No.JEMCP0-010859B CHIPEMIFIL®CHIP3-TERMINALCAPACITORFORLARGECURRENTFORGENERAL NFM18CCSeries ReferenceSheet 1.Scope ThisproductspecificationisappliedtoChipEMIFIL®Chip3-terminalCapacitorusedforGeneralElectronicequipment. 2.ReferencePARTNo.List CustomerPARTNO. MURATAPARTNO. 1 NFM18CC101R1C3D 2 NFM18CC102R1C3D 3 NFM18CC220U1C3D 4 NFM18CC221R1C3D 5 NFM18CC222R1C3D 6 NFM18CC223R1C3D 7 NFM18CC470U1C3D 8 NFM18CC471R1C3D 3.MURATAPart NO.System (Ex.) NFM 18 CC 101 R 1C 3 D (1)L/W (3)Nominal (4) (5)DCRated (7)Packaging (2)Features (6)Electrode Dimensions Capacitance Characteristics Voltage Code 4.Type& Dimensions (Unit:mm) (1)-1L (1)-2W T e g MURATAPARTNO. i j 1.6±0.1 0.8±0.1 0.6±0.1 0.25±0.1 0.2min. 1 NFM18CC101R1C3D 0.4±0.1 0.2±0.1 1.6±0.1 0.8±0.1 0.6±0.1 0.25±0.1 0.2min. 2 NFM18CC102R1C3D 0.4±0.1 0.2±0.1 1.6±0.1 0.8±0.1 0.6±0.1 0.25±0.1 0.2min. 3 NFM18CC220U1C3D 0.4±0.1 0.2±0.1 1.6±0.1 0.8±0.1 0.6±0.1 0.25±0.1 0.2min. 4 NFM18CC221R1C3D 0.4±0.1 0.2±0.1 1.6±0.1 0.8±0.1 0.6±0.1 0.25±0.1 0.2min. 5 NFM18CC222R1C3D 0.4±0.1 0.2±0.1 1.6±0.1 0.8±0.1 0.6±0.1 0.25±0.1 0.2min. 6 NFM18CC223R1C3D 0.4±0.1 0.2±0.1 1.6±0.1 0.8±0.1 0.6±0.1 0.25±0.1 0.2min. 7 NFM18CC470U1C3D 0.4±0.1 0.2±0.1 1.6±0.1 0.8±0.1 0.6±0.1 0.25±0.1 0.2min. 8 NFM18CC471R1C3D 0.4±0.1 0.2±0.1 1

No.JEMCP0-010859B a)EquivalentCircuit 5.Ratedvalue (5) Rated (3)Nominal Capacitance DC Insulation SpecificationsandTestMethods MURATAPARTNO. Rated Current Capacitance Tolerance Resistance Resistance (Operating/StorageTemp.Range) Voltage (mA) Section7.1 1 NFM18CC101R1C3D 100pF ±20% DC16V 500mA(DC) 0.3Ωmax. 1000MΩmin. (-55to125°C/-55to125°C) Section7.1 2 NFM18CC102R1C3D 1000pF ±20 % DC 16 V 600mA(DC) 0.3Ωmax. 1000MΩmin. (-55to125°C/-55to125°C) Section7.1 3 NFM18CC220U1C3D 22 pF ±20 % DC 16 V 400mA(DC) 0.3Ωmax. 1000MΩmin. (-55to125°C/-55to125°C) Section7.1 4 NFM18CC221R1C3D 220 pF ±20 % DC 16 V 500mA(DC) 0.3Ωmax. 1000MΩmin. (-55to125°C/-55to125°C) Section7.1 5 NFM18CC222R1C3D 2200 pF ±20 % DC 16 V 700mA(DC) 0.3Ωmax. 1000MΩmin. (-55to125°C/-55to125°C) Section7.1 6 NFM18CC223R1C3D 22000 pF ±20 % DC 16 V 1A(DC) 0.05Ωmax.1000MΩmin. (-55to125°C/-55to125°C) Section7.1 7 NFM18CC470U1C3D 47 pF ±20 % DC 16 V 400mA(DC) 0.3Ωmax. 1000MΩmin. (-55to125°C/-55to125°C) Section7.1 88 NNFFMM1188CCCC447711RR11CC33DD 447700ppFF ±±2200%% DDCC1166VV 550000mmAA((DDCC)) 00..33ΩΩmmaaxx.. 11000000MMΩΩmmiinn.. (-55to125°C/-55to125°C) 6.Package MURATAPARTNO. (7)Packaging PackagingUnit f180mmReel 1 NFM18CC101R1C3D 4000pcs./Reel PAPER f180mmReel 2 NFM18CC102R1C3D 4000pcs./Reel PAPER f180mmReel 3 NFM18CC220U1C3D 4000pcs./Reel PAPER f180mmReel 4 NFM18CC221R1C3D 4000pcs./Reel PAPER f180mmReel 5 NFM18CC222R1C3D 4000pcs./Reel PAPER f180mmReel 6 NFM18CC223R1C3D 4000pcs./Reel PAPER f180mmReel 7 NFM18CC470U1C3D 4000pcs./Reel PAPER f180mmReel 8 NFM18CC471R1C3D 4000pcs./Reel PAPER ProductspecificationsinthiscatalogareasofDec.15,2014,andaresubjecttochangeorobsolescencewithoutnotice. Pleaseconsulttheapprovalsheetbeforeordering. Pleasereadratingand!Cautionsfirst. 2

7.1 7 ■SPECIFICATIONS AND TESTMETHODS ElectricalPerformance No Item Specification TestMethod 1 Capacitance Meetitem5. Frequency (Cap.) 22to47pF:1±0.1MHz 100to22000pF:1±0.1kHz Voltage:1±0.2V(rms) 2 Insulation Voltage:RatedVoltage Resistance(I.R.) Time:2minutesmax. 3 DCResistance Measuredwith100mAmax. (Rdc1,2) Rdc1:betweensignalterminals Rdc2:betweengroundterminals Rdc2 Rdc1 Rdc1 Rdc2 4 WithstandingVoltage Productsshallnotbedamaged. TestVoltage:RatedVoltagex300% Time:1to5s ChargeCurrent:50mAmax. 5 OperatingTemperature Showninitem5. Includesself-heating 6 StorageTemperature StandardTestingCondition <Unlessotherwisespecified> <Incaseofdoubt> Temperature:OrdinaryTemp./15°Cto35°C Temperature:20°C±2°C Humidity:OrdinaryHumidity/25%(RH)to85%(RH) Humidity:60%(RH)to70%(RH) Atmosphericpressure:86kPato106kPa JJEEMMCCPPSS--0022220099BB 3

7.1 7 ■SPECIFICATIONS AND TESTMETHODS MechanicalPerformance No Item Specification TestMethod 1 Appearanceand Meetitem4. VisualInspectionandmeasuredwithSlideCalipersor Dimensions Micrometer. 2 Solderability Electrodesshallbeatleast90%coveredwith Flux:Ethanolsolutionofrosin,25(wt)% newsoldercoating. Pre-heat:150±10°C,60to90s Solder:Sn-3.0Ag-0.5Cu SolderTemperature:240±3°C ImmersionTime:3±1s Immersionandemersionrates:25mm/s 3 Resistanceto MeetTable1. Flux:Ethanolsolutionofrosin,25(wt)% solderingheat Table1 Pre-heat:150±10°C,60to90s Appearance Nodamaged Solder:Sn-3.0Ag-0.5Cu Cap.Change Within±7.5% SolderTemperature:270±5°C I.R. Meettheinitialratedvalue. ImmersionTime:10±1s 22to2200pF 0.5max. Immersionandemersionrates:25mm/s Rdc1,2 22000pF 0.05max. Initialvalues:About100to22000pF, measuredafterheattreatment(150+0/-10°C,1hour)and exposureintheroomconditionfor48±4hours. Thenmeasuredafterexposureintheroomconditionfor followinghours. 22to47pF :24±2hours 100to22000pF:48±4hours 4 BendingStrength MeetTable2. Itshallbesolderedontheglass-epoxysubstrate(t=1.0mm). Table2 Deflection:2mm KeepingTime:30s Pressurejig Appearance Nodamaged Cap.Change Within±7.5% R340 F 22to2200pF 0.5max. Rdc1,2 22000pF 0.05max. Deflection 4455 4455 PPrroodduucctt ((iinnmmmm)) 5 Drop Productsshallbenofailureaftertested. Itshallbedroppedonconcreteorsteelboard. Method:Freefall Height:1m Attitudefromwhichtheproductisdropped:3directions TheNumberofTime:3timesforeachdirection (Total9times) 6 BondingStrength Theelectrodesshallbenofailureaftertested. Itshallbesolderedontheglass-epoxysubstrate. ApplyingForce(F):9.8N ApplyingTime:30s 0.5 0.6 (inmm) 0.4 1.6 7 Vibration MeetTable3. Itshallbesolderedontheglass-epoxysubstrate. Table3 OscillationFrequency:10to2000to10Hzfor20minutes. Appearance Nodamaged Totalamplitude1.5mmorAccelerationamplitude196m/s2 Capacitance Meettheinitialratedvalue. whicheverissmaller. 22to2200pF 0.5max. Time:Aperiodof2hoursineachof3mutually Rdc1,2 22000pF 0.05max. perpendiculardirections.(Total6hours) Initialvalues:About100to22000pF, measuredafterheattreatment(150+0/-10°C,1hour) andexposureintheroomconditionfor48±4hours. Thenmeasuredafterexposureintheroomconditionfor followinghours. 22to47pF :24±2hours 100to22000pF:48±4hours JJEEMMCCPPSS--0022220099BB 4

7.1 7 ■SPECIFICATIONS AND TESTMETHODS EnvironmentPerformance Itshallbesolderedontheglass-epoxysubstrate. No Item Specification TestMethod 1 TemperatureCycling MeetTable1. 1Cycle 1step:-55+0/-3℃/30+3/-0min 2step:RoomTemperature/within3min 3step:+125+3/-0℃/30+3/-0min 4step:RoomTemperature/within3min Totalof10cycles Initialvalues:About100to22000pF,measuredafterheat treatment(150+0/-10°C,1hour)andexposureintheroom conditionfor48±4hours. Thenmeasuredafterexposureintheroomconditionfor followinghours. 22to47pF :24±2hours 100to22000pF:48±4hours About100to22000pF,Ifit’sdoubt,measuredafterheat treatment(150+0/-10°C,1hour)andexposureintheroom conditionfor48±4hours. 2 Humidity MeetTable4. Temperature:40±2°C Table4 Humidity:90to95%(RH) AAppppeeaarraannccee NNooddaammaaggeedd Time:500+24/-0hours CCaapp..CChhaannggee WWiitthhiinn±±1122..55%% Initialvalues:About100to22000pF,measuredafterheat treatment(150+0/-10°C,1hour),andexposureintheroom II..RR.. MMeeeetttthheeiinniittiiaallrraatteeddvvaalluuee.. conditionfor48±4hours. 2222ttoo22220000ppFF 00..55mmaaxx.. RRddcc11,,22 Then measured after exposure in the room condition for 2222000000ppFF 00..0055mmaaxx.. followinghours. 22to47pF :24±2hours 100to22000pF:48±4hours About100~22000pF,Ifit’sdoubt,measuredafterheat treatment(150+0/-10°C,1hour)andexposureintheroom conditionfor48±4hours. 3 HeatLife Temperature:125±2°C TestVoltage:RatedVoltagex200% CChhaarrggeeCCuurrrreenntt::5500mmAAmmaaxx.. Time:1000+48/-0hours Initialvalues:About100to22000pF,measuredaftervoltage treatment(MaximumOperatingTemperature±2°C,Rated Voltagex200%,1hour)andexposureintheroomcondition for48±4hours. Then measured after exposure in the room condition for followinghours. 22to47pF :24±2hours 100to22000pF:48±4hours 4 ColdResistance Temperature:-55±2°C Time:500+24/-0hours Initialvalues:About100to22000pF,measuredafterheat treatment(150+0/-10°C,1hour),andexposureintheroom conditionfor48±4hours. Thenmeasuredafterexposureintheroomconditionfor followinghours. 22to47pF :24±2hours 100to22000pF:48±4hours About100to22000pF,Ifit’sdoubt,measuredafterheat treatment(150+0/-10°C,1hour)andexposureintheroom conditionfor48±4hours. JJEEMMCCPPSS--0022220099BB 5

8 PACKAGING NFM18Type 1.AppearanceandDimensions(8mm-widepapertape) 1 0. SporocketHole 4.0±0.1 1.5±00.1 75± 1. Chipthickness Dimension 05 (T) (a) 0. 3 0.8 1.1max 85±0.1 3.5± 8.0±0. 0.6 0.9max 1. (inmm) 1.05±0.1 4.0±0.1 2.0±0.05 0.9maax. 2.SpecificationofTaping Directionof feed (1)Packingquantity(standardquantity) 4000pcs./reel (2)PackingMethod Productsshallbepackagedinthecavityofthebasetapeandsealedbytoptapeandbottomtape. (3)SprocketHole Thesprocketholesaretotherightasthetapeispulledtowardtheuser. (4)BasetapeandToptape Thebasetapeandtoptapehavenosplicedpoint. (5)Cavity Thereshallnotbeburrinthecavity. (6)Missingcomponentsnumber Missingcomponentsnumberwithin0.1%ofthenumberperreelor1pc.,whicheverisgreater,andarenotcontinuous. Thespecifiedquantityperreeliskept. 3.PullStrengthofTopTape 5Nmin.(※OnlyforNFM18PS,8Nmin.) 4.Peelingoffforceoftoptape Toptape 0.1Nto0.6N(minimumvalueistypical)165to180degree F SpeedofPeelingoff:300mm/min Bottomtape Basetape 5.DimensionsofLeader-tape,TrailerandReel TThheerreesshhaallllbbeelleeaaddeerr--ttaappee((ttooppttaappeeaannddeemmppttyyttaappee))aannddttrraaiilleerr--ttaappee((eemmppttyyttaappee))aassffoolllloowwss.. Trailer Leader 2.0±0.5 160min. Label 190min. 210min. Emptytape Toptape 13.0±0.2 60±10 21.0±0.8 Directionoffeed 9±10 13±1.4 (inmm) 180±03 JJEEMMCCPPPP--0022223311AA 6

9 ! Caution 1.Mountingdensity Addspecialattentiontoradiatingheatofproductswhenmountingthisproductneartheproductswithheating. Theexcessiveheatbyotherproductsmaycausedeteriorationofinsulationresistanceandexcessiveheatatthisproduct, resultinginafire. 2.LimitationofApplications Pleasecontactusbeforeusingourproductsfortheapplicationslistedbelowwhichrequireespeciallyhigh reliabilityforthepreventionofdefectswhichmightdirectlycausedamagetothethirdparty'slife,bodyorproperty. (1)Aircraftequipment (2)Aerospaceequipment (3)Underseaequipment (4)Powerplantcontrolequipment (5)Medicalequipment (6)Transportationequipment(automobiles,trains,ships,etc.)(7)Trafficsignalequipment (8)Disasterprevention/crimepreventionequipment (9)Data-processingequipment (10)Applicationsofsimilarcomplexityorwithreliabilityrequirementscomparabletotheapplicationslistedintheabove JJJEEEMMMCCCPPPCCC---000222222444444AAA 7

9 Notice Productscanonlybesolderedwithreflow. Thisproductisdesignedforsoldermounting. Pleaseconsultusinadvanceforapplyingothermountingmethodsuchasconductiveadhesive. 1.FluxandSolder Flux Userosin-basedflux,Donotusehighlyacidicflux(withchlorinecontentexceeding0.2(wt)%). Donotusewater-solubleflux. Otherflux(exceptabove)Pleasecontactusfordetails,thenuse. Solder UseSn-3.0Ag-0.5Cusolder UseofSn-Znbasedsolderwilldeteriorateperformanceofproducts. IncaseofusingSn-Znbasedsolder,pleasecontactMuratainadvance. 2.NoteforAssembling <ThermalShock> Pre-heatingshouldbeinsuchawaythatthetemperaturedifferencebetweensolderandproductssurfaceislimited to100°Cmax.Alsocoolingintosolventaftersolderingshouldbeinsuchawaythatthetemperaturedifferenceis limitedto100°Cmax. 3.AttentionRegardingP.C.B.Bending ThefollowingshallbeconsideredwhendesigningP.C.B.'sandlayingoutproducts. (1)P.C.B.shallbedesignedsothatproductsarenotsubjecttothemechanicalstressforboardwarpage. [Productsdirection] a b Productsshallbelocatedinthesideways direction(Length:a<b)tothemechanicalstress. 〈Poorexample〉 〈Goodexample〉 (2)ProductslocationonP.C.B.nearseamforseparation. CC SSeeaamm BB Products(A,B,C,D)shallbelocatedcarefullysothatproductsare notsubjecttothemechanicalstressduetowarpingtheboard. bb AA DD BBeeccaauusseetthheeyymmaayybbeessuubbjjeecctteeddtthheemmeecchhaanniiccaallssttrreessssiinnoorrddeerr SSlliitt LLeennggtthh::aabb ofA>C>B≒D. aa 4.Pre-heatingTemperature Solderingshallbehandledsothatthedifferencebetweenpre-heatingtemperatureandsoldertemperatureshallbe limitedto100°Cmax.toavoidtheheatstressfortheproducts. 5.ReflowSoldering •Standardprintingpatternofsolderpaste. 1)Solderingpasteprintingforreflow •Standardthicknessofsolderpaste:100µmto150µm. 0.4 0.6 1.2 •Usethesolderpasteprintingpatternoftherightpattern. •Fortheresistandcopperfoilpattern,usestandardlanddimensions. 0.4 1.0 (inmm) 2.2 2)SolderingConditions Standardsolderingprofileandthelimitsolderingprofileisasfollows. Theexcessivelimitsolderingconditionsmaycauseleachingoftheelectrodeand/orresultinginthedeteriorationof productquality. Temp. 260°C (°C) 245°C±3°C 230°C 220°C LimitProfile 180 150 30s～60s StandardProfile 60smax. 90s±30s Time.(s) StandardProfile LimitProfile Pre-heating 150°C~180°C,90s±30s Heating above220°C,30s~60s above230°C,60smax. Peaktemperature 245°C±3°C 260°C,10s Cycleofreflow 2times 2times JJJEEEMMMCCCPPPCCC---000222222444444AAA 8

9 Notice 6.ReworkingwithSolderingiron Thefollowingconditionsshallbestrictlyfollowedwhenusingasolderingiron. Pre-heating:150°C,1min •Solderingironoutput:30Wmax. Tiptemperature:350°Cmax. •Tipdiameter:φ3mm max. Solderingtime:3(+1,-0)s •Times:2timesmax. Note:Donotdirectlytouchtheproductswiththetipofthesolderingironinordertopreventthecrackonthe ceramicmaterialduetothethermalshock. 7.SolderVolume Soldershallbeusednottobeexceededasshownbelow. UpperLimit UpperLimit Recommendable Recommendable t 1/3Tt T(T:Chipthickness) Accordinglyincreasingthesoldervolume,themechanicalstresstoproductisalsoincreased. Excessivesoldervolumemaycausethefailureofmechanicalorelectricalperformance. 8.CleaningConditions Productsshallbecleanedonthefollowingconditions. (1)Cleaningtemperatureshallbelimitedto60°Cmax.(40°Cmax.forIsopropylalcohol(IPA)) (2)Ultrasoniccleaningshallcomplywiththefollowingconditions,withavoidingtheresonancephenomenonatthe mountedproductsandP.C.B. Power :20W/lmax. Frequency :28kHzto40kHz Time :5minutesmax. (3)Cleaner 1.Cleaner Isopropylalcohol(IPA) 22..AAqquueeoouussaaggeenntt PINEALPHAST-100S (4)Thereshallbenoresidualfluxandresidualcleaneraftercleaning. Inthecaseofusingaqueousagent,productsshallbedriedcompletelyafterrinsewithde-ionizedwaterinorderto removethecleaner. (5)Othercleaning Pleasecontactus. 9.OperatingEnvironment Donotusethisproductunderthefollowingenvironmentalconditions,ondeteriorationoftheperformance,suchas insulationresistancemayresultfromtheuse. (1)inthecorrodibleatmosphere(acidicgases,alkalinegases,chlorine,sulfurgases,organicgasesandetc.) (2)intheatmospherewhereliquidsuchasorganicsolvent,maysplashontheproducts. (3)intheatmospherewherethetemperature/humiditychangesrapidlyanditiseasytodew. 10.Resincoating Thecapacitancevaluemaychangeand/oritmayaffectontheproduct'sperformanceduetohighcure-stressofresin tobeusedforcoating/moldingproducts.Sopleasepayyourcarefulattentionwhenyouselectresin.Inpriortouse,please makethereliabilityevaluationwiththeproductmountedinyourapplicationset. 11.Handlingofasubstrate Aftermountingproductsonasubstrate,donotapplyanystresstotheproductcausedbybendingortwistingtothesubstrate whencroppingthesubstrate,insertingandremovingaconnectorfromthesubstrateortighteningscrewtothesubstrate. Excessivemechanicalstressmaycausecrackingintheproduct. Bending Twisting JJJEEEMMMCCCPPPCCC---000222222444444AAA 9

9 Notice 12.StandardLandDimensions ThechipEMIfiltersuppressesnoisebyconductingthehigh-frequencynoiseelementtoground. Therefore,togetenoughnoisereduction,feedthroughholeswhichisconnectedtoground-planeshouldbe arrangedaccordingtothefiguretoreinforcetheground-pattern. <Standardlanddimensionsforreflow> ･Sideonwhichchipsaremounted Small diameter thru hole 0.2～0.3 4 6 2 5 0. 0. 1. 1. 0.4 Resist 0.6 Copper foil pattern 1.0 No pattern 2.2 (inmm) 13.Storagecondition (1)Storageperiod Usetheproductswithin12monthsafterdelivered. Solderabilityshouldbecheckedifthisperiodisexceeded. (2)Storageenvironmentcondition ・Productsshouldbestoredinthewarehouseonthefollowingconditions. Temperature: -10to+40°C HHuummiiddiittyy:: 1155ttoo8855%%rreellaattiivveehhuummiiddiittyy Norapidchangeontemperatureandhumidity ・Don'tkeepproductsincorrosivegasessuchassulfur,chlorinegasoracid,oritmaycauseoxidizationofelectrode, resultinginpoorsolderability. ・Productsshouldbestoredonthepaletteforthepreventionoftheinfluencefromhumidity,dustandsoon. ・Productsshouldbestoredinthewarehousewithoutheatshock,vibration,directsunlightandsoon. ・Productsshouldbestoredundertheairtightpackagedcondition. (3)Delivery Careshouldbetakenwhentransportingorhandlingproducttoavoidexcessivevibrationormechanicalshock. JJJEEEMMMCCCPPPCCC---000222222444444AAA 10

9 NOTE ! (1)Pleasemakesurethatyourproducthasbeenevaluatedinviewofyourspecificationswithourproductbeingmounted toyourproduct. (2)Youarerequestednottouseourproductdeviatingfromtheagreedspecifications. (3)Weconsideritnotappropriatetoincludeanytermsandconditionswithregardtothebusinesstransactioninthe productspecifications,drawingsorothertechnicaldocuments.Therefore,ifyourtechnicaldocumentsasabove includesuchtermsandconditionssuchaswarrantyclause,productliabilityclause,orintellectualpropertyinfringement liabilityclause,theywillbedeemedtobeinvalid. JJJEEEMMMCCCPPPCCC---000222222444444AAA 11