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  • 型号: NC7SZ125M5
  • 制造商: Fairchild Semiconductor
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NC7SZ125M5产品简介:

ICGOO电子元器件商城为您提供NC7SZ125M5由Fairchild Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 NC7SZ125M5价格参考。Fairchild SemiconductorNC7SZ125M5封装/规格:逻辑 - 缓冲器,驱动器,接收器,收发器, Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output SOT-23-5。您可以下载NC7SZ125M5参考资料、Datasheet数据手册功能说明书,资料中有NC7SZ125M5 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC BUFF TRI-ST UHS N-INV SOT23-5缓冲器和线路驱动器 Buffer w/ 3-STAT O

产品分类

逻辑 - 缓冲器,驱动器,接收器,收发器

品牌

Fairchild Semiconductor

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

逻辑集成电路,缓冲器和线路驱动器,Fairchild Semiconductor NC7SZ125M57SZ

数据手册

点击此处下载产品Datasheet

产品型号

NC7SZ125M5

PCN封装

点击此处下载产品Datasheet

PCN设计/规格

点击此处下载产品Datasheet

产品种类

缓冲器和线路驱动器

传播延迟时间

5.7 ns at 3.3 V, 5 ns at 5 V

低电平输出电流

32 mA

供应商器件封装

SOT-23-5

元件数

1

其它名称

NC7SZ125M5CT

包装

剪切带 (CT)

单位重量

30 mg

商标

Fairchild Semiconductor

安装类型

表面贴装

安装风格

SMD/SMT

封装

Reel

封装/外壳

SC-74A,SOT-753

封装/箱体

SOT-23-5

工作温度

-40°C ~ 85°C

工厂包装数量

250

最大功率耗散

200 mW

最大工作温度

+ 85 C

最小工作温度

- 40 C

极性

Non-Inverting

标准包装

1

每元件位数

1

每芯片的通道数量

1

电压-电源

1.65 V ~ 5.5 V

电流-输出高,低

32mA,32mA

电源电压-最大

5.5 V

电源电压-最小

1.65 V

系列

NC7SZ125

输入线路数量

1

输出类型

3-State

输出线路数量

1

逻辑类型

缓冲器/线路驱动器,非反相

逻辑系列

TinyLogic UHS

零件号别名

NC7SZ125M5_NL

高电平输出电流

- 32 mA

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PDF Datasheet 数据手册内容提取

Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

N C 7 S Z January 2014 1 2 5 — T i n y L o g NC7SZ125 ic ® TinyLogic® UHS Buffer with Three-State Output U H S B u f f Features Description e r w  Ultra-High Speed: t 2.6 ns (Typical) into 50 pF The NC7SZ125 is a single buffer with three-state i PD t at 5 V V output from Fairchild's Ultra-High Speed (UHS) of h CC TinyLogic®. The device is fabricated with advanced T  High Output Drive: ±24 mA at 3 V VCC CMOS technology to achieve ultra high speed with hr  Broad VCC Operating Range: 1.65 V to 5.5 V high output drive while maintaining low static power ee  Matches Performance of LCX Operated at ddiesvsiicpea tiiso ns poevceirfi ead v etor yo bpreoraadte V oCvCe or ptheera 1ti.n6g5 r Van tgoe 5. .T5h Ve -St 3.3 V VCC range. The inputs and output are high impedance at e  Power Down High-Impedance Inputs/Outputs above ground when VCC is 0 V. Inputs tolerate voltages O  OTrvaenrs-Vlaotilotang e Tolerance Inputs Facilitate 5 V to 3 V uoSpuT tAptouT tE 6 t coVol enirndaditteieospn e.v nodletangt eosf aVbCoCv oep eVrCaCti nwgh evno ltiang eth. eT h3e- utp u  Proprietary Noise/EMI Reduction Circuitry t  Ultra-Small MicroPak™ Packages  Space-Saving SOT23 and SC70 Packages Ordering Information Part Number Top Mark Package Packing Method 3000 Units on NC7SZ125M5X 7Z25 5-Lead SOT23, JEDEC MO-178 1.6 mm Tape & Reel 3000 Units on NC7SZ125P5X Z25 5-Lead SC70, EIAJ SC-88a, 1.25 mm Wide Tape & Reel 5000 Units on NC7SZ125L6X DD 6-Lead MicroPak™, 1.00 mm Wide Tape & Reel 5000 Units on NC7SZ125FHX DD 6-Lead, MicroPak2, 1x1 mm Body, .35mm Pitch Tape & Reel © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ125 • Rev. 1.0.5

N C Connection Diagrams 7 S Z 1 2 5 IEEE/IEC — T i n y L o g Figure 1. Logic Symbol ic ® U H S Pin Configurations B u f f e r w i t h T h r e e -S t Figure 2. SC70 and SOT23 (Top View) Figure 3. MicroPak™ (Top Through View) a t e O u t p Pin Definitions u t Pin # SC70 / SOT23 Pin # MicroPak Name Description 1 1 OE Input 2 2 A Input 3 3 GND Ground 4 4 Y Output 5 6 V Supply Voltage CC 5 NC No Connect Function Table Inputs Output /OE In A Out Y L L L L H H H X Z H = HIGH Logic Level L = LOW Logic Level X = HIGH or LOW Logic Level Z = HIGH Impedance State © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ125 • Rev. 1.0.5 2

N C Absolute Maximum Ratings 7 S Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be Z 1 operable above the recommended operating conditions and stressing the parts to these levels is not recommended. 2 In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. 5 The absolute maximum ratings are stress ratings only. — T Symbol Parameter Min. Max. Unit i n y VCC Supply Voltage -0.5 6.0 V L o VIN DC Input Voltage -0.5 6.0 V g i V DC Output Voltage -0.5 6.0 V c OUT ® V < -0.5 V -50 U IN I DC Input Diode Current mA H IK VIN > 6.0 V +20 S V < -0.5 V -50 B I DC Output Diode Current OUT mA u OK VOUT > 6 V, VCC=GND +20 ffe I DC Output Current ±50 mA r OUT w ICC or IGND DC VCC or Ground Current ±50 mA it h TSTG Storage Temperature Range -65 +150 °C T h T Junction Temperature Under Bias +150 °C J r e T Junction Lead Temperature (Soldering, 10 Seconds) +260 °C e L - S SOT-23 200 t a SC70-5 150 t P Power Dissipation at +85°C mW e D MicroPak-6 130 O u MicroPak2-6 120 t p Human Body Model, JESD22-A114 4000 u ESD V t Charged Device Model, JESD22-C101 2000 Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Max. Unit Supply Voltage Operating 1.65 5.50 V V CC Supply Voltage Data Retention 1.50 5.50 V Input Voltage 0 5.5 V IN Active State 0 V CC V Output Voltage V OUT Three-State 0 5.5 T Operating Temperature -40 +85 °C A V at 1.8 V, 2.5 V ±0.2 V 0 20 CC t, t Input Rise and Fall Times V at 3.3 V ±0.3 V 0 10 ns/V r f CC V at 5.0 V ±0.5 V 0 5 CC SOT-23 300 SC70-5 425  Thermal Resistance °C/W JA MicroPak-6 500 MicroPak2-6 560 Note: 1. Unused inputs must be held HIGH or LOW. They may not float. © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ125 • Rev. 1.0.5 3

N C DC Electrical Characteristics 7 S Z TA=+25°C TA=-40 to +85°C 1 Symbol Parameter V Conditions Units 2 CC Min. Typ. Max. Min. Max. 5 — HIGH Level 1.65 to 1.95 0.75VCC 0.75VCC V V T IH Input Voltage 2.30 to 5.50 0.70VCC 0.70VCC in V LOW Level Input 1.65 to 1.95 0.25VCC 0.25VCC V yL IL Voltage 2.30 to 5.50 0.30V 0.30V o CC CC g 1.65 1.55 1.65 1.55 ic ® 1.80 1.70 1.80 1.70 U 2.30 V =V , I =-100 µA 2.20 2.30 2.20 V H IN IH OH S 3.00 2.90 3.00 2.90 B HIGH Level 4.50 4.40 4.50 4.40 u VOH Output Voltage 1.65 IOH=-4 mA 1.29 1.52 1.29 ffe r 2.30 I =-8 mA 1.90 2.15 1.90 OH w 3.00 IOH=-16 mA 2.40 2.80 2.40 it h 3.00 IOH=-24 mA 2.30 2.68 2.30 T 4.50 I =-32 mA 3.80 4.20 3.80 h OH r e 1.65 0.00 0.10 0.00 e - 1.80 0.00 0.10 0.10 S t 2.30 V =V , I =100 µA 0.00 0.10 0.10 a IN IL OL t e 3.00 0.00 0.10 0.10 O LOW Level 4.50 0.00 0.10 0.10 u VOL Output Voltage 1.65 I =4 mA 0.80 0.24 0.24 V tp OL u 2.30 I =8 mA 0.10 0.30 0.30 t OL 3.00 I =16 mA 0.15 0.40 0.40 OL 3.00 I =24 mA 0.22 0.55 0.55 OL 4.50 I =32 mA 0.22 0.55 0.55 OL Input Leakage I 0 to 5.5 0 ≥ V ≥ 5.5 V ±1 ±10 µA IN Current IN 3-STATE Output V =V or V I 0 to 5.5 IN IH IL ±1 ±10 µA OZ Leakage 0 ≥ V ≥ 5.5 V O Power Off I 0 V or V =5.5 V 1 10 µA OFF Leakage Current IN OUT Quiescent I 1.65 to 5.50 V =5.5 V, GND 2 20 µA CC Supply Current IN © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ125 • Rev. 1.0.5 4

N AC Electrical Characteristics C 7 S T =+25°C T =-40 to +85°C Symbol Parameter V Conditions A A Units Figure Z CC Min. Typ. Max. Min. Max. 1 2 1.65 2.0 6.4 13.2 2.0 13.8 5 1.80 C=15 pF, 2.0 5.3 11.0 2.0 11.5 — L 2.50 ±0.20 RD=1 M 0.8 3.4 7.5 0.8 8.0 T t t Propagation Delay 3.30 ±0.30 S1=OPEN 0.5 2.5 5.2 0.5 5.5 ns Figure 4 in PLH,PHL Figure 6 y 5.00 ±0.50 0.5 2.1 4.5 0.5 4.8 L 3.30 ±0.30 C=50 pF, 1.5 3.2 5.7 1.5 6.0 o L g 5.00 ±0.50 RSD==O50P0E N  0.8 2.6 5.0 0.8 5.3 ic 1 ® 1.65 CL=50 pF, 2.0 8.4 15.0 2.0 15.6 U 1.80 RD=500  2.0 7.0 12.5 2.0 13.0 H RU=500  S t t Output Enable Time 2.50 ±0.20 1.5 4.6 8.5 1.5 9.0 PZL,PZH 3.30 ±0.30 SS11==GVINN fDo rf otPrZ tLP ZH 1.5 3.5 6.2 1.5 6.5 Bu 5.00 ±0.50 VIN=2•VCC 0.8 2.8 5.5 0.8 5.8 ns Figure 4 ffe 1.65 CL=50 pF, 2.0 6.5 13.2 2.0 14.5 Figure 6 r 1.80 RD=500  2.0 5.4 11.0 2.0 12.0 w tPLZ,tPHZ Output Disable Time 2.50 ±0.20 RSU==G5N0D0 for t 1.5 3.5 8.0 1.5 8.5 ith 3.30 ±0.30 S1=V for t PHZ 1.0 2.8 5.7 1.0 6.0 T 1 IN PLZ 5.00 ±0.50 V =2•V 0.5 2.1 4.7 0.5 5.0 h IN CC r C Input Capacitance 0.00 4 pF e IN e C Output Capacitance 0.00 8 - OUT S Power Dissipation 3.30 17 ta CPD Capacitance(2) 5.00 24 pF Figure 5 te Note: O 2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating u PD t current consumption (I ) at no output lading and operating at 50% duty cycle. C is related to I dynamic p CCD PD CCD u operating current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic). t Note: 3. C includes load and stray capacitance. L Input PRR=1.0 MHz, t =500 ns. W Figure 4. AC Test Circuit Note: 4. Input=AC Waveform; t=t=1.8 ns; r f PRR=10 MHz; Duty Cycle=50%. Figure 5. I Test Circuit Figure 6. AC Waveforms CCD © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ125 • Rev. 1.0.5 5

N C Physical Dimensions 7 S Z SYMM 1 CL 2 32..0800 A 0.95 0.95 5 — 5 4 T B i n y L 32..0600 o g 1.70 1.50 2.60 ic ® U H 1 2 3 (0.30) S 0.50 1.00 B 0.95 0.30 u 1.90 0.20 C A B ff e 0.70 r w TOP VIEW LAND PATTERN RECOMMENDATION i t h SEE DETAIL A T h r e e - 1.30 S 0.90 1.45 MAX ta t e 00..1055 C 0.22 O 0.08 u 0.10 C t p u t NOTES: UNLESS OTHEWISE SPECIFIED A) THIS PACKAGE CONFORMS TO JEDEC MO-178, ISSUE B, VARIATION AA, GAGE PLANE B) ALL DIMENSIONS ARE IN MILLIMETERS. C) MA05Brev5 0.25 8° 0° 0.55 0.35 SEATING PLANE 0.60 REF Figure 7. 5-Lead SOT23, JEDEC MO-178 1.6 mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/MA/MA05B.pdf. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/SOT23-5L_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed M5X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ125 • Rev. 1.0.5 6

N C Physical Dimensions 7 S Z 1 2 5 — T i n y L o g i c ® U H S B u f f e r w i t h T h r e e - S t a t e O u t p u t Figure 8. 5-Lead, SC70, EIAJ SC-88a, 1.25 mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/MA/MAA05A.pdf. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/analog/pdf/sc70-5_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed P5X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ125 • Rev. 1.0.5 7

N C 7 Physical Dimensions S Z 1 2X 2 5 0.05 C 1.45 B — 2X (1) 0.05 C T i n y L (0.254) 1.00 (0.49) o 5X g (0.75) ic ® U (0.52) PIN 1 IDENTIFIER TOP VIEW A 1X HS 5 0.55MAX (0.30) B u PIN 1 6X f 0.05 C f e 0.05 RECOMMENED r 0.00 w LAND PATTERN i 0.05 C t h C 0.45 T 0.106X 0.35 h 00..2155 6X 0.00 re DETAIL A 1.0 e 0.10 C B A - S 0.05 C 0.40 0.30 ta t e 0.35 5X O 0.25 u t p 00..4300 5X DETAIL A ut 0.075 X 45 PIN 1 TERMINAL (0.05) 0.5 CHAMFER (0.13) 6X 4X BOTTOM VIEW Notes: 1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M-1994 4. FILENAME AND REVISION: MAC06AREV4 5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. Figure 9. 6-Lead, MicroPak™, 1.0 mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/MA/MAC06A.pdf. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed L6X Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ125 • Rev. 1.0.5 8

N C 7 Physical Dimensions S Z 1 0.89 2 5 0.05 C 0.35 2X 1.00±0.050 B A — 5X 0.40 T i n PIN 1 y 0.66 L MIN 250uM o 1.00±0.050 g 1X 0.45 i c ® U 6X 0.19 0.05 C H TOP VIEW 2X RECOMMENDED LAND PATTERN S FOR SPACE CONSTRAINED PCB B 0.90 u f 0.05 C 0.35 fe r w C 0.50±0.05 5X0.52 it h T SIDE VIEW 0.73 h r e (0.08) 4X 6X 1X0.57 e DETAIL A 1 2 3 0.14±0.05 -S t a 0.20 6X te ALTERNATIVE LAND PATTERN O u FOR UNIVERSAL APPLICATION t p (0.05) 6X u t 5X 0.30±0.05 0.60 6 5 4 0.10 C B A 0.35 (0.08) .05 C 0.35±0.050 4X BOTTOM VIEW NOTES: A. COMPLIES TO JEDEC MO-252 STANDARD B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009 0.075X45° D. LANDPATTERN RECOMMENDATION IS BASED ON FSC CHAMFER DETAIL A DESIGN. PIN 1 LEAD SCALE: 2X E. DRAWING FILENAME AND REVISION: MGF06AREV4 F. FAIRCHILD SEMICONDUCTOR Figure 10. 6-Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/MG/MGF06A.pdf. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed FHX Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ125 • Rev. 1.0.5 9

N C 7 S Z 1 2 5 — T i n y L o g i c ® U H S B u f f e r w i t h T h r e e - S t a t e O u t p u t © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ125 • Rev. 1.0.5 10

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