC = 0 V or 5.0 V http://onsemi.com 3

NLAS4717EP ANALOG SWITCH AC CHARACTERISTICS −40C to +85C Symbol Parameter Condition VCC (V) Min Typ Max Unit tON Turn−On Time VNC_, VNO_ = VIH or VIL 1.8 to 5.5 − − 30 nS RL = 300 (cid:2), CL = 35 pF VIN[x] = VIH or VIL tOFF Turn−Off Time VNC_, VNO_ = VIH or VIL 1.8 to 5.5 − − 40 nS RL = 300 (cid:2), CL = 35 pF VIN[x] = VIH or VIL tBBM Break−Before−Make VNC_, VNO_ = 1.5 V − − 8.0 − nS Time Delay RL = 300 (cid:2), CL = 35 pF (Note 5) tSKEW Skew RS = 39 (cid:2), CL = 50 pF − − 0.15 2.0 nS (Note 5) 2. RON characterized for VCC range (1.65 V to 5.5 V). 3. (cid:4)RON = RON(MAX) − RON(MIN). 4. RFLAT[ON] = RON(MAX) − RON(MIN), measured over VCC range. 5. Guaranteed by design. ANALOG SWITCH APPLICATION CHARACTERISTICS −40C to +85C Symbol Parameter Condition VCC (V) Min Typ Max Unit Q Charge Injection VIN = VCC to GND 3.0 6.0 pC RIn = 0 (cid:2), CL = 1.0 nF 5.0 9.0 Q = CL − (cid:4)VOUT VISO Off−Isolation f = 10 MHz 1.65 to 5.5 −50 dB VNO_, VNC_ = 1.0 Vp−p RL = 50 (cid:2), CL = 5.0 pF f = 1.0 MHz −75 VNO_, VNC_ = 1.0 Vp−p RL = 50 (cid:2), CL = 5.0 pF VCT Cross−Talk f = 10 MHz 1.65 to 5.5 −80 dB VNO_, VNC_ = 1.0 Vp−p RL = 50 (cid:2), CL = 5.0 pF f = 1.0 MHz −110 VNO_, VNC_ = 1.0 Vp−p RL = 50 (cid:2), CL = 5.0 pF BW On−Channel Signal = 0 dB 1.8 to 5.0 90 MHz −3.0 db Bandwidth RL = 50 (cid:2), CL = 5.0 pF THD Total Harmonic Distortion VCOM = 2.0 Vp−p, − 0.02 % RL = 600 (cid:2)(cid:5) TA = 25C CNO_[OFF] NO_, NC_ F = 1.0 MHz − 15 pF CNC_[OFF] OFF−Capacitance CNO_[ON] NO_, NC_ F = 1.0 MHz − 38 pF CNC_[ON] ON−Capacitance http://onsemi.com 4

NLAS4717EP 2.0 3.0 2.5 +85C 1.5 2.0 (cid:2)) +25C (cid:2)) (S(on) 1.0 −40C (S(on) 1.5 +85C D D R R +25C 1.0 0.5 −40C 0.5 0.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VCOM (V) VCOM (V) Figure 2. R @ V = 5.0 V Figure 3. R @ V = 3.0 V DS(on) CC DS(on) CC 1.5 1.5 1.4 1.4 1.3 1.3 (cid:2)) (cid:2)) (n) 1.2 (n) 1.2 o o DS( 1.1 DS( 1.1 R R 1.0 1.0 3.0 V 5.0 V 0.9 0.9 0.8 0.8 −40C +25C +85C −40C +25C +85C TEMPERATURE (C) TEMPERATURE (C) Figure 4. Delta R @ V = 5.0 V Figure 5. Delta R @ V = 3.0 V DS(on) CC DS(on) CC 8 1 6 4 5.0 V 2 P) 0 %) Q (c −2 3.0 V HD ( 0.1 T −4 −6 −8 3.0 V −10 0.01 0.0 1.0 2.0 3.0 4.0 5.0 10 100 1000 10000 100000 VCOM (V) FREQUENCY (Hz) Figure 6. Charge Injection Figure 7. Total Harmonic Distortion http://onsemi.com 5

NLAS4717EP 20 10 VCC = 1.65 V to 5.5 V B) 0 d 0 −−4200 s (−10 Ba−n3d wdBidth s dB) −60 gre 0 ( e d −−−11208000 OFF−Isolation Cross−Talk −45 TVAC C= −=4 30.0C V t oto + 58.50 VC −P3h0a dseeg −140 0.001 0.01 0.1 1 10 100 0.1 1 10 100 1000 (MHz) (MHz) Figure 8. Frequency Response Figure 9. Bandwidth and Phase http://onsemi.com 6

NLAS4717EP DUT VCC VCC Output Input 0.1 (cid:3)F VOUT GND 300 (cid:2) 35 pF tBMM 90% 90% of VOH Output Switch Select Pin GND Figure 10. t (Time Break−Before−Make) BBM VCC DUT Input 50% 50% VCC Output 0 V 0.1 (cid:3)F VOUT VOH Open 300 (cid:2) 35 pF 90% 90% Output VOL Input tON tOFF Figure 11. t /t ON OFF VCC VCC DUT Input 50% 50% 300 (cid:2) 0 V Output VOUT VOH Open 35 pF Output 10% 10% VOL Input tOFF tON Figure 12. t /t ON OFF http://onsemi.com 7

NLAS4717EP 50 (cid:2) DUT Reference Input Transmitted Output 50 (cid:2) Generator 50 (cid:2) Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. (cid:4) (cid:5) VOUT VISO = Off Channel Isolation = 20 Log V I N for VIN at 100 kHz (cid:4) (cid:5) VOUT VONL = On Channel Loss = 20 Log V I N for VIN at 100 kHz to 50 MHz Bandwidth (BW) = the frequency 3.0 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 (cid:2) Figure 13. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/V ONL DUT VCC Open Output VIN GND CL Output Off On Off (cid:4)VOUT VIN Figure 14. Charge Injection: (Q) http://onsemi.com 8

NLAS4717EP PACKAGE DIMENSIONS Microbump−10 CASE 489AA−01 ISSUE A 4 X D A B NOTES: 0.10 C 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. PIN ONE E 3. COPLANARITY APPLIES TO SPHERICAL CORNER CROWNS OF SOLDER BALLS. MILLIMETERS DIM MIN MAX A −−− 0.650 A1 A1 0.210 0.270 A2 0.280 0.380 0.10 C D 1.965 BSC E 1.465 BSC A2 A b 0.250 0.350 e 0.500 BSC 0.075 C D1 1.500 BSC C SEATING E1 1.000 BSC PLANE D1 e 10 X b C 0.15 C A B B E1 A 0.05 C 1 2 3 4 e http://onsemi.com 9

NLAS4717EP PACKAGE DIMENSIONS WQFN10, 1.4x1.8, 0.4P CASE 488AQ−01 ISSUE C D A EDGE OF PACKAGE NO1.TEDSI:MENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. ÉÉ 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL ÉÉ AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. M1 4. COPLANARITY APPLIES TO THE EXPOSED PAD ÉÉ E AS WELL AS THE TERMINALS. PIN 1 REFERENCE 5. EXPOSED PADS CONNECTED TO DIE FLAG. DETAIL A USED AS TEST CONTACTS. 2X 0.15 C Bottom View MILLIMETERS (Optional) DIM MIN MAX 0.15 C A 0.70 0.80 2X B EXPOSED Cu MOLD CMPD AA13 0.00.020 RE0F.050 ÉÉÉ b 0.15 0.25 A D 1.40 BSC 0.10 C ÉÉÉÉÉÉ A3 E 1.80 BSC e 0.40 BSC 0.08 C L 0.30 0.50 L1 0.40 0.60 A1 M1 0.00 0.05 A1 DETAIL B A3 C SEATING Side View PLANE (Optional) MOUNTING FOOTPRINT* 3 5 e/2 9 XL 6 1.700 9 X 0.0669 0.563 e 1 0.663 0.0221 0.0261 10 0.200 L1 10 X 0.10 C A B 0.0079 b 1 0.05 C NOTE 3 2.100 0.0827 0.400 0.0157 PITCH 10 X 0.225 (cid:4) (cid:5) 0.0089 mm SCALE 20:1 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com NLAS4717EP/D 10

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: NLAS4717EPMTR2G NLAS4717EPFCT1G