NCP4625 300 mA, 10 V, Low Dropout Regulator The NCP4625 is a CMOS Linear voltage regulator with 300 mA output current capability. The device is capable of operating with input voltages up to 10 V, with high output voltage accuracy and low temperature−drift coefficient. The NCP4625 is easy to use, with http://onsemi.com output current fold−back protection and a thermal shutdown circuit MARKING included. A Chip Enable function is included to save power by DIAGRAMS lowering supply current. Features • XXX M(cid:2) Operating Input Voltage Range: 2.6 V to 10 V • SC−70 (cid:2) Output Voltage Range: 1.2 to 6.0 V (available in 0.1 V steps) CASE 419A 1 • Low Supply Current: 23 (cid:2)A • Very Low Dropout: ♦ 200 mV (I = 100 mA, V = 3.0 V) 1 OUT IN ♦ 770 mV (IOUT = 300 mA, VIN = 2.8 V) XXX • High PSRR: 70 dB at 1 kHz SOT−89 5 XMM • Line Regulation 0.02%/V Typ CASE 528AB • Current Fold Back Protection • Thermal Shutdown Protection • Stable with Ceramic Capacitors XXXMM • Available in SC−70, SOT89 and SOT−23 Package SOT−23−5 • 1 These are Pb−Free Devices CASE 1212 Typical Applications XX, XXX= Specific Device Code • Battery products powered by Two Lithium Ion cells M, MM = Date Code • Networking and Communication Equipment A = Assembly Location • Y = Year Cameras, DVRs, STB and Camcorders W = Work Week • Toys, industrial applications (cid:2) = Pb−Free Package (*Note: Microdot may be in either location) NCP4625x VIN VOUT VIN VOUT ORDERING INFORMATION C1 C2 See detailed ordering and shipping information in the package CE 1(cid:2) GND 1(cid:2) dimensions section on page 14 of this data sheet. Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2012 1 Publication Order Number: February, 2012 − Rev. 2 NCP4625/D

NCP4625 VIN VOUT VIN VOUT Vref Vref Current Limit Current Limit Thermal Shutdown CE Thermal Shutdown CE GND GND NCP4625Hxxxx NCP4625Dxxxx Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. Pin No. Pin No. SOT89 SC−70 SOT23 Pin Name Description 5 5 1 VIN Input pin 2 3 2 GND Ground 3 1 3 CE Chip enable pin (Active “H”) 1 4 5 VOUT Output pin 4 2 4 NC No connection ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) V 12.0 V IN Output Voltage VOUT −0.3 to VIN + 0.3 V Chip Enable Input VCE 12.0 V Output Current IOUT 330 mA Power Dissipation SOT89 PD 900 mW Power Dissipation SC−70 380 Power Dissipation SOT23 420 Junction Temperature T −40 to 150 °C J Storage Temperature T −55 to 125 °C STG ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. http://onsemi.com 2

NCP4625 THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, SOT89 R(cid:3)JA 111 °C/W Thermal Resistance, Junction−to−Air Thermal Characteristics, SOT23 R(cid:3)JA 238 °C/W Thermal Resistance, Junction−to−Air Thermal Characteristics, SC−70 R(cid:3)JA 263 °C/W Thermal Resistance, Junction−to−Air ELECTRICAL CHARACTERISTICS −40°C ≤ TA ≤ 85°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 0.47 (cid:2)F, unless otherwise noted. Typical values are at TA = +25°C. Parameter Test Conditions Symbol Min Typ Max Unit Operating Input Voltage VIN 2.6 10 V Output Voltage TA = +25°C VOUT > 1.5 V VOUT x0.99 x1.01 V VOUT ≤ 1.5 V −15 15 mV −40°C ≤ TA ≤ 85°C VOUT > 1.5 V x0.974 x1.023 V VOUT ≤ 1.5 V −40 35 mV Output Voltage Temp. −40°C ≤ TA ≤ 85°C ±80 ppm/°C Coefficient Line Regulation VOUT(NOM) + 0.5 V or 2.6 V (whichever is higher) LineReg 0.02 0.2 %/V ≤ VIN ≤ 10 V Load Regulation IOUT = 0.1 mA to 300 mA LineReg 10 70 mV Dropout Voltage IOUT = 300 mA 1.2 V ≤ VOUT < 1.3 V VDO 1.40 1.80 V 1.3 V ≤ VOUT < 1.5 V 1.35 1.75 1.5 V ≤ VOUT < 1.8 V 1.20 1.55 1.8 V ≤ VOUT < 2.3 V 0.98 1.30 2.3 V ≤ VOUT < 3.0 V 0.77 1.08 3.0 V ≤ VOUT < 4.0 V 0.60 0.85 4.0 V ≤ VOUT < 6.0 V 0.50 0.75 Output Current IOUT 300 mA Short Current Limit VOUT = 0 V ISC 40 mA Quiescent Current IQ 23 40 (cid:2)A Standby Current VIN = 10 V, VCE = 0 V, TA = 25°C ISTB 0.1 1.0 (cid:2)A CE Pin Threshold Voltage CE Input Voltage “H” VCEH 1.7 V CE Input Voltage “L” VCEL 0.8 CE Pull Down Current ICEPD 0.3 (cid:2)A Power Supply Rejection Ratio VIN = VOUT + 1 V or 3.0 V whichever is higher, PSRR 70 dB ΔVIN = 0.2 Vpk−pk, IOUT = 30 mA, f = 1 kHz Output Noise Voltage f = 10 Hz to 100 kHz VN 85 (cid:2)Vrms Low Output N−channel Tr. On VIN = 7 V, VCE = 0 V, VOUT = 1.2 V, VIN = 2.6 V, RLOW 250 (cid:4) Resistance IOUT = 30 mA Thermal Shutdown Temperature TTSD 165 °C Thermal Shutdown Release TTSR 110 °C http://onsemi.com 3

NCP4625 TYPICAL CHARACTERISTICS 1.4 3.0 3.6 V 1.2 4.0 V 2.5 3.3 V 5.0 V 1.0 VIN = 3.0 V 2.0 V) 0.8 VIN = 2.6 V V) (UT 3.0 V 4.0 V (UT 1.5 O 0.6 O V V 1.0 0.4 0.5 0.2 0.0 0.0 0 100 200 300 400 500 600 0 110000 220000 330000 440000 550000 660000 IOUT (mA) IOUT (mA) Figure 3. Output Voltage vs. Output Current Figure 4. Output Voltage vs. Output Current 1.2 V Version (T = 25(cid:2)C) 2.8 V Version (T = 25(cid:2)C) J J 6.0 1.75 8.0 V 5.0 1.50 105°C VIN = 5.3 V 1.25 TJ = −40°C and TJ = 25°C 4.0 5.6 V V) 6.0 V V) 1.00 (UT 3.0 7.0 V (O VO VD 0.75 2.0 0.50 1.0 0.25 0.0 0.00 0 100 200 300 400 500 600 0 50 100 150 200 250 300 IOUT (mA) IOUT (mA) Figure 5. Output Voltage vs. Output Current Figure 6. Dropout Voltage vs. Output Current 5.0 V Version (T = 25(cid:2)C) 1.2 V Version J 0.70 0.50 0.60 TJ = 25°C 0.40 0.50 TJ = 25°C V)0.40 105°C V) 0.30 V (DO0.30 V (DO0.20 105°C −40°C 0.20 −40°C 0.10 0.10 0.00 0.00 0 50 100 150 200 250 300 0 50 100 150 200 250 300 IOUT (mA) IOUT (mA) Figure 7. Dropout Voltage vs. Output Current Figure 8. Dropout Voltage vs. Output Current 2.8 V Version 5.0 V Version http://onsemi.com 4

NCP4625 TYPICAL CHARACTERISTICS 1.30 2.90 1.28 VIN = 2.6 V 2.88 VIN = 3.8 V 1.26 2.86 1.24 2.84 V)1.22 V) 2.82 (T1.20 (T 2.80 U U O O V1.18 V 2.78 1.16 2.76 1.14 2.74 1.12 2.72 1.10 2.70 −40 −20 0 20 40 60 80 −40 −20 0 20 40 60 80 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 9. Output Voltage vs. Temperature, Figure 10. Output Voltage vs. Temperature, 1.2 V Version 2.8 V Version 5.10 40 5.08 VIN = 6.0 V 35 5.06 30 5.04 VOUT = 5 V 25 V)5.02 A) (UT5.00 (cid:2) (D 20 2.8 V O N V4.98 G 1.2 V I 15 4.96 10 4.94 5 4.92 4.90 0 −40 −20 0 20 40 60 80 0 1 2 3 4 5 6 TJ, JUNCTION TEMPERATURE (°C) VIN, OUTPUT VOLTAGE (V) Figure 11. Output Voltage vs. Temperature, Figure 12. Supply Current vs. Input Voltage 5.0 V Version 30 1.4 1.2 25 2.8 V 5.0 V 1 mA 20 mA 1.0 20 50 mA A) V) 0.8 (cid:2) (D 15 VOUT = 1.2 V (UT 100 mA N O 0.6 G V I 10 IOUT = 200 mA 0.4 5 0.2 0 0.0 −40 −20 0 20 40 60 80 0 2 4 6 8 10 TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V) Figure 13. Supply Current vs. Temperature, Figure 14. Output Voltage vs. Input Voltage, 1.2 V Version 1.2 V Version http://onsemi.com 5

NCP4625 TYPICAL CHARACTERISTICS 3.0 6.0 1 mA 2.5 20 mA 5.0 50 mA 2.0 4.0 100 mA 20 mA V) V) (T1.5 (T 3.0 U U 50 mA O O V V 1.0 IOUT = 200 mA 2.0 100 mA 1 mA 0.5 1.0 IOUT = 200 mA 0.0 0.0 0 2 4 6 8 10 0 2 4 6 8 10 VIN, INPUT VOLTAGE (V) VIN, INPUT VOLTAGE (V) Figure 15. Output Voltage vs. Input Voltage, Figure 16. Output Voltage vs. Input Voltage, 2.8 V Version 5.0 V Version 100 100 90 90 IOUT = 100 mA 80 IOUT = 100 mA 80 30 mA 70 30 mA 70 B) 60 1 mA B) 60 R (d 50 R (d 50 1 mA R R S 40 S 40 P P 30 30 20 20 10 10 0 0 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 17. PSRR, 1.2 V Version, V = 2.6 V Figure 18. PSRR, 1.2 V Version, V = 3.0 V IN IN 100 100 90 90 IOUT = 100 mA 80 IOUT = 100 mA 80 30 mA 70 70 30 mA B) 60 B) 60 d 1 mA d 1 mA R ( 50 R ( 50 R R S 40 S 40 P P 30 30 20 20 10 10 0 0 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 19. PSRR, 2.8 V Version, V = 3.8 V Figure 20. PSRR, 2.8 V Version, V = 4.8 V IN IN http://onsemi.com 6

NCP4625 TYPICAL CHARACTERISTICS 100 100 90 90 80 80 30 mA 70 70 30 mA B) 60 1 mA B) 60 R (d 50 R (d 50 IOUT = 100 mA 1 mA R IOUT = 100 mA R S 40 S 40 P P 30 30 20 20 10 10 0 0 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 21. PSRR, 5.0 V Version, V = 6.0 V Figure 22. PSRR, 5.0 V Version, V = 7.0 V IN IN 3.0 9.0 8.0 2.5 7.0 Hz) 2.0 Hz)6.0 √/ms1.5 √/ms5.0 Vr Vr4.0 (cid:2)V (N1.0 (cid:2)V (N3.0 2.0 0.5 1.0 0.0 0.0 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 23. Output Voltage Noise, 1.2 V Version, Figure 24. Output Voltage Noise, 2.8 V Version, V = 2.6 V V = 3.8 V IN IN 12 10 z) 8.0 H √ /s m6.0 Vr (cid:2) V (N4.0 2.0 0.0 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) Figure 25. Output Voltage Noise, 5.0 V Version, V = 6.0 V IN http://onsemi.com 7

NCP4625 TYPICAL CHARACTERISTICS 5 4 3 2 (V)UT11..221250 01 (V)N O VI V1.210 1.205 1.200 1.195 1.190 0 10 20 30 40 50 60 70 80 90 100 t ((cid:2)s) Figure 26. Line Transients, 1.2 V Version, t = t = 5 (cid:2)s, I = 30 mA R F OUT 6 5 4 3 (V)UT22..881250 12 (V)N O VI V2.810 2.805 2.800 2.795 2.790 0 10 20 30 40 50 60 70 80 90 100 t ((cid:2)s) Figure 27. Line Transients, 2.8 V Version, t = t = 5 (cid:2)s, I = 30 mA R F OUT 8 7 6 5 (V)UT55..000150 34 (V)N O VI V 5.000 4.995 4.990 4.985 4.980 0 10 20 30 40 50 60 70 80 90 100 t ((cid:2)s) Figure 28. Line Transients, 5.0 V Version, t = t = 5 (cid:2)s, I = 30 mA R F OUT http://onsemi.com 8

NCP4625 TYPICAL CHARACTERISTICS 200 150 100 50 V) A) (UT 0 (mT O 1.24 U V O I 1.22 1.20 1.18 1.16 1.14 0 20 40 60 80 100 120 140 160 180 200 t ((cid:2)s) Figure 29. Load Transients, 1.2 V Version, I = 50 – 100 mA, t = t = 0.5 (cid:2)s, V = 2.6 V OUT R F IN 200 150 100 50 V) 0 A) (UT 2.83 (mT O U V 2.81 O I 2.79 2.77 2.75 2.73 0 20 40 60 80 100 120 140 160 180 200 t ((cid:2)s) Figure 30. Load Transients, 2.8 V Version, I = 50 – 100 mA, t = t = 0.5 (cid:2)s, V = 3.8 V OUT R F IN 200 150 100 50 V) 0 A) (UT 5.05 (mT O U V 5.03 O I 5.01 4.99 4.97 4.95 0 20 40 60 80 100 120 140 160 180 200 t ((cid:2)s) Figure 31. Load Transients, 5.0 V Version, I = 50 – 100 mA, t = t = 0.5 (cid:2)s, V = 6.0 V OUT R F IN http://onsemi.com 9

NCP4625 TYPICAL CHARACTERISTICS 200 150 100 50 V) 0 A) (UT 1.40 (mT O U V 1.30 O I 1.20 1.10 1.00 0.99 0 50 100 150 200 250 300 350 400 450 500 t ((cid:2)s) Figure 32. Load Transients, 1.2 V Version, I = 1 – 150 mA, t = t = 0.5 (cid:2)s, V = 2.6 V OUT R F IN 200 150 100 50 V) 0 A) (UT 2.90 (mT O U V 2.80 O I 2.70 2.60 2.50 2.40 0 50 100 150 200 250 300 350 400 450 500 t ((cid:2)s) Figure 33. Load Transients, 2.8 V Version, I = 1 – 150 mA, t = t = 0.5 (cid:2)s, V = 3.8 V OUT R F IN 200 150 100 50 V) 0 A) (UT 5.20 (mT O U V 5.10 O I 5.00 4.90 4.80 4.70 0 50 100 150 200 250 300 350 400 450 500 t ((cid:2)s) Figure 34. Load Transients, 5.0 V Version, I = 1 – 150 mA, t = t = 0.5 (cid:2)s, V = 6.0 V OUT R F IN http://onsemi.com 10

NCP4625 TYPICAL CHARACTERISTICS 4 Chip Enable 3 2 1 V) 0 V) V (OUT12..50 IOUT = 30 mA V (CE 1.0 IOUT = 300 mA 0.5 IOUT = 1 mA 0.0 −0.5 0 20 40 60 80 100 120 140 160 180 200 t ((cid:2)s) Figure 35. Start−up, 1.2 V Version, V = 2.6 V IN 55 Chip Enable 44 33 22 11 V (V)OUT 34 IOUT = 30 mA 00 V (V)CE 2 1 IOUT = 300 mA IOUT = 1 mA 0 −1 0 20 40 60 80 100 120 140 160 180 200 t ((cid:2)s) Figure 36. Start−up, 2.8 V Version, V = 3.8 V IN 10 8 Chip Enable 6 4 V) 2 V) V (OUT 68 0 V (CE 4 IOUT = 30 mA 2 IOUT = 300 mA IOUT = 1 mA 0 −2 0 20 40 60 80 100 120 140 160 180 200 t ((cid:2)s) Figure 37. Start−up, 5.0 V Version, V = 6.0 V IN http://onsemi.com 11

NCP4625 TYPICAL CHARACTERISTICS 4 3 2 1 Chip Enable V) 0 V) (UT2.0 (N VO1.5 IOUT = 1 mA VE 1.0 IOUT = 30 mA 0.5 0.0 IOUT = 300 mA −0.5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t ((cid:2)s) Figure 38. Shutdown, 1.2 V Version D, V = 2.6 V IN 5 4 3 2 (V)UT 4 Chip Enable 1 (V)N VO 3 IOUT = 1 mA VE 2 IOUT = 30 mA 1 0 IOUT = 300 mA −1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t ((cid:2)s) Figure 39. Shutdown, 2.8 V Version D, V = 3.8 V IN 10 8 6 4 V) 2 V) (UT 8 Chip Enable 0 (N VO 6 VE IOUT = 1 mA 4 2 IOUT = 30 mA 0 IOUT = 300 mA −2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t ((cid:2)s) Figure 40. Shutdown, 5.0 V Version D, V = 6.0 V IN http://onsemi.com 12

NCP4625 APPLICATION INFORMATION A typical application circuit for NCP4625 series is shown Enable Operation in Figure 41. The enable pin CE may be used for turning the regulator on and off. The IC is switched on when a high level voltage NCP4625x is applied to the CE pin. The enable pin has an internal pull VIN VOUT VIN VOUT down current source. If the enable function is not needed C1 C2 connect CE pin to VIN. CE 1(cid:2) GND 1(cid:2) Output Discharger The D version includes a transistor between V and OUT GND that is used for faster discharging of the output capacitor. This function is activated when the IC goes into disable mode. Figure 41. Typical Application Schematic Thermal As a power across the IC increase, it might become Input Decoupling Capacitor (C1) necessary to provide some thermal relief. The maximum A 1 (cid:2)F ceramic input decoupling capacitor should be power dissipation supported by the device is dependent connected as close as possible to the input and ground pin of upon board design and layout. Mounting pad configuration the NCP4625. Higher values and lower ESR improves line on the PCB, the board material, and also the ambient transient response. temperature affect the rate of temperature increase for the part. When the device has good thermal conductivity Output Decoupling Capacitor (C2) through the PCB the junction temperature will be relatively A 1 (cid:2)F ceramic output decoupling capacitor is enough to low in high power dissipation applications. achieve stable operation of the IC. If a tantalum capacitor is used, and its ESR is high, loop oscillation may result. The PCB Layout capacitors should be connected as close as possible to the Make the VIN and GND line as large as practical. If their output and ground pins. Larger values and lower ESR impedance is high, noise pickup or unstable operation may improves dynamic parameters. result. Connect capacitors C1 and C2 as close as possible to the IC, and make wiring as short as possible. http://onsemi.com 13

NCP4625 ORDERING INFORMATION Nominal Output Device Voltage Description Marking Package Shipping† NCP4625DSN12T1G 1.2 V Auto discharge FBA SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625DSN18T1G 1.8 V Auto discharge FBH SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625DSN28T1G 2.8 V Auto discharge FBU SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625DSN30T1G 3.0 V Auto discharge FBX SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625DSN33T1G 3.3 V Auto discharge GBA SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625DSN50T1G 5.0 V Auto discharge GBT SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625HSN12T1G 1.2 V Standard FAA SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625HSN18T1G 1.8 V Standard FAH SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625HSN28T1G 2.8 V Standard FAU SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625HSN30T1G 3.0 V Standard FAX SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625HSN33T1G 3.3 V Standard GAA SOT−23 3000 / Tape & Reel (Pb−Free) NCP4625HSN50T1G 5.0 V Standard GAT SOT−23 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 14

NCP4625 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE K A NOTES: 1. DIMENSIONING AND TOLERANCING G PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE 5 4 MOLD FLASH, PROTRUSIONS, OR GATE BURRS. S −B− INCHES MILLIMETERS 1 2 3 DIM MIN MAX MIN MAX A 0.071 0.087 1.80 2.20 B 0.045 0.053 1.15 1.35 C 0.031 0.043 0.80 1.10 D 0.004 0.012 0.10 0.30 D 5 PL 0.2 (0.008) M B M G 0.026 BSC 0.65 BSC H --- 0.004 --- 0.10 J 0.004 0.010 0.10 0.25 N K 0.004 0.012 0.10 0.30 N 0.008 REF 0.20 REF S 0.079 0.087 2.00 2.20 J C K H http://onsemi.com 15

NCP4625 PACKAGE DIMENSIONS SOT−89, 5 LEAD CASE 528AB−01 ISSUE O D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS INCLUDES LEAD FINISH. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. E H 5. DIMENSIONS L, L2, L3, L4, L5, AND H ARE MEAS- URED AT DATUM PLANE C. MILLIMETERS DIM MIN MAX 1 A 1.40 1.60 b 0.32 0.52 b1 0.37 0.57 TOP VIEW c 0.30 0.50 D 4.40 4.60 D2 1.40 1.80 E 2.40 2.60 c e 1.40 1.60 A H 4.25 4.45 L 1.10 1.50 0.10 C L2 0.80 1.20 L3 0.95 1.35 C SIDE VIEW L4 0.65 1.05 L5 0.20 0.60 e e RECOMMENDED b1 b L2 MOUNTING FOOTPRINT* L 1 2 3 4X0.57 1.75 1.50 L5 0.45 2.79 5 4 4.65 L3 L4 D2 1.65 BOTTOM VIEW 1.30 1 2X 0.62 2X1.50 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 16

NCP4625 PACKAGE DIMENSIONS SOT−23 5−LEAD CASE 1212−01 ISSUE A NOTES: A 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. A D B A2 2. CONTROLLING DIMENSIONS: MILLIMETERS. 0.05 S A1 3. DATUM C IS THE SEATING PLANE. MILLIMETERS 5 4 DIM MIN MAX E L A --- 1.45 1 2 3 A1 0.00 0.10 E1 A2 1.00 1.30 L1 5Xb C b 0.30 0.50 c 0.10 0.25 e 0.10 M C B S A S C D 2.70 3.10 E 2.50 3.10 E1 1.50 1.80 e 0.95 BSC RECOMMENDED L 0.20 --- SOLDERING FOOTPRINT* L1 0.45 0.75 3.30 5X 0.85 5X 0.56 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com NCP4625/D 17

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: NCP4625DSN12T1G NCP4625DSN18T1G NCP4625DSN28T1G NCP4625DSN30T1G NCP4625DSN33T1G NCP4625DSN50T1G NCP4625HSN12T1G NCP4625HSN18T1G NCP4625HSN28T1G NCP4625HSN30T1G NCP4625HSN33T1G NCP4625HSN50T1G