NL7WB66 Ultra-Small SPST Analog Switch The NL7WB66 is a very low R dual SPST analog switch. R is ON ON 5.0 (cid:2) (Typ) at 5.0 V. The device is offered in the very popular low cost US8 package. It is designed as a general purpose dual switch and can be used to switch either analog signals such as audio and video or www.onsemi.com digital signal such as TTL, CMOS, LVDS, ECL, or complex digital signals such as QPSK. MARKING DIAGRAM Features 8 • Excellent Performance RDS = 5.0 (cid:2) at 5.0 V ON • High Speed Operation: tPD = 0.25 ns (Max) at 5.0 V 8 US8 AJM (cid:2) • US SUFFIX (cid:2) 1.65 to 5.5 V Operating Range CASE 493 • 1 Reduced Threshold Voltages for LVTTL on Control Pin ♦ Eliminates the Need for Translators for Many Applications 1 ♦ TTL Compatibility when V is 5.0 V CC ♦ Can Operate with 1.8 V Inputs, if V is 3.0 AJ = Device Code CC ♦ Also Meets Full CMOS Specifications M = Date Code* • (cid:2) = Pb−Free Package Ultra−Low Charge Injection = 7.5 pC at 5.0 V • Low Stand−by Power I = 1.0 nA (Max) at T = 25°C (Note: Microdot may be in either location) CC A *Date Code orientation may vary depending up- • Control Pins IN1, IN2, are Overvoltage Tolerant on manufacturing location. • Pin for Pin Replacement TC7WB66, NC7WB66, 74LVC2G66 • ESD Protection: PIN ASSIGNMENT Machine Model >200 V, Pin Function OVT Human Body Model >2000 V • 11 NO1 − Latchup Max Rating: 200 mA • 2 COM1 − These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS 3 OE2 Yes Compliant 4 GND − Typical Applications 5 NO2 − • Cell Phones 6 COM2 − • PDAs • 7 OE1 Yes Digital Still Cameras • 8 VCC − Video • Digital Video FUNCTION TABLE On/Off State of Enable Input Analog Switch NO1 1 8 VCC L Off H On COM1 2 7 OE1 OE2 3 6 COM2 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. GND 4 5 NO2 Figure 1. Pin Assignment Diagram © Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: July, 2015 − Rev. 6 NL7WB66/D

NL7WB66 MAXIMUM RATINGS Symbol Rating Value Unit VCC DC Supply Voltage (cid:2)0.5 to (cid:3)7.0 V VI DC Input Voltage (cid:2)0.5 to (cid:3)7.0 V VO DC Output Voltage (cid:2)0.5 to (cid:3)7.0 V IIK DC Input Diode Current VI < GND (cid:2)50 mA IOK DC Output Diode Current VO < GND (cid:2)50 mA IO DC Output Sink Current (cid:4)50 mA ICC DC Supply Current per Supply Pin (cid:4)100 mA IGND DC Ground Current per Ground Pin (cid:4)100 mA TSTG Storage Temperature Range (cid:2)65 to (cid:3)150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature under Bias (cid:3)150 °C (cid:3) Thermal Resistance 250 °C/W JA PD Power Dissipation in Still Air at 85°C 250 mW MSL Moisture Sensitivity Level 1 − FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − VESD ESD Withstand Voltage Human Body Model (Note 2) > 2000 V Machine Model (Note 3) > 200 Charged Device Model (Note 4) N/A Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC Positive DC Supply Voltage 1.65 5.5 V VIN Digital Input Voltage (Enable) GND 5.5 V VIO Static or Dynamic Voltage Across an Off Switch GND VCC V VIS Analog Input Voltage NO GND VCC V COM TA Operating Temperature Range, All Package Types −55 +125 °C tr, tf Input Rise or Fall Time VCC = 3.3 V + 0.3 V 0 100 ns/V (Enable Input) VCC = 5.0 V + 0.5 V 0 20 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DEVICE JUNCTION TEMPERATURE VS. TIME TO 0.1% BOND FAILURES Junction Temperature (cid:2)C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 www.onsemi.com 2

NL7WB66 E T FAILURE RATE OF PLASTIC = CERAMIC A R UNTIL INTERMETALLICS OCCUR E R C C C C AILU °130 °120 °110 °100 °90C °80C F = = = = = = D J J J J J J E T T T T T T LIZ 1 A M R O 1 10 100 1000 N TIME, YEARS Figure 2. Failure Rate vs. Time Junction Temperature DC CHARACTERISTICS − Digital Section (Voltages Referenced to GND) Guaranteed Max Limit −40 to −55 to Symbol Parameter Condition VCC 25(cid:2)C 85(cid:2)C <125(cid:2)C Unit VIH High−level Input Voltage, 1.65 to 1.95 VCC x 0.65 VCC x 0.65 VCC x 0.65 V Control Input 2.3 to 2.7 VCC x 0.7 VCC x 0.7 VCC x 0.7 3.0 to 3.6 VCC x 0.7 VCC x 0.7 VCC x 0.7 4.5 to 5.5 VCC x 0.7 VCC x 0.7 VCC x 0.7 VIL Low−level Input Voltage, 1.65 to 1.95 VCC x 0.35 VCC x 0.35 VCC x 0.35 V Control Input 2.3 to 2.7 VCC x 0.3 VCC x 0.3 VCC x 0.3 3.0 to 3.6 VCC x 0.3 VCC x 0.3 VCC x 0.3 4.5 to 5.5 VCC x 0.3 VCC x 0.3 VCC x 0.3 IIN Maximum Input Leakage VIN = 5.5 V or GND 0 V to 5.5 V +0.1 +1.0 +1.0 (cid:4)A Current, Enable Inputs ICC Maximum Quiescent Enable and VIS = VCC 5.5 1.0 1.0 2.0 (cid:4)A Supply Current or GND (per package) Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3

NL7WB66 DC ELECTRICAL CHARACTERISTICS − Analog Section Guaranteed Max Limit Symbol Parameter Condition VCC 25(cid:2)C −40 to 85(cid:2)C −55 to <125(cid:2)C Unit RON On−State Switch VIS = VCC IS = 4 mA 1.65 30 30 30 (cid:2) Resistance VIS = GND IS = 4 mA 1.65 15 15 15 VIS = VCC IS = 8 mA 2.3 20 20 20 VIS = GND IS = 8 mA 2.3 10 10 10 VIS = VCC IS = 24 mA 3.0 15 15 15 VIS = GND IS = 24 mA 3.0 7.0 7.0 7.0 VIS = VCC IS = 32 mA 4.5 10 10 10 VIS = 2.4 IS = 15 mA 4.5 8.0 8.0 8.0 VIS = GND IS = 32 mA 4.5 5.0 5.0 5.0 RON(p) Peak On−State Resistance VIS = VCC to GND, IS = 4 mA 1.65 120 120 120 (cid:2) VIN = VIH IS = 8 mA 2.3 30 30 30 IS = 24 mA 3.0 20 20 20 IS = 32 mA 4.5 15 15 15 (cid:5) RON Difference of On−State VIS = VCC to GND, IS = 4 mA 1.65 1.2 1.2 1.2 (cid:2) Resistance between VIN = VIH IS = 8 mA 2.3 1.3 1.3 1.3 Switches IS = 24 mA 3.0 1.5 1.5 1.5 IS = 32 mA 4.5 2.0 2.0 2.0 RFLAT VIS = VCC to GND IS = 4 mA 1.65 240 240 240 (cid:2) IS = 8 mA 2.3 60 60 60 IS = 24 mA 3.0 14 14 14 IS = 32 mA 4.5 5.0 5.0 5.0 INO(OFF) Off Leakage Current VIN = VIL 5.5 1.0 10 100 nA VNO = 1.0 V, VCOM = 4.5 V or VCOM = 1.0 V and VNO 4.5 V ICOM(OFF) Off Leakage Current VIN = VIL 5.5 1.0 10 100 nA VNO = 4.5 V or 1.0 V VCOM = 1.0 V or 4.5 V AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Max Limit VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5.0 V (cid:2)0.15 V (cid:2)0.2 V (cid:2)0.3 V (cid:2)0.5 V Symbol Parameter Test Conditions Min Max Min Max Min Max Min Max Unit tON Output Enable Time 2.3 10 1.6 5.6 1.5 4.4 1.3 3.9 ns tOFF Output Disable Time 2.5 10.5 1.2 6.9 2.0 7.2 1.1 6.3 ns tPD Propagation Delay Time − 0.55 − 0.5 − 0.35 − 0.25 ns Typical @ 25(cid:2)C, VCC = 5.0 V Unit CIN Maximum Input Capacitance, Select Input 3.0 pF CNO1 or CNO2 Analog I/O (Switch Off) 10 CCOM(OFF) Common I/O (Switch Off) 10 CCOM(ON) Feed−through (Switch Off) 10 www.onsemi.com 4

NL7WB66 ADDITIONAL APPLICATIONS CHARACTERISTICS (Voltage Reference to GND Unless Noted) Symbol Parameter Condition VCC (V) Typical 25(cid:2)C Unit BW Maximum On−Channel −3.0 dB VIS = 0 dBm 2.0 102 MHz Bandwidth or Minimum Frequency VIS centered between VCC and GND 3.0 180 Response 4.5 186 VONL Maximum Feed−Through On Loss VIS = 0 dBm @ 10 kHz 2.0 −2.2 dB VIS centered between VCC and GND 3.0 −0.8 4.5 −0.4 VISO Off−Channel Isolation f = 100 kHz 2.0 −73 dB VIS = 1.0 V RMS 3.0 −74 VIS centered between VCC and GND 4.5 −75 Q Charge Injection VIS = VCC to GND, FIS = 20 kHz pC Enable Input to Common I/O tr = tf = 3.0 nS 3.0 4.8 RIS = 0 (cid:2), CL = 100 pF 5.5 7.5 THD Total Harmonic Distortion FIS = 10 Hz to 100 kHz, % TDH + Noise RL = Rgen = 600 (cid:2), CL = 50 pF 3.0 0.19 VIS = 3.0 VPP Sine Wave 5.5 0.06 VIS = 5.0 VPP Sine Wave DEVICE ORDERING INFORMATION Device Order Number Package Shipping† NL7WB66USG US8 3000 Units / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5

NL7WB66 TIMING INFORMATION VCC DUT Input 50% 50% NO VCC COM 0 V 0.1 (cid:4)F VOUT VOH 300 (cid:2) 35 pF 90% 90% Output VOL Input Figure 3. tON/tOFF tON tOFF VCC VCC Input 50% 50% DUT NO 300 (cid:2) 0 V COM VOUT VOH 35 pF Output 10% 10% VOL Input Figure 4. tON/tOFF tOFF tON DUT Reference COM Transmitted NO 50 (cid:2) Generator 50 (cid:2) Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. (cid:5) (cid:6) VOUT VISO = Off Channel Isolation = 20 Log V I N for VIN at 100 kHz (cid:5) (cid:6) VOUT VONL = On Channel Loss = 20 Log V I N for VIN at 100 kHz to 50 MHz Bandwidth (BW) = the frequency 3 dB below VONL Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/V ONL DUT VCC NO COM VIN GND CL Output Off On Off (cid:5)VOUT VIN Figure 6. Charge Injection: (Q) www.onsemi.com 6

NL7WB66 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE D NOTES: X Y 1. DIMENSIONING AND TOLERANCING PER ANSI A J Y14.5M, 1982. 8 5 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.14MM (0.0055”) PER SIDE. DETAIL E 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH B L AND PROTRUSION SHALL NOT EXCEED 0.14MM (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203MM (0.003−0.008”). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508MM (0.0002”). 1 4 R MILLIMETERS INCHES G S DIM MIN MAX MIN MAX P A 1.90 2.10 0.075 0.083 U B 2.20 2.40 0.087 0.094 C 0.60 0.90 0.024 0.035 C D 0.17 0.25 0.007 0.010 H F 0.20 0.35 0.008 0.014 SPELAATNIENG D K 0.10 (0.004) T N GH 00..5400 BRSECF 00..002106 BRSECF J 0.10 0.18 0.004 0.007 T R 0.10 TYP 0.10 (0.004) M T X Y K 0.00 0.10 0.000 0.004 L 3.00 3.20 0.118 0.128 M 0 (cid:3) 6 (cid:3) 0 (cid:3) 6 (cid:3) V N 0 (cid:3) 10 (cid:3) 0 (cid:3) 10 (cid:3) M P 0.23 0.34 0.010 0.013 R 0.23 0.33 0.009 0.013 S 0.37 0.47 0.015 0.019 U 0.60 0.80 0.024 0.031 F V 0.12 BSC 0.005 BSC DETAIL E RECOMMENDED SOLDERING FOOTPRINT* 8X 0.30 8X 0.68 3.40 1 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative www.onsemi.com NL7WB66/D 7

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