MTS62C19A Dual Full-Bridge Motor Driver Features Description • 750 mA Continuous Output Current The MTS62C19A motor driver is a CMOS device capa- • Load Voltage Supply: 10V to 40V ble of driving both windings of a bipolar stepper motor or bidirectionally control two DC motors. Each of the • Full Bipolar Stepper Motor Drive Capability two independent H-bridge outputs is capable of sus- • Bidirectional DC Motor Capability taining 40V and delivering up to 750mA of continuous • Internal Fixed T Time PWM Current Control OFF current. The output current level is controlled by an • Internal Protection Diodes internal pulse-width modulation (PWM) circuit that is • Internal Thermal Shutdown configured using two logic inputs, a current sense • Under Voltage Lockout resistor, and a selectable reference voltage. The H-bridge outputs have been optimized to provide a low • LS-TTL Compatible Logic Inputs with Pull-Up output saturation voltage drop. Resistors • Low R Output Resistance Full, half and micro-stepping operations are possible ON with the PWM current control and logic inputs. The • Low Quiescent Current maximum output current is set by a sensing resistor • Operating Temperature Range: -40°C to +105°C and a user-selectable reference voltage. The output • Pin Compatible with Allegro 6219 current limit is selected using two logic level inputs. The selectable output current limits are 0%, 33%, 67% or Applications 100% of the maximum output current. Each bridge has a PHASE input signal which is used to control the • Stepper Motor Actuators direction of current flow through the H-bridge and the • DC Motor Actuators load. • Automotive HVAC Ventilation The H-bridge power stage is controlled by non-overlap- • Automotive Power Seats ping signals which prevent current cross conduction when switching the direction of the current flow. Internal Note: The MTS62C19A device is formerly a clamp diodes protect against inductive transients. product of Advanced Silicon. Thermal protection circuitry disables the outputs when the junction temperature exceeds the safe operating limit. No special power-up sequencing is required. Undervoltage Lockout circuitry prevents the chip from operating when the load supply is applied prior to the logic supply. The device is supplied in a 24-pin SOP Package. Package Types MTS62C19A OUT1A 1 24 VLOAD SOP-24 OUT2A 2 23 SENSE1 SENSE2 3 22 COMPIN1 COMPIN2 4 21 OUT1B OUT2B 5 20 I01 GND 6 19 GND GND 7 18 GND I02 8 17 I11 I12 9 16 PHASE1 PHASE2 10 15 V REF1 V 11 14 RC1 REF2 RC2 12 13 V LOGIC  2010-2013 Microchip Technology Inc. DS22260C-page 1

MTS62C19A Functional Block Diagram VLOGIC VLOAD PHASE1 Shift Drivers Logic I01 OUT1A Power I11 Bridge OUT1B Current V REF1 Sense One-shot Comparator Under-V Thermal Lockout Shutdown PHASE2 Logic Shift Drivers I02 OUT2A Power I12 Bridge OUT2B Current V REF2 Sense One-shot Comparator COMPIN1 COMPIN2 RC2 RC1 GND SENSE1 SENSE2 DS22260C-page 2  2010-2013 Microchip Technology Inc.

MTS62C19A Typical Application 5V 10 to 30V 100nF 100µF 100nF VLOGIC VLOAD PHASE1 Shift Drivers I01 Logic OUT1A Power I11 Bridge OUT1B Current V REF1 Sense P Comparator One-shot µ c/ gi o L Under-V Thermal Lockout Shutdown PHASE2 Shift Drivers I02 Logic OUT2A I12 Power M Bridge OUT2B Current VREF2 CoSmepnaserator One-shot COMPIN1 COMPIN2 RC2 RC1 GND SENSE1 SENSE2 C t Rt C Rt RS RS t C RC C CC RC  2010-2013 Microchip Technology Inc. DS22260C-page 3

MTS62C19A 1.0 ELECTRICAL † Notice: Stresses above those listed under “Maximum CHARACTERISTICS Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those Absolute Maximum Ratings † indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions Logic Supply Voltage (VLOGIC) ......................... -0.3 to +5.5V for extended periods may affect device reliability. Load Supply Voltage (V ) ..........................-0.3 to +40.0V LOAD Logic Input Voltage Range (V ) ....... -0.3 to VLOGIC + 0.3V IN V Voltage Range (V ).............................-0.3 to +10.0V REF REF Output Current (Peak) ..................................................... ±1A Output Current (Continuous) ...................................... ±0.75A Sense Output Voltage ...................................... -0.3V to 1.5V Junction Temperature (T ).............................-40°C to +150°C J Operating Temperature Range (T )..........-40°C to +105°C OPR Storage Temperature Range (T ).............-55°C to +150°C STG ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are established for V =4.5V to 5.5V, LOGIC V =30V,V =5V, T =+25°C LOAD REF A Parameters Sym Min Typ Max Units Conditions DC Characteristics Logic Supply Voltage V 4.5 5.0 5.5 V LOGIC Load Supply Voltage V 10 30 40 V LOAD Logic Supply Current I — 0.8 1.0 mA VLOGIC V Voltage Range V 1.5 5.0 7.0 V REF REF Driver Supply Current I — 0.55 1.0 mA Both Bridges ON, No Load VLOAD_ON I — 0.55 1.0 mA Both Bridges Off VLOAD_OFF Control Logic I — — -70 µA I01, I11, I02, I12, PHASE1, IN Input Current (V = 0V) PHASE2, (Note1) IN Logic-Low V — — 0.8 V I01, I11, I02, I12, PHASE1, IL Input Voltage PHASE2 Logic-High V 2.4 — — V I01, I11, I02, I12, PHASE1, IH Input Voltage PHASE2 Current Limit Threshold V _V 9.5 10 10.5 — I0=L, I1=L REF SENSE Ratio (VREF ÷ VSENSE) 13.5 15 16.5 — I0=H, I1=L 25.5 30 34.5 — I0=L, I1=H Driver Output Satura- V — 0.55 0.65 V (Sink) I = +500 mA ONN OUT tion Voltage VCE(SAT) (Low Side) — 0.90 1.00 V (Sink) IOUT = +750 mA V — 1.05 1.40 V (Source) I = -500 mA ONP OUT (High Side) — 1.85 2.10 V (Source) I = -750 mA OUT Clamp Diode Forward V — 0.95 1.30 V I = 750 mA F_NDIODE F Voltage (Note2) V — 1.00 1.30 V I = 750 mA F_PDIODE F Driver Output I — — -50 µA V = 0V LEAK OUT Leakage Current — — 50 µA V = V OUT LOAD Thermal Shutdown T — 170 — °C J_SHDN Temperature AC Characteristics Cut-off Time T — 50 58 µs R =1, R =1k, C =820pF, OFF s C C (one-shot pulse) R =56k, C =820pF t t Turn-off Delay T — 1.5 10 µs D Note 1: V = 5.0V input current given by internal pull-up to Logic Supply. IN 2: Clamp/Freewheel diode is the intrinsic body-drain diode of the NMOS and PMOS transistors. DS22260C-page 4  2010-2013 Microchip Technology Inc.

MTS62C19A TEMPERATURE SPECIFICATIONS Parameters Sym Min Typ Max Units Conditions Recommended Temperature Ranges Junction Temperature Range T -40 +125 °C J Operating Temperature Range T -40 +105 °C A Thermal Package Resistance Thermal Resistance, SOP-24  — 76 — °C/W EIA/JEDEC JESD51-10 JA Thermal Resistance, SOP-24  — 16 — °C/W EIA/JEDEC JESD51-10 JC  2010-2013 Microchip Technology Inc. DS22260C-page 5

MTS62C19A 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table2-1. TABLE 2-1: MTS62C19A PIN FUNCTION TABLE Pin No. Type Name Function SOP-24 1 Output OUT1A Output 1 ‘A’ Side of Motor Winding 2 Output OUT2A Output 2 ‘A’ Side of Motor Winding 3 Input SENSE2 Current Sense for Output 2 4 Input COMPIN2 Current Sense Comparator Input for Output 2 5 Output OUT2B Output 2 ‘B’ Side of Motor Winding 6 Power GND Negative Logic Supply (Ground) 7 Power GND Negative Logic Supply (Ground) 8 Input I02 Output 2 Current Selection Bit 0 9 Input I12 Output 2 Current Selection Bit 1 10 Input PHASE2 Output 2 Phase 11 Input V Output 2 Current Reference REF2 12 Input RC2 Output 2 RC Time Constant 13 Power V Positive Logic Supply Voltage LOGIC 14 Input RC1 Output 1 RC Time Constant 15 Input V Output 1 Current Reference REF1 16 Input PHASE1 Output 1 Phase 17 Input I11 Output 1 Current Selection Bit 1 18 Power GND Negative Logic Supply (Ground) 19 Power GND Negative Logic Supply (Ground) 20 Input I01 Output 1 Current Selection Bit 0 21 Output OUT1B Output 1 ‘B’ Side of Motor Winding 22 Input COMPIN1 Current Sense Comparator Input for Output 1 23 Input SENSE1 Current Sense for Output 1 24 Power V Positive Load Supply Voltage LOAD DS22260C-page 6  2010-2013 Microchip Technology Inc.

MTS62C19A 2.1 Output Stage (OUT1A, OUT2A, 2.6 Current Flow Direction Selection OUT1B, OUT2B) (PHASE1, PHASE2) Output connection to “A” side and “B” side of motor Logic input to select the direction of the current flow windings. through the load. A “HIGH” logic signal level causes load current to flow from OUTxA to OUTxB. A “LOW” 2.2 Current Sense Input (SENSE1, logic level causes load current to flow from OUTxB to SENSE2) OUTxA. Connection to lower sources of output stage for 2.7 Current Sense Reference insertion of current sense resistor. (V , V ) REF1 REF2 2.3 Current Sense Comparator Input Reference voltage for current sense comparator. (COMPIN1, COMPIN2) Determines the level of output current detection together with sensing resistor and inputs I0x, I1x. Current sense comparator input. 2.8 Output Stage OFF Time 2.4 Ground Terminal (GND) (RC1, RC2) Logic supply ground. Only the driver current flows out A parallel RC network connected to this pin sets the t t of this pin; there is no high current. Minimize voltage OFF time of the power transistors. The monostable drops between this pin and the logic inputs. pulse generator is triggered by the output of the current sense comparator. 2.5 Current Detection Selection (I01, I02, I11, I12) 2.9 Logic Supply Voltage (V ) LOGIC Comparator input for current threshold detection. The Connect V to the logic source voltage. Decouple LOGIC voltage across the sense resistor is fed back to this the supply with a 0.1µF ceramic capacitor mounted input through the low-pass filter R C . The power tran- close to the V and GND terminals. c c LOGIC sistors are disabled when the sense voltage exceeds the reference voltage of the selected comparator. 2.10 Load Supply Voltage (V ) LOAD When this occurs, the current decays for a time set by RtCt (TOFF = 1.1 RtCt). Connect VLOAD to the motor positive voltage supply. The motor current is supplied through this pin and the selected output transistors.  2010-2013 Microchip Technology Inc. DS22260C-page 7

MTS62C19A 3.0 FUNCTIONAL DESCRIPTION 3.1 Power Bridge Operation The circuit is designed to drive the two windings of a Each motor winding is driven by an H-type bridge bipolar stepper motor, and can be divided in two identi- consisting of two N and two P transistors that allow the cal channels (channel 1 and channel 2) and protection current to flow in both winding directions depending on circuitry for overtemperature and undervoltage. The the value of the PHASE signal (Table3-1). The functionality of a channel and protection circuitry is H-bridge can be set in five configurations that are presented in the following sections. related to the digital inputs PHASE, I0 and I1 and to the current sensed. These configurations are shown in Table3-2. V V V LOAD LOAD LOAD Pa Pb Pa Pb Pa Pb L H L H L H OUTA OUTB OUTA OUTB OUTA OUTB L H L H L H Na Nb Na Nb Na Nb SENSE SENSE SENSE RS RS RS a) b) c) Legend: a) Bridge ON, b) Source OFF, c) All OFF/Coasting Note: For PHASE = L/Reverse, invert A and B in drawings. FIGURE 3-1: Power Bridge Control (PHASE = H/forward). TABLE 3-1: CURRENT DIRECTION CONTROL Phase Output Current L Current flows from OUTxB to OUTxA H Current flows from OUTxA to OUTxB TABLE 3-2: POWER BRIDGE GATE CONTROL TRUTH TABLE I0I1 PHASE Overi T Case/Mode gna gpa gnb gpb OFF 00/01/10 1 0 0 Forward ON L L H H 00/01/10 1 x 1 Forward OFF L H H H 00/01/10 0 0 0 Reverse ON H H L L 00/01/10 0 x 1 Reverse OFF H H L H 11 x x x No Current/ L H L H Coasting Legend: Bold = Active MOS Transistors, Overi = Overcurrent flag, T = Channel T State Flag OFF OFF DS22260C-page 8  2010-2013 Microchip Technology Inc.

MTS62C19A 3.2 PWM Current Control The current level in each motor winding is controlled by a PWM circuit with a fixed T time. The load current OFF flowing in the winding is sensed through an external sensing resistor R , connected between the power S bridge's source pin SENSE (sources of transistors Na and Nb) and GND. V LOAD V Power REF Bridge Pa Pb One-Shot OUTA ÷10 Source Disable OUTB I0 Na Nb I1 COMPIN RC SENSE CC RC Ct Rt RS FIGURE 3-2: PWM Current Control Circuit Principle (Channel 1 Shown). The voltage across R is compared to a fraction of the The maximum trip current for regulation, given for S reference voltage V , chosen with the logic input bits I0I1=00 is calculated in Equation3-1. REF I0 and I1 (Table3-3). The power bridge, and thus the load current, can also be switched off completely when EQUATION 3-1: both logic inputs are high. Note that any logic input left V unconnected will be treated as a high level (pull-up I = -------R---E---F----- resistor). MAX 10R S TABLE 3-3: CURRENT LEVEL CONTROL TRUTH TABLE I0 I1 Comp. Trip Voltage Output Current 0 0 V = 1/10xV I = V /10R TRIP REF MAX REF S 1 0 V = 1/15xV 2/3xI = V /15R TRIP REF MAX REF S 0 1 V = 1/30xV 1/3xI = V /30R TRIP REF MAX REF S 1 1 x 0 (no current)  2010-2013 Microchip Technology Inc. DS22260C-page 9

MTS62C19A When the maximum allowed current is reached, the 3.3 Circuit Protection bridge source is turned off during a fixed period T OFF (typically 50µs) given by a non-retriggerable pulse A thermal protection circuitry turns off all drivers when generator and the external timing components R the junction temperature exceeds a safe operating limit t (20k–100k range) and C (100pF–1000pF of +170°C (typical). This protects the devices from t range): failure due to excessive heating. Despite this thermal protection, output short circuits are not permitted. The output drivers are re-enabled once junction EQUATION 3-2: temperature has dropped below +145°C (typical). T = 1.1R C  OFF t t thshtd_en During T the winding current decreases. When the OFF driver is re-enabled, the winding current increases again until it reaches the threshold, and the cycle 1 repeats itself, maintaining the load current at the desired level. PHASE 0 IOUT+0 +145°C +170°C - FIGURE 3-4: Thermal Shutdown Output I vs. Temperature Showing Hysteresis. OUT An undervoltage lockout circuit protects the MTS62C19A from potential shoot-through currents ton td toff when the load supply voltage is applied prior to the logic supply voltage. The power bridge and all outputs FIGURE 3-3: PWM Output Current are disabled if V is smaller than 4V. LOGIC Waveform. With this protection feature, the circuit will withstand any order of turn-on or turn-off of the supply voltages V and V Normal dV/dt values are assumed. LOGIC LOAD. DS22260C-page 10  2010-2013 Microchip Technology Inc.

MTS62C19A 4.0 APPLICATION CIRCUITS AND ISSUES 4.1 Typical Application The MTS62C19A circuit, with external components for a typical application, is shown in Figure4-1. Typical passive component values are: R = 1, R = 1k, S C C =820pF, R = 56k and C = 820pF. C t t 5V 10 to 30V 100nF 100µF 100nF VLOGIC VLOAD PHASE1 Shift Drivers I01 Logic OUT1A Power I11 Bridge OUT1B Current V REF1 Sense P Comparator One-shot µ c/ gi o L Under-V Thermal Lockout Shutdown PHASE2 Shift Drivers I02 Logic OUT2A I12 Power M Bridge OUT2B Current VREF2 CoSmepnaserator One-shot COMPIN1 COMPIN2 RC2 RC1 GND SENSE1 SENSE2 C t Rt C Rt RS RS t CC RC CC RC FIGURE 4-1: Typical Application Circuit. During PWM operation, when the output stage is turned-on, large voltage peaks might appear across R , which can wrongly trigger the input comparator. To S avoid an unstable current control, an external R C fil- C C ter should be used that delays the comparator action. Depending on load type, many applications will not require this filter (SENSE connected to COMPIN).  2010-2013 Microchip Technology Inc. DS22260C-page 11

MTS62C19A 4.2 Stepping Examples The MTS62C19A control modes are full-step, half- step, modified half-step and microstepping control of the motor, as shown in Figure4-2. Full-Step Half-Step Modified Half-Step Micro-Stepping (1/8th) 1 2 3 4 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1... ...32 I01 I11 PHASE1 I02 I12 PHASE2 5V VREF1 0V 5V VREF2 5V 5V 5V 0V +500 mA Motor Current 0 in Phase 1 -500 mA +500 mA Motor Current +167 mA +333 mA 0 in Phase 2 -167 mA -333 mA -500 mA FIGURE 4-2: Examples of Stepping Modes Achievable with Typical Application Circuit. 4.3 PCB Design Guidelines Unused inputs should be connected to fixed voltage levels in order to get the highest noise immunity. Typi- cal PCB layout guidelines for power applications should be followed. These include separate power ground planes, supply decoupling capacitors close to the IC, short connections and use of maximized copper areas to improve thermal dissipation. DS22260C-page 12  2010-2013 Microchip Technology Inc.

MTS62C19A 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 24-Lead SOP Example MTS62C19A HS105^e^3 YYWWNNN 1248256 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2010-2013 Microchip Technology Inc. DS22260C-page 13

MTS62C19A SOP 24L Package Outline Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 24 13 1 12 0.016 typ 0.05 typ D L GAUGE PLANE SEATING PLANE Note: The package drawing dimensions are expressed in inches. Symbol Minimum Typical Maximum Unit A — — 2.642 (0.104) mm (inch) A1 0.102 (0.004) — — mm (inch) D 15.545 (0.612) 15.697 (0.618) 15.850 (0.624) mm (inch) E 7.417 (0.292) 7.518 (0.296) 7.595 (0.299) mm (inch) H 10.287 (0.405) 10.464 (0.412) 10.643 (0.419) mm (inch) L 0.533 (0.021) 0.787 (0.031) 1.041 (0.041) mm (inch) J 0 4 8 ° Note 1: JEDEC outline: M0-119 AA 2: Dimensions “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs should not exceed 0.25mm (0.010inch) per side. 3: Dimensions “E” does not include inter-lead flash, or protrusions. Inter-lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. DS22260C-page 14  2010-2013 Microchip Technology Inc.

MTS62C19A APPENDIX A: REVISION HISTORY Revision C (March 2013) The following is the list of modifications: 1. Corrected one dimension in the package drawing. Added a note mentioning the unit type used in the drawing. 2. Minor editorial changes. Revision B (December 2012) The following is the list of modifications: 1. Updated Operating Temperature Range throughout the document. 2. Corrected Typical Application diagram. 3. Added Section5.1, Package Marking Information. 4. Added Product Identification System section. Revision A (September 2010) • Original Release of this Document.  2010-2013 Microchip Technology Inc. DS22260C-page 15

MTS62C19A NOTES: DS22260C-page 16  2010-2013 Microchip Technology Inc.

MTS62C19A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. -X X XXX Examples: a) MTS62C19A-HS105 Tube, Device Tube/Tape Package Fixed 24LD SOP Package and Reel Characters b) MTS62C19A-LS105 Tape and Reel, 24LD SOP Package Device: MTS62C19A: Dual Full-Bridge Motor Driver Packing Type: H = Tube L = Tape and Reel Package: S* = 24-Lead Plastic Small Outline (SOP) * These devices are formerly products of Advanced Silicon  2010-2013 Microchip Technology Inc. DS22260C-page 17

MTS62C19A NOTES: DS22260C-page 18  2010-2013 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2010-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-053-5 QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2010-2013 Microchip Technology Inc. DS22260C-page 19

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