Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

N C 7 S P February 2011 1 7 — T in y L NC7SP17 o g TinyLogic® ULP Single Buffer with Schmitt Trigger Input ic ® U L Features Description P S  0.9V to 3.6V V Supply Operation The NC7SP17 is a single buffer with Schmitt trigger i CC n  3.6V Over-Voltage Tolerant I/Os at VCC from iTnipnuyLt ofrgoicm® .F aIdirecahli ldfo’sr Uapltprali cLaotiwon Ps owwheer re(U bLaPt)t esrye rileifse oisf gle 0.9V to 3.6V critical, this product is designed for ultra low power B  P ro4p.a0gnast iToynp Dicealla fyo r( t3P.D0)V: to 3.6V V c3o.6nVs uVmCCp.t ion within the VCC operating range of 0.9V to uffe CC r  5.0ns Typical for 2.3V to 2.7V VCC The internal circuit is composed of a minimum of w  6.0ns Typical for 1.65V to 1.95V VCC iunltvrear tleorw ssttaagtiecs a, nidn cdlyundainmgi ct hpeo woeurt.p ut buffer, to enable ith  7.0ns Typical for 1.40V to 1.60V V CC S  11.0ns Typical for 1.10V to 1.30V V The NC7SP17, for lower drive requirements, is uniquely c  27.0ns Typical for 0.90V V CC designed for optimized power and speed and is hm CC fabricated with an advanced CMOS technology to  Power-Off High-Impedance Inputs and Outputs achieve best-in-class speed of operation, while itt maintaining extremely low CMOS power dissipation. T  Static Drive (IOH/IOL): ri  ± 2.6mA at 3.00V V g CC g  ± 2.1mA at 2.30V V e CC r  ± 1.5mA at 1.65V V I CC n  ± 1.0mA at 1.40V V p CC u  ± 0.5mA at 1.10V V t CC  ± 20µA at 0.9V V CC  Quiet Series™ Noise / EMI Reduction Circuitry  Ultra Small MicroPak™ Packages  Ultra Low Dynamic Power Ordering Information Part Number Top Mark Package Packing Method NC7SP17P5X P17 5-Lead SC70, EIAJ SC-88a, 1.25mm Wide 3000 Units on Tape & Reel NC7SP17L6X K4 6-Lead MicroPak™, 1.00mm Wide 5000 Units on Tape & Reel NC7SP17FHX K4 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch 5000 Units on Tape & Reel © 2001 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SP17 • Rev. 1.0.4

N C Notes: 7 S 1. TinyLogic ULP and ULP-A with up to 50% less power P consumption can extend battery life significantly. 1 7 2. Battery Life=(Vbattery x Ibattery x 0.9) / (Pdevice) / — 24hrs/day; where, P =(I x V ) + (C + C ) device CC CC PD L x VCC2 x f. T 3. Assumes ideal 3.6V Lithium Ion battery with current in rating of 900mAH and derated 90% and device y L frequency at 10MHz, with CL=15pF load. o g Figure 1. Battery Life vs. V Supply Voltage i CC c ® U Connection Diagrams L P IEEE/IEC S i n g A 1 Y le B u f Figure 2. Logic Symbol f e r w Pin Configurations it h S c h NC 1 5 VCC NC 1 6 VCC m i t t A 2 A 2 5 NC T r i g g GND 3 4 Y GND 3 4 Y e r I n Figure 3. SC70 (Top View) Figure 4. MicroPak™ (Top Through View) p u t Function Table Y=A Input Output A Y L L H H L = Low Logic Level H = High Logic Level Pin Definitions Pin # SC70 Pin # MicroPak Name Description 1 1, 5 NC No Connect 2 2 A Input 3 3 GND Ground 4 4 Y Output 5 6 V Supply Voltage CC © 2001 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SP17 • Rev. 1.0.4 2

N C Absolute Maximum Ratings 7 S Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be P 1 operable above the recommended operating conditions and stressing the parts to these levels is not recommended. 7 In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. — The absolute maximum ratings are stress ratings only. T i Symbol Parameter Min. Max. Unit n y L V Supply Voltage -0.5 4.6 V CC o V DC Input Voltage -0.5 4.6 V g IN i c HIGH or LOW State(4) -0.5 V to +0.5 V ® VOUT DC Output Voltage CC U V =0V -0.5 4.6 V CC L I DC Input Diode Current at V < 0V -50 mA P IK IN S V < 0V -50 OUT i I DC Output Diode Current mA n OK V > V +50 g OUT CC l I / I DC Output Source/Sink Current ±50 mA e OH OL B ICC or Ground DC VCC or Ground Current per Supply Pin ±50 mA u f T Storage Temperature Range -65 +150 °C f STG e r TJ Junction Temperature Under Bias +150 °C w T Junction Lead Temperature (Soldering, 10 Seconds) +260 °C i L t h SC70-5 150 S P Power Dissipation at +85°C MicroPak™-6 130 mW c D h MicroPak2™-6 120 m i Human Body Model JEDEC: JESD22-A114 4000 tt ESD V T Charged Device Model JEDEC: JESD22-C101 2000 r i g Note: g 4. The IO maximum rating must be observed. e r I n Recommended Operating Conditions p u The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended t operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Typ. Max. Unit V Supply Voltage 0.9 3.6 V CC V Input Voltage(5) 0 3.6 V IN HIGH or LOW State 0 V CC V Output Voltage V OUT V =0V 0 3.6 CC V =3.0V to 3.6V ±2.6 CC V =2.3V to 2.7V ±2.1 CC V =1.65V to 1.95V ±1.5 mA CC I / I Output Current in I / I OH OL OH OL V =1.40V to 1.60V ±1.0 CC V =1.10V to 1.30V ±0.5 CC V =0.9V 20.0 µA CC T Free Air Operating Temperature -40 +85 °C A t / V Minimum Input Edge Rate V =0.8V to 2.0V, V =3.0V 10 ns/V IN CC SC70-5 425  Thermal Resistance MicroPak™-6 500 °C/W JA MicroPak2™-6 560 Note: 5. Unused inputs must be held HIGH or LOW. They may not float. © 2001 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SP17 • Rev. 1.0.4 3

N C DC Electrical Characteristics 7 S P T =+25°C T =–40°C to +85°C Symbol Parameter Conditions V (V) A A Units 1 CC 7 Min. Max. Min. Max. — 0.90 0.30 0.60 0.30 0.60 T 1.10 0.40 1.00 0.40 1.00 i n 1.40 0.50 1.20 0.50 1.20 y V Positive Threshold Voltage V L P 1.65 0.70 1.50 0.70 1.50 o g 2.30 1.00 1.90 1.00 1.90 i c 3.00 1.50 2.60 1.50 2.60 ® U 0.90 0.10 0.60 0.10 0.60 L 1.10 0.15 0.70 0.15 0.70 P S 1.40 0.20 0.80 0.20 0.80 VN Negative Threshold Voltage V in 1.65 0.25 0.90 0.25 0.90 g l 2.30 0.40 1.15 0.40 1.15 e B 3.00 0.6 1.50 0.60 1.50 u 0.90 0.07 0.50 0.07 0.50 ff e 1.10 0.08 0.60 0.08 0.60 r w 1.40 0.09 0.80 0.09 0.80 VH Hysteresis Voltage 1.65 0.10 1.00 0.10 1.00 V ith S 2.30 0.25 1.10 0.25 1.10 c 3.00 0.60 1.80 0.60 1.80 h m 0.90 VCC – 0.1 VCC – 0.1 it t 1.10  VCC  1.30 VCC – 0.1 VCC – 0.1 T I =–20µA 1.40  VCC  1.60 VCC – 0.1 VCC – 0.1 rig OH 1.65  VCC  1.95 VCC – 0.1 VCC – 0.1 ge 2.30  VCC  2.70 VCC – 0.1 VCC – 0.1 r VOH HVoIGltaHg Lee vel Output 3.00  VCC  3.60 VCC – 0.1 VCC – 0.1 V Inp IOH=–0.5mA 1.10  VCC  1.30 0.75 x VCC 0.70 x VCC ut IOH=–1mA 1.40  VCC  1.60 1.07 0.99 IOH=–1.5mA 1.65  VCC  1.95 1.24 1.22 IOH=–2.1mA 2.30  VCC  2.70 1.95 1.87 IOH=–2.6mA 3.00  VCC  3.60 2.61 2.55 0.90 0.1 0.1 1.10  V  1.30 0.1 0.1 CC 1.40  V  1.60 0.1 0.1 CC I =20µA OL 1.65  V  1.95 0.1 0.1 CC 2.30  V  2.70 0.1 0.1 CC LOW Level Output 3.00  V  3.60 0.1 0.1 V CC V OL Voltage 0.30 x 0.30 x IOL=0.5mA 1.10  VCC  1.30 V V CC CC IOL=1mA 1.40  VCC  1.60 0.31 0.37 IOL=1.5mA 1.65  VCC  1.95 0.31 0.35 IOL=2.1mA 2.30  VCC  2.70 0.31 0.33 IOL=2.6mA 3.00  VCC  3.60 0.31 0.33 IIN Input Leakage Current 0  VIN  3.6V 0.90 to 3.60 ±0.1 ±0.5 µA Power Off Leakage 0  (V , V ) I IN O 0 0.5 0.5 µA OFF Current  3.6V Quiescent Supply I V =V or GND 0.90 to 3.60 0.9 0.9 µA CC Current IN CC © 2001 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SP17 • Rev. 1.0.4 4

N C AC Electrical Characteristics 7 S P T =25°C T =-40 to 85°C A A 1 Symbol Parameter Conditions VCC Units F7igure Min. Typ. Max. Min. Max. — 0.90 27.0 T i 1.10 ≤ V ≤ 1.30 3.5 11.0 21.8 3.0 34.3 n CC y CL=10pF, 1.40 ≤ VCC ≤ 1.60 2.5 7.0 14.8 2.0 15.0 Lo RL=1M 1.65 ≤ VCC ≤ 1.95 2.0 6.0 12.0 1.5 12.2 g i 2.30 ≤ V ≤ 2.70 1.5 5.0 9.4 1.0 9.9 c CC ® 3.00 ≤ VCC ≤ 3.60 1.0 4.0 8.3 1.0 9.0 U L 0.90 30.0 P 1.10 ≤ VCC ≤ 1.30 4.0 11.0 22.8 3.5 37.3 S Fiigure t , t Propagation Delay CL=15pF, 1.40 ≤ VCC ≤ 1.60 3.0 8.0 15.5 2.5 16.5 ns ng5 PHL PLH RL=1M 1.65 ≤ VCC ≤ 1.95 2.5 6.0 12.6 2.0 13.6 Fleigure 6 2.30 ≤ V ≤ 2.70 2.0 5.0 9.9 1.5 10.8 B CC u 3.00 ≤ VCC ≤ 3.60 1.5 4.0 8.7 1.0 9.5 ff e 0.90 32.0 r 1.10 ≤ V ≤ 1.30 5.0 13.0 25.9 4.0 46.3 w CC i t CL=30pF, 1.40 ≤ VCC ≤ 1.60 4.0 9.0 17.8 3.5 18.2 h RL=1M 1.65 ≤ VCC ≤ 1.95 3.0 7.0 14.4 2.0 15.9 Sc 2.30 ≤ V ≤ 2.70 2.0 6.0 11.3 1.5 12.8 h CC m 3.00 ≤ VCC ≤ 3.60 1.5 5.0 9.2 1.0 10.7 it CIN Input Capacitance 0 2 pF t T r Power Dissipation V =0V or V , i C IN CC 0.90 to 3.60 8 pF g PD Capacitance f=10MHz g e r I n p u t Figure 5. AC Test Circuit Figure 6. AC Waveforms for Inverting and Non-Inverting Functions Symbol V CC 3.3V ± 0.3V 2.5V ± 0.2V 1.8V ± 0.15V 1.5V ± 0.1V 1.2V ± 0.1V 0.9V V 1.5V V / 2 V / 2 V / 2 V / 2 V / 2 mi CC CC CC CC CC V 1.5V V / 2 V / 2 V / 2 V / 2 V / 2 mo CC CC CC CC CC © 2001 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SP17 • Rev. 1.0.4 5

N C Physical Dimensions 7 S P 1 7 — T i n y L o g i c ® U L P S i n g l e B u f f e r w i t h S c h m i t t T r i g g e r I n p u t Figure 7. 5-Lead, SC70, EIAJ SC-88a, 1.25mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/analog/pdf/sc70-5_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed P5X Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 2001 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SP17 • Rev. 1.0.4 6

N C Physical Dimensions 7 S P 2X 1 7 0.05 C 1.45 B — 2X (1) 0.05 C T i n y L (0.254) 1.00 (0.49) og 5X i c (0.75) ® U (0.52) L PIN 1 IDENTIFIER TOP VIEW A 1X P S 5 i 0.55MAX (0.30) n g PIN 1 6X l 0.05 C e B 0.05 RECOMMENED u 0.00 LAND PATTERN f f 0.05 C e r C 0.45 w 0.25 00..10006X 0.35 ith 6X 0.15 DETAIL A 1.0 S 0.10 C B A c h 0.05 C 0.40 m 0.30 i t t 0.35 5X T 0.25 r i g g 00..4300 5X DETAIL A er 0.075 X 45 PIN 1 TERMINAL In (0.05) 0.5 CHAMFER p (0.13) u 6X 4X t BOTTOM VIEW Notes: 1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M-1994 4. FILENAME AND REVISION: MAC06AREV4 5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. Figure 8. 6-Lead, MicroPak™, 1.0mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed L6X Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 2001 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SP17 • Rev. 1.0.4 7

N C Physical Dimensions 7 S P 0.89 1 7 0.05 C 0.35 — 2X 1.00 B A T 5X 0.40 i n y PIN 1 L MIN 250uM 0.66 o 1.00 g i 1X 0.45 c ® U 6X 0.19 L 0.05 C P TOP VIEW 2X RECOMMENDED LAND PATTERN S FOR SPACE CONSTRAINED PCB i n 0.90 g l 0.05 C 0.35 e B u C 0.55MAX 5X0.52 ff e r w SIDE VIEW 0.73 i t h (0.08) 4X 0.09 1X0.57 S DETAIL A 1 2 3 0.19 6X ch m 0.20 6X i t t ALTERNATIVE LAND PATTERN T FOR UNIVERSAL APPLICATION ri g g (0.05) 6X e r 5X 0.35 In 0.25 0.60 p 6 5 4 0.10 C B A u 0.35 (0.08) .05 C 00..4300 t 4X BOTTOM VIEW NOTES: A. COMPLIES TO JEDEC MO-252 STANDARD B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 0.075X45° D. LANDPATTERN RECOMMENDATION IS BASED ON FSC CHAMFER DETAIL A DESIGN. PIN 1 LEAD SCALE: 2X E. DRAWING FILENAME AND REVISION: MGF06AREV3 Figure 9. 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed FHX Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed © 2001 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SP17 • Rev. 1.0.4 8

N C 7 S P 1 7 — T i n y L o g i c ® U L P S i n g l e B u f f e r w i t h S c h m i t t T r i g g e r I n p u t © 2001 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SP17 • Rev. 1.0.4 9

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: NC7SP17L6X NC7SP17P5X NC7SP17FHX