ICGOO在线商城 > 分立半导体产品 > 二极管 - 整流器 - 单 > MSS1P6-M3/89A
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MSS1P6-M3/89A产品简介:
ICGOO电子元器件商城为您提供MSS1P6-M3/89A由Vishay设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 MSS1P6-M3/89A价格参考。VishayMSS1P6-M3/89A封装/规格:二极管 - 整流器 - 单, Diode Schottky 60V 1A Surface Mount MicroSMP (DO-219AD)。您可以下载MSS1P6-M3/89A参考资料、Datasheet数据手册功能说明书,资料中有MSS1P6-M3/89A 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | DIODE SCHOTTKY 60V 1A MICROSMP肖特基二极管与整流器 1.0 Amp 60 Volt |
产品分类 | 单二极管/整流器分离式半导体 |
品牌 | Vishay SemiconductorsVishay Semiconductor Diodes Division |
产品手册 | |
产品图片 | |
rohs | RoHS 合规性豁免无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 二极管与整流器,肖特基二极管与整流器,Vishay Semiconductors MSS1P6-M3/89AeSMP™ |
数据手册 | |
产品型号 | MSS1P6-M3/89AMSS1P6-M3/89A |
不同If时的电压-正向(Vf) | 680mV @ 1A |
不同 Vr、F时的电容 | - |
不同 Vr时的电流-反向漏电流 | 150µA @ 60V |
二极管类型 | |
产品 | Schottky Rectifiers |
产品目录绘图 | |
产品目录页面 | |
产品种类 | 肖特基二极管与整流器 |
供应商器件封装 | MicroSMP |
其它名称 | MSS1P6-M3/89AGIDKR |
包装 | Digi-Reel® |
反向恢复时间(trr) | - |
商标 | Vishay Semiconductors |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | MicroSMP |
封装/箱体 | Micro SMP |
峰值反向电压 | 60 V |
工作温度-结 | -55°C ~ 150°C |
工作温度范围 | - 55 C to + 150 C |
工厂包装数量 | 4500 |
技术 | Silicon |
最大反向漏泄电流 | 150 uA |
最大工作温度 | + 150 C |
最大浪涌电流 | 25 A |
最小工作温度 | - 55 C |
标准包装 | 1 |
正向电压下降 | 0.68 V |
正向连续电流 | 1 A |
电压-DC反向(Vr)(最大值) | 60V |
电流-平均整流(Io) | 1A |
系列 | MSSxPx |
速度 | 快速恢复 =< 500 ns,> 200mA(Io) |
配置 | Single |
MSS1P5, MSS1P6 www.vishay.com Vishay General Semiconductor Surface Mount Schottky Barrier Rectifiers FEATURES eSMP® Series • Very low profile - typical height of 0.65 mm Available • Ideal for automated placement • Low forward voltage drop, low power losses • High efficiency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Top View Bottom View • AEC-Q101 qualified available MicroSMP (DO-219AD) - Automotive ordering code: base P/NHM3 • Material categorization: for definitions of complianc e Anode Cathode please see www.vishay.com/doc?99912 ADDITIONAL RESOURCES TYPICAL APPLICATIONS 3DDD 333D For use in low voltage high frequency inverters, freewheeling, DC/DC converters, and polarity protectio n 3D Models applications. PRIMARY CHARACTERISTICS MECHANICAL DATA I 1.0 A Case: MicroSMP (DO-219AD) F(AV) Molding compound meets UL 94 V-0 flammability ratin g V 50 V, 60 V RRM Base P/N-M3 - halogen-free, RoHS-compliant, and IFSM 25 A commercial grade V at I = 1.0 A 0.52 V Base P/NHM3_X - halogen-free, RoHS-compliant, and F F AEC-Q101 qualified T max. 150 °C J (“_X” denotes revision code e.g. A, B,...) Package MicroSMP (DO-219AD) Terminals: matte tin plated leads, solderable per Circuit configuration Single J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker test Polarity: color band denotes the cathode end MAXIMUM RATINGS (T = 25 °C unless otherwise noted) A PARAMETER SYMBOL MSS1P5 MSS1P6 UNIT Device marking code 15 16 Maximum repetitive peak reverse voltage V 50 60 V RRM Maximum average forward rectified current (fig. 1) I 1.0 A F(AV) Peak forward surge current 8.3 ms single half sine-wave I 25 A superimposed on rated load FSM Operating junction and storage temperature range T , T -55 to +150 °C J STG Revision: 17-Dec-2019 1 Document Number: 89018 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MSS1P5, MSS1P6 www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (T = 25 °C unless otherwise noted) A PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT I = 0.5 A 0.45 - F T = 25 °C J Maximum instantaneous IF = 1.0 A V (1) 0.56 0.68 V forward voltage I = 0.5 A F 0.40 - F T = 125 °C J I = 1.0 A 0.52 0.60 F T = 25 °C 20 150 μA Maximum reverse current Rated V J I (2) R R T = 125 °C 7.0 12 mA J Typical junction capacitance 4.0 V, 1 MHz C 40 - pF J Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width 40 ms THERMAL CHARACTERISTICS (T = 25 °C unless otherwise noted) A PARAMETER SYMBOL MSS1P5 MSS1P6 UNIT R (1) 125 JA Typical thermal resistance R (1) 30 °C/W JL R (1) 40 JC Note (1) Thermal resistance from junction to ambient and junction to lead mounted on PCB with 6.0 mm x 6.0 mm copper pad areas R is measured JL at the terminal of cathode band. R is measured at the top center of the body JC ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE MSS1P6-M3/89A 0.006 89A 4500 7" diameter plastic tape and reel MSS1P6HM3_A/H (1) 0.006 H 4500 7" diameter plastic tape and reel Note (1) AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (T = 25°C unless otherwise noted) A 1.2 0.7 A) Resistive or Inductive Load D = 0.3 D = 0.5 D = 0.8 nt ( 1.0 0.6 D = 0.2 urre W) d C 0.8 ss ( 0.5 D = 0.1 D = 1.0 e o d Rectifi 0.6 Power L 00..43 erage Forwar 00..24 aTtL tMhee aCsautrheodde Band Terminal Average 00..21 D = tp/T Ttp v A 0 0 0 25 50 75 100 125 150 0 0.2 0.4 0.6 0.8 1.0 1.2 Lead Temperature (°C) Average Forward Current (A) Fig. 1 - Maximum Forward Current Derating Curve Fig. 2 - Forward Power Loss Characteristics Revision: 17-Dec-2019 2 Document Number: 89018 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MSS1P5, MSS1P6 www.vishay.com Vishay General Semiconductor 10 1000 A) nt ( TJ= 150°C Curre 1 T = 125°C )Fp( e d J cn war atic or ap 100 F a us 0.1 C n ntaneo TJ= 25°C oitcnuJ a st TJ= -40°C n I 0.01 10 0 0.10.20.30.40.50.60.70.80.91.01.11.21.31.41.5 0.1 1 10 100 Reverse Voltage (V) Instantaneous Forward Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 5 - Typical Junction Capacitance Axis Title 1000 10000 1000 A) )W Junction to Ambient ent (m 10100 TJ= 150 °C /C°( e e Curr 1 TJ= 125 °C 1000 cnade 100 d lineRevers 0.00.11 TJ= 25 °C 1st line pmI lam 2nous 0.001 100 reh 10 e T an 0.0001 tn Instant0.00001 TJ= -40 °C eisnarT 0.000001 10 1 10 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 100 1000 Percent of Rated Peak Reverse Voltage (%) t - Pulse Duration (s) Fig. 4 - Typical Reverse Characteristics Fig. 6 - Typical Transient Thermal Impedance PACKAGE OUTLINE DIMENSIONS in inches (millimeters) MicroSMP (DO-219AD) 0.059 (1.50) 0.030 (0.75) Cathode Band 0.043 (1.10) 0.022 (0.55) 0.055 (1.40) 0.039 (0.98) 0.030 (0.75) 0.047 (1.20) 0.031 (0.78) 0.022 (0.55) 0.091 (2.30) 0.083 (2.10) 0.106 (2.70) 0.091 (2.30) Mounting Pad Layout 0.079 0.032 (2.00) (0.80) 0.029 (0.73) 0.043 0.032 0.025 (0.63) (1.10) (0.80) 0.011 (0.27) 0.005 (0.12) 0.020 (0.50) Revision: 17-Dec-2019 3 Document Number: 89018 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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