MURB1620CTG, NRVUB1620CTT4G SWITCHMODE Power Rectifier D2PAK Power Surface Mount Package http://onsemi.com These state−of−the−art devices are designed for use in switching ULTRAFAST RECTIFIER power supplies, inverters and as free wheeling diodes. 16 AMPERES, 200 VOLTS Features • Package Designed for Power Surface Mount Applications • Ultrafast 35 Nanosecond Recovery Times • 175°C Operating Junction Temperature • Epoxy Meets UL 94 V−0 @ 0.125 in D2PAK • High Temperature Glass Passivated Junction CASE 418B • Low Leakage Specified @ 150°C Case Temperature STYLE 3 • Short Heat Sink Tab Manufactured − Not Sheared! 1 • Similar in Size to Industrial Standard TO−220 Package 4 • NRVUB Prefix for Automotive and Other Applications Requiring 3 Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable MARKING DIAGRAM • These Devices are Pb−Free and are RoHS Compliant* AY WW Mechanical Characteristics: U1620G • Case: Epoxy, Molded, Epoxy Meets UL 94, V−0 AKA • Weight: 1.7Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • A = Assembly Location Lead and Mounting Surface Temperature for Soldering Purposes: Y = Year 260°C Max. for 10 Seconds WW = Work Week • Device Meets MSL1 Requirements U1620 = Device Code • G = Pb−Free Package ESD Ratings: AKA = Diode Polarity ♦ Machine Model = C (> 400 V) ♦ Human Body Model = 3B (> 8000 V) ORDERING INFORMATION Device Package Shipping† MURB1620CTG D2PAK 50 Units / Rail (Pb−Free) MURB1620CTT4G D2PAK 800 / (Pb−Free) Tape & Reel NRVUB1620CTT4G D2PAK 800 / (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications *For additional information on our Pb−Free strategy and soldering details, please Brochure, BRD8011/D. download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 1 Publication Order Number: November, 2012 − Rev. 7 MURB1620CT/D

MURB1620CTG, NRVUB1620CTT4G MAXIMUM RATINGS (Per Leg) Rating Symbol Value Unit Peak Repetitive Reverse Voltage VRRM 200 V Working Peak Reverse Voltage VRWM DC Blocking Voltage VR Average Rectified Forward Current IF(AV) 8.0 A (Rated VR, TC = 150°C) Total Device 16 Peak Repetitive Forward Current IFM A (Rated VR, Square Wave, 20 kHz, TC = 150°C) 16 Non−Repetitive Peak Surge Current IFSM A (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) 100 Operating Junction and Storage Temperature Range TJ, Tstg −65 to +175 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS (Per Leg) Characteristic Symbol Value Unit Maximum Thermal Resistance, Junction−to−Case R(cid:2)JC 3 °C/W Maximum Thermal Resistance, Junction−to−Ambient R(cid:2)JA 50 °C/W Temperature for Soldering Purposes: 1/8″ from Case for 5 Seconds TL 260 °C ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Symbol Max Unit Maximum Instantaneous Forward Voltage (Note 1) vF V (iF = 8 A, TC = 150°C) 0.895 (iF = 8 A, TC = 25°C) 0.975 Maximum Instantaneous Reverse Current (Note 1) iR (cid:3)A (Rated DC Voltage, TC = 150°C) 250 (Rated DC Voltage, TC = 25°C) 5 Maximum Reverse Recovery Time trr ns (IF = 1 A, di/dt = 50 A/(cid:3)s) 35 (IF = 0.5 A, iR = 1 A, IREC = 0.25 A) 25 1. Pulse Test: Pulse Width = 300 (cid:3)s, Duty Cycle ≤ 2.0% S) 100 10 K P M 50 NT (A 20 A)1.400 K0 S FORWARD CURRE 5211...0000 TJ = 175°C 100°C 25°C μVERSE CURRENT ((cid:2)(cid:3) 1201400 TJ = 117050°°CC OU 0.7 RE 25°C NE , R0.2 A 0.3 I T N 0.04 A T , INSiF0.10.2 0.4 vF, INSTA0N.6TANEOUS V0O.8LTAGE (V) 1 1.2 0.010 20 40 60VR, RE8V0ERS1E0 0VOLT1A2G0E (V1)40 160 180 200 Figure 1. Typical Forward Voltage, Per Leg Figure 2. Typical Reverse Current, Per Leg* http://onsemi.com 2

MURB1620CTG, NRVUB1620CTT4G WER DISSIPATION (WATTS 987651.....000000 DC RATRE(cid:2)DJC V =R 3A°PCP/WLIED WER DISSIPATION (WATTS) 675891.....000000 TJ = 175°C SQUARE WAVE DC I, AVERAGE POF(AV)4321....00000140 150 SQUARE1 W60AVE 170 180 P, AVERAGE POF(AV)4231....000000 1 2 3 4 5 6 7 8 9 10 TC, CASE TEMPERATURE (°C) IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 3. Current Derating Case, Per Leg Figure 4. Power Dissipation, Per Leg D E LIZ 1 A M D = 0.5 R O 0.5 N E ( C N SISTA 0.2 0.1 P(pk) Z(cid:2)JC(t) = r(t) R(cid:2)JC L RE 0.1 0.05 Dpu clsuerv terasi na psphloyw fonr power RMA 0.05 0.01 t1 read time at T1 HE t2 T T SINGLE PULSE Duty Cycle, D = t1/t2(cid:4)TJ(pk) - TC = P(pk) Z(cid:2)JC(t) N E 0.02 SI N A R 0.01 T 0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10 20 50 100 200 500 r(t), t, TIME (ms) Figure 5. Thermal Response 1 K 300 F) TJ = 25°C p E ( C N A 100 T CI A P A C C, 30 10 1 10 100 VR, REVERSE VOLTAGE (V) Figure 6. Typical Capacitance, Per Leg http://onsemi.com 3

MURB1620CTG, NRVUB1620CTT4G PACKAGE DIMENSIONS D2PAK 3 CASE 418B−04 ISSUE K NOTES: C 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. E 2. CONTROLLING DIMENSION: INCH. V 3. 418B−01 THRU 418B−03 OBSOLETE, −B− NEW STANDARD 418B−04. W 4 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.340 0.380 8.64 9.65 B 0.380 0.405 9.65 10.29 A C 0.160 0.190 4.06 4.83 S D 0.020 0.035 0.51 0.89 1 2 3 E 0.045 0.055 1.14 1.40 F 0.310 0.350 7.87 8.89 G 0.100 BSC 2.54 BSC −T− H 0.080 0.110 2.03 2.79 K J 0.018 0.025 0.46 0.64 SEATING W PLANE G J KL 00..009502 00..011702 21..2392 21..7893 M 0.280 0.320 7.11 8.13 H N 0.197 REF 5.00 REF D3 PL P 0.079 REF 2.00 REF 0.13 (0.005) M T B M R 0.039 REF 0.99 REF S 0.575 0.625 14.60 15.88 V 0.045 0.055 1.14 1.40 VARIABLE STYLE 3: PIN 1.ANODE CONFIGURATION 2.CATHODE ZONE N P 3.ANODE R U 4.CATHODE L L L M M M F F F VIEW W−W VIEW W−W VIEW W−W 1 2 3 SOLDERING FOOTPRINT* 10.49 8.38 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4

MURB1620CTG, NRVUB1620CTT4G ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com MURB1620CT/D 5

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: MURB1620CTG MURB1620CTT4G