NL27WZ125 Dual Buffer with 3-State Outputs The NL27WZ125 is a high performance dual noninverting buffer operating from a 1.65 V to 5.5 V supply. Features www.onsemi.com • Designed for 1.65 V to 5.5 V V Operation CC • MARKING 2.7 ns t at V = 5 V (typ) PD CC • DIAGRAMS Inputs/Outputs Overvoltage Tolerant up to 5.5 V • I Supports Partial Power Down Protection OFF • Source/Sink 24 mA at 3.0 V • US8 XX M Available in US8, UDFN8 and UQFN8 Packages US SUFFIX (cid:2) • Chip Complexity < 100 FETs CASE 493 • NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable UDFN8, 1.45x1.0 • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS MU3 SUFFIX X M Compliant CASE 517BZ 1 UDFN8, 1.95x1.0 MU1 SUFFIX X M OEA11 EN 1 Y1 CASE 517CA 1 OEA22 Y2 UQFN8, 1.4x1.2 MQ2 SUFFIX XM Figure 1. Logic Symbol CASE 523AS 1 1 UQFN8, 1.6x1.6 MQ1 SUFFIX XX M(cid:2) 8 CASE 523AN 1 X, XX = Specific Device Code M = Date Code* (cid:2) = Pb−Free Package ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2011 1 Publication Order Number: January, 2019 − Rev. 11 NL27WZ125/D

NL27WZ125 OE2 Y1 A2 7 6 5 OE1 1 8 VCC OE1 1 8 VCC VCC GND A1 2 7 OE2 A1 2 7 OE2 8 4 Y2 3 6 Y1 Y2 3 6 Y1 1 2 3 GND 4 5 A2 OE1 A1 Y2 GND 4 5 A2 UQFN8 US8 UDFN8 Figure 2. Pinout PIN ASSIGNMENT FUNCTION TABLE Y = AB Pin Function Input Output 1 OE1 2 A1 OEn B Yn L L L 3 Y2 L H H 4 GND H X Z 5 A2 6 Y2 X = Don’t Care n = 1, 2 7 OE2 8 VCC www.onsemi.com 2

NL27WZ125 MAXIMUM RATINGS Symbol Characteristics Value Unit VCC DC Supply Voltage −0.5 to +6.5 V VIN DC Input Voltage −0.5 to +6.5 V DC Output Voltage Active−Mode (High or Low State) −0.5 to VCC + 0.5 V Tri−State Mode (Note 1) −0.5 to +6.5 Power−Down Mode (VCC = 0 V) −0.5 to +6.5 IIK DC Input Diode Current VIN < GND −50 mA IOK DC Output Diode Current VOUT < GND −50 mA IOUT DC Output Source/Sink Current ±50 mA ICC or IGND DC Supply Current per Supply Pin or Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 secs 260 °C TJ Junction Temperature Under Bias +150 °C (cid:2)JA Thermal Resistance (Note 2) US8 250 °C/W UQFN8 208 UDFN8 111 PD Power Dissipation in Still Air US8 250 mW UDFN8 601 UQFN8 1127 MSL Moisture Sensitivity Level 1 − FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − VESD ESD Withstand Voltage (Note 3) Human Body Model 2000 V Charged Device Model 1000 ILatchup Latchup Performance (Note 4) (cid:2)100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow. 3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC Positive DC Supply Voltage 1.65 5.5 V VIN DC Input Voltage 0 5.5 V VOUT DC Output Voltage Active−Mode (High or Low State) 0 VCC Tri−State Mode (Note 1) 0 5.5 Power−Down Mode (VCC = 0 V) 0 5.5 TA Operating Temperature Range −55 +125 °C tr , tf Input Rise and Fall Time VCC = 1.65 V to 1.95 V 0 20 ns/V VCC = 2.3 V to 2.7 V 0 20 VCC = 3.0 V to 3.6 V 0 10 VCC = 4.5 V to 5.5 V 0 5 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3

NL27WZ125 DC ELECTRICAL CHARACTERISTICS VCC TA = 25(cid:2)C −55(cid:2)C (cid:3) TA (cid:3) 125(cid:2)C Symbol Parameter Condition (V) Min Typ Max Min Max Units VIH High−Level Input 1.65 to 1.95 0.65 VCC − − 0.65 VCC − V Voltage 2.3 to 5.5 0.70 VCC − − 0.70 VCC − VIL Low−Level Input 1.65 to 1.95 − − 0.35 VCC − 0.35 VCC V Voltage 2.3 to 5.5 − − 0.30 VCC − 0.30 VCC VOH High−Level Output VIN = VIH or VIL V Voltage IOH = −100 (cid:3)A 1.65 to 5.5 VCC − 0.1 VCC − VCC − 0.1 − IOH = −4 mA 1.65 1.29 1.4 − 1.29 − IOH = −8 mA 2.3 1.9 2.1 − 1.9 − IOH = −12 mA 2.7 2.2 2.4 − 2.2 − IOH = −16 mA 3.0 2.4 2.7 − 2.4 − IOH = −24 mA 3.0 2.3 2.5 − 2.3 − IOH = −32 mA 4.5 3.8 4.0 − 3.8 − VOL Low−Level Output VIN = VIH or VIL V Voltage IOL = 100 (cid:3)A 1.65 to 5.5 − 0.1 − 0.1 IOL = 4 mA 1.65 − 0.08 0.24 − 0.24 IOL = 8 mA 2.3 − 0.2 0.3 − 0.3 IOL = 12 mA 2.7 − 0.22 0.4 − 0.4 IOL = 16 mA 3.0 − 0.28 0.4 − 0.4 IOL = 24 mA 3.0 − 0.38 0.55 − 0.55 IOL = 32 mA 4.5 − 0.42 0.55 − 0.55 IIN Input Leakage Current VIN = 5.5 V or 1.65 to 5.5 − − ±0.1 − ±1.0 (cid:3)A GND IOFF Power Off Leakage VIN = 5.5 V or 0 − − 1.0 − 10 (cid:3)A Current VOUT = 5.5 V ICC Quiescent Supply VIN = VCC or GND 5.5 − − 1.0 − 10 (cid:3)A Current IOZ 3−State Output Leakage VIN = VIL or VIH 2.3 to 5.5 − − ±0.5 − ±5 (cid:3)A 0 V ≤ VOUT ≤ 5.5 V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 4

NL27WZ125 AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns) VCC TA = 25(cid:2)C −55(cid:2)C (cid:3) TA (cid:3) 125(cid:2)C Symbol Parameter (V) Condition Min Typ Max Min Max Units tPLH Propagation Delay 1.8 ±0.15 CL = 15 pF, RL = 1 M(cid:4) − 6.0 12.0 − 13.0 ns tPHL 2.5 ±0.2 R1 = Open − 3.5 7.5 − 8.0 3.3 ±0.3 − 2.6 5.2 − 5.5 5.0 ± 0.5 − 2.0 5.7 − 6.0 3.3 ± 0.3 CL = 50 pF, RL = 500 (cid:4) − 3.0 4.5 − 4.8 R1 = Open 5.0 ± 0.5 − 2.4 5.0 − 5.3 tOSLH Output to Output Skew 3.3 ± 0.3 RL = 500 (cid:4), CL = 50 pF − 0.08 1.0 − 1.0 ns tOSHL 5.0 ± 0.5 − 0.05 0.8 − 0.8 tPZH Output Enable Time 1.8 ± 0.15 − 6.5 14.0 − 15.0 ns tPZL 2.5 ± 0.2 − 3.7 8.5 − 9.0 3.3 ± 0.3 − 2.8 6.2 − 6.5 5.0 ± 0.5 − 2.1 5.5 − 5.8 tPHZ Output Enable Time 1.8 ± 0.15 − 4.2 12.0 − 13.0 ns tPLZ 2.5 ± 0.2 − 3.1 8.0 − 8.5 3.3 ± 0.3 − 2.6 5.7 − 6.0 5.0 ± 0.5 − 2.6 4.7 − 5.0 CAPACITIVE CHARACTERISTICS (tR = tF = 3.0 ns) Symbol Parameter Condition Typical Units CIN Input Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VIN = 0 V or VCC 9 pF (Note 5) 10 MHz, VCC = 5.5 V, VIN = 0 V or VCC 11 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD (cid:2) VCC (cid:2) fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD (cid:2) VCC2 (cid:2) fin + ICC (cid:2) VCC. www.onsemi.com 5

NL27WZ125 OPEN Test Switch CL, pF RL, (cid:2) R1, (cid:2) 2 x VCC GND Position tPLH / tPHL Open See AC Characteristics Table R1 tPLZ / tPZL 2 x VCC 50 500 500 DUT OUTPUT tPHZ / tPZH GND 50 500 500 X = Don’t Care RT RL CL* CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 (cid:4)) f = 1 MHz Figure 3. Test Circuit tr = 3 ns tf = 3 ns VCC 90% 90% VCC INPUT Vmi Vmi INPUT Vmi Vmi GND 10% 10% GND tPZL tPLZ tPHL tPLH ~VCC VOH OUTPUT Vmo Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH tPHL tPZH tPHZ VOH VOH −V OVHY OUTPUT Vmo Vmo OUTPUT Vmo VOL ~0 V Figure 4. Switching Waveforms Vmo, V VCC, V Vmi, V tPLH, tPHL tPZL, tPLZ, tPZH, tPHZ VY, V 1.65 to 1.95 VCC/2 (VOH − VOL)/2 VCC/2 0.15 2.3 to 2.7 VCC/2 (VOH − VOL)/2 VCC/2 0.15 3.0 to 3.6 VCC/2 (VOH − VOL)/2 VCC/2 0.3 4.5 to 5.5 VCC/2 (VOH − VOL)/2 VCC/2 0.3 www.onsemi.com 6

NL27WZ125 DEVICE ORDERING INFORMATION Pin 1 Orientation Device Packages Specific Device Code (See below) Shipping† NL27WZ125USG US8 M0 Q4 3000 / Tape & Reel NLV27WZ125USG* US8 TBD Q4 3000 / Tape & Reel (In Development) NL27WZ125MQ1TCG UQFN8, 1.6 x 1.6, 0.5P TBD TBD 3000 / Tape & Reel (In Development) NL27WZ125MU1TCG UDFN8, 1.95 x 1.0, 0.5P TBD TBD 3000 / Tape & Reel (In Development) NL27WZ125MU3TCG UDFN8, 1.45 x 1.0, 0.5P TBD TBD 3000 / Tape & Reel (In Development) NL27WZ125MQ2TCG UQFN8, 1.4 x 1.2, 0.5P TBD TBD 3000 / Tape & Reel (In Development) NL27WZ125 SM8 TBD TBD 3000 / Tape & Reel (In Development) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. Pin 1 Orientation in Tape and Reel www.onsemi.com 7

NL27WZ125 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 −X− ISSUE B NOTES: A 1. DIMENSIONING AND TOLERANCING PER 8 5 −Y− J ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM DETAIL E (0.0055”) PER SIDE. B L 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH 1 4 THICKNESS OF 0.0076−0.0203 MM. R (300−800 “). G 6. ALL TOLERANCE UNLESS OTHERWISE P S SPECIFIED ±0.0508 (0.0002 “). U MILLIMETERS INCHES C DIM MIN MAX MIN MAX H A 1.90 2.10 0.075 0.083 −T− K 0.10 (0.004) T B 2.20 2.40 0.087 0.094 SEATING D N C 0.60 0.90 0.024 0.035 PLANE D 0.17 0.25 0.007 0.010 0.10 (0.004) M T X Y R 0.10 TYP F 0.20 0.35 0.008 0.014 G 0.50 BSC 0.020 BSC H 0.40 REF 0.016 REF V J 0.10 0.18 0.004 0.007 M K 0.00 0.10 0.000 0.004 L 3.00 3.20 0.118 0.126 M 0 (cid:3) 6 (cid:3) 0 (cid:3) 6 (cid:3) N 5 (cid:3) 10 (cid:3) 5 (cid:3) 10 (cid:3) F P 0.23 0.34 0.010 0.013 R 0.23 0.33 0.009 0.013 DETAIL E S 0.37 0.47 0.015 0.019 U 0.60 0.80 0.024 0.031 V 0.12 BSC 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.015 0.50 1.8 0.0197 0.07 0.30 0.012 1.0 0.0394 (cid:3) (cid:4) mm SCALE 8:1 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8

NL27WZ125 PACKAGE DIMENSIONS UDFN8, 1.45x1, 0.35P CASE 517BZ ISSUE O D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED PIN ONE TERMINAL AND IS MEASURED BETWEEN REFERENCE ÉÉ E 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF 2X 0.10 C ÉÉ BURRS AND MOLD FLASH. MILLIMETERS DIM MIN MAX 2X 0.10 C A 0.45 0.55 TOP VIEW A1 0.00 0.05 A3 0.13 REF 0.05 C A3 b 0.15 0.25 D 1.45 BSC E 1.00 BSC A e 0.35 BSC L 0.25 0.35 0.05 C L1 0.30 0.40 SIDE VIEW A1 C SEATING RECOMMENDED PLANE SOLDERING FOOTPRINT* 7X e/2 0.48 08X.22 e 7XL 1 4 L1 1.18 1 8 5 8Xb 0.53 0.35 PKG PITCH 0.10 M C A B OUTLINE DIMENSIONS: MILLIMETERS BOTTOM VIEW 0.05 M C NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 9

NL27WZ125 PACKAGE DIMENSIONS UDFN8, 1.95x1, 0.5P CASE 517CA ISSUE O D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED PIN ONE TERMINAL AND IS MEASURED BETWEEN REFERENCE ÉÉ E 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF ÉÉ BURRS AND MOLD FLASH. 2X 0.10 C MILLIMETERS DIM MIN MAX 2X 0.10 C A 0.45 0.55 TOP VIEW A1 0.00 0.05 A3 0.13 REF A3 b 0.15 0.25 0.05 C D 1.95 BSC E 1.00 BSC A e 0.50 BSC L 0.25 0.35 L1 0.30 0.40 0.05 C SIDE VIEW A1 C SEATING RECOMMENDED PLANE SOLDERING FOOTPRINT* 7X e/2 0.49 8X 0.30 e 7XL 1 4 L1 1.24 8 5 1 8Xb 0.54 0.50 PKG 0.10 M C A B OUTLINE PITCH BOTTOM VIEW 0.05 M C NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 10

NL27WZ125 PACKAGE DIMENSIONS UQFN8, 1.4x1.2, 0.4P CASE 523AS ISSUE A D A L L N1O.TDEISM:ENSIONING AND TOLERANCING PER B ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. L1 3. DIMENSION b APPLIES TO PLATED TERMINAL PIN ONE AND IS MEASURED BETWEEN 0.15 AND REFERENCE ÉÉ 0.25 mm FROM THE TERMINAL TIP. E DETAIL A 2X 0.10 CÉÉ ALTERNATE MILLIMETERS CONSTRUCTIONS DIM MIN MAX A 0.45 0.55 2X 0.10 C A1 0.00 0.05 TOP VIEW EXPOSED Cu MOLD CMPD A3 0.13 REF ÉÉ b 0.15 0.25 D 1.40 BSC DETAIL B (A3) A ÇÇ E 1.20 BSC e 0.40 BSC 0.05 C DETAIL B L 0.20 0.40 ALTERNATE L1 −−− 0.15 CONSTRUCTION L2 0.30 0.50 8X 0.05 C A1 SOLDERING FOOTPRINT* C SEATING SIDE VIEW PLANE 1.61 L2 L 0.55 2 4 DETAIL A 1 1 7X 1.40 0.45 8 6 e 6Xb 0.10 M C A B BOTTOM VIEW 0.05 M C NOTE 3 8X 0.25 0P.I4T0CH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 11

NL27WZ125 PACKAGE DIMENSIONS UQFN8, 1.6x1.6, 0.5P CASE 523AN ISSUE O D A EXPOSED Cu MOLD CMPD NOTES: 1. DIMENSIONING AND TOLERANCING PER B ASME Y14.5M, 1994. ÉÉ ÇÉÇÉ 2. CONTROLLING DIMENSION: MILLIMETERS. PIN ONE A3 3. DIMENSION b APPLIES TO PLATED TERMINAL REFERENCE ÉÉ ÉÉ AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. E 2X A1 MILLIMETERS 0.10 C DETAIL B DIM MIN MAX 2X OPTIONAL A 0.45 0.60 CONSTRUCTION A1 0.00 0.05 0.10 C A3 0.13 REF b 0.15 0.25 TOP VIEW L1 L3 D 1.60 BSC E 1.60 BSC DETAIL B (A3) A Le 0.03.550 BS0.C45 0.05 C L1 −−− 0.15 L3 0.25 0.35 b (0.15) 0.05 C (0.10) SOLDERING FOOTPRINT* SIDE VIEW C SEATING DETAIL A A1 PLANE OPTIONAL 1.70 0.50 CONSTRUCTION PITCH 8X 1 L3 8XL e 5 3 0.35 1.70 1 7 8 DETAIL A 8Xb 7X 0.25 0.10 C A B 88XX 00..5533 BOTTOM VIEW 0.05 C NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada For additional information, please contact your local Email: orderlit@onsemi.com Sales Representative ◊ www.onsemi.com NL27WZ125/D 12