NCP502, NCV502 Voltage Regulator - CMOS Low Iq, Low-Dropout 80 mA The NCP502 series of fixed output linear regulators are designed for handheld communication equipment and portable battery powered wwwwww..oonnsseemmii..ccoomm applications which require low quiescent. The NCP502 series features an ultra−low quiescent current of 40 (cid:2)A. Each device contains a MARKING voltage reference unit, an error amplifier, a PMOS power transistor, DIAGRAM resistors for setting output voltage, current limit, and temperature limit 5 protection circuits. 5 4 SC70−5 xxx M(cid:2) The NCP502 has been designed to be used with low cost ceramic SQ SUFFIX (cid:2) capacitors. The device is housed in the micro−miniature SC70−5 and 123 CASE 419A 1 TSOP−5 surface mount packages. Standard voltage versions are 1.5 V, 1.8 V, 2.5 V, 2.7 V, 2.8 V, 2.9 V, 3.0 V, 3.1 V, 3.3 V, 3.4 V, 3.5 V, 3.6 V, 3.7 V and 5.0 V. Other voltages are available in 100 mV steps. TSOP−5 5 (SOT23−5, SC59−5) xxx AYW(cid:2) 5 SN SUFFIX (cid:2) Features 1 CASE 483 • Low Quiescent Current of 40 (cid:2)A Typical 1 • Excellent Line and Load Regulation xxx = Specific Device Code • A = Assembly Location Low Output Voltage Option Y = Year • Output Voltage Accuracy of 2.0% W = Work Week • Industrial Temperature Range of −40°C to 85°C, M = Date Code (cid:2) = Pb−Free Package NCV502, T = −40°C to 125°C A (Note: Microdot may be in either location) • NCP502: 1.3 V Enable Threshold High, 0.3 V Enable Threshold Low • NCV Prefix for Automotive and Other Applications Requiring PIN CONNECTIONS Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable • Vin 1 5 Vout These are Pb−Free Devices GND 2 Typical Applications Enable 3 4 N/C • Cellular Phones • Battery Powered Consumer Products (Top View) • Hand−Held Instruments • Camcorders and Cameras ORDERING INFORMATION Battery or Vout See detailed ordering and shipping information in the package Unregulated 1 5 dimensions section on page 7 of this data sheet. + Voltage C1 + 2 C2 ON 3 4 OFF This device contains 86 active transistors Figure 1. Typical Application Diagram © Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: October, 2019 − Rev. 21 NCP502/D

NCP502, NCV502 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁPin ÁÁNo.ÁÁÁÁPÁÁin NÁÁamÁÁe ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁDeÁÁscrÁÁiptioÁÁn ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ1ÁÁÁÁÁÁÁÁVÁÁin ÁÁÁÁÁÁPoÁÁsitivÁÁe poÁÁwer ÁÁsuppÁÁly inÁÁput ÁÁvoltaÁÁge.ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ2ÁÁÁÁÁÁÁÁGNÁÁD ÁÁÁÁÁÁPoÁÁwerÁÁ supÁÁply gÁÁrounÁÁd. ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ3ÁÁÁÁEnaÁbleÁÁÁThÁis inÁput iÁs usÁed toÁ plaÁce thÁe deÁviceÁ intoÁ low−ÁpowÁer sÁtandÁby. WÁhenÁ thisÁ inpÁut isÁ pulleÁd loÁw, thÁe deÁviceÁ is Á disabled. If this function is not used, Enable should be connected to Vin. ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 4 N/C No internal connection. ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ 5 Vout Regulated output voltage. ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ MAXIMUM RATINGS ÁÁÁÁÁÁÁÁÁRÁatinÁg ÁÁÁÁÁÁÁÁÁÁSyÁmboÁl ÁÁÁÁÁValÁue ÁÁÁÁÁUÁnit Á ÁÁÁÁInpuÁÁt VoÁÁltageÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁVin ÁÁÁÁÁÁÁÁÁÁÁÁ1ÁÁ2 ÁÁÁÁÁÁÁÁÁÁÁÁV ÁÁ ÁÁÁÁEnaÁÁble VÁÁoltaÁÁge ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁEnÁÁableÁÁÁÁÁÁÁÁÁÁ−0.3ÁÁ to VÁÁin +ÁÁ0.3 ÁÁÁÁÁÁÁÁÁÁV ÁÁ ÁÁÁÁOutÁÁput VÁÁoltaÁÁge ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁVÁÁoutÁÁÁÁÁÁÁÁÁÁ−0.3ÁÁ to VÁÁin +ÁÁ0.3 ÁÁÁÁÁÁÁÁÁÁV ÁÁ ÁÁPowÁer DÁissipÁatioÁn anÁd ThÁermÁal ChÁaracÁterisÁticsÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Power Dissipation PD Internally Limited W ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Operating Junction Temperature TJ +150 °C ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Operating Ambient Temperature NCP502 TA −40 to +85 °C ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁNCÁÁV50ÁÁ2 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ−4ÁÁ0 toÁÁ +12ÁÁ5 ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁStorÁageÁ TemÁperaÁtureÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁTÁstg ÁÁÁÁÁ−5Á5 toÁ +15Á0 ÁÁÁÁ°ÁC Á Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Latchup capability (85°C) ±100 mA DC with trigger voltage. THERMAL CHARACTERISTICS Rating Symbol Test Conditions Value Unit Thermal Characteristics, TSOP−5 (Note 2) R(cid:3)JA 1 oz Copper Thickness, 100 mm2 °C/W Thermal Resistance, Junction−to−Air (Note 3) 205 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁ Thermal Resistance, Junction−to−Ambient, SC70−5 R(cid:3)JA 400 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁWÁ °C/W ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁ NOTE: Single component mounted on a 80 x 80 x 15 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12. 2. True no connect. Printed circuit board traces are allowable. 3. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015. Machine Model Method 200 V.. www.onsemi.com 2

NCP502, NCV502 ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 2.0 V, Venable = Vin, Cin = 1.0 (cid:2)F, Cout = 1.0 (cid:2)F, TJ = 25°C, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit Output Voltage (TA = 25°C, Iout = 10 mA) Vin = Vout (nom.) +1.0 V Vout V 1.5 V 1.455 1.5 1.545 1.8 V 1.746 1.8 1.854 2.5 V 2.425 2.5 2.575 2.7 V 2.646 2.7 2.754 2.8 V 2.744 2.8 2.856 2.9 V 2.842 2.9 2.958 3.0 V 2.94 3.0 3.06 3.1 V 3.038 3.1 3.162 3.3 V 3.234 3.3 3.366 3.4 V 3.332 3.4 3.468 3.5 V 3.43 3.5 3.57 3.6 V 3.528 3.6 3.672 3.7 V 3.626 3.7 3.774 5.0 V 4.900 5.0 5.100 Output Voltage (TA = Tlow to Thigh, Iout = 10 mA) Vin = Vout (nom.) Vout V 1.5 V 1.455 1.5 1.545 1.8 V 1.746 1.8 1.854 2.5 V 2.425 2.5 2.575 2.7 V 2.619 2.7 2.781 2.8 V 2.716 2.8 2.884 2.9 V 2.813 2.9 2.987 3.0 V 2.910 3.0 3.09 3.1 V 3.007 3.1 3.193 3.3 V 3.201 3.3 3.399 3.4 V 3.298 3.4 3.502 3.5 V 3.43 3.5 3.57 3.6 V 3.528 3.6 3.672 3.7 V 3.626 3.7 3.774 5.0 V 4.900 5.0 5.100 Line Regulation (Vin = Vout + 1.0 V to 12 V, Iout = 10 mA) Regline − 0.4 3.0 mV/V Load Regulation (Iout = 1.0 mA to 80 mA) Regload − 0.2 0.8 mV/mA Output Current (Vout = (Vout at Iout = 80 mA) −3%) Io(nom.) 80 180 − mA Dropout Voltage (TA = Tlow to Thigh, Iout = 80 mA, Measured at Vout Vin−Vout mV −3.0%) 1.5 V−1.7 V − 1500 1900 1.8 V−2.4 V − 1300 1700 2.5 V−2.6 V − 1000 1400 2.7 V−2.9 V − 850 1300 3.0 V−4.0 V − 850 1200 4.1 V−5.0 V − 600 900 NCV502 − 5.0 V − 700 1100 Quiescent Current IQ (cid:2)A (Enable Input = 0 V) − 0.1 1.0 (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) − 40 90 Output Short Circuit Current (Vout = 0 V) Iout(max) 90 200 500 mA Ripple Rejection (f = 1.0 kHz, 15 mA) RR − 55 − dB Output Voltage Noise (f = 100 Hz to 100 kHz) Vn − 180 − (cid:2)Vrms Enable Input Threshold Voltage (NCP502) Vth(en) V (Voltage Increasing, Output Turns On, Logic High) 1.3 − − (Voltage Decreasing, Output Turns Off, Logic Low) − − 0.3 Output Voltage Temperature Coefficient TC − 100 − ppm/°C 4. Maximum package power dissipation limits must be observed. PD(cid:2)TJ(max) (cid:3)TA R(cid:3)JA 5. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. www.onsemi.com 3

NCP502, NCV502 45 45 (cid:2)T (A) 3450 VOUT = 3.0 V (cid:2)T (A) 42.5 VVIONU =T 5=. 03 .V0 V N N E E R 30 R 40 R R CU 25 CU T T 37.5 N 20 N E E C C S 15 S 35 E E QUI 10 QUI I, Q 5 I, Q32.5 0 30 0 1 2 3 4 5 6 7 −60 −40 −20 0 20 40 60 80 100 VIN, INPUT VOLTAGE (V) T, TEMPERATURE (°C) Figure 2. Quiescent Current versus Input Voltage Figure 3. Quiescent Current versus Temperature 6 10 NPUTGE (V) 5 VIN = 4.0 V to 5.0 V BLEGE (V) 5 VVIENN =A B4L.E0 =V 0 to 4.0 V V, IINOLTA 4 ENAOLTA 0 V V 60 COUT = 1.0 (cid:2)F E 40 IOUT = 30 mA UTPUT VOLTAGDEVIATION (mV)−22000 V, OUTPUTOUTVOLTAGE (V)312...000 ICOOUUTT = = 3 10. 0m (cid:2)AF O −40 0 0 10 20 30 40 50 60 70 80 90 100 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t, TIME ((cid:2)s) t, TIME (ms) Figure 4. Line Transient Response Figure 5. Enable Response TA) 60 70 Um TPT ( 30 , OUUTRREN 0 N (dB) 60 OU O IC TI 50 100 C GEV) 50 CVOOUUTT == 31..00 V(cid:2)F REJE OLTAN (m 0 VIN = 4.0 V PLE 40 VIN = 4.5 V + 0.5 VP−P UT VATIO RIP 30 VIOOUUTT = = 3 30. 0m VA TPEVI−50 COUT = 1.0 (cid:2)F UD O −100 20 0 50 100 150 200 250 300 350 400 450 0.01 0.1 1.0 10 100 t, TIME ((cid:2)s) FREQUENCY (kHz) Figure 6. Load Transient Response Figure 7. Ripple Rejection/Frequency www.onsemi.com 4

NCP502, NCV502 2.995 IOUT = 10 mA VIN = 12 V V) 2.99 E ( G2.985 A LT VIN = 4.0 V O 2.98 V T U P 2.975 T U O 2.97 , T U O V2.965 2.96 −60 −40 −20 0 20 40 60 80 100 T, TEMPERATURE (°C) Figure 8. Output Voltage versus Temperature 3.5 CIN = 1.0 (cid:2)F V) 3 COUT = 1.0 (cid:2)F E ( VENABLE = VIN G 2.5 A T L O 2 V T U P 1.5 T U O , T 1 U O V 0.5 0 0 1 2 3 4 5 6 VIN, INPUT VOLTAGE (V) Figure 9. Output Voltage versus Input Voltage 1200 V) m E (1000 G TA 80 mA LOAD L O 800 V T U O 600 P O DR 400 40 mA LOAD , T U O V 200 − V IN 0 10 mA LOAD −50 −25 0 25 50 75 100 125 T, TEMPERATURE (°C) Figure 10. Dropout Voltage versus Temperature www.onsemi.com 5

NCP502, NCV502 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output The change in output voltage for a change in input voltage. current at a constant temperature. The measurement is made under conditions of low dissipation or by using pulse technique such that the average Dropout Voltage chip temperature is not significantly affected. The input/output differential at which the regulator output no longer maintains regulation against further reductions in Line Transient Response input voltage. Measured when the output drops 3.0% below Typical over and undershoot response when input voltage its nominal. The junction temperature, load current, and is excited with a given slope. minimum input supply requirements affect the dropout level. Thermal Protection Maximum Power Dissipation Internal thermal shutdown circuitry is provided to protect The maximum total dissipation for which the regulator the integrated circuit in the event that the maximum junction will operate within its specifications. temperature is exceeded. When activated at typically 160°C, the regulator turns off. This feature is provided to prevent Quiescent Current failures from accidental overheating. The quiescent current is the current which flows through the ground when the LDO operates without a load on its Maximum Package Power Dissipation output: internal IC operation, bias, etc. When the LDO The maximum power package dissipation is the power becomes loaded, this term is called the Ground current. It is dissipation level at which the junction temperature reaches actually the difference between the input current (measured its maximum operating value, i.e. 125°C. Depending on the through the LDO input pin) and the output current. ambient power dissipation and thus the maximum available output current. APPLICATIONS INFORMATION A typical application circuit for the NCP502 series is threshold are covered in the electrical specification section shown in Figure 1, front page. of this data sheet. If the enable is not used then the pin should be connected to V . in Input Decoupling (C1) A 1.0 (cid:2)F capacitor either ceramic or tantalum is Hints recommended and should be connected close to the NCP502 Please be sure the Vin and GND lines are sufficiently package. Higher values and lower ESR will improve the wide. When the impedance of these lines is high, there is a overall line transient response. If large line or load transients chance to pick up noise or cause the regulator to are not expected, then it is possible to operate the regulator malfunction. without the use of a capacitor. Set external components, especially the output capacitor, TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K as close as possible to the circuit, and make leads as short as possible. Output Decoupling (C2) The NCP502 is a stable regulator and does not require any Thermal specific Equivalent Series Resistance (ESR) or a minimum As power across the NCP502 increases, it might become output current. Capacitors exhibiting ESRs ranging from a necessary to provide some thermal relief. The maximum few m(cid:4) up to 5.0 (cid:4) can thus safely be used. The minimum power dissipation supported by the device is dependent decoupling value is 1.0 (cid:2)F and can be augmented to fulfill upon board design and layout. Mounting pad configuration stringent load transient requirements. The regulator accepts on the PCB, the board material and also the ambient ceramic chip capacitors as well as tantalum devices. Larger temperature effect the rate of temperature rise for the part. values improve noise rejection and load regulation transient This is stating that when the NCP502 has good thermal response. conductivity through the PCB, the junction temperature will TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, be relatively low with high power dissipation applications. or C3216X7R1C105K Enable Operation The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. These limits of www.onsemi.com 6

NCP502, NCV502 The maximum dissipation the package can handle is Ptot(cid:2)(cid:4)Vin*Ignd(Iout)(cid:5)(cid:6)[Vin(cid:3)Vout]*Iout given by: or PD(cid:2)TJ(mRa(cid:3)xJ)A(cid:3)TA VinMAX(cid:2)PtoItg(cid:6)ndV(cid:6)ouIto*uItout If junction temperature is not allowed above the maximum 125°C, then the NCP502 can dissipate up to If an 80 mA output current is needed then the ground 250 mW @ 25°C. current from the data sheet is 40(cid:5)(cid:2)A. For an NCP502 (3.0 V), The power dissipated by the NCP502 can be calculated the maximum input voltage will then be 6.12 V. from the following equation: ORDERING INFORMATION Nominal Device Output Voltage Marking Package Shipping† NCP502SQ15T2G 1.5 LCC NCP502SQ18T2G 1.8 LCD NCP502SQ25T2G 2.5 LCE NCP502SQ27T2G 2.7 LCF NCP502SQ28T2G 2.8 LCG NCP502SQ29T2G 2.9 LJI NCP502SQ30T2G 3.0 LCH SC70−5 3000 / Tape & Reel NCP502SQ31T2G 3.1 LJJ (Pb−Free) NCP502SQ33T2G 3.3 LCI NCP502SQ34T2G 3.4 LJK NCP502SQ35T2G 3.5 LGO NCP502SQ36T2G 3.6 LIU NCP502SQ37T2G 3.7 LJQ NCP502SQ50T2G 5.0 LCJ NCP502SN28T1G 2.8 LKD NCP502SN29T1G 2.9 LJN NCP502SN30T1G 3.0 LKE NCP502SN31T1G 3.1 LJO NCP502SN33T1G 3.3 LKF NCV502SN33T1G* 3.3 LKF TSOP−5 3000 / Tape & Reel NCP502SN34T1G 3.4 LJK (Pb−Free) NCP502SN35T1G 3.5 LJ6 NCP502SN36T1G 3.6 AC4 NCP502SN37T1G 3.7 LKC NCP502SN50T1G 5.0 LKG NCV502SN50T1G* 5.0 LKG Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. www.onsemi.com 7

NCP502, NCV502 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) SQ SUFFIX CASE 419A−02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING G PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE 5 4 MOLD FLASH, PROTRUSIONS, OR GATE BURRS. S −B− INCHES MILLIMETERS 1 2 3 DIM MIN MAX MIN MAX A 0.071 0.087 1.80 2.20 B 0.045 0.053 1.15 1.35 C 0.031 0.043 0.80 1.10 D 0.004 0.012 0.10 0.30 D 5 PL 0.2 (0.008) M B M G 0.026 BSC 0.65 BSC H --- 0.004 --- 0.10 J 0.004 0.010 0.10 0.25 N K 0.004 0.012 0.10 0.30 N 0.008 REF 0.20 REF S 0.079 0.087 2.00 2.20 J C K H SOLDER FOOTPRINT 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 (cid:7) (cid:8) 0.0748 mm SCALE 20:1 inches www.onsemi.com 8

NCP502, NCV502 PACKAGE DIMENSIONS TSOP−5 SN SUFFIX CASE 483−02 ISSUE M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME NOTE 5 D5X Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 0.20 C A B 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH 2X 0.10 T THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. M 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD 2X 0.20 T B 5 4 S FFLLAASSHH,, PPRROOTTRRUUSSIIOONNSS,, OORR GGAATTEE BBUURRRRSS. SMHOALLDL NOT 1 2 3 EXCEED 0.15 PER SIDE. DIMENSION A. K 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL B G DETAIL Z TTRRIIMMMMEEDD LLEEAADD INSO ATL TLOO WEXETDE INND T HMIOS RLEO CTHATAINO N0..2 A A FROM BODY. MILLIMETERS TOP VIEW DIM MIN MAX A 2.85 3.15 B 1.35 1.65 DETAIL Z C 0.90 1.10 J D 0.25 0.50 C G 0.95 BSC H 0.01 0.10 0.05 J 0.10 0.26 H C SPELAATNIENG END VIEW MK 0.02 0(cid:3) 010.6 (cid:3) 0 SIDE VIEW S 2.50 3.00 SOLDERING FOOTPRINT* 1.9 0.074 0.95 0.037 2.4 0.094 1.0 0.039 0.7 (cid:7) (cid:8) 0.028 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative ◊ www.onsemi.com NCP502/D 9

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: NCP502SQ15T1 NCP502SQ15T1G NCP502SQ18T1 NCP502SQ18T1G NCP502SQ25T1 NCP502SQ25T1G NCP502SQ27T1 NCP502SQ27T1G NCP502SQ28T1 NCP502SQ28T1G NCP502SQ30T1 NCP502SQ30T1G NCP502SQ33T1 NCP502SQ33T1G NCP502SQ35T1 NCP502SQ35T1G NCP502SQ50T1 NCP502SQ50T1G NCP502SN35T1G NCP502SQ15T2G NCP502SQ18T2G NCP502SQ25T2G NCP502SQ27T2G NCP502SQ28T2G NCP502SQ29T2G NCP502SQ30T2G NCP502SQ31T2G NCP502SQ33T2G NCP502SQ34T2G NCP502SQ35T2G NCP502SQ36T2G NCP502SQ37T2G NCP502SQ50T2G NCP502SN36T1G NCP502SQ37T1G NCP502SN37T1G NCP502SQ29T1G NCP502SQ31T1G NCP502SQ34T1G NCP502SN30T1G NCP502SN34T1G NCP502SN28T1G NCP502SN33T1G NCP502SN29T1G NCP502SN31T1G NCP502SN50T1G NCV502SN50T1G NCP502SQ36T1G NCV502SN33T1G