Reference Only Spec. No. JENF243D-0006L-01 P 1/ 8 Chip EMIFIL® LC Combined Monolithic NFL21SP□□□X1C□□ Reference Specification 1. Scope This reference specification applies to Chip EMIFIL® LC Combined Monolithic Type NFL21S Series. 2. Part Numbering NF L 21 SP 106 X 1C 3 D Product ID Structure Dimension Features Cut-off Characteristics Rated Electrode Packaging Code (L×W) Frequency Voltage (3,7 : Sn plating) (D : Taping / B : Bulk) 3. Rating Cut-off Inductance DC Rated Insulation Rated Withstanding Customer MURATA Capacitance Frequency (L) Resistance Current Resistance Voltage Voltage Part Number Part Number [pF] [MHz] [nH] [Ω max.] [mA(DC)] [MΩ min.] [V(DC)] [V(DC)] NFL21SP106X1C3D 10 670±20% 680±20% NFL21SP106X1C3B 8.5 100 NFL21SP206X1C7D 20 240±20% 700±20% NFL21SP206X1C7B NFL21SP506X1C3D 50 84±20% 305±20% 3.5 NFL21SP506X1C3B 150 NFL21SP706X1C3D 70 76±20% 185±20% 3.0 NFL21SP706X1C3B NFL21SP107X1C3D 100 44±20% 135±20% NFL21SP107X1C3B 2.0 200 1000 16 50 NFL21SP157X1C3D 150 28±20% 128±20% NFL21SP157X1C3B NFL21SP207X1C3D 200 22±20% 72±20% 1.5 250 NFL21SP207X1C3B NFL21SP307X1C3D 300 19±10% 45±10% NFL21SP307X1C3B NFL21SP407X1C3D 400 16±10% 34±10% 1.2 300 NFL21SP407X1C3B NFL21SP507X1C3D 500 12±10% 31±10% NFL21SP507X1C3B • Operating Temperature : -55°C to +125°C (Includes self-heating.) • Storage Temperature : -55°C to +125°C 4. Standard Testing Condition < Unless otherwise specified > < In case of doubt > Temperature : Ordinary Temp. / 15 °C to 35 °C Temperature: 20 °C ± 2 °C Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH) Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure: 86 kPa to 106 kPa 5. Style and Dimensions 0.3±0.2 0.6±0.2 0.3±0.2 1.25±0.1 ■ Equivalent Circuit 1 Input Out put 5±0. (1) (3) 8 0. 0.4±0.2 2.0±0.2 GND (2) (2) 1 ∗ NoPolarity (1) (3) ±0. 5 :Electrode 2 1. ■ Unit Mass (Typical value) (2) 0.25±0.2 (inmm) 0.009g MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243D-0006L-01 P 2/ 8 ■ Insertion Loss Characteristics (I.L.) (Typ.) 6. Marking No marking 7. Electrical Performance No. Item Specification Test Method 7.1 Capacitance Meet item 3. · Frequency : 1±0.1MHz (Cap.) · Voltage : 1±0.2V(rms) 7.2 Inductance · Frequency (L) Cut-off Frequency 20~500MHz : 10±1MHz Cut-off Frequency 10MHz : 1±0.1MHz · Voltage : 1±0.2V(rms) 7.3 DC Resistance Measured with 10mA max. (Rdc) Measured between terminal (1)-(3). (ref. Item5) 7.4 Insulation · Voltage : Rated Voltage Resistance(I.R.) · Time : 1 minutes max. 7.5 Withstanding Products shall not be damaged. · Test Voltage : 50V(DC) Voltage · Time : 1 to 5 s · Charge Current : 50 mA max. 8. Mechanical Performance No. Item Specification Test Method 8.1 Appearance and Meet item 5. Visual Inspection and measured with Slide Dimensions Calipers. 8.2 Solderability Electrodes shall be at least 90% · Flux : Ethanol solution of rosin, 25(wt)% covered with new solder coating. · Pre-heat : 150 ± 10°C, 60 to 90s · Solder : Sn-3.0Ag-0.5Cu · Solder Temperature : 240 ± 3°C · Immersion Time : 3±1 s · Immersion and emersion rates : 25mm / s 8.3 Resistance to Meet Table 1. · Flux : Ethanol solution of rosin, 25(wt)% soldering heat · Pre-heat : 150 ± 10°C, 60 to 90s Table 1 · Solder : Sn-3.0Ag-0.5Cu · Solder Temperature : 270 ± 5°C Appearance No damaged · Immersion Time : 10 ± 1 s Cap. Change within ± 5% · Immersion and emersion rates : 25mm / s L Change within ± 5% · Then measured after exposure in the room I.R. meet item 3 condition for 24±2 hours. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243D-0006L-01 P 3/ 8 No. Item Specification Test Method 8.4 Bending Meet Table 2. It shall be soldered on the glass-epoxy substrate Strength (t = 1.0mm). Table 2 · Deflection : 2 mm · Keeping Time : 30 s Appearance No damaged Pressure jig Cap. Change within ± 5% R230 F Deflection 45 45 Product (in mm) 8.5 Drop Products shall be no failure after It shall be dropped on concrete or steel board. tested. · Method : Free fall · Height : 75 cm · Attitude from which the product is dropped : 3 directions · The Number of Time : 3 times for each direction (Total 9 times) 8.6 Bonding The electrodes shall be no failure after It shall be soldered on the glass-epoxy substrate. Strength tested. · Applying Force (F) : 9.8 N · Applying Time : 30 s 1.0 0.8 0.6 1.6 (in mm) 8.7 Vibration Meet Table 1. It shall be soldered on the glass-epoxy substrate. · Oscillation Frequency : 10 to 55Hz for 1 minute · Double Amplitude : 1.5 mm · Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) 9. Environment Performance It shall be soldered on the glass-epoxy substrate. No. Item Specification Test Method 9.1 Temperature Meet Table 1. · 1 Cycle Cycling 1 step: -55 ± 03 °C / 30 ± 30 min 2 step: Room Temperature / within 3 min 3 step: +125 ± 30 °C / 30 ± 30 min 4 step: Room Temperature / within 3 min · Total of 10 cycles · Then measured after exposure in the room condition for 24±2 hours. 9.2 Humidity · Temperature : 40 ± 2 °C · Humidity : 90 to 95%(RH) · Time : 500± 240 hours · Then measured after exposure in the room condition for 24±2 hours. 9.3 Heat Life · Temperature : 125 ± 2 °C · Test Voltage : Rated Voltage × 200% · Charge Current : 50 mA max. · Time : 1000 ± 480 hours · Then measured after exposure in the room condition for 24±2 hours. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243D-0006L-01 P 4/ 8 10. Specification of Packaging 10.1. Appearance and Dimensions (8mm-wide paper tape) 1 0. Sporocket Hole 4.0±0.1 φ1.5±00.1 75± 1. 5 ±0.0±0.1 0.3 0.23±0.1 3.53.5 8.0± 2. 1.55±0.2 4.0±0.1 22.0.±0±00.0.15 1.1max. Direction of feed (in mm) 10.2. Specification of Taping (1) Packing quantity (standard quantity) 4000 pcs. / reel (2) Packing Method Products shall be packaged in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Base tape and Top tape The base tape and top tape have no spliced point. (5) Cavity There shall not be burr in the cavity. (6) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not continuous. The specified quantity per reel is kept. 10.3. Pull Strength of Top Tape and Bottom Tape Top tape 5N min. Bottom tape 10.4. Peeling off force of top tape 0.1N to 0.6N (minimum value is typical) Top tape 165 to 180 degree Speed of Peeling off : 300 mm / min F Bottomtape Base tape 10.5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows. Trailer Leader 2.0±0.5 160min. Label 190min. 210min. Emptytape Toptape φ13.0±0.2 φ60±10 φ21.0±0.8 9±1 Directionoffeed 0 13±1.4 φ180±03 (in mm) MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243D-0006L-01 P 5/ 8 10.6. Marking for reel Customer part number , MURATA part number , Inspection number(∗1) , RoHS marking(∗2) , Quantity , etc ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking» ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 10.7. Marking for Outside package (corrugated paper box) Customer name , Purchasing Order Number , Customer Part Number , MURATA part number , RoHS marking (∗2) , Quantity , etc 10.8. Specification of Outer Case Outer Case Dimensions Label Standard Reel Quantity in Outer Case (mm) (Reel) H W D H 186 186 93 5 D ∗ Above Outer Case size is typical. It depends on a quantity of an order. W 11. Standard Land Dimensions The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground. Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged according to the figure to reinforce the ground-pattern. < Standard land dimensions for reflow > •Side on which chips are mounted Small diameterthruholeφ0.4 6 8 9 3 0. 0. 1. 2. 0.6 Resist 1.4 Copperfoil pattern 2.6 Nopattern (in mm) 12. ! Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment(automobiles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity or with reliability requirements comparable to the applications listed in the above MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243D-0006L-01 P 6/ 8 13. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 13.1. Flux and Solder Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Other flux (except above) Please contact us for details, then use. 13.2. Note for Assembling < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. 13.3. Attention Regarding P.C.B. Bending The following shall be considered when designing P.C.B.'s and laying out products. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. [Products direction] a Products shall be located in the sideways b < direction (Length:a b) to the mechanical stress. 〈Poor example〉 〈Goodexample〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 13.4. Pre-heating Temperature Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be limited to 100°C max. to avoid the heat stress for the products. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243D-0006L-01 P 7/ 8 13.5. Reflow Soldering 1) Soldering paste printing for reflow • Standard printing pattern of solder paste. · Standard thickness of solder paste: 100µm to 150µm. · Use the solder paste printing pattern of the right pattern. · For the resist and copper foil pattern, use standard land 6 8 9 0. 0. 1. dimensions. 0.6 1.4 2.6 (in mm) 2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. 260°C (°C) 245°C±3°C 230°C 220°C Limit Profile 180 150 30s～60s Standard Profile 60smax. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150°C ~ 180°C , 90s ± 30s Heating above 220°C , 30s ~ 60s above 230°C , 60s max. Peak temperature 245°C ± 3°C 260°C , 10s Cycle of reflow 2 times 2 times 13.6. Reworking with Soldering iron The following conditions shall be strictly followed when using a soldering iron. • Pre-heating : 150°C, 1 min • Soldering iron output : 30W max. • Tip temperature : 350°C max. • Tip diameter : φ3mm max. • Soldering time : 3(+1,-0) s • Times : 2times max. Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. 13.7. Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Upper Limit Recommendable Recommendable t 1/3T≤t ≤T(T:Chipthickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Excessive solder volume may cause the failure of mechanical or electrical performance. MURATA MFG.CO., LTD.

Reference Only Spec. No. JENF243D-0006L-01 P 8/ 8 13.8. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA)) (2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner 1. Cleaner · Isopropyl alcohol (IPA) 2. Aqueous agent · PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 13.9. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 13.10. Resin coating The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 13.11. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 13.12. Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment condition · Products should be stored in the warehouse on the following conditions. Temperature: -10 to +40°C, Humidity: 15 to 85% relative humidity No rapid change on temperature and humidity · Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. · Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. · Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. · Products should be stored under the airtight packaged condition. (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 14. ! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.