Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

N C 7 W Z June 2011 1 4 — T i n y NC7WZ14 L o g TinyLogic® UHS Dual Inverter with Schmitt Trigger ic ® Inputs U H S D Features Description u a  U5Vltr Va-CHC igh Speed: tPD 3.2ns (Typical) into 50pF at Tfrohme NCF7aWircZh1ild4' sis aU dltruaa-lH inigvhe rteSrp weeithd S(cUhHmSitt) triSggeerier sin pouft l Inv TinyLogic. The device is fabricated with advanced CMOS e  High Output Drive: ±24mA at 3V VCC technology to achieve ultra-high speed with high output rt e  Broad V Operating Range: 1.65V to 5.5V drive while maintaining low static power dissipation over a r CC  M3.a3tVc hVeCsC Performance of LCX when Operated at ovoeuprteypr uabttrseo aoadvr eeVr CthCh ieog ph1e-.i6rma5tpVine gdto ar na5cn.5egV e .wV ThCheCe nr a dneVgvCeiCc. eT ishis e s 0ipnVep.c uitIfsnie pdau nttdos with S  Power Down High Impedance Inputs/Outputs tolerate voltages up to 7V independent of VCC operating c voltage. Schmitt trigger inputs achieve typically 1V h  Over-Voltage Tolerance Inputs Facilitate 5V to 3V hysteresis between the positive-and negative-going input m Translation threshold voltage at 5V. it t  Proprietary Noise/EMI Reduction Circuitry T r  Ultra-Small MicroPak™ Packages ig g  Space-Saving SC70 Package e r In p u Ordering Information t s Operating Top Packing Part Number Package Temperature Mark Method 3000 Units on NC7WZ14P6X -40 to +85°C Z14 6-Lead SC70, EIAJ SC-88a, 1.25mm Wide Tape & Reel 3000 Units on NC7WZ14EP6X -40 to +125°C Z14 6-Lead SC70, EIAJ SC-88a, 1.25mm Wide Tape & Reel 5000 Units on NC7WZ14L6X -40 to +85°C A9 6-Lead MicroPak™, 1.00mm Wide Tape & Reel 5000 Units on NC7WZ14FHX -40 to +85°C A9 6-Lead, MicroPak2, 1x1mm Body, .35mm Pitch Tape & Reel © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ14 • Rev. 1.0.7

N C Connection Diagrams 7 W IEEC/IEC Z 1 4 — T i n y L o Figure 1. Logic Symbol g i c ® Pin Configurations U H S A1 1 6 Y1 D u a GND 2 5 VCC l I n v A2 3 4 Y2 er t e r Figure 2. SC70 (Top View) Figure 3. MicroPak (Top Through View) w i t h S c AAA h m i t t T Pin One r ig g Notes: e 1. AAA represents Product Code Top Mark (see ordering code). r I 2. Orientation of Top Mark determines Pin One location. Read the top product code mark left to right. n p Pin One is the lower left pin. u Figure 4. SC70 Pin 1 Orientation t s Pin Definitions Pin # SC70 Pin # MicroPak Name Description 1 1 A Input 1 2 2 GND Ground 3 3 A Input 2 4 4 Y Output 2 5 5 V Supply Voltage CC 6 6 Y Output 1 Function Table Y= /A Inputs Output A Y L H H L H = HIGH Logic Level L = LOW Logic Level © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ14 • Rev. 1.0.7 2

N C Absolute Maximum Ratings 7 W Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be Z operable above the recommended operating conditions and stressing the parts to these levels is not recommended. 1 4 In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. — The absolute maximum ratings are stress ratings only. T Symbol Parameter Min. Max. Unit in y V Supply Voltage -0.5 7.0 V L CC o V DC Input Voltage -0.5 7.0 V g IN i c V DC Output Voltage -0.5 7.0 V ® OUT U I DC Input Diode Current V < -0.5V -50 mA IK IN H I DC Output Diode Current V < -0.5V -50 mA S OK OUT D I DC Output Current ±100 mA OUT u a ICC or IGND DC VCC or Ground Current ±50 mA l I T Storage Temperature Range -65 +150 °C n STG v e T Junction Temperature Under Bias +150 °C J r t T Junction Lead Temperature (Soldering, 10 Seconds) +260 °C e L r T =85°C 170 w SC70-6 A it T =125°C 104 h PD Power Dissipation A mW S MicroPak-6 130 c h MicroPak2-6 120 m Human Body Model, JEDEC:JESD22-A114 4000 it ESD V t Charge Device Model, JEDEC:JESD22-C101 2000 T r i g g e r Recommended Operating Conditions(3) I n p The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended u t operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not s recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Max. Unit Supply Voltage Operating 1.65 5.50 V V CC Supply Voltage Data Retention 1.5 5.5 V Input Voltage 0 5.5 V IN V Output Voltage 0 V V OUT CC SC70-6 -40 +125 T Operating Temperature MicroPak-6 -40 +85 °C A MicroPak2-6 -40 +85 SC70-6 390  Thermal Resistance MicroPak-6 500 °C/W JA MicroPak2-6 560 Note: 3. Unused inputs must be held HIGH or LOW. They may not float. © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ14 • Rev. 1.0.7 3

N C DC Electrical Characteristics 7 W T =-40 to T =-40 to Z Symbol Parameter V (V) Conditions TA=+25°C A+85°C +A125°C Units 14 CC — Min. Typ. Max. Min. Max. Min. Max. T 1.65 0.60 1.40 0.60 1.40 0.60 1.40 i n 1.80 0.70 1.50 0.70 1.50 0.70 1.50 y L Positive Threshold 2.30 1.00 1.80 1.00 1.80 1.00 1.80 o V V g P Voltage 3.00 1.30 2.20 1.30 2.20 1.30 2.20 i c ® 4.50 1.90 3.10 1.90 3.10 2.00 3.20 U 5.50 2.20 3.60 2.20 3.60 2.30 3.70 H S 1.65 0.20 0.50 0.80 0.20 0.80 0.30 0.90 D 1.80 0.25 0.56 0.90 0.25 0.90 0.35 1.00 u a Negative Threshold 2.30 0.40 0.75 1.15 0.40 1.15 0.50 1.20 l V V N Voltage 3.00 0.60 0.98 1.50 0.60 1.50 0.70 1.60 In v 4.50 1.00 1.42 2.00 1.00 2.00 1.10 2.20 e r 5.50 1.20 1.68 2.30 1.20 2.30 1.40 2.50 te r 1.65 0.10 0.48 0.90 0.10 0.90 0.10 0.90 w 1.80 0.15 0.51 1.00 0.15 1.00 0.15 1.00 it h 2.30 0.25 0.62 1.10 0.25 1.10 0.25 1.10 S V Hysteresis Voltage V H 3.00 0.40 0.76 1.20 0.40 1.20 0.40 1.20 c h 4.50 0.60 1.01 1.50 0.60 1.50 0.60 1.50 m i 5.50 0.70 1.20 1.70 0.70 1.70 0.70 1.70 tt T 1.65 1.55 1.65 1.55 1.55 r i 1.80 1.70 1.80 1.70 1.70 g g V =V , 2.30 IN IL 2.20 2.30 2.20 2.20 e IOH=-100µA r 3.00 2.90 3.00 2.90 2.90 In p V HIGH Level Output 4.50 4.40 4.50 4.40 4.40 V u OH Voltage 1.65 IOH=-4mA 1.29 1.52 1.29 1.26 ts 2.30 I =-8mA 1.90 2.14 1.90 1.80 OH 3.00 I =-16mA 2.40 2.75 2.40 2.30 OH 3.00 I =-24mA 2.30 2.62 2.30 2.20 OH 4.50 I =-32mA 3.80 4.13 3.80 3.70 OH 1.65 0.00 0.10 0.10 0.10 1.80 0.00 0.10 0.10 0.10 V =V , 2.30 IN IH 0.00 0.10 0.10 0.10 I =100µA OL 3.00 0.00 0.10 0.10 0.10 LOW Level Output 4.50 0.00 0.10 0.10 0.10 V V OL Voltage 1.65 I =4mA 0.08 0.24 0.24 0.26 OL 2.30 I =8mA 0.10 0.30 0.30 0.32 OL 3.00 I =16mA 0.16 0.40 0.40 0.43 OL 3.00 I =24mA 0.24 0.55 0.55 0.60 OL 4.50 I =32mA 0.25 0.55 0.55 0.60 OL Input Leakage I 0 to 5.5 V =5.5V, GND ±0.1 ±1.0 ±2.0 µA IN Current IN Power Off Leakage V or I 0 IN 1 10 20 µA OFF Current V =5.5V OUT Quiescent Supply 1.65 to I V =5.5V, GND 1.0 10 20 µA CC Current 5.50 IN © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ14 • Rev. 1.0.7 4

N C AC Electrical Characteristics 7 W T =-40 to T =-40 to Z Symbol Parameter V (V) Conditions TA=+25°C A+85°C +A125°C Units Figure 14 CC — Min. Typ. Max. Min. Max. Min. Max. T 1.65 2.5 7.6 13.1 2.5 14.5 2.5 14.7 i n 1.80 2.5 6.3 10.9 2.5 12.0 2.5 12.3 y C=15pF, Figure 5 L 2.50 ± 0.20 L 1.8 4.3 7.4 1.8 8.1 1.8 8.4 o RL=1M Figure 6 g tPLH, tPHL Propagation Delay 3.30 ± 0.30 1.5 3.3 5.0 1.5 5.5 1.5 5.8 ns ic ® 5.00 ± 0.50 1.0 2.7 4.1 1.0 4.5 1.0 4.8 U 3.30 ± 0.30 C=50pF, 1.8 4.0 6.0 1.8 6.6 1.8 6.9 Figure 5 H L 5.00 ± 0.50 RL=500 1.2 3.2 4.9 1.2 5.4 1.2 5.7 Figure 6 S D CIN Input Capacitance 0.00 2.5 pF u Power Dissipation 3.30 11.0 al CPD Capacitance(4) 5.00 12.5 pF Figure 7 In v Note: e r 4. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating t PD e current consumption (I ) at no output loading and operating at 50% duty cycle. C is related to I dynamic r CCD PD CCD operating current by the expression: I =(C )(V )(f )+(I static). w CCD PD CC IN CC it h S c h m i t t T r i g g e Note: r I 5. CL includes load and stray capacitance; n p Input PRR=1.0MHz; tW=500ns u t s Figure 5. AC Test Circuit Figure 6. AC Waveforms Note: 6. Input=AC Waveform; t=t=1.8ns; PRR=variable; Duty Cycle =50%. r f Figure 7. I Test Circuit CCD © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ14 • Rev. 1.0.7 5

N C Physical Dimensions 7 W SYMM Z CL 14 2.00±0.20 A 0.65 — 0.50 MIN T 6 4 B in y L o PIN ONE g 1.25±0.10 1.90 i c ® U 1 3 H S (0.25) 0.30 D 0.15 0.40 MIN u 0.10 A B 1.30 a 0.65 l I LAND PATTERN RECOMMENDATION n 1.30 v e r 1.00 SEE DETAIL A te 0.80 r w i t 1.10 h 0.80 S c 0.10 0.10 C h C 0.00 m 2.10±0.30 SEATING it t PLANE T r i NOTES: UNLESS OTHERWISE SPECIFIED g g GAGE A) THIS PACKAGE CONFORMS TO EIAJ er PLANE (R0.10) B ) S ACL-L8 8D, I1M9E9N6.SIONS ARE IN MILLIMETERS. In p C) DIMENSIONS DO NOT INCLUDE BURRS 0.25 u 0.10 OR MOLD FLASH. t 0.20 D) DRAWING FILENAME: MKT-MAA06AREV6 s 0.46 30° 0.26 0° DETAIL A SCALE: 60X Figure 8. 6-Lead, SC70, EIAJ SC-88a, 1.25mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/analog/pdf/sc70-6_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed P6X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ14 • Rev. 1.0.7 6

N C Physical Dimensions 7 W Z 2X 1 4 0.05 C 1.45 B — 2X (1) 0.05 C T i n y L (0.254) 1.00 (0.49) o 5X g i c (0.75) ® U (0.52) H PIN 1 IDENTIFIER TOP VIEW A 1X S 5 D 0.55MAX (0.30) u PIN 1 6X a l 0.05 C I n 0.05 RECOMMENED v 0.00 e LAND PATTERN r 0.05 C te C r 0.45 0.106X 0.35 w 0.25 0.00 it 0.15 6X h DETAIL A 1.0 S 0.10 C B A c 0.05 C 0.40 h 0.30 m i t 0.35 t 5X 0.25 T r i g 00..4300 5X DETAIL A ge 0.075 X 45 PIN 1 TERMINAL r I (0.05) 0.5 (0.13) CHAMFER np 6X 4X u BOTTOM VIEW t s Notes: 1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M-1994 4. FILENAME AND REVISION: MAC06AREV4 5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. Figure 9. 6-Lead, MicroPak™, 1.0mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed L6X Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ14 • Rev. 1.0.7 7

N C Physical Dimensions 7 W Z 0.89 1 4 0.05 C 0.35 — 2X 1.00 B A 5X 0.40 T i n y PIN 1 L 0.66 MIN 250uM o 1.00 g 1X 0.45 ic ® U 6X 0.19 H 0.05 C S TOP VIEW 2X RECOMMENDED LAND PATTERN D FOR SPACE CONSTRAINED PCB u 0.90 a l 0.05 C 0.35 In v e C 0.55MAX 5X0.52 rte r w SIDE VIEW 0.73 i t h (0.08) 4X 0.09 1X0.57 S DETAIL A 1 2 3 0.19 6X ch m 0.20 6X i t t ALTERNATIVE LAND PATTERN T r FOR UNIVERSAL APPLICATION i g g (0.05) 6X e r 5X 0.35 In 0.25 0.60 p 6 5 4 u 0.10 C B A 0.35 (0.08) .05 C 0.40 ts 4X 0.30 BOTTOM VIEW NOTES: A. COMPLIES TO JEDEC MO-252 STANDARD B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 0.075X45° D. LANDPATTERN RECOMMENDATION IS BASED ON FSC CHAMFER DETAIL A DESIGN. PIN 1 LEAD SCALE: 2X E. DRAWING FILENAME AND REVISION: MGF06AREV3 Figure 10. 6-Lead, MicroPak2, 1x1mm Body, .35mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed FHX Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ14 • Rev. 1.0.7 8

N C 7 W Z 1 4 — T i n y L o g i c ® U H S D u a l I n v e r t e r w i t h S c h m i t t T r i g g e r I n p u t s © 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7WZ14 • Rev. 1.0.7 9

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: NC7WZ14P6 NC7WZ14P6X NC7WZ14L6X NC7WZ14FHX NC7WZ14EP6X