C L D - D Product family data sheet S 2 8 R e v 6 H Cree® XLamp® MX-3 LEDs ProDuCt DEsCriPtion FEAturEs tAbLE oF ContEnts The Cree XLamp® MX-3 LeD provides the • Available in white (2600 K to 8300 K Characteristics .......................................2 proven lighting-class performance and CCT) Flux Characteristics ...............................2 reliability of Cree XLamp LEDs in a flat‑top • Maximum drive current: 500 mA Relative Spectral Power Distribution ....3 PLCC package. The XLamp MX-3 LeD • Wide viewing angle: 120° Relative Flux vs. Junction continues Cree’s history of innovation in • electrically neutral thermal path Temperature ...........................................3 LeDs for lighting applications with a wide • Qualification at maximum drive electrical Characteristics .......................4 viewing angle, unlimited floor life, uniform current Relative Flux vs. Current ........................4 light output without secondary optics and • RoHS and ReACh compliant Typical Spatial Distribution ....................5 electrically neutral thermal path. • UL® recognized component Thermal Design ......................................5 (e349212) Reflow Soldering Characteristics ..........6 The XLamp MX-3 LeD brings high Notes ......................................................7 performance and quality of light to a wide Mechanical Dimensions ........................9 range of lighting applications, including Tape and Reel .......................................10 linear lighting, LED light bulbs, fluorescent Packaging .............................................11 retrofits and retail‑display lighting. p m A L X / m o C e. e R C w. w w Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and Cree, Inc. XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300

XLamp® mX-3 LED ChArACtEristiCs Characteristics unit Minimum typical Maximum Thermal resistance, junction to solder point °C/W 11 viewing angle (FWHM) degrees 120 Temperature coefficient of voltage mv/ °C -2.7 ESD classification (HBM per Mil‑Std‑883D) Class 2 DC forward current mA 500 Reverse voltage v -5 Reverse current mA -0.1 Forward voltage (@ 350 mA) v 3.7 4.0 LeD junction temperature °C 150 FLuX ChArACtEristiCs (t = 25 °C) J The following table provides several base order codes for XLamp MX-3 LeDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order- code nomenclature, please consult the XLamp MX Family LED Binning and Labeling document. Calculated Minimum Minimum Luminous Flux CCt range Luminous Flux (lm) (lm) @ 350 mA Color @ 300 mA* order Code Minimum Maximum Group Flux (lm) Flux (lm) R2 114 100 MX3AWT-A1-0000-000e51 Cool White 5000 K 8300 K Q5 107 93.9 MX3AWT-A1-0000-000D51 3700 K 4300 K Q4 100 87 MX3AWT-A1-0000-000Ce5 Warm White 2600 K 3700 K Q3 93.9 82 MX3AWT‑A1‑0000‑000BE7 Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. See the Measurements section (page 7). • Typical CRI for Cool White (4300 K – 8300 K CCT) is 75. • Typical CRI for Warm White (2600 K – 4300 K CCT) is 80. * Calculated values for reference purposes only. Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 222

XLamp® mX-3 LED Relative Spectral Power rELAtivE sPECtrAL PowEr Distribution 100 %) 80 er ( w o P 60 5000 K - 8300 K CCT nt a di 3500 K - 5000 K CCT a e R 40 2600 K - 3500 K CCT v ati el R 20 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Relative Flux Output vs. Junction Temperature rELAtivE FLuX vs. JunCtion tEMPErAturE (i = 350 mA) F 100% 80% x u Fl s u 60% o n mi u L e 40% v ati el R 20% 0% 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 333

XLamp® mX-3 LED Electrical Characteristics (Tj = 25ºC) ELECtriCAL ChArACtEristiCs (t = 25 °C) J 500 450 400 A) 350 m nt ( 300 e urr 250 C ard 200 w or 150 F 100 50 0 2.50 2.75 3.00 3.25 3.50 3.75 4.00 4.25 4.50 Forward Voltage (V) Relative Intensity vs. Current (Tj = 25ºC) rELAtivE FLuX vs. CurrEnt (t = 25 °C) J 140 120 %) x ( 100 u Fl us 80 o n mi u 60 L e v ati 40 el R 20 0 0 50 100 150 200 250 300 350 400 450 500 Forward Current (mA) Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 444

XLamp® mX-3 LED Typical Spatial Radiation Pattern tyPiCAL sPAtiAL Distribution 100 %) 80 y ( sit n nte 60 s I u o n mi 40 u L e v ati el 20 R 0 -90 -70 -50 -30 -10 10 30 50 70 90 Angle (º) thErMAL DEsiGn The maximum forward current is determined by the thermal resistance between the LeD junction and ambient. It is crucial for the end Thermal Design product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 450 400 350 mA) 300 ent ( 250 urr C 200 m u m 150 Rj-a = 15° C/W axi Rj-a = 20° C/W M 100 Rj-a = 25° C/W 50 Rj-a = 30° C/W 0 0 20 40 60 80 100 120 140 160 Ambient Temperature (ºC) Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 555

XLamp® mX-3 LED rEFLow soLDErinG ChArACtEristiCs In testing, Cree has found XLamp MX-3 LeDs to be compatible with JeDeC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. t T P Critical Zone P T to T L P Ramp-up T ure L Tsmax tS t a r e p Ts m min e T ts Ramp-down Preheat 25 t 25˚C to Peak Time Profile Feature Lead-Free solder Average Ramp-Up Rate (Ts to T) 1.2 °C/second max p Preheat: Temperature Min (Ts ) 120 °C min Preheat: Temperature Max (Ts ) 170 °C max Preheat: Time (ts to ts ) 65-150 seconds min max Time Maintained Above: Temperature (T) 217 °C L Time Maintained Above: Time (t) 45-90 seconds L Peak/Classification Temperature (Tp) 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to the topside of the package, measured on the package body surface. Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 666

XLamp® mX-3 LED notEs Measurements The luminous flux, radiant power, chromaticity, forward voltage and CRI measurements in this document are binning specifications only and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are provided for informational purposes only and are not intended or provided as specifications. Pre‑Release Qualification Testing Please read the LeD Reliability Overview for details of the qualification process Cree applies to ensure long‑term reliability for XLamp LEDs and details of Cree’s pre‑release qualification testing for XLamp LEDs. Lumen Maintenance Cree now uses standardized IeS LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LeD lumen maintenance. For information on the specific LM‑80 data sets available for this LED, refer to the public LM-80 results document. Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting. Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LeD junction temperature. Moisture sensitivity Cree recommends keeping XLamp MX‑3 LEDs in the provided, resealable moisture‑barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp MX‑3 LEDs should be handled and stored as MSL 2a per JEDEC J‑STD‑033, meaning they have limited exposure time before damage to the LeD may occur during the soldering Maximum Percent relative humidity temp. operation. The table on the right specifies the maximum exposure time 30% 40% 50% 60% 70% 80% 90% in days depending on temperature and humidity conditions. LeDs with 35 ºC - - - 17 1 .5 .5 exposure time longer than the specified maximums must be baked 30 ºC - - - 28 1 1 1 25 ºC - - - - 2 1 1 according to the baking conditions listed below. 20 ºC - - - - 2 1 1 baking Conditions It is not necessary to bake all XLamp MX-3 LeDs. Only the LeDs that meet all of the following criteria must be baked: 1. LEDs that have been removed from the original MBP. 2. LeDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above. 3. LeDs that have not been soldered. LEDs should be baked at 70 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do not bake parts at temperatures higher than 70 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 777

XLamp® mX-3 LED notEs - ContinuED storage Conditions XLamp MX‑3 LEDs that have been removed from the original MBP but not soldered should be stored in one of the following ways: • Store the parts in a rigid metal container with a tight‑fitting lid. Verify that the storage temperature is <30 °C, and place fresh desiccant and an RH indicator in the container to verify that the RH is no greater than 60%. • Store the parts in a dry, nitrogen‑purged cabinet or container that actively maintains the temperature at <30° and the RH at no greater than 60%. • For short‑term store only: LEDs can be resealed in the original MBP soon after opening. Fresh desiccant may be needed. Use the included humidity indicator card to verify <60% RH. If an environment of <60% RH is not available for storage, XLamp MX‑3 LEDs should be baked (described above) before reflow soldering. rohs Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eU Directive 2011/65/eC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product ecology section of the Cree website. rEACh Compliance ReACh substances of very high concern (SvHCs) information is available for this product. Since the european Chemical Agency (eCHA) has published notice of their intent to frequently revise the SvHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date ReACh SvHC Declaration. ReACh banned substance information (ReACh Article 67) is also available upon request. uL® recognized Component This product meets the requirements to be considered a UL Recognized Component with Level 4 enclosure consideration. The LeD package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/UL 8750. vision Advisory WARNING: Do not look at an exposed lamp in operation. eye injury can result. For more information about LeDs and eye safety, please refer to the LeD eye Safety application note. Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 8

XLamp® mX-3 LED MEChAniCAL DiMEnsions All measurements are ±.13 mm unless otherwise indicated. top view top view bottom view side view recommended Fr4 solder Pad recommended MCPCb solder Pad Alternative solder Pad Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 9

160.0 A B A SECTION A-A SCALE 2 : 1 DETAIL B SCALE 2 : 1 6 5 4 3 2 1 NOTICE REVISONS CCORENET ACINOENDF IWDEITNHTIINA LA.R TEH ITSH PEL PORTO APNRDIE TTHAER IYN AFONDRMATION REV DESCRIPTION BY DATE APP'D CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT A Released J.L. 7/1/09 UMNAAYU NTOHTO BREIZ CEOD PPIEERDS, ROENP RWOITDHUOCUETDT HOER WDIRSICTLTOENSE CDO TNOS EANNTY B ADDED CATHODE AND ANODE NOTES DC 2/26/12 OF CREE INC. 4.0±.1 1.5±.1 XLamp® mX-3 LED 8.0±.1 D 1.75±.10 2.5±.1 D Cathode Side tAPE AnD rEEL All Cree carrier ta+p.3es conform to eIA-481D, Automated Component Handling Systems Standard. 12.0 .0 except as noted, all dimensions in mm. Cathode Mark (4) (8) Anode Side C (denoted by + and circle) C ( 1.5) (1.75) UCAsTeHrO DFEe SeIDdE Direction (1.55) END START (12) ANODE SIDE Loaded Pockets Trailer Leader (1,000 Lamps) 160mm (min) of 400mm (min) of B B empty Tpraoilecrkets Loaded Pockets Leader empty pockets with 160mm (min) of (1,400 pcs /Reel 400mm (min) of sealede mwptiyt pho ctkaetpse empty pockets with at least 100mm (20 posceakleedt wsit hm tapine.) at least 100mm sealed by tape (20 pockets min.) sealed by tape (50 empty pockets min(.)50 empty pockets min.) User Feed Direction A MTUILONLLLIEMEDRESIAMTSCNE EOCRN..TXXESoSHXX IUAEO Xv NNR N DL W S± eE± AISASFSRrET E S ES.. 21PRTIPN52E E5F CCIaNIIFFISIIpEEHDD.e: ADCPRHPAEDRWC.OKN SV BEeYDibel DDDAAA7TTT/EEE1/09 TITLE 4PDF6hau0oxrh0 n(a e9Sm 1i(l99,ic )1No 93.nC)1 D33 2-1r57i3v57-e50583300 A THIRD ANGLE PROJECTION FOR SHEEXT° M E T±AL PA .5RT°S ONLY MATERIAL Carrier Loading Specification-MX6 .X ± 1.5 ..XXX°XX X ± ± ± ...52755° FINAL PROTECTIVE FINISH SIZEC DRAWING N2O.402-00005 REBV. SURFACE FINISH: 1.6 SCALE4.000 SHEET OF 1/2 6 5 4 3 2 1 Pocket Tape 13mm 7" Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 10

XLamp® mX-3 LED PACkAGinG Unpackaged Reel Vacuum-Sealed MVaocuisutmu-rSee aBleadrrier Bag Moisture Barrier Bag CLRaEbEe Bli nw Ciotdhe Cree Bin &C oBadreco,d Qe Ltayb, eLlot # Label with Cree Bin Code, Quantity, Reel ID LLaabbeel wl iwthi tChu sCtormeeer Bin CP/oNd, Qet,y ,Q Lotyt ,# , LPoOt # # Packaged Reel Patent Label Dessicant (inside bag) LLaabbeel lw iwthi tChus tComreere O Orderrd er Code, Code, Qty, Reel ID, PO # Quantity, Reel ID, PO # Humidity Indicator Card (inside bag) Label with Cree Bin Code, Quantity, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Patent Label (on bottom of box) Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 11