MURA160, NRVUA160V, SURA8160 Surface Mount Ultrafast Power Rectifier Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications www.onsemi.com where compact size and weight are critical to the system. Features ULTRAFAST RECTIFIER • Small Compact Surface Mountable Package with J−Bend Leads 1 AMPERE, 600 VOLTS • Rectangular Package for Automated Handling • High Temperature Glass Passivated Junction • Low Forward Voltage Drop (1.05 V Max @ 1.0 A, TJ = 150°C) • NRVUA and SURA8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change SMA Requirements; AEC−Q101 Qualified and PPAP Capable* CASE 403D • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MARKING DIAGRAM Mechanical Characteristics: • Case: Epoxy, Molded U4J • AYWW(cid:2) Weight: 70 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable U4J = Device Code • Lead and Mounting Surface Temperature for Soldering Purposes: A = Assembly Location 260°C Max. for 10 Seconds Y = Year • WW = Work Week Polarity: Polarity Band Indicates Cathode Lead (cid:2) = Pb−Free Package • ESD Protection: ♦ Human Body Model > 4000 V (Class 3) ♦ Machine Model > 400 V (Class C) ORDERING INFORMATION Device Package Shipping† MURA160T3G SMA 5,000/Tape & Reel (Pb−Free) NRVUA160VT3G SMA 5,000/Tape & Reel (Pb−Free) SURA8160T3G SMA 5,000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: October, 2016 − Rev. 7 MURA160T3/D

MURA160, NRVUA160V, SURA8160 MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage VRRM 600 V Working Peak Reverse Voltage VRWM DC Blocking Voltage VR Average Rectified Forward Current IF(AV) A @ TL = 145°C 1.0 @ TL = 110°C 2.0 Non-Repetitive Peak Surge Current IFSM A (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) 30 Operating Junction Temperature Range TJ −65 to +175 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, Junction−to−Lead (TL = 25°C) (Note 1) PsiJL 24 °C/W (Note 2) Thermal Resistance, Junction−to−Ambient (Note 1) R(cid:2)JA 216 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 2. In compliance with JEDEC 51, these values (historically represented by R(cid:2)JL) are now referenced as PsiJL. ELECTRICAL CHARACTERISTICS Characteristic Symbol Max Unit Maximum Instantaneous Forward Voltage (Note 3) vF V (iF = 1.0 A, TJ = 25°C) 1.25 (iF = 1.0 A, TJ = 150°C) 1.05 Maximum Instantaneous Reverse Current (Note 3) iR (cid:3)A (Rated dc Voltage, TJ = 25°C) 5.0 (Rated dc Voltage, TJ = 150°C) 150 Maximum Reverse Recovery Time trr ns (iF = 1.0 A, di/dt = 50 A/(cid:3)s) 75 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width = 300 (cid:3)s, Duty Cycle ≤ 2.0%. www.onsemi.com 2

MURA160, NRVUA160V, SURA8160 100 1000 TJ = 150°C A) A) (cid:3) (cid:3) T ( 10 T ( TJ = 150°C N N E E100 R R R TJ = 100°C R U U C C E 1 E S S R R VE VE 10 TJ = 100°C E E R 0.1 R , R TJ = 25°C , R I I TJ = 25°C 0.01 1 0 100 200 300 400 500 600 0 100 200 300 400 500 600 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current ENT (A) 10 TC = 150°C 100°C RENT (A) 10 TC = 150°C 100°C RR 25°C UR 25°C U C D C 1 RD 1 R A A W W R R O O F S F US U 0.1 O 0.1 O E E N N A A T T N N A A T T S S 0.01 N 0.01 , INF 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 I, IF 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 I VF, INSTANTANEOUS VOLTAGE (VOLTS) VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 3. Typical Forward Voltage Figure 4. Maximum Forward Voltage www.onsemi.com 3

MURA160, NRVUA160V, SURA8160 25 30 NOTE: MAXIMUM NOTE: TYPICAL 25 CAPACITANCE AT 20 CAPACITANCE AT pF) 0 V = 24 pF pF) 0 V = 27 pF E ( E ( 20 NC 15 NC A A T T 15 CI CI A 10 A P P A A 10 C C C, C, 5 5 0 0 0 4 8 12 16 20 24 28 32 36 40 0 4 8 12 16 20 24 28 32 36 40 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance Figure 6. Maximum Capacitance A) 5 A) 1 T ( T ( N N 0.9 dc E E R R R 4 R 0.8 U U C C 0.7 D dc D R 3 R 0.6 SQUARE A A W W WAVE R SQUARE WAVE R 0.5 O O F 2 F 0.4 E E G G 0.3 A A R R E 1 E 0.2 V V A A , V) , V) 0.1 A 0 A 0 IF( 60 80 100 120 140 160 180 IF( 0 20 40 60 80 100 120 140 160 180 TL, LEAD TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 7. Current Derating, Lead Figure 8. Current Derating, Ambient (FR−4 Board with Minimum Pad) W) 4.5 N ( 4 O TI dc A 3.5 P SI S 3 DI SQUARE WAVE R 2.5 E W 2 O P E 1.5 G RA 1 E AV 0.5 P, F 0 0 0.5 1 1.5 2 2.5 3 3.5 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation www.onsemi.com 4

MURA160, NRVUA160V, SURA8160 PACKAGE DIMENSIONS SMA CASE 403D ISSUE H HE NOTES: E 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L. MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX b D A 1.97 2.10 2.20 0.078 0.083 0.087 A1 0.05 0.10 0.20 0.002 0.004 0.008 b 1.27 1.45 1.63 0.050 0.057 0.064 c 0.15 0.28 0.41 0.006 0.011 0.016 D 2.29 2.60 2.92 0.090 0.103 0.115 POLARITY INDICATOR OPTIONAL AS NEEDED E 4.06 4.32 4.57 0.160 0.170 0.180 (SEE STYLES) HE 4.83 5.21 5.59 0.190 0.205 0.220 L 0.76 1.14 1.52 0.030 0.045 0.060 STYLE 1: PIN 1.CATHODE (POLARITY BAND) 2.ANODE A A1 L c SOLDERING FOOTPRINT* 4.000 0.157 2.000 0.079 2.000 0.079 (cid:2) (cid:3) mm SCALE 8:1 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative ◊ www.onsemi.com MURA160T3/D 5

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