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  • 型号: NCP4688DSN28T1G
  • 制造商: ON Semiconductor
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NCP4688DSN28T1G产品简介:

ICGOO电子元器件商城为您提供NCP4688DSN28T1G由ON Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 NCP4688DSN28T1G价格参考。ON SemiconductorNCP4688DSN28T1G封装/规格:PMIC - 稳压器 - 线性, Linear Voltage Regulator IC Positive Fixed 1 Output 2.8V 150mA SOT-23-5。您可以下载NCP4688DSN28T1G参考资料、Datasheet数据手册功能说明书,资料中有NCP4688DSN28T1G 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC REG LDO 2.8V 0.15A SOT23-5低压差稳压器 LOW NOISE 150MA LDO REGUL

产品分类

PMIC - 稳压器 - 线性

品牌

ON Semiconductor

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

电源管理 IC,低压差稳压器,ON Semiconductor NCP4688DSN28T1G-

数据手册

点击此处下载产品Datasheet

产品型号

NCP4688DSN28T1G

PSRR/纹波抑制—典型值

80 dB

产品种类

低压差稳压器

供应商器件封装

SOT-23-5

其它名称

NCP4688DSN28T1G-ND
NCP4688DSN28T1GOSTR

包装

带卷 (TR)

商标

ON Semiconductor

回动电压—最大值

800 mV

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

SC-74A,SOT-753

封装/箱体

SOT-23-5

工作温度

-40°C ~ 85°C

工厂包装数量

3000

最大工作温度

+ 150 C

最大输入电压

5.25 V

最小工作温度

- 40 C

最小输入电压

2 V

标准包装

3,000

电压-跌落(典型值)

0.2V @ 150mA

电压-输入

最高 5.25V

电压-输出

2.8V

电压调节准确度

1 %

电流-输出

150mA

电流-限制(最小值)

-

稳压器拓扑

正,固定式

稳压器数

1

系列

NCP4688

线路调整率

0.1 % / V

负载调节

14 mV

输出电压

2.8 V

输出电流

150 mA

输出端数量

1 Output

输出类型

Fixed

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PDF Datasheet 数据手册内容提取

NCP4688 Voltage Regulator - Low Noise, LDO Linear 150 mA The NCP4688 is a CMOS 150 mA LDO linear voltage regulator with high output voltage accuracy which features a low noise output http://onsemi.com voltage and high ripple rejection. The low level of output noise 10(cid:2)Vrms typically is kept at any output voltage. The very common MARKING SOT23−5 package and small (cid:2)DFN 1x1 package are suitable for DIAGRAMS industrial applications, portable communication equipments and RF modules. XXXMM Features • SOT−23−5 Operating Input Voltage Range: 2 V to 5.25 V 1 CASE 1212 • Output Voltage Range: 1.2 to 4.8 V (available in 0.1 V steps) • ±1% Output Voltage Accuracy • Output Noise: 10 (cid:2)Vrms XX • Line Regulation: 0.02%/V 1 M (cid:2) • UDFN−4 1 (cid:2) Current Limit Circuit CASE 517BR • High PSRR: 80 dB at 1 kHz, 75 dB at 10 kHz (Top Views) • Available in SOT−23−5 and (cid:2)DFN 1.0 x 1.0 mm Package XX, XXX = Specific Device Code • These are Pb−Free Devices M, MM = Date Code (cid:2) = Pb−Free Package Typical Applications • (*Note: Microdot may be in either location) Home Appliances, Industrial Equipment • Cable Boxes, Satellite Receivers, Entertainment Systems • Car Audio Equipment, Navigation Systems ORDERING INFORMATION • Notebook Adaptors, LCD TVs, Cordless Phones and Private LAN See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet. Systems • RF Modules NCP4688x VIN VOUT VIN VOUT C1 CE C2 1.0 (cid:2)F GND 1.0 (cid:2)F Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2012 1 Publication Order Number: October, 2019 − Rev. 1 NCP4688/D

NCP4688 NCP4688xxxx NCP4688D Vin Vout Vin Vout Vref Vref Noise Reduction Noise Reduction CE CE Current Limit Current Limit GND GND Figure 2. Simplified Schematic Block Diagram Table 1. PIN FUNCTION DESCRIPTION Pin No. Pin No. SOT−23−5 DFN 1x1 Pin Name Description 1 4 VIN Input pin 2 2 GND Ground pin 3 3 CE Chip enable pin (“H” active) 4 NC Non connected 5 1 VOUT Output pin *EP EP Exposed Pad (leave floating or connect to GND) Table 2. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage VIN 0 − 6 V V Output Voltage VOUT −0.3 to VIN + 0.3 V Chip Enable Input VCE 0 − 6 V V Power Dissipation SOT−23−5 PD 420 mW Power Dissipation (cid:2)DFN 1.0 x 1.0 mm 400 Junction Temperature TJ −40 to 150 °C Storage Temperature TSTG −55 to 125 °C ESD Capability, Human Body Model (Note 1) ESDHBM 2000 V ESD Capability, Machine Model (Note 1) ESDMM 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78 http://onsemi.com 2

NCP4688 Table 3. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, SOT−23−5 R(cid:3)JA 238 °C/W Thermal Resistance, Junction−to−Air Thermal Characteristics, (cid:2)DFN 1x1 R(cid:3)JA 250 °C/W Thermal Resistance, Junction−to−Air Table 4. ELECTRICAL CHARACTERISTICS (−40°C ≤ TA ≤ 85°C; CIN = COUT = 1.0 (cid:2)F, unless otherwise noted. Typical values are at TA = +25°C.) Parameter Test Conditions Symbol Min Typ Max Unit Operating Input Voltage 1.2 V < Vout < 4.8 V VIN 2.0 5.25 V Output Voltage Ta = 25°C, Vout > 2.0 V VOUT x0.99 x1.01 V −40°C < Ta < 85°C, Vout > 2.0 V x0.985 x1.015 V Ta = 25°C, Vout ≤ 2.0 V −20 +20 mV −40°C < Ta < 85°C, Vout ≤ 2.0 V −30 +30 mV Output Voltage Temp. −40°C < Ta < 85°C ±100 ppm/°C Coefficient Line Regulation Set Vout + 0.3 < VIN < 5.25 V Vout > 4.1 V LineReg 0.02 0.10 %/V Set Vout + 0.5 < VIN < 5.0 V 1.7 V ≤ VOUT < 4.1 V 2.2 < VIN < 5.0 V Vout < 1.7 V Load Regulation 1 mA < IOUT ≤ 150 mA LoadReg −14 0 14 mV Dropout Voltage IOUT = 150 mA 1.2 V ≤ VOUT < 1.3 V VDO 0.39 0.80 V 1.3 V ≤ VOUT < 1.4 V 0.37 0.70 1.4 V ≤ VOUT ≤ 1.5 V 0.34 0.60 1.5 V ≤ VOUT < 1.7 V 0.32 0.50 1.7 V ≤ VOUT < 2.0 V 0.29 0.41 2.0 V ≤ VOUT < 2.5 V 0.25 0.36 2.5 V ≤ VOUT < 2.8 V 0.22 0.31 2.8 V ≤ VOUT ≤ 4.8 V 0.20 0.28 Output Current IOUT 150 mA Short Current Limit VOUT = 0 V ISC 40 mA Quiescent Current Iout = 0 mA Vout > 4.1 V IQ 80 100 (cid:2)A Vout ≤ 4.1 V 75 Standby Current VIN = VIN max , VCE = 0 V ISTB 0.1 1.0 (cid:2)A CE Pin Pull−Down Current IPD 0.3 0.6 (cid:2)A CE Pin Threshold Voltage CE Input Voltage “H” VCEH 1.0 VIN V CE Input Voltage “L” VCEL 0.4 Power Supply VOUT > 4.1 V @ VIN = 5.25 V, f = 1 kHz PSRR 80 dB Rejection Ratio VOUT ≤ 4.1 V @ VIN = Set VOUT + 1.0 V, f = 10 kHz 75 ΔVIN_PK−PK = 0.2 V, f = 100 kHz 65 IOUT = 30 mA Output Noise Voltage IOUT = 30 mA, f = 10 Hz to 100 kHz VNOISE 10 (cid:2)Vrms Autodischarge NMOS VIN = 4.0 V, VCE = 0.0 V RDSON 60 ohm Resistance http://onsemi.com 3

NCP4688 TYPICAL CHARACTERISTICS 1.4 3.0 Vin = 5.25 V Vin = 5.25 V 1.2 2.5 V) Vin = 4.0 V V) Vin = 4.0 V E ( 1.0 E ( 2.0 G Vin = 3.0 V G TA 0.8 TA Vin = 3.0 V L L O Vin = 2.0 V O 1.5 V V T 0.6 T Vin = 2.8 V U U P P 1.0 UT 0.4 UT O O 0.5 0.2 0 0 0 50 100 150 200 250 0 50 100 150 200 250 300 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) Figure 3. Output Voltage vs. Output Current Figure 4. Output Voltage vs. Output Current NCP4688xx12 NCP4688xx25 4.5 1.4 Vin = 5.25 V 4.0 1.2 Vin = 4.3 V V) 3.5 V) GE ( 3.0 Vin = 4.5 V GE ( 1.0 A Vin = 4.8 V A LT 2.5 LT 0.8 O O V V T 2.0 T 0.6 U U P 1.5 P Iout = 1 mA UT UT 0.4 O 1.0 O Iout = 30 mA 0.2 0.5 Iout = 50 mA 0 0 0 50 100 150 200 250 300 0 1 2 3 4 5 6 OUTPUT CURRENT (mA) INPUT VOLTAGE (V) Figure 5. Output Voltage vs. Output Current Figure 6. Output Voltage vs. Input Voltage NCP4688xx40 NCP4688xx12 3.0 4.5 4.0 2.5 V) V) 3.5 GE ( 2.0 GE ( 3.0 A A LT LT 2.5 O 1.5 O V V T T 2.0 U U Iout = 1 mA P 1.0 P 1.5 T T U U O Iout = 1 mA O 1.0 0.5 Iout = 30 mA Iout = 30 mA 0.5 Iout = 50 mA Iout = 50 mA 0 0 0 1 2 3 4 5 6 0 1 2 3 4 5 6 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 7. Output Voltage vs. Input Voltage Figure 8. Output Voltage vs. Input Voltage NCP4688xx25 NCP4688xx40 http://onsemi.com 4

NCP4688 TYPICAL CHARACTERISTICS 80 90 70 80 A) A) 70 (cid:2) 60 (cid:2) T ( T ( 60 N 50 N E E R R 50 R 40 R U U C C 40 Y 30 Y PL PL 30 P P U 20 U S S 20 10 10 0 0 0 1 2 3 4 5 6 0 1 2 3 4 5 6 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 9. Supply Current vs. Input Voltage Figure 10. Supply Current vs. Input Voltage NCP4688xx12 NCP4688xx25 90 80 80 75 A) 70 A) (cid:2) (cid:2) T ( 60 T ( 70 N N E E R 50 R R R 65 U U C 40 C Y Y PL 30 PL 60 P P U U S 20 S 55 10 0 50 0 1 2 3 4 5 6 −50 −25 0 25 50 75 100 INPUT VOLTAGE (V) TEMPERATURE (°C) Figure 11. Supply Current vs. Input Voltage Figure 12. Supply Current vs. Temperature NCP4688xx40 NCP4688xx12 80 80 75 75 A) A) (cid:2) (cid:2) T ( 70 T ( 70 N N E E R R R 65 R 65 U U C C Y Y PL 60 PL 60 P P U U S S 55 55 50 50 −50 −25 0 25 50 75 100 −50 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 13. Supply Current vs. Temperature Figure 14. Supply Current vs. Temperature NCP4688xx25 NCP4688xx40 http://onsemi.com 5

NCP4688 TYPICAL CHARACTERISTICS 1.220 2.53 1.215 2.52 V) V) GE (1.210 GE ( 2.51 A A T T L L O1.205 O 2.50 V V T T U U P1.200 P 2.49 T T U U O O 1.195 2.48 1.190 2.47 −50 −25 0 25 50 75 100 −50 −25 0 25 50 75 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 15. Output Voltage vs. Temperature Figure 16. Output Voltage vs. Temperature NCP4688xx12 NCP4688xx25 4.02 0.50 0.45 85°C GE (V) 44..0001 AGE (V) 00..3450 25°C A T 0.30 LT OL −40°C O 3.99 V 0.25 UT V OUT 0.20 UTP 3.98 OP 0.15 O R D 0.10 3.97 0.05 3.96 0 −50 −25 0 25 50 75 100 0 30 60 90 120 150 TEMPERATURE (°C) OUTPUT CURRENT (mA) Figure 17. Output Voltage vs. Temperature Figure 18. Dropout Voltage vs. Output Current NCP4688xx40 NCP4688xx12 0.30 0.25 V) 0.25 85°C V) 0.20 85°C E ( 25°C E ( 25°C G 0.20 G A A T T 0.15 L L O O V 0.15 V T −40°C T −40°C U U 0.10 O O P 0.10 P O O R R D D 0.05 0.05 0 0 0 30 60 90 120 150 0 30 60 90 120 150 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) Figure 19. Dropout Voltage vs. Output Current Figure 20. Dropout Voltage vs. Output Current NCP4688xx25 NCP4688xx40 http://onsemi.com 6

NCP4688 TYPICAL CHARACTERISTICS 120 120 110 110 100 100 Iout = 1 mA 90 90 B) Iout = 1 mA B) d 80 d 80 R ( R ( R 70 R 70 S S P P Iout = 60 Iout = 60 50 mA 50 mA 50 Vin = 2.2 V 50 Vin = 3.5 V 40 40 Iout = 150 mA Iout = 150 mA 30 30 100 1k 10k 100k 1M 100 1k 10k 100k 1M FREQUENCY (Hz) FREQUENCY (Hz) Figure 21. PSRR vs. Frequency NCP4688xx12 Figure 22. PSRR vs. Frequency NCP4688xx25 120 0.8 110 0.7 100 0.6 90 B) Iout = 1 mA Hz 0.5 PSRR (d 7800 Iout = (cid:2)V / sqrt 00..34 60 50 mA 0.2 50 Vin = 5.0 V 40 0.1 Iout = 150 mA 30 0 100 1k 10k 100k 1M 100 1k 10k 100k 1M FREQUENCY (Hz) FREQUENCY (Hz) Figure 23. PSRR vs. Frequency NCP4688xx40 Figure 24. Output Noise Density vs. Frequency NCP4688xx12 0.8 0.8 0.7 0.7 0.6 0.6 z 0.5 z 0.5 H H qrt 0.4 qrt 0.4 s s V / V / (cid:2) 0.3 (cid:2) 0.3 0.2 0.2 0.1 0.1 0 0 10 100 1k 10k 100k 1M 10 100 1k 10k 100k 1M FREQUENCY (Hz) FREQUENCY (Hz) Figure 25. Output Noise Density vs. Frequency Figure 26. Output Noise Density vs. Frequency NCP4688xx25 NCP4688xx40 http://onsemi.com 7

NCP4688 TYPICAL CHARACTERISTICS 3.7 5.0 3.2 4.5 2.7 4.0 2.2 3.5 (V)UT11..220032 (V)N (V)UT22..550032 (V)N O VI O VI V1.201 V2.501 1.200 2.500 1.199 2.499 1.198 Iout = 30 mA 2.498 Iout = 30 mA 1.197 2.497 0 40 80 120 160 200 240 280 320 360 400 0 40 80 120 160 200 240 280 320 360 400 t ((cid:2)s) t ((cid:2)s) Figure 27. Line Transient Response Figure 28. Line Transient Response NCP4688xx12 NCP4688xx25 5.75 225 5.25 150 4.75 75 4.25 0 (V)UT44..000032 (V)N (V)UT11..2242 (mA)T O VI O U V4.001 V1.20 O I 4.000 1.18 3.999 1.16 3.998 Iout = 30 mA 1.14 Vin = 2.2 V 3.997 1.12 0 40 80 120 160 200 240 280 320 360 400 0 20 40 60 80 100 120 140 160 180 200 t ((cid:2)s) t ((cid:2)s) Figure 29. Line Transient Response Figure 30. Load Transient Response Load NCP4688xx40 Step 1 mA to 150 mA NCP4688xx12 150 225 100 150 50 75 1.23 0 0 V)1.22 A) V) 2.54 A) (UT1.21 (mT (UT2.52 (mT O U O U V1.20 O V 2.50 O I I 1.19 2.48 1.18 2.46 1.17 Vin = 2.2 V 2.44 Vin = 3.5 V 1.16 2.42 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 t ((cid:2)s) t ((cid:2)s) Figure 31. Load Transient Response Load Figure 32. Load Transient Response Load Step 50 mA to 100 mA NCP4688xx12 Step 1 mA to 150 mA NCP4688xx25 http://onsemi.com 8

NCP4688 TYPICAL CHARACTERISTICS 150 225 100 150 50 75 2.53 0 4.06 0 V (V)OUT222...555102 (mA)OUT V (V)OUT444...000402 (mA)OUT I I 2.49 3.98 2.48 3.96 2.47 Vin = 3.5 V 3.94 Vin = 5.0 V 2.46 3.92 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 t ((cid:2)s) t ((cid:2)s) Figure 33. Load Transient Response Load Figure 34. Load Transient Response Load Step 50 mA to 100 mA NCP4688xx25 Step 1 mA to 150 mA NCP4688xx40 150 3.3 100 2.2 50 1.1 Chip Enable 4.03 0 0 V (V)OUT444...000102 (mA)OUT V (V)OUT212...550 V (V)CE I Iout = 1 mA 3.99 1.0 Iout = 30 mA 3.98 0.5 3.97 Vin = 5.0 V 0 Iout = 150 mA 3.96 −0.5 0 20 40 60 80 100 120 140 160 180 200 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t ((cid:2)s) t (ms) Figure 35. Load Transient Response Load Figure 36. Turn Off with CE Behavior Step 50 mA to 100 mA NCP4688xx40 NCP4688Dx12 5.25 7.5 3.50 5.0 1.75 2.5 Chip Enable Chip Enable 0 0 (V)VOUT 122...550 Iout = 1 mA V (V)CE V (V)OUT534...000 V (V)CE Iout = 1 mA 1.0 Iout = 30 mA 2.0 Iout = 30 mA 0.5 1.0 0 0 Iout = 150 mA Iout = 150 mA −0.5 −1.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t (ms) t (ms) Figure 37. Turn Off with CE Behavior Figure 38. Turn Off with CE Behavior NCP4688Dx25 NCP4688Dx40 http://onsemi.com 9

NCP4688 TYPICAL CHARACTERISTICS 3.3 5.25 2.2 3.50 Chip Enable Chip Enable 1.1 1.75 0 0 Iout = 1 mA (V)UT22..50 IoIouut =t = 1 3500 mmAA (V)E (V)UT22..50 (V)E O C O C V 1.5 V V 1.5 V 1.0 1.0 0.5 0.5 Iout = 1 mA Iout = 30 mA 0 0 Iout = 150 mA −0.5 −0.5 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 t ((cid:2)s) t ((cid:2)s) Figure 39. Turn ON with CE Behavior Figure 40. Turn ON with CE Behavior NCP4688xx12 NCP4688xx25 http://onsemi.com 10

NCP4688 APPLICATION INFORMATION A typical application circuit for NCP4688 series is shown Enable Operation in the Figure 41. The enable pin CE may be used for turning the regulator on and off. The IC is switched on when a high level voltage NCP4688x is applied to the CE pin. The enable pin has an internal pull VIN VOUT down current source which assure off state of LDO in case VIN VOUT the CE pin will stay floating. If the enable function is not C1 CE C2 needed connect CE pin to V . 1.0 (cid:2)F GND 1.0 (cid:2)F IN The D version of the NCP4688 device includes a transistor between V and GND that is used for faster OUT discharging of the output capacitor. This function is activated when the IC goes into disable mode. Figure 41. Typical Application Schematic Thermal Consideration As a power across the IC increase, it might become necessary to provide some thermal relief. The maximum Input Decoupling Capacitor (C1) power dissipation supported by the device is dependent A 1.0 (cid:2)F ceramic input decoupling capacitor should be upon board design and layout. Mounting pad configuration connected as close as possible to the input and ground pin of on the PCB, the board material, and also the ambient the NCP4688 device. Higher values and lower ESR temperature affect the rate of temperature increase for the improves line transient response. part. When the device has good thermal conductivity Output Decoupling Capacitor (C2) through the PCB the junction temperature will be relatively A 1.0 (cid:2)F ceramic output decoupling capacitor is sufficient low in high power dissipation applications. to achieve stable operation of the device. If tantalum ESR vs. Output Current capacitor is used, and its ESR is high, the loop oscillation When using the NCP4688 devices, consider the following may result. For information about ESR see Figures 42, 43 points: and 44. The capacitor should be connected as close as The relation between Output Current Iout and ESR of the possible to the output and ground pin. Larger values and output capacitor are shown below in Figures 42, 43 and 44. lower ESR improves dynamic parameters. The conditions when the device performs stable operation are marked as the hatched area in the charts. 100 100 10 10 (cid:4)) (cid:4)) R ( 1 R ( 1 S S E E 0.1 0.1 0.01 0.01 0 25 50 75 100 125 150 0 25 50 75 100 125 150 LOAD CURRENT (mA) LOAD CURRENT (mA) Figure 42. ESR vs. Load Current NCP4688xx12 Figure 43. ESR vs. Load Current NCP4688xx25 http://onsemi.com 11

NCP4688 100 10 (cid:4)) R ( 1 S E 0.1 0.01 0 25 50 75 100 125 150 LOAD CURRENT (mA) Figure 44. ESR vs. Load Current NCP4688xx40 ORDERING INFORMATION Nominal Output Device Marking Voltage Feature Package Shipping† NCP4688DMU12TCG 3A 1.2 V Auto discharge DFN1010 10000 / Tape & Reel (Pb−Free) NCP4688DMU15TCG 3E 1.5 V Auto discharge DFN1010 10000 / Tape & Reel (Pb−Free) NCP4688DMU18TCG 3H 1.8 V Auto discharge DFN1010 10000 / Tape & Reel (Pb−Free) NCP4688DMU25TCG 3R 2.5 V Auto discharge DFN1010 10000 / Tape & Reel (Pb−Free) NCP4688DMU28TCG 3U 2.8 V Auto discharge DFN1010 10000 / Tape & Reel (Pb−Free) NCP4688DMU30TCG 3X 3.0 V Auto discharge DFN1010 10000 / Tape & Reel (Pb−Free) NCP4688DMU33TCG 4A 3.3 V Auto discharge DFN1010 10000 / Tape & Reel (Pb−Free) NCP4688DSN12T1G L12 1.2 V Auto discharge SOT−23 3000 / Tape & Reel (Pb−Free) NCP4688DSN15T1G L15 1.5 V Auto discharge SOT−23 3000 / Tape & Reel (Pb−Free) NCP4688DSN18T1G L18 1.8 V Auto discharge SOT−23 3000 / Tape & Reel (Pb−Free) NCP4688DSN25T1G L25 2.5 V Auto discharge SOT−23 3000 / Tape & Reel (Pb−Free) NCP4688DSN28T1G L28 2.8 V Auto discharge SOT−23 3000 / Tape & Reel (Pb−Free) NCP4688DSN33T1G L33 3.3 V Auto discharge SOT−23 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 12

NCP4688 PACKAGE DIMENSIONS UDFN4 1.0x1.0, 0.65P CASE 517BR−01 ISSUE O NOTES: D A 4XL3 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. B 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND c 0.18 REFEPRINE ONCNEE L2 typ 4. 0C.O20P LmAmN AFRRIOTMY ATEPRPLMIEINSA TLO. THE EXPOSED ÉÉ E PAD AS WELL AS THE TERMINALS. DETAIL A 2X 0.05 CÉÉ MILLIMETERS DIM MIN MAX 2X 0.05 C A −−− 0.60 3X0.43 4X0.23 A1 0.00 0.05 TOP VIEW A3 0.10 REF b 0.20 0.30 0.05 C (A3) D 1.00 BSC D2 0.43 0.53 A E 1.00 BSC e 0.65 BSC 0.05 C 3X0.10 L 0.20 0.30 L2 0.27 0.37 NOTE 4 SIDE VIEW A1 C SPELAATNIENG DETAIL B L3 0.02 0.12 e e/2 DETAIL A 1 2 3XL D2 D2 45(cid:2) 4 3 4Xb 0.05 M C A B BOTTOM VIEW NOTE 3 RECOMMENDED MOUNTING FOOTPRINT* 0.65 PITCH DETAIL B 2X 0.52 PACKAGE OUTLINE 1.30 0.53 4X 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 13

NCP4688 PACKAGE DIMENSIONS SOT−23 5−LEAD CASE 1212−01 ISSUE A NOTES: A 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. A D B A2 2. CONTROLLING DIMENSIONS: MILLIMETERS. 0.05 S A1 3. DATUM C IS THE SEATING PLANE. MILLIMETERS 5 4 DIM MIN MAX E L A --- 1.45 1 2 3 A1 0.00 0.10 E1 A2 1.00 1.30 L1 5Xb C b 0.30 0.50 c 0.10 0.25 e 0.10 M C B S A S C D 2.70 3.10 E 2.50 3.10 E1 1.50 1.80 e 0.95 BSC L 0.20 --- RECOMMENDED L1 0.45 0.75 SOLDERING FOOTPRINT* 3.30 5X 0.85 5X 0.56 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com NCP4688/D 14

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: NCP4688DMU15TCG NCP4688DMU18TCG NCP4688DMU30TCG NCP4688DMU28TCG NCP4688DSN25T1G NCP4688DSN33T1G NCP4688DSN18T1G NCP4688DSN28T1G NCP4688DSN15T1G NCP4688DMU33TCG NCP4688DSN12T1G NCP4688DMU25TCG NCP4688DMU12TCG