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NC7SZ08L6X产品简介:
ICGOO电子元器件商城为您提供NC7SZ08L6X由Fairchild Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 NC7SZ08L6X价格参考。Fairchild SemiconductorNC7SZ08L6X封装/规格:逻辑 - 栅极和逆变器, AND Gate IC 1 Channel 6-MicroPak。您可以下载NC7SZ08L6X参考资料、Datasheet数据手册功能说明书,资料中有NC7SZ08L6X 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
描述 | IC GATE AND 1CH 2-INP 6-MICROPAK逻辑门 TinyLogic UHS 2Input |
产品分类 | |
品牌 | Fairchild Semiconductor |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 逻辑集成电路,逻辑门,Fairchild Semiconductor NC7SZ08L6X7SZ |
数据手册 | |
产品型号 | NC7SZ08L6X |
PCN设计/规格 | |
不同V、最大CL时的最大传播延迟 | 4.5ns @ 5V,50pF |
产品 | AND |
产品种类 | 逻辑门 |
传播延迟时间 | 5.2 ns |
低电平输出电流 | 32 mA |
供应商器件封装 | 6-MicroPak |
其它名称 | NC7SZ08L6X-ND |
包装 | 带卷 (TR) |
单位重量 | 19.800 mg |
商标 | Fairchild Semiconductor |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | 6-UFDFN |
封装/箱体 | MicroPak |
工作温度 | -40°C ~ 85°C |
工厂包装数量 | 5000 |
最大工作温度 | + 85 C |
最小工作温度 | - 40 C |
栅极数量 | 1 Gate |
标准包装 | 5,000 |
特性 | - |
电压-电源 | 1.65 V ~ 5.5 V |
电流-输出高,低 | 32mA,32mA |
电流-静态(最大值) | 2µA |
电源电压-最大 | 5.5 V |
电源电压-最小 | 1.65 V |
电路数 | 1 |
系列 | NC7SZ08 |
输入/输出线数量 | 2 / 1 |
输入数 | 2 |
输入线路数量 | 2 |
输出线路数量 | 1 |
逻辑电平-低 | - |
逻辑电平-高 | - |
逻辑类型 | 与门 |
逻辑系列 | NC7SV |
高电平输出电流 | - 32 mA |
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
N C 7 S Z September 2009 0 8 — T in y L NC7SZ08 o g TinyLogic® UHS Two-Input AND Gate ic ® U H Features Description S T (cid:131) Ultra-High Speed: t 2.7ns (Typical) into 50pF at The NC7SZ08 is a single two-input AND gate from w 5V VCC PD FTianiyrcLhoigldic’s® . TUhltera -dHeivgihc e iSsp efaebdr ica(tUedH Sw) ith seardievasn ceodf o-In (cid:131) High Output Drive: ±24mA at 3V VCC CMOS technology to achieve ultra-high speed with high p u (cid:131)(cid:131) BMraotacdh eVsC PC eOrfpoerrmaatinngce R oafn LgCeX: 1 O.6p5eVra ttoe d5 .a5tV 3 .3V VCC oddeuisvtspiisupeta tiisod nrsi vpeoe vceifwri ehdail et bor omoapadein ratVateCinC i onvgoe pre lrotahwtei n g1s .6tar5atVinc g teop. o5Tw.5heVer t AN (cid:131) Power Down High Impedance Inputs/Outputs VCC operating range. The inputs and output are high D impedance when V is 0V. Inputs tolerate voltages up G CC (cid:131) Over-Voltage Tolerance inputs facilitate 5V to 3V to 6V, independent of V operating voltage. a CC t Translation e (cid:131) Proprietary Noise/EMI Reduction Circuitry (cid:131) Ultra-Small MicroPak™ Packages (cid:131) Space-Saving SOT23 and SC70 Packages Ordering Information Packing Part Number Top Mark Eco Status Package Method 3000 Units on NC7SZ08M5X 7Z08 RoHS 5-Lead SOT23, JEDEC MO-178 1.6mm Tape & Reel 3000 Units on NC7SZ08P5X Z08 RoHS 5-Lead SC70, EIAJ SC-88a, 1.25mm Wide Tape & Reel 5000 Units on NC7SZ08L6X GG RoHS 6-Lead MicroPak™, 1.00mm Wide Tape & Reel 5000 Units on NC7SZ08FHX GG Green 6-Lead, MicroPak2, 1x1mm Body, .35mm Pitch Tape & Reel For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ08 • Rev. 1.0.3
N C Connection Diagrams 7 S Z 0 IEEE/IEC 8 — T i n y L Figure 1. Logic Symbol o g i c ® U H S Pin Configurations T w o - I n p u t A N D G a te Figure 2. SC70 and SOT23 (Top View) Figure 3. MicroPak (Top Through View) Pin Definitions Pin # SC70 / SOT23 Pin # MicroPak Name Description 1 1 A Input 2 2 B Input 3 3 GND Ground 4 4 Y Output 5 6 V Supply Voltage CC 5 NC No Connect Function Table Y=AB Inputs Output A B Y L L L L H L H L L H H H H = HIGH Logic Level L = LOW Logic Level © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ08 • Rev. 1.0.3 2
N C Absolute Maximum Ratings 7 S Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be Z 0 operable above the recommended operating conditions and stressing the parts to these levels is not recommended. 8 In addition, extended exposure to stresses above the recommended operating conditions may affect device — reliability. The absolute maximum ratings are stress ratings only. T i Symbol Parameter Min. Max. Unit n y L V Supply Voltage -0.5 6.0 V CC o g V DC Input Voltage -0.5 6.0 V IN i c V DC Output Voltage -0.5 6.0 V ® OUT U VIN < -0.5V -50 H I DC Input Diode Current mA IK S V > 6.0V +20 IN T V < -0.5V -50 w OUT IOK DC Output Diode Current mA o VOUT > 6V, VCC=GND +20 -I n IOUT DC Output Current ±50 mA p u ICC or IGND DC VCC or Ground Current ±50 mA t A TSTG Storage Temperature Range -65 +150 °C N D T Junction Temperature Under Bias +150 °C J G TL Junction Lead Temperature (Soldering, 10 Seconds) +260 °C a t SOT-23 200 e SC70-5 150 P Power Dissipation at +85°C mW D MicroPak-6 130 MicroPak2-6 120 Human Body Model, JESD22-A114 4000 ESD V Charged Device Model, JESD22-C101 2000 Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Max. Unit Supply Voltage Operating 1.65 5.50 V V CC Supply Voltage Data Retention 1.50 5.50 V Input Voltage 0 5.5 V IN V Output Voltage 0 V V OUT CC T Operating Temperature -40 +85 °C A V at 1.8V, 2.5V ± 0.2V 0 20 CC t, t Input Rise and Fall Times V at 3.3V ± 0.3V 0 10 ns/V r f CC V at 5.0V ± 0.5V 0 5 CC SOT-23 300 SC70-5 425 θ Thermal Resistance °C/W JA MicroPak-6 500 MicroPak2-6 560 Note: 1. Unused inputs must be held HIGH or LOW. They may not float. © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ08 • Rev. 1.0.3 3
N C DC Electrical Characteristics 7 S Z T =25°C T =-40 to +85°C A A 0 Symbol Parameter VCC Conditions Units 8 Min. Typ. Max. Min. Max. — HIGH Level Input 1.65 to 1.95 0.75VCC 0.75VCC T VIH Voltage 2.30 to 5.50 0.70VCC 0.70VCC V in y LOW Level Input 1.65 to 1.95 0.25VCC 0.25VCC L VIL Voltage 2.30 to 5.50 0.30VCC 0.30VCC V og i c 1.65 1.55 1.65 1.55 ® 1.80 1.70 1.80 1.70 U H 2.30 VIN=VIH, IOH=-100µA 2.20 2.30 2.20 S 3.00 2.90 3.00 2.90 T w HIGH Level 4.50 4.40 4.50 4.40 V o VOH Output Voltage 1.65 IOH=-4mA 1.29 1.52 1.29 -In 2.30 IOH=-8mA 1.90 2.15 1.90 pu 3.00 IOH=-16mA 2.50 2.80 2.40 t A 3.00 IOH=-24mA 2.40 2.68 2.30 N D 4.50 IOH=-32mA 3.90 4.20 3.80 G 1.65 0.00 0.10 0.10 a t 1.80 0.00 0.10 0.10 e 2.30 VIN=VIL, IOL=100µA 0.00 0.10 0.10 3.00 0.00 0.10 0.10 LOW Level 4.50 0.00 0.10 0.10 V VOL Output Voltage 1.65 IOL=4mA 0.80 0.24 0.24 2.30 IOL=8mA 0.10 0.30 0.30 3.00 IOL=16mA 0.15 0.40 0.40 3.00 IOL=24mA 0.22 0.55 0.55 4.50 IOL=32mA 0.22 0.55 0.55 Input Leakage IIN Current 0 to 5.5 VIN=5.5V, GND ±1 ±10 µA Power Off IOFF Leakage Current 0 VIN or VOUT=5.5V 1 10 µA Quiescent Supply ICC Current 1.65 to 5.50 VIN=5.5V, GND 2 20 µA © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ08 • Rev. 1.0.3 4
N C AC Electrical Characteristics 7 S Z T =25°C T =-40 to +85°C A A 0 Symbol Parameter VCC Conditions Units Figure 8 Min. Typ. Max. Min. Max. — 1.65 2.0 6.3 12.0 2.0 12.7 T i 1.80 2.0 5.2 10.0 2.0 10.5 n y 2.50 ± 0.20 CL=15pF, 0.8 3.4 7.0 0.8 7.5 L tPLH, tPHL Propagation Delay 3.30 ± 0.30 RL=1MΩ 0.5 2.6 4.7 0.5 5.0 ns FFiigguurree 54 ogi c 5.00 ± 0.50 0.5 2.2 4.1 0.5 4.4 ® U 3.30 ± 0.30 CL=50pF, 1.5 3.3 5.2 1.5 5.5 H 5.00 ± 0.50 RL=500Ω 0.8 2.7 4.5 0.8 4.8 S T CIN Input Capacitance 0.00 4 pF w o Power Dissipation 3.30 20 - CPD Capacitance(2) 5.00 25 pF Figure 6 Inp u Note: t 2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating A PD current consumption (I ) at no output lading and operating at 50% duty cycle. C is related to I dynamic N CCD PD CCD D operating current by the expression: I =(C )(V )(f )+(I static). CCD PD CC IN CC G a t e Notes: 3. C includes load and stray capacitance. L 4. Input PRR=1.0MHz; t 500ns. W Figure 4. AC Test Circuit Figure 5. AC Waveforms Note: 5. Input=AC Waveform; t=t=1.8ns; PRR=10MHz; Duty Cycle=50%. r f Figure 6. I Test Circuit CCD © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ08 • Rev. 1.0.3 5
N C Physical Dimensions 7 S Z SYMM 0 CL 8 32..0800 A 0.95 0.95 — T 5 4 B in y L o 3.00 2.60 g 1.70 ic 1.50 2.60 ® U H 1 2 3 S (0.30) T 0.50 1.00 w 0.95 0.30 o 1.90 0.20 C A B -I n 0.70 p TOP VIEW LAND PATTERN RECOMMENDATION u t A N SEE DETAIL A D G a t 1.30 e 0.90 1.45 MAX 0.15 0.05 C 0.22 0.08 0.10 C NOTES: UNLESS OTHEWISE SPECIFIED A) THIS PACKAGE CONFORMS TO JEDEC MO-178, ISSUE B, VARIATION AA, GAGE PLANE B) ALL DIMENSIONS ARE IN MILLIMETERS. C) MA05Brev5 0.25 8° 0° 0.55 0.35 SEATING PLANE 0.60 REF Figure 7. 5-Lead SOT23, JEDEC MO-178 1.6mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/SOT23-5L_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed M5X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ08 • Rev. 1.0.3 6
N C Physical Dimensions 7 S Z 0 8 — T i n y L o g i c ® U H S T w o - I n p u t A N D G a t e Figure 8. 5-Lead, SC70, EIAJ SC-88a, 1.25mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/analog/pdf/sc70-5_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed P5X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ08 • Rev. 1.0.3 7
N C 7 Physical Dimensions S Z 0 2X 8 0.05 C 1.45 B — 2X (1) T 0.05 C i n y L (0.49) o 1.00 g 5X i c (0.75) ® U (0.52) H TOP VIEW A 1X S T 0.55MAX (0.30) w PIN 1 6X o 0.05 C - I n 0.05 RECOMMENED p 0.00 LAND PATTERN u 0.05 C t C A 0.25 00..10006X 00..4355 ND 0.15 6X G DETAIL A 1.0 0.10 C B A a 0.05 C 0.40 te 0.30 0.35 5X 0.25 00..4300 5X DETAIL A 0.075 X 45 PIN 1 TERMINAL (0.05) 0.5 CHAMFER (0.13) 6X 4X BOTTOM VIEW Notes: 1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M-1994 MAC06AREVC Figure 9. 6-Lead, MicroPak™, 1.0mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed L6X Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ08 • Rev. 1.0.3 8
N C 7 Physical Dimensions S Z 0 8 — T i n y L o g i c ® U H S T w o - I n p u t A N D G DETAIL A a t e 5X Figure 10. 6-Lead, MicroPak2, 1x1mm Body, .35mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed FHX Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ08 • Rev. 1.0.3 9
N C 7 S Z 0 8 — T i n y L o g i c ® U H S T w o - I n p u t A N D G a t e © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ08 • Rev. 1.0.3 10
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