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  • 型号: NC7WZ17L6X
  • 制造商: Fairchild Semiconductor
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NC7WZ17L6X产品简介:

ICGOO电子元器件商城为您提供NC7WZ17L6X由Fairchild Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 NC7WZ17L6X价格参考。Fairchild SemiconductorNC7WZ17L6X封装/规格:逻辑 - 缓冲器,驱动器,接收器,收发器, Buffer, Non-Inverting 2 Element 1 Bit per Element Push-Pull Output 6-MicroPak。您可以下载NC7WZ17L6X参考资料、Datasheet数据手册功能说明书,资料中有NC7WZ17L6X 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC BUFF DL SCHMT TRIG 6MICROPAK缓冲器和线路驱动器 Dl Buff Sch Trigger

产品分类

逻辑 - 缓冲器,驱动器,接收器,收发器

品牌

Fairchild Semiconductor

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

逻辑集成电路,缓冲器和线路驱动器,Fairchild Semiconductor NC7WZ17L6X7WZ

数据手册

点击此处下载产品Datasheet

产品型号

NC7WZ17L6X

PCN组件/产地

点击此处下载产品Datasheet

PCN设计/规格

点击此处下载产品Datasheet点击此处下载产品Datasheet

产品种类

缓冲器和线路驱动器

传播延迟时间

6.6 ns at 3.3 V, 5.6 ns at 5 V

低电平输出电流

32 mA

供应商器件封装

6-MicroPak

元件数

2

其它名称

NC7WZ17L6XCT

包装

剪切带 (CT)

单位重量

19.800 mg

商标

Fairchild Semiconductor

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

6-UFDFN

封装/箱体

MicroPAK-6

工作温度

-40°C ~ 85°C

工厂包装数量

5000

最大功率耗散

130 mW

最大工作温度

+ 85 C

最小工作温度

- 40 C

极性

Non-Inverting

标准包装

1

每元件位数

1

每芯片的通道数量

2

电压-电源

1.65 V ~ 5.5 V

电流-输出高,低

32mA,32mA

电源电压-最大

5.5 V

电源电压-最小

1.65 V

系列

NC7WZ17

输入线路数量

2

输出线路数量

2

逻辑类型

CMOS

逻辑系列

TinyLogic UHS

高电平输出电流

- 32 mA

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PDF Datasheet 数据手册内容提取

Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

N C 7 W Z January 2012 1 7 — T i n y NC7WZ17 L o g TinyLogic® UHS Dual Buffer with Schmitt Trigger Inputs i c ® U H S D Features Description u a  Ultra-High Speed: t 3.6ns (Typical) into 50pF The NC7WZ17 is a dual buffer with Schmitt trigger l PD B at 5V VCC inputs from Fairchild's Ultra-High Speed (UHS) series u of TinyLogic® products. The device is fabricated with f  High Output Drive: ±24mA at 3V VCC advanced CMOS technology to achieve ultra-high fe r  Broad V Operating Range: 1.65V to 5.5V speed with high output drive, while maintaining low w CC  Matches Performance of LCX when Operated sotpaetirca tinpgo wrearn ged.is sTihpea tidoenv icoev eirs sap evceifriey d btroo aodp erVaCteC ith at 3.3V VCC over the 1.65V to 5.5V VCC range. The inputs and S c  Power Down High Impedance Inputs/Outputs outputs are high-impedance when VCC is 0V. Inputs h  Over-Voltage Tolerance Inputs Facilitate 5V to 3V toopleerraattein g vovoltaltaggees . Supc hmtoit t 7trVig, geinr dienppeuntsd eanct hieovf e V1CVC mi t Translation typical hysteresis between the positive- and negative- t T  Proprietary Noise/EMI Reduction Circuitry going input threshold voltage at 5V. r i g  Ultra-Small MicroPak™ Packages g e  Space-Saving SC70 Package r I n p u t s Ordering Information Operating Packing Part Number Top Mark Package Temperature Method 3000 Units on NC7WZ17P6X -40 to +85°C Z17 6-Lead SC70, EIAJ SC-88a, 1.25mm Wide Tape & Reel 5000 Units on NC7WZ17L6X -40 to +85°C A5 6-Lead MicroPak™, 1.00mm Wide Tape & Reel 5000 Units on NC7WZ17FHX -40 to +85°C A5 6-Lead, MicroPak2, 1x1mm Body, .35mm Pitch Tape & Reel © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ17 • Rev. 1.0.6

N C Connection Diagrams 7 W IEEC/IEC Z 1 7 A 1 Y 1 1 — T A Y i 2 2 n y L o Figure 1. Logic Symbol g i c ® Pin Configurations U H S D A1 1 6 Y1 A1 1 6 Y1 u a l GND 2 5 VCC GND 2 5 VCC B u f f A2 3 4 Y2 A2 3 4 Y2 er w i Figure 2. SC70 (Top View) Figure 3. MicroPak (Top Through View) th S c h m AAA i t t T r i g Pin One g e r Notes: I n 1. AAA represents Product Code Top Mark (see ordering code). p 2. Orientation of Top Mark determines Pin One location. Read the top product code mark left to right. u t Pin One is the lower left pin. s Figure 4. SC70 Pin 1 Orientation Pin Definitions Pin # SC70 Pin # MicroPak Name Description 1 1 A Input 1 2 2 GND Ground 3 3 A Input 2 4 4 Y Output 2 5 5 V Supply Voltage CC 6 6 Y Output 1 Function Table Y = A Inputs Output A Y L L H H H = HIGH Logic Level L = LOW Logic Level © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ17 • Rev. 1.0.6 2

N C Absolute Maximum Ratings 7 W Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be Z operable above the recommended operating conditions and stressing the parts to these levels is not recommended. 1 7 In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. — The absolute maximum ratings are stress ratings only. T Symbol Parameter Min. Max. Unit in y V Supply Voltage -0.5 7.0 V L CC o V DC Input Voltage -0.5 7.0 V g IN i c V DC Output Voltage -0.5 7.0 V ® OUT U I DC Input Diode Current V < -0.5V -50 mA IK IN H I DC Output Diode Current V < -0.5V -50 mA S OK OUT D I DC Output Current ±50 mA OUT u a ICC or IGND DC VCC or Ground Current ±100 mA l B TSTG Storage Temperature Range -65 +150 °C u f T Junction Temperature Under Bias +150 °C f J e r T Junction Lead Temperature (Soldering, 10 Seconds) +260 °C L w SC70-6 180 it h PD Power Dissipation at 85°C MicroPak-6 130 mW S c MicroPak2-6 120 h m Human Body Model, JEDEC:JESD22-A114 4000 i ESD V t t Charge Device Model, JEDEC:JESD22-C101 2000 T r i g g e r I n Recommended Operating Conditions(3) p u t The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended s operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Max. Unit Supply Voltage Operating 1.65 5.50 V V CC Supply Voltage Data Retention 1.5 5.5 V Input Voltage 0 5.5 V IN V Output Voltage 0 V V OUT CC T Operating Temperature -40 +85 °C A SC70-6 350  Thermal Resistance MicroPak-6 500 °C/W JA MicroPak2-6 560 Note: 3. Unused inputs must be held HIGH or LOW. They may not float. © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ17 • Rev. 1.0.6 3

N C DC Electrical Characteristics 7 W T =25°C T =-40 to 85°C Z Symbol Parameter V (V) Conditions A A Units 1 CC 7 Min. Typ. Max. Min. Max. — 1.65 0.60 1.00 1.40 0.60 1.40 T 1.80 0.70 1.07 1.50 0.70 1.50 in y Positive Threshold 2.30 1.00 1.38 1.80 1.00 1.80 L V V P Voltage 3.00 1.30 1.74 2.20 1.30 2.20 o g 4.50 1.90 2.43 3.10 1.90 3.10 ic ® 5.50 2.20 2.88 3.60 2.20 3.60 U 1.65 0.20 0.50 0.80 0.20 0.80 H S 1.80 0.25 0.56 0.90 0.25 0.90 D Negative Threshold 2.30 0.40 0.75 1.15 0.40 1.15 u V V a N Voltage 3.00 0.60 0.98 1.50 0.60 1.50 l B 4.50 1.00 1.42 2.00 1.00 2.00 u f 5.50 1.20 1.68 2.30 1.20 2.30 f e r 1.65 0.10 0.48 0.90 0.10 0.90 w 1.80 0.15 0.51 1.00 0.15 1.00 i t h 2.30 0.25 0.62 1.10 0.25 1.10 V Hysteresis Voltage V S H 3.00 0.40 0.76 1.20 0.40 1.20 c h 4.50 0.60 1.01 1.50 0.60 1.50 m i 5.50 0.70 1.20 1.70 0.70 1.70 t t 1.65 1.55 1.65 1.55 T r i 1.80 1.70 1.80 1.70 g V =V , g 2.30 IN IH 2.20 2.30 2.20 e IOH=-100µA r 3.00 2.90 3.00 2.90 I n HIGH Level Output 4.50 4.40 4.50 4.40 p V V u OH Voltage 1.65 I =-4mA 1.29 1.52 1.29 t OH s 2.30 I =-8mA 1.90 2.14 1.90 OH 3.00 I =-16mA 2.40 2.75 2.40 OH 3.00 I =-24mA 2.30 2.62 2.30 OH 4.50 I =-32mA 3.80 4.13 3.80 OH 1.65 0.00 0.10 0.10 1.80 0.00 0.10 0.10 2.30 V =V , I =100µA 0.00 0.10 0.10 IN IL OL 3.00 0.00 0.10 0.10 LOW Level Output 4.50 0.00 0.10 0.10 V V OL Voltage 1.65 I =4mA 0.08 0.24 0.24 OL 2.30 I =8mA 0.10 0.30 0.30 OL 3.00 I =16mA 0.16 0.40 0.40 OL 3.00 I =24mA 0.24 0.55 0.55 OL 4.50 I =32mA 0.25 0.55 0.55 OL I Input Leakage Current 0 to 5.5 V =5.5V, GND ±0.1 ±1.0 µA IN IN Power Off Leakage I 0 V or V =5.5V 1 10 µA OFF Current IN OUT I Quiescent Supply Current 1.65 to 5.50 V =5.5V, GND 1 10 µA CC IN © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ17 • Rev. 1.0.6 4

N C AC Electrical Characteristics 7 W T =-40 to Z Symbol Parameter V (V) Conditions TA=25°C A85°C Units Figure 17 CC — Min. Typ. Max. Min. Max. T 1.65 2.0 8.3 14.3 2.0 15.8 i n 1.80 2.0 6.9 11.9 2.0 13.1 y C=15pF, Figure 5 L 2.50 ± 0.20 L 1.5 4.8 8.2 1.5 9.0 o RL=1M Figure 6 g tPLH, tPHL Propagation Delay 3.30 ± 0.30 1.0 3.7 5.6 1.0 6.2 ns ic ® 5.00 ± 0.50 0.8 3.0 4.7 0.8 5.2 U 3.30 ± 0.30 C=50pF, 1.5 4.3 6.6 1.5 7.3 Figure 5 H L 5.00 ± 0.50 RL=500 1.0 3.6 5.6 1.0 6.2 Figure 6 S D CIN Input Capacitance 0.00 2.5 pF u Power Dissipation 3.30 10.0 al CPD Capacitance(4) 5.00 12.0 pF Figure 7 B u Note: ff e 4. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating r current consumption (I ) at no output loading and operating at 50% duty cycle. C is related to I dynamic w CCD PD CCD operating current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic). ith S c h tr = 3ns tf= 3ns m i t V VCC 90% 90% t T CC r Input i 50% 50% g g Input Output GND 10% 10% e t r CL RL W In p t t PLH PHL u t Note: s V 5. C includes load and stray capacitance; OH L Input PRR=1.0MHz; tW=500ns Output 50% 50% V OL Figure 5. AC Test Circuit Figure 6. AC Waveforms V CC A Input Note: 6. Input=AC Waveform; t=t=1.8ns; PRR=10MHz; Duty Cycle =50%. r f Figure 7. I Test Circuit CCD © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ17 • Rev. 1.0.6 5

N C Physical Dimensions 7 W SYMM Z CL 1 7 2.00±0.20 A 0.65 — 0.50 MIN T 6 4 B in y L PIN ONE o 1.25±0.10 1.90 g i c ® U 1 3 H S (0.25) 0.30 D 0.15 0.40 MIN u 0.10 A B 1.30 a 0.65 l B LAND PATTERN RECOMMENDATION 1.30 u f f e 1.00 SEE DETAIL A r 0.80 w i t h 1.10 S 0.80 c h m 0.10 0.10 C C 0.00 2.10±0.30 itt SEATING T PLANE r i g g NOTES: UNLESS OTHERWISE SPECIFIED e r GAGE A) THIS PACKAGE CONFORMS TO EIAJ I n PLANE (R0.10) SC-88, 1996. p B) ALL DIMENSIONS ARE IN MILLIMETERS. u C) DIMENSIONS DO NOT INCLUDE BURRS t 0.25 s 0.10 OR MOLD FLASH. 0.20 D) DRAWING FILENAME: MKT-MAA06AREV6 0.46 30° 0.26 0° DETAIL A SCALE: 60X Figure 8. 6-Lead, SC70, EIAJ SC-88a, 1.25mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/analog/pdf/sc70-6_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed P6X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ17 • Rev. 1.0.6 6

N C Physical Dimensions 7 W Z 2X 1 7 0.05 C 1.45 B — 2X (1) 0.05 C T i n y L (0.254) 1.00 (0.49) o 5X g i (0.75) c ® U (0.52) H PIN 1 IDENTIFIER TOP VIEW A 1X S 5 D 0.55MAX (0.30) u PIN 1 6X a 0.05 C l B 0.05 RECOMMENED u 0.00 f LAND PATTERN f e 0.05 C r C w 0.45 0.106X 0.35 it 0.25 0.00 h 0.15 6X S DETAIL A 1.0 0.10 C B A c h 0.05 C 0.40 m 0.30 i t t 0.35 5X T 0.25 r i g g 00..4300 5X DETAIL A er 0.075 X 45 PIN 1 TERMINAL In (0.05) 0.5 CHAMFER p (0.13) u 6X 4X t BOTTOM VIEW s Notes: 1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M-1994 4. FILENAME AND REVISION: MAC06AREV4 5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. Figure 9. 6-Lead, MicroPak™, 1.0mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed L6X Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ17 • Rev. 1.0.6 7

N C Physical Dimensions 7 W 0.89 Z 1 0.05 C 0.35 7 2X 1.00 B A — 5X 0.40 T i n PIN 1 0.66 y MIN 250uM L 1.00 o 1X 0.45 g i c ® 6X 0.19 U TOP VIEW 2X 0.05 C RECOMMENDED LAND PATTERN HS FOR SPACE CONSTRAINED PCB D 0.90 u 0.05 C 0.35 a l B u C 0.55MAX 5X0.52 ff e r SIDE VIEW 0.73 w i t h (0.08) 4X 0.09 1X0.57 S DETAIL A 1 2 3 0.19 6X c h m 0.20 6X i t ALTERNATIVE LAND PATTERN t T FOR UNIVERSAL APPLICATION r i g (0.05) 6X g e 5X0.35 r 0.25 0.60 In 6 5 4 0.10 C B A p 0.35 (0.08) .05 C 0.40 u 4X 0.30 ts BOTTOM VIEW NOTES: A. COMPLIES TO JEDEC MO-252 STANDARD B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 0.075X45° D. LANDPATTERN RECOMMENDATION IS BASED ON FSC CHAMFER DETAIL A DESIGN. PIN 1 LEAD SCALE: 2X E. DRAWING FILENAME AND REVISION: MGF06AREV3 Figure 10. 6-Lead, MicroPak2, 1x1mm Body, .35mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed FHX Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ17 • Rev. 1.0.6 8

N C 7 W Z 1 7 — T i n y L o g i c ® U H S D u a l B u f f e r w i t h S c h m i t t T r i g g e r I n p u t s © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ17 • Rev. 1.0.6 9

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