MRF24WB0MA/MRF24WB0MB MRF24WB0MA/MRF24WB0MB Data Sheet 2.4 GHz IEEE 802.11b™ Features • Integrated RSSI ADC and I/Q DACs, RSSI readings available to host • IEEE 802.11-compliant RF Transceiver • Balanced receiver and transmitter characteristics • Serialized unique MAC address for low power consumption • Data Rate: 1 and 2 Mbps • Compatible with IEEE 802.11b/g/n networks MAC/Baseband Features • Small size: 21 mm x 31 mm 36-pin Surface Mount • Hardware CSMA/CA access control, automatic Module ACK, and FCS creation and checking • Integrated PCB antenna (MRF24WB0MA) • Automatic MAC packet retransmit • External antenna option (MRF24WB0MB) with • Hardware Security Engine for AES and ultra miniature coaxial (UFL) connector RC4-based ciphers • Range: up to 400m (1300 ft.) • Supports 802.1x, 802.1i security: WEP, • Easy integration into final product – accelerates WPA-PSK, and WPA-2-PSK. product development, provides quicker time to • Supports Infrastructure, ad hoc market • Radio regulation certification for United States Applications (FCC), Canada (IC), Europe (ETSI) and Japan (ARIB) • Utility and Smart Energy • Wi-Fi® certified (WFA ID: WFA7150) - Thermostats • Designed for use with Microchip microcontroller - Smart Meters families (PIC18, PIC24, dsPIC33, and PIC32) with - HVAC downloadable Microchip TCP/IP Stack • Consumer Electronics Operational - Remote Control - Internet Radio • Single operating voltage: 2.7V–3.6V (3.3V typical) • Industrial Controls • Temperature Range: -40° C to +85° C - Chemical Sensors • Simple, four-wire SPI interface with interrupt - HVAC • Low-current consumption: - Security Systems - RX mode – 85 mA (typical) - M2M Communication - TX mode – 154 mA (+10 dBm typical) • Remote Device Management - Sleep – 250 µA (typical) - Location and Asset Tracking - Hibernate – <0.1 µA (typical) - Automotive RF/Analog Features • Retail - POS Terminals • ISM Band 2.400–2.484 GHz operation - Wireless Price Tags • 14 Channels selectable individually or domain- - Digital Remote restricted • Medical, Fitness, and Health care • DSSS Modulation - Patient Asset Tracking • Data Rate – 1000 kbps • -91 dBm Typical sensitivity at 1 Mbps • +10 dBm Typical output power with control Note: For products that are intended for use with • Integrated low phase noise VCO, RF frequency any Access Point, it is recommended to use MRF24WG0MA/MB. synthesizer, PLL loop filter and PA • Digital VCO and filter calibration  2010-2013 Microchip Technology Inc. DS70632C-page 1

MRF24WB0MA/MRF24WB0MB Pin Diagram Note: Antenna connector on MRF24WB0MB only. DS70632C-page 2  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB Table of Contents 1.0 Devices Overview.........................................................................................................................................................................5 2.0 Circuit Description......................................................................................................................................................................11 3.0 Regulatory Approval...................................................................................................................................................................21 4.0 Electrical Characteristics............................................................................................................................................................27 Appendix A: Revision History...............................................................................................................................................................31 The Microchip Web Site.......................................................................................................................................................................33 Customer Change Notification Service................................................................................................................................................33 Customer Support................................................................................................................................................................................33 Reader Response................................................................................................................................................................................34 Product Identification System..............................................................................................................................................................35 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products.  2010-2013 Microchip Technology Inc. DS70632C-page 3

MRF24WB0MA/MRF24WB0MB NOTES: DS70632C-page 4  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB 1.0 DEVICES OVERVIEW The MRF24WB0MA/MRF24WB0MB modules have received regulatory approvals for modular devices in The MRF24WB0MA and MRF24WB0MB are low-power, the United States (FCC), Canada (IC), and Europe 2.4 GHz, IEEE 802.11-compliant, surface mount (ETSI). The modular approval removes the need for modules with all associated RF components such as expensive RF and antenna design, and allows the end crystal oscillator, bypass and bias passives with user to place the modules inside a finished product and integrated MAC, baseband, RF and power amplifier, and not require regulatory testing for an intentional radiator built-in hardware support for AES, and TKIP (WEP, WPA, (RF transmitter). They also have Radio Type Approval WPA2 security). The integrated module design frees the Certification for Japan. See Section3.0, Regulatory designer from RF and antenna design tasks and Approval, for the specific requirements that should be regulatory compliance testing, ultimately providing adhered to by the integrator. quicker time to market. The MRF24WB0MA module is approved for use with the integrated PCB meander 1.1 Interface Description antenna. Figure1-1 represents a MRF24WB0MA/ The MRF24WB0MB has an ultra miniature coaxial MRF24WB0MB module. It interfaces to Microchip connector (U.FL) and is approved for use with a list of PIC18, PIC24, dsPIC33, or PIC32 microcontrollers pre-certified antennas. See Section2.8, External through a four-wire serial slave SPI interface, such as Antenna, for specific recommendations. interrupt, hibernate, Reset, power and ground signals. The MRF24WB0MA/MRF24WB0MB modules are The module runs on a single supply voltage of designed to be used with Microchip’s TCP/IP software nominally 3.3V. It also supports optional JTAG and stack. The software stack has an integrated driver that serial debug for testability. The debug port operates at implements the API that is used in the modules for 3.3V and requires a level shifter for operation with RS- command and control, and for management and data 232 devices. Figure1-2 shows a simplified connection packet traffic. between a Microchip’s PIC MCU and the module. The Microchip TCP/IP software stack is available in the Table1-1 lists the pin descriptions. Microchip Application Libraries for free download Data communications with the MRF24WB0MA/ (including example applications and source code) from MRF24WB0MB are through the SPI interface, for the Microchip web site, http://www.microchip.com/ more information see Section2.0, Circuit Descrip- wireless. tion. Microchip’s PIC MCUs communicates with the The combination of the module and a PIC running the module through a command API within the Microchip TCP/IP stack results in support for IEEE 802.11 and IP TCP/IP stack. The command API is detailed in the services. This allows the immediate implementation of Microchip TCP/IP stack online help that is available in a wireless web server. the Microchip Application Libraries for free download.  2010-2013 Microchip Technology Inc. DS70632C-page 5

MRF24WB0MA/MRF24WB0MB FIGURE 1-1: MRF24WB0MA/MRF24WB0MB BLOCK DIAGRAM MRF24WB0MA 2.4 GHz IEEE Std. 802.11b RF Transceiver Module SPI Digital I/O AES, TKIP FLASH Encryption Interface Accelerator Interrupt Power 2.4 GHz RAM Transceiver JTAG PCB Debug Matching Antenna Circuitry Power (MRF24WB0MA) ROM Reset Amplifier Hibernate FIGURE 1-2: MICROCONTROLLER TO MRF24WB0MA/MRF24WB0MB INTERFACE MRF24WB0Mx PIC Microcontroller External Antenna CS I/O (MRF24WB0MB) SDI SDO SDO SDI SCK SCK INT INTx +3.3V (Typ) VDD HIBERNATE I/O GND GND WP I/O RESET I/O DS70632C-page 6  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB TABLE 1-1: Pin Description Pin Symbol Type Description 1 GND P Ground 2 NC NC Do not connect 3 JTAGTDO O JTAG test data output 4 JTAGTCK I: Constant(1) JTAG clock input (drive or pull-up only) 5 JTAGTMS I JTAG mode input 6 JTAGTDI I JTAG test data input 7 RESET I: Constant(1) Module Reset input 8 NC NC Do not connect 9 JTAGRST I JTAG Reset input (optional; see Section2.0, Circuit Description) 10 GND P Ground 11 NC NC Do not connect 12 NC NC Do not connect 13 NC NC Do not connect 14 NC NC Do not connect 15 NC NC Do not connect 16 WP(2) I Write protect (this pin is used to enable FLASH update) 17 VDD P Power 18 GND P Ground 19 GND P Ground 20 HIBERNATE I Hibernate mode enable (high input will disable the module) 21 JTAGEN I JTAG test enable 22 NC NC Do not connect 23 CS I: Constant(1) SPI Chip Select input, constant drive or pull-up required 24 NC NC Do not connect 25 GND P Ground 26 DEBUGRX I Serial debug port input (see Section2.0, Circuit Description) 27 DEBUGTX O Serial debug port output (see Section2.0, Circuit Description) 28 GND P Ground 29 VDD P Power 30 GND P Ground 31 NC NC Do not connect 32 SDO O SPI data out 33 INT O Interrupt output (open drain – requires a pull-up) 34 SCK I SPI clock input 35 SDI I SPI data in 36 GND P Ground Legend: Pin type abbreviation: P = Power input, I = Input, O = Output, NC = Do Not Connect Note 1: Signals of Type “I: Constant” must either be constantly driven by the host or have a pull-up or pull-down (in case the host is likely to tri-state the signal during power down modes). The constant drive is used to ensure defined operation of the part and to minimize leakage current during low power modes. 2: WP is used as write-protect for the internal module SPI Flash. For production use, this pin should be pulled low. This pin can be controlled by the host microcontroller to enable in field Flash updates.  2010-2013 Microchip Technology Inc. DS70632C-page 7

MRF24WB0MA/MRF24WB0MB 1.2 Mounting Details The MRF24WB0MA/MRF24WB0MB is a surface mountable module. Module dimensions are shown in Figure1-3. The module Printed Circuit Board (PCB) is 1 mm thick with castellated mounting points on two sides. FIGURE 1-3: MRF24WB0MA/MRF24WB0MB MODULE PHYSICAL DIMENSIONS Note: Antenna connector on MRF24WB0MB only. DS70632C-page 8  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB The MRF24WB0MA has an integrated PCB antenna. underneath the module. Do not “cut-out” host PCB For best performance, mount the module on the PCB material under the antenna. Figure1-4 shows the without metal obstructions in the keep out area. The recommended host PCB footprint for the module. antenna is tuned to have FR4 PCB material FIGURE 1-4: RECOMMENDED HOST PCB FOOTPRINT Note1: The “Note 1” demarcation specifies the host PCB copper plane “keep-out” area on underlying board layers. Users can route surface escape traces in this area. The module has exposed copper test points on bottom side in the “keep out” zone. Ensure that there is no exposed cop- per on mounting board that may short these.  2010-2013 Microchip Technology Inc. DS70632C-page 9

MRF24WB0MA/MRF24WB0MB Figure1-5 illustrates the module reflow profile that is recommended for mounting the device onto the host PCB. FIGURE 1-5: RECOMMENDED MODULE REFLOW PROFILE AND SETPOINTS Zones 1 2 3 4 5 6 7 8 300 250 C) 200 ° e ( ur at r 150 e p m e T 100 50 0 0 50 100 150 200 250 300 Time (Seconds) The following table lists the module re-flow profile TABLE 1-2: MODULE RE-FLOW PROFILE(1) Zone 1 2 3 4 5 6 7 8 Temperature (°C) 180° 180° 200° 200° 200° 220° 265° 270° Note 1: Conveyor Speed: 90 cm/min. details. DS70632C-page 10  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB 2.0 CIRCUIT DESCRIPTION The MRF24WB0MA/MRF24WB0MB interfaces to Microchip’s PIC18, PIC24, dsPIC33, and PIC32 microprocessors with a minimal of external components through digital-only connections. This section details use of the module, starting with an example host connection as shown in Figure2-1. 2.1 Schematic FIGURE 2-1: MRF24WB0MA/MRF24WB0MB EXAMPLE APPLICATION SCHEMATIC 2.2 Power-On Sequence The internal regulators for the digital and analog core power supplies are disabled by driving the HIBERNATE pin high. Figure2-2 shows the power up sequence for the MRF24WB0MA/MRF24WB0MB. An internal Power-on Reset (POR) circuit which keeps the module in Reset until VDD is within the specification. The Hibernate and Reset signals are also used to control startup. In Figure2-2, section A is controlled by the internal POR and section B is an allowance for the SPI bus to stabilize when the module supplies are enabled. After Hibernate is disabled, the host software provides 1mS of startup to allow the SPI to stabilize. This time is pre-programmed into the host driver, and may need to be increased if insufficient initial drive current is not provided to the MRF24WB0M module. Section C is the driver controlled release from Reset period. This takes approximately 300 mS and is monitored by the stack driver. No additional time needs to be provided by user software for startup.  2010-2013 Microchip Technology Inc. DS70632C-page 11

MRF24WB0MA/MRF24WB0MB FIGURE 2-2: MRF24WB0MA/MRF24WB0MB POWER-ON SEQUENCE TIMING DS70632C-page 12  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB 2.3 Power States state affects system behavior, and overall power con- sumption or battery life. Addition to that there is one The MRF24WB0MA/MRF24WB0MB has the following “Standby” state that is not user-controlled. power states: Hibernate, Sleep and Active (two sub- states), as shown in Figure2.4. The selection of power FIGURE 2-3: MRF24WB0MA/MRF24WB0MB POWER-STATE DIAGRAM 10 µs Off RX On TX On Note 1 200 µs Hibernate Standby Note 1 200 µs Sleep Note1: See Section2.2, Power-On Sequence. 2.3.2 SLEEP STATE The Sleep state is a low power dynamic state that 2.3.1 HIBERNATE STATE implements the 802.11 Power Save feature. In this An “Off” state is defined as no power applied to the mode, if enabled, the module will enter Power Save device. The Hibernate mode is the closest to controlled mode when all activity is complete. off that the module can approach. It is controlled The module will wake autonomously to any PIC through the HIBERNATE pin (high input puts the intervention to check DTIM beacons from the Access module into Hibernate). When in Hibernate, the module Point (AP). If any traffic is listed as queued for the only consumes leakage current, but does not maintain module, then it will awaken and get the data from the state. Hibernate has to be fully controlled by the PIC AP on the next possible opportunity. When data is MCU and requires the TCP/IP stack to restart on an acquired, the module will interrupt the PIC awake. microcontroller on a normal “data available” indication. The module contains about 70µF of internal bulk If no data is available on a DTIM check, the module capacitance. Supplies should be provisioned to supply reenters the Power Save state until the next DTIM. The sufficient charge on release of hibernate for required DTIM interval is programmed at the AP. This state can start time or sufficient delay must be provided in provide “as if on” behavior of the radio with a significant software after hibernate release and before Reset power savings versus “always on”. The battery life release. expectation of this mode is several days to several This state provides the best battery life for embedded weeks. This mode is characterized by a very-low products. Entering Hibernate for intervals of less than latency (as low as 200 mS) to begin data transfer from 30 seconds is not likely to save power. Battery life the low-power state. expectation can be more than a year for devices 2.3.3 ACTIVE STATE operating on AA cells that is in Hibernate except to wake up every hour for a small data transfer (<500 The Active state is identified as one of the two states Bytes). where the radio circuitry is fully on. The two active states are the Receive state (RX ON) and Transmit state (TX ON).  2010-2013 Microchip Technology Inc. DS70632C-page 13

MRF24WB0MA/MRF24WB0MB 2.3.4 STANDBY STATE The Standby state is not user-controlled, but it is noted as it helps identify and track certain operations of the module during power tracing. TABLE 2-1: MRF24WB0MA/MRF24WB0MB POWER STATE DEFINITIONS State VDD Hibernate Description Off 0V 0V Power is disconnected Hibernate 3.3V 3.3V All internal power regulators are OFF – enabled by HIBERNATE pin Sleep 3.3V 0V Enabled by TCP/IP driver RX ON 3.3V 0V Receive circuits are ON and receiving TX ON 3.3V 0V Transmit circuits are ON and transmitting Standby 3.3V 0V State machine transition state only – not user controlled DS70632C-page 14  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB 2.4 JTAG Interface It is recommended that the module be mounted on the edge of the host PCB. It is permitted for PCB material Joint Test Action Group (JTAG) is the common name to be below the antenna structure of the module as long used for IEEE 1149.1 entitled Standard Test Access as no copper traces or planes are on the host PCB in Port and Boundary-Scan Architecture for test access that area. For best performance, place the module on ports that are used for testing printed circuit boards the host PCB according to the details shown in using boundary scan. The MRF24WB0MA/ Figure1-4. MRF24WB0MB supports JTAG boundary scan. The Figure2-4, Figure2-5 and Figure2-6 show the JTAG port provides the optional hardware JTAG Reset antenna and simulated radiation patterns expected input, JTAGRST. JTAG_EN and JTAGRST need to be from the PCB antenna. Refer to three separate axis of driven high to enable JTAG mode. JTAG should not be measurement that corresponds to the orientation of the enabled during normal functional operation which module (drawn in the center of each plot). affects power state current. The horizontal and vertical data, blue and red, in each 2.5 Debug Serial Interface plot correspond to the orientation (polarization) of the measurement antenna rotated 360 degrees around the The MRF24WB0MA/MRF24WB0MB incorporates a module. Transmit Data pin (DEBUGTX) and a Receive Data pin The horizontal measurement was done with the receive (DEBUGRX) for serial debugging purposes. These pins antenna parallel to the module PCB. The vertical mea- can be connected to commercially available RS-232 line surement was done perpendicular to the module PCB. drivers/receivers with appropriate external level shifters. The serial interface operates at 19200, 8, N, 1, N. These patterns allow the designer to understand the performance of the module with respect to the position of the receive or transmit antenna at the other end of the link. 2.6 SPI Interface The slave Serial Peripheral Interface (SPI) is used to interface with the host PIC microcontroller. The slave SPI interface works with the Interrupt line (INT). When data is available for the PIC microcontroller during operation, the INT line is asserted (logic low) by the MRF24WB0MA/MRF24WB0MB module. The INT line is de-asserted (logic high) by the MRF24WB0MA/ MRF24WB0MB after the data is transferred to the host PIC microcontroller. The SPI SCK frequency can be up to 25 MHz. The slave SPI interface implements the [CPOL = 0; CPHA = 0] and [CPOL = 1; CPHA = 1] modes (0 and 3) of operation. That is, data is clocked in on the first rising edge of the clock after Chip Select (CS) is asserted. Data is placed on the bus with most significant bit (MSb) first. The CS pin must be toggled with transfer blocks and cannot be held low permanently. The falling edge of CS is used to indicate the start of a transfer. The rising edge of CS is used to indicate the completion of a transfer. Figure4-1 in Section4.0, Electrical Characteristics shows the SPI timing diagram. Table4-7 details the SPI timing AC characteristics. 2.7 PCB Antenna For MRF24WB0MA, the PCB antenna is fabricated on the top copper layer and covered in solder mask. The layers below the antenna have no copper trace.  2010-2013 Microchip Technology Inc. DS70632C-page 15

MRF24WB0MA/MRF24WB0MB FIGURE 2-4: AZIMUTH RADIATION PATTERN, 2.44 GHz 0° 0 dB -5 dB Horizontal -10 dB -15 dB -20 dB Vertical 270° 90° 180° DS70632C-page 16  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB FIGURE 2-5: RADIATION PATTERN ON SIDE WITH PCB ANTENNA, 2.44 GHz 0° 0 dB -5 dB Horizontal -10 dB -15 dB Vertical -20 dB 270° 90° 180°  2010-2013 Microchip Technology Inc. DS70632C-page 17

MRF24WB0MA/MRF24WB0MB FIGURE 2-6: RADIATION PATTERN ALONG PIN EDGE, 2.44 GHz 0° 0 dB -5 dB Horizontal -10 dB -15 dB -20 dB 270° 90° Vertical 180° DS70632C-page 18  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB 2.8 External Antenna The choice of an external antenna is limited to the antenna types the module is tested with. Refer to Section3.0, Regulatory Approval for specific country- wise regulatory requirements. A list of antennas types tested with the MRF24WB0MB modules is provided in Table2-2. TABLE 2-2: TESTED EXTERNAL ANTENNA TYPES VSWR Part Number Type Gain (dBi) Connector Vendor Max. RFA-02-P05 PCB 2 2.0 IPEX Aristotle RFA-02-L6H1-70-35 Dipole 2 2.0 IPEX Aristotle RFA-02-D3 Dipole 1.5 2.0 IPEX Aristotle RFA-02-L2H1 Dipole 2 2.0 IPEX Aristotle RFA-02-3-C5H1 Dipole 3 2.0 IPEX Aristotle RFA-02-5-C7H1 Dipole 5 2.0 IPEX Aristotle RFA-02-5-F7H1 Dipole 5 2.0 IPEX Aristotle WF2400-15001A Dipole 5 2.0 IPEX Saytec WF2400-15001AR Dipole 5 2.0 RF-IPEX Saytec WF2400-10001I Dipole 2 2.0 IPEX Saytec WF2400-10001R Dipole 2 2.0 RF-IPEX Saytec AN2400-5901RS, used with connector Omni 9 2.0 IPEX Saytec SMASFR8-3152H-00X00I AN2400-5901RS, used with connector Omni 9 2.0 RF-IPEX Saytec SMASFR8-3152H-00X00IR  2010-2013 Microchip Technology Inc. DS70632C-page 19

MRF24WB0MA/MRF24WB0MB NOTES: DS70632C-page 20  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB 3.0 REGULATORY APPROVAL This exterior label can use wording as follows: This section outlines the regulatory information for the Contains Transmitter Module FCC ID: MRF24WB0MA/MRF24WB0MB module for the following W7OZG2100-ZG2101 countries: or • United States Contains FCC ID: W7OZG2100-ZG2101 • Canada This device complies with Part 15 of the FCC • Europe Rules. Operation is subject to the following two • Australia conditions: • New Zealand (1) this device may not cause harmful interference, • Korea and (2) this device must accept any interference received, including interference that may cause • Other undesired operation. 3.1 United States A user’s manual for the product should include the following statement: The MRF24WB0MA/MRF24WB0MB module has received Federal Communications Commission (FCC) This equipment has been tested and found to CFR47 Telecommunications, Part 15 Subpart C “Inten- comply with the limits for a Class B digital device, tional Radiators” modular approval in accordance with pursuant to part 15 of the FCC Rules. These limits Part 15.212 Modular Transmitter approval. Modular are designed to provide reasonable protection approval allows the end user to integrate the against harmful interference in a residential MRF24WB0MA/MRF24WB0MB module into a finished installation. This equipment generates, uses and product without obtaining subsequent and separate can radiate radio frequency energy, and if not FCC approvals for intentional radiation, provided no installed and used in accordance with the changes or modifications are made to the module cir- instructions, may cause harmful interference to cuitry. Changes or modifications could void the user's radio communications. However, there is no authority to operate the equipment. The end user must guarantee that interference will not occur in a comply with all of the instructions provided by the particular installation. If this equipment does cause Grantee, which indicate installation and/or operating harmful interference to radio or television conditions necessary for compliance. reception, which can be determined by turning the The finished product is required to comply with all appli- equipment off and on, the user is encouraged to try cable FCC equipment authorizations regulations, to correct the interference by one or more of the requirements and equipment functions not associated following measures: with the transmitter module portion. For example, com- • Reorient or relocate the receiving antenna. pliance must be demonstrated to regulations for other • Increase the separation between the equipment transmitter components within the host product; to and receiver. requirements for unintentional radiators (Part 15 Subpart • Connect the equipment into an outlet on a circuit B “Unintentional Radiators”), such as digital devices, different from that to which the receiver is computer peripherals, radio receivers, etc; and to addi- connected. tional authorization requirements for the non-transmitter • Consult the dealer or an experienced radio/TV functions on the transmitter module (i.e., Verification, or technician for help. Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. Additional information on labeling and user information requirements for Part 15 devices can be found in KDB 3.1.1 LABELING AND USER Publication 784748 available at the FCC Office of Engi- INFORMATION REQUIREMENTS neering and Technology (OET) Laboratory Division The MRF24WB0MA/MRF24WB0MB module is labeled Knowledge Database (KDB), with its own FCC ID number. If the FCC ID is not visible http://apps.fcc.gov/oetcf/kdb/index.cfm. when the module is installed inside another device, then the outside of the finished product into which the module is installed must display a label referring to the enclosed module.  2010-2013 Microchip Technology Inc. DS70632C-page 21

MRF24WB0MA/MRF24WB0MB 3.1.2 RF EXPOSURE 3.2 Canada All transmitters regulated by FCC must comply with RF The MRF24WB0MA/MRF24WB0MB module is certi- exposure requirements. OET Bulletin 65, Evaluating fied for use in Canada under Industry Canada (IC) Compliance with FCC Guidelines for Human Exposure Radio Standards Specification (RSS) RSS-210 and to Radio Frequency Electromagnetic Fields, provides RSSGen. Modular approval permits the installation of a assistance in determining whether proposed or existing module in a host device without the need to recertify transmitting facilities, operations or devices comply the device. with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications 3.2.1 LABELING AND USER Commission (FCC). The bulletin offers guidelines and INFORMATION REQUIREMENTS suggestions for evaluating compliance. Labeling requirements for the Host Device (from Sec- If appropriate, compliance with exposure guidelines for tion 3.2.1, RSS-Gen, Issue 3, December 2010): The mobile and unlicensed devices can be accomplished host device must be labeled to identify the module by the use of warning labels and by providing users within the host device. with information concerning minimum separation The Industry Canada certification label of a module distances from transmitting structures and proper must be clearly visible at all times when installed in the installation of antennas. host device, otherwise the host device must be labeled The following statement must be included as a caution to display the Industry Canada certification number of statement in manuals and OEM products to alert users the module, preceded by the words “Contains transmit- of FCC RF exposure compliance: ter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: To satisfy FCC RF Exposure requirements for Contains transmitter module IC: mobile and base station transmission devices, a 8248A-G21ZEROG separation distance of 20 cm or more should be maintained between the antenna of this device and User Manual Notice for License-Exempt Radio Appara- persons during operation. To ensure compliance, tus (from Section 7.1.3, RSS-Gen, Issue 3, December operation at closer than this distance is not 2010): User manuals for license-exempt radio apparatus recommended. must contain the following or equivalent notice in a con- The antenna(s) used for this transmitter must not spicuous location in the user manual or alternatively on be co-located or operating in conjunction with any the device or both: other antenna or transmitter. This device complies with Industry Canada license-exempt RSS standard(s). Operation is If the MRF24WB0MA/MRF24WB0MB module is used subject to the following two conditions: (1) this in a portable application (i.e., the antenna is less than device may not cause interference, and (2) this 20 cm from persons during operation), the integrator is device must accept any interference, including responsible for performing Specific Absorption Rate interference that may cause undesired operation of (SAR) testing in accordance with FCC rules 2.1091. the device. 3.1.3 APPROVED EXTERNAL ANTENNA Le présent appareil est conforme aux CNR TYPES d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée To maintain modular approval in the United States, only aux deux conditions suivantes: (1) l'appareil ne doit tested antenna types must be used. It is permissible to pas produire de brouillage, et (2) l'utilisateur de use different manufacturer antenna provided the same l'appareil doit accepter tout brouillage radioélec- antenna type and antenna gain (equal to or less than) trique subi, même si le brouillage est susceptible is used. d'en compromettre le fonctionnement. MRF24WB0MB module testing was performed with the antenna types listed in Table2-2 in Section2.8, Exter- nal Antenna. 3.1.4 HELPFUL WEB SITES Federal Communications Commission (FCC): http://www.fcc.gov. FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm. DS70632C-page 22  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB Transmitter Antenna (from Section 7.1.2, RSS-Gen, 3.2.2 APPROVED EXTERNAL ANTENNA Issue 3, December 2010): User manuals for transmit- TYPES ters must display the following notice in a conspicuous Transmitter Antenna (from Section 7.1.2 RSS-Gen, location: Issue 3, December 2010): Under Industry Canada regulations, this radio The MRF24WB0MA/MRF24WB0MB module can only transmitter may only operate using an antenna of a be sold or operated with antennas with which it was type and maximum (or lesser) gain approved for approved. Transmitter may be approved with multiple the transmitter by Industry Canada. To reduce antenna types. An antenna type comprises antennas potential radio interference to other users, the having similar in-band and out-of-band radiation pat- antenna type and its gain should be so chosen that terns. Testing shall be performed using the highest gain the equivalent isotropically radiated power (e.i.r.p.) antenna of each combination of transmitter and is not more than that necessary for successful antenna type for which approval is being sought, with communication. the transmitter output power set at the maximum level. Conformément à la réglementation d'Industrie Any antenna of the same type having equal or lesser Canada, le présent émetteur radio peut fonction- gain as an antenna that had been successfully tested ner avec une antenne d'un type et d'un gain maxi- with the transmitter, will also be considered approved mal (ou inférieur) approuvé pour l'émetteur par with the transmitter, and may be used and marketed Industrie Canada. Dans le but de réduire les ris- with the transmitter. ques de brouillage radioélectrique à l'intention des When a measurement at the antenna connector is autres utilisateurs, il faut choisir le type d'antenne used to determine RF output power, the effective gain et son gain de sorte que la puissance isotrope ray- of the device’s antenna shall be stated, based on onnée équivalente (p.i.r.e.) ne dépasse pas l'inten- measurement or on data from the antenna sité nécessaire à l'établissement d'une manufacturer. For transmitters of output power greater communication satisfaisante. than 10 milliwatts, the total antenna gain shall be added to the measured RF output power to demonstrate The above notice may be affixed to the device instead compliance to the specified radiated power limits. of displayed in the user manual. Approved external antenna types for the User manuals for transmitters equipped with MRF24WB0MB module are listed in Table2-2 in detachable antennas shall also contain the following Section2.8, External Antenna. notice in a conspicuous location: 3.2.3 HELPFUL WEB SITES This radio transmitter (identify the device by certifi- cation number, or model number if Category II) has Industry Canada: http://www.ic.gc.ca/. been approved by Industry Canada to operate with the antenna types listed below with the maximum 3.3 Europe permissible gain and required antenna impedance for each antenna type indicated. Antenna types not The MRF24WB0MA/MRF24WB0MB module is an included in this list, having a gain greater than the R&TTE Directive assessed radio module that is CE maximum gain indicated for that type, are strictly marked, and manufactured and tested with the inten- prohibited for use with this device. tion of being integrated into a final product. Conformément à la réglementation d'Industrie The MRF24WB0MA/MRF24WB0MB module tested to Canada, le présent émetteur radio peut fonction- R&TTE Directive 1999/5/EC Essential Requirements for ner avec une antenne d'un type et d'un gain maxi- Health and Safety (Article (3.1(a)), Electromagnetic Com- mal (ou inférieur) approuvé pour l'émetteur par patibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) Industrie Canada. Dans le but de réduire les ris- and are summarized in Table3-1. A Notified Body Opin- ques de brouillage radioélectrique à l'intention des ion has also been issued. All test reports are available on autres utilisateurs, il faut choisir le type d'antenne the MRF24WB0MA/MRF24WB0MB product web page at et son gain de sorte que la puissance isotrope ray- http://www.microchip.com. onnée équivalente (p.i.r.e.) ne dépasse pas l'inten- The R&TTE Compliance Association provides guid- sité nécessaire à l'établissement d'une ance on modular devices in the document “Technical communication satisfaisante. Guidance Note 01”, which is available at http:// www.rtteca.com/html/download_area.htm. After the preceding notice, the manufacturer must pro- vide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each.  2010-2013 Microchip Technology Inc. DS70632C-page 23

MRF24WB0MA/MRF24WB0MB does not require further involvement of an R&TTE Note: To maintain conformance to the testing listed Directive Notified Body for the final product. See in Table3-1: European Compliance Testing, the Section2.3.4, Standby State. module shall be installed in accordance with the The European Compliance Testing listed in Table3-1 installation instructions in this data sheet and shall was performed using the antenna types listed in not be modified. Section2.8, External Antenna. When integrating a radio module into a completed product the integrator becomes the manufacturer 3.3.3 HELPFUL WEB SITES of the final product and is therefore responsible for A document that can be used as a starting point in demonstrating compliance of the final product with understanding the use of Short Range Devices (SRD) in the essential requirements of the R&TTE Directive. Europe is the European Radio Communications Com- mittee (ERC) Recommendation 70-03 E, which can be 3.3.1 LABELING AND USER downloaded from the European Radio Communications INFORMATION REQUIREMENTS Office (ERO) at: http://www.ero.dk/. The label on the final product which contains the Additional helpful web sites are: MRF24WB0MA/MRF24WB0MB module must follow CE • Radio and Telecommunications Terminal Equipment marking requirements. The R&TTE Compliance Associ- (R&TTE): ation document “Technical Guidance Note 01” provides guidance on final product CE marking. http://ec.europa.eu/enterprise/rtte/index_en.htm. • European Conference of Postal and Telecommu- 3.3.2 EXTERNAL ANTENNA nications Administrations (CEPT): REQUIREMENTS http://www.cept.org From the R&TTE Compliance Association document • European Telecommunications Standards Institute Technical Guidance Note 01: (ETSI): Provided the integrator installing an assessed radio http://www.etsi.org module with an integral or specific antenna and installed in conformance with the radio module manu- • European Radio Communications Office (ERO): facturer's installation instructions requires no further http://www.ero.dk evaluation under Article 3.2 of the R&TTE Directive and TABLE 3-1: EUROPEAN COMPLIANCE TESTING Certification Standards Article Laboratory Report Number Date Safety IEC 60950-1:2001 (3.1(a)) TUV Rheinland 30883573.001 2009-03-11 EMC EN 301 489-1 V1.8.1 (2008-04) (3.1(b)) 30853571.004 2009-03-16 EN 301 489-17 V1.2.1 (2002-04) Radio EN 300 328 V1.7.1 (2006-10) (3.2) 30853571.003 2009-04-28 3.4 Australia Conformity (DoC) and so on. Integrator must know what is required in the compliance folder for ACMA The Australia radio regulations do not provide a modu- compliance. All test reports are available on the lar approval policy similar to the United States (FCC) MRF24WB0MA/MRF24WB0MB product web page at and Canada (IC). However, MRF24WB0MA/ http://www.microchip.com. For more information on MRF24WB0MB module RF transmitter test reports can Australia compliance, refer to the Australian be used in part to demonstrate compliance in accor- Communications and Media Authority web site http:// dance with ACMA Radio communications “Short www.acma.gov.au/. Range Devices” Standard 2004 (The Short Range Devices standard calls up the AS/NZS 4268:2008 3.4.1 EXTERNAL ANTENNA industry standard). The MRF24WB0MA/ REQUIREMENTS MRF24WB0MB module test reports can be used as The compliance testing listed in Table3-1 was per- part of the product certification and compliance folder. formed using the antenna types listed in Table2-2 in For more information on the RF transmitter test reports, Section2.8, External Antenna. contact Microchip Technology Australia sales office. To meet overall Australian final product compliance, the 3.4.2 HELPFUL WEB SITES developer must construct a compliance folder The Australian Communications and Media Authority: containing all relevant compliance test reports, for http://www.acma.gov.au/. example RF, EMC, electrical safety and Declaration of DS70632C-page 24  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB 3.5 New Zealand 3.6.1 LABELING AND USER INFORMATION REQUIREMENTS The New Zealand radio regulations do not provide a modular approval policy similar to the United States The label on the final product which contains the (FCC) and Canada (IC). However, MRF24WB0MA/ MRF24WB0MA/MRF24WB0MB module must follow MRF24WB0MB module RF transmitter test reports can KC marking requirements. The integrator of the module be used in part to demonstrate compliance against the should refer to the labeling requirements for Korea New Zealand “General User Radio License for Short available on the Korea Communications Commission Range Devices”. New Zealand Radio communications (KCC) web site. (Radio Standards) Notice 2010 calls up the AS/NZS The MRF24WB0MA/MRF24WB0MB module is labeled 4268:2008 industry standard. The MRF24WB0MA/ with its own KC mark. The final product requires the KC MRF24WB0MB module test reports can be used as mark and certificate number of the module: part of the product certification and compliance folder. All test reports are available on the MRF24WB0MA/ MRF24WB0MB product web page at http://www.micro- chip.com. For more information on the RF transmitter test reports, contact Microchip Technology sales office. 3.6.2 EXTERNAL ANTENNA Information on the New Zealand short range devices REQUIREMENTS license can be found in the following web sites: The Korea compliance testing was performed using the http://www.rsm.govt.nz/cms/licensees/types-oflicence/ antenna types listed in Table2-2 in Section2.8, External general-user-licences/short-range-devices. Antenna. and 3.6.3 HELPFUL WEB SITES http://www.rsm.govt.nz/cms/policy-and-planning/spec- Korea Communications Commission (KCC): trum-policy-overview/legislation/gazette-notices/prod- http://www.kcc.go.kr. uct-compliance/radiocommunications-radiostandards- notice-2010. National Radio Research Agency (RRA): http://rra.go.kr. To meet overall New Zealand final product compliance, the developer must construct a compliance folder with 3.7 Other Regulatory Jurisdictions all relevant compliance test reports, for example RF, EMC, electrical safety and DoC (Declaration of Confor- Other regulatory jurisdiction certification must be mity) etc. The developer must know what is required in required by the customer, or the customer need to the compliance folder for New Zealand Radio commu- recertify the module for other reasons, a certification nications. For more information on New Zealand com- utility is available. The utility runs on a Window’s PC pliance, refer to the web site http://www.rsm.govt.nz/. and utilizes a USB to SPI converter to interface to the MRF24WB0M module. To use the utility, the 3.5.1 EXTERNAL ANTENNA MRF24WB0M module must be out of Reset and not REQUIREMENTS accessed by the system host. That is, the SPI signals The compliance testing listed in Table3-1 was per- to the MRF24WB0M must be tri-state, with Reset and formed using the antenna types listed in Table2-2 in Hibernate deasserted. The following signals will need Section2.8, External Antenna. to be brought from the MRF24WB0M for connection to the PC (through the USB adapter): 3.5.2 HELPFUL WEB SITES • SDO Radio Spectrum Ministry of Economic Development: • SDI http://www.rsm.govt.nz/. • CS • SCK 3.6 Korea • INT The MRF24WB0MA/MRF24WB0MB module has • GND received certification of conformity in accordance with For further regulatory Certification Utility and the Radio Waves Act. Integration of this module into a documentation, contact local Microchip sales office. final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed.  2010-2013 Microchip Technology Inc. DS70632C-page 25

MRF24WB0MA/MRF24WB0MB 3.8 Wi-Fi® Alliance Per the Wi-Fi Alliance approved ASD test plan, the definition of the Microchip MRF24WB0MA and Wi-Fi Alliance Certification focuses on interoperability MRF24WB0MB modular solutions is expressed in the testing of devices based on 802.11 standards. following statements: Historically, when the certification process and “Member Wireless solution is a single-chip programs were developed by Wi-Fi Alliance members, 802.11b module including MAC, baseband, RF the vast majority of the 802.11 clients were PC-centric, and power amplifier personal STA. It utilizes a and certification testing adequately addressed those simple to use API for embedded markets, and an types of devices. In subsequent years, the number of OS is not a requirement for operation. It supports Wi-Fi devices that are not PC-centric has grown 1 and 2 Mbps (TX and RX). It also supports WEP, significantly. WPA Personal, and WPA2 Personal security. These non-standard devices, as a class of products, Ciphers supported are AES and TKIP. The have been dubbed Application Specific Devices Member Wireless solution interfaces with the (ASDs) by the Wi-Fi Alliance. ASDs are 802.11 HOST through SPI Bus. Some applications for devices, for example clients or access points (APs), the Member Wireless solution are as following: which cannot be tested under a standard Alliance test • Sensors/Controls such as Industrial and Factory plan because they do not comply with the standard test sensors, HVAC, and Lighting configuration, and because they are designed to • Consumer Electronic such as remote controls, perform a specific application. For example, bar code toys, and internet radio scanners, pagers, recording devices, monitoring equipment, and cable modems. This certification ensures that the MRF24WB0MA and MRF24WB0MB modules have passed The APs or clients that are used to validate ASD rigorous testing for interoperability across existing compliance (from the standard test bed) will meet all of consumer and business Wi-Fi equipments, and the requirements specified in the applicable System their certifications are completed (WFA ID: Interoperability Test Plans (referred to as the “standard WFA7150). The certification effort undertaken will test plan”), unless specifically exempted. The save customers time and money. For modular MRF24WB0MA and MRF24WB0MB modules are in policy, refer to WFA Module Policy (Version 2.2; the ASD category. MARCH 2006). The modules are certified under Wi-Fi 802.11 with WPA2, WPA, and WEP System Interoperability ASD Model Test Plan with Test Engine For IEEE 802.11a, b, and g Devices (Version 1.0). DS70632C-page 26  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB 4.0 ELECTRICAL CHARACTERISTICS TABLE 4-1: DIGITAL ELECTRICAL CHARACTERISTICS (NOMINAL CONDITIONS: 25C, VDD=3.3V) Parameters Min Typ Max Units VIL (Input low voltage) -0.3 — 0.8 V VIH (Input high voltage) 2 — 5.5 V VOL (Output low voltage) — — 0.4 V VOH (Output high voltage) 2.4 — — V IOL (Output low level current at VOL Max) — 8.5 — mA IOH (Output high level current at VOH Min) — 15.4 — mA TABLE 4-2: ABSOLUTE MAXIMUM RATINGS(1) Parameters Min Max Notes Storage Temperature -40C +125C — VDD 0V 4.2V for 0.5 mS VDD above this level and duration will disable Radio VIN on SDI, CS, SCK -0.3V 5.5V — Note 1: Listed Absolute Maximum Ratings are not meant for functional operation. Operation at these levels is not guaranteed, and may reduce the operating life of the component. TABLE 4-3: RECOMMENDED OPERATING CONDITIONS Parameters Min Typ Max Units Ambient Temperature -40 — +85 Degrees Celsius VDD – for FCC and IC 2.70 3.3 3.63(1) Volts Note 1: While 3.63V is the maximum operating voltage, the module will detect an overvoltage condition at 4.2V and disable the RF Transmit function after 0.5 ms. This is an RF certification requirement pertaining to disabling transmission in unforeseen over-voltage conditions.  2010-2013 Microchip Technology Inc. DS70632C-page 27

MRF24WB0MA/MRF24WB0MB TABLE 4-4: CURRENT CONSUMPTION(3) (NOMINAL CONDITIONS: 25C, VDD = 3.3V) Parameters Min Typ Max Units IDD, Hibernate = 3.3V — 0.1 — µA IDD, Sleep (software enabled) — 250(1) — µA IDD, Standby (transitional state) — 10 — mA IDD core(2), RX on, Receive @-83 dBm with 2 Mbps — 85 — mA modulated signal at antenna port IDD core, TX on, +0 dBm — 115 — mA IDD core, TX on, +10 dBm — 154 — mA Note 1: Sleep current is current consumed during periods of “standby” between DTIM beacons. The module will awake 2 mS before a DTIM and turn on its receiver, and possibly its transmitter (if data is available for it). 2: IDD core is current consumed by the part not including the I/O consumption of the SPI port. 3: Current Consumption values represent Typical Peak currents, and the measured current conditions were done with 85% duty cycle modulated signal. Wi-Fi® applications typically operate at less than 85% TX duty cycle. TX current is dependent on such criteria as transmit power setting, and transmit data rate and bandwidth being used. RX current is affected by connection distance. TABLE 4-5: RECEIVER AC CHARACTERISTICS(1) Parameters Min Typ Max Units Flo 2412 — 2484 MHz RX Min Input Level Sensitivity, 1 Mbps, 8% PER — -91 — dBm RX Min Input Level Sensitivity, 2 Mbps, 8% PER — -88 — dBm RX Max Input Level (Power), 1 Mbps, 8% PER — -4 — dBm RX Max Input Level (Power), 2 Mbps, 8% PER — -4 — dBm Note 1: Nominal conditions: 25C, VDD = 3.3V, Flo = 2437 MHz, measurements at antenna port. TABLE 4-6: TRANSMITTER AC CHARACTERISTICS(1) Parameters Min Typ Max Units Flo 2412 — 2484 MHz Average Pout (transmit spectrum mask compliant) — +10 — dBm Average Pout gain step resolution from +5 to +10 dBm — 0.5 — dB Average Pout gain step resolution from -5 to +5 dbm — 1.0 — dB Average Pout settled variation -0.5 — 0.5 dB Note 1: Nominal conditions: 25C, VDD = 3.3V, Flo = 2437 MHz, 2 Mbps. modulated signal measured at antenna port. DS70632C-page 28  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB FIGURE 4-1: SPI INPUT TIMING TCSD TSCK CS TCSS TCSH SCK TSU THD SI MSb In LSb In SO High-Impedance CS must be toggled for each SPI block transfer. FIGURE 4-2: SPI OUTPUT TIMING CS TSCK SCK TV TV TDIS SO MSb Out LSb Out Don’t Care SI LSb In TABLE 4-7: SPI INTERFACE AC CHARACTERISTICS Symbol Parameters Min Max Units TSCK SCK Period 40 — nS TCSD CS High time 50 — nS TCSS CS Setup time 50 — nS TCSH CS Hold time 50 — nS TSU SDI Setup time 10 — nS THD SDI Hold time 10 — nS TV SDO Valid time — 15 nS  2010-2013 Microchip Technology Inc. DS70632C-page 29

MRF24WB0MA/MRF24WB0MB NOTES: DS70632C-page 30  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB APPENDIX A: REVISION HISTORY Revision A (April 2010) This is the initial released version of the document. Revision B (June 2011) This revision includes the following updates: • Updated section Operational Changed temperature range to -20° C to +85° C • Updated Table1-1: Added type and pin description to pin 23. • Updated Table4-3 • Replaced Figure2-2 • Updated Section2.0, Circuit Description • Added Section3.7, Other Regulatory Jurisdictions • Updated the temperature on the order code in section Product Identification System • Minor changes to the text and formatting were incorporated throughout the document Revision C (May 2013) • Updated the standard temperature specification to industrial • Correction on bias for JTAG_TCK • Minor changes to the text and formatting were incorporated throughout the document  2010-2013 Microchip Technology Inc. DS70632C-page 31

MRF24WB0MA/MRF24WB0MB NOTES: DS70632C-page 32  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at Users of Microchip products can receive assistance www.microchip.com. This web site is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the web site contains the following information: • Field Application Engineer (FAE) • Technical Support • Product Support – Data sheets and errata, application notes and sample programs, design • Development Systems Information Line resources, user’s guides and hardware support Customers should contact their distributor, documents, latest software releases and archived representative or field application engineer (FAE) for software support. Local sales offices are also available to help • General Technical Support – Frequently Asked customers. A listing of sales offices and locations is Questions (FAQs), technical support requests, included in the back of this document. online discussion groups, Microchip consultant Technical support is available through the web site program member listing at: http://microchip.com/support • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.  2010-2013 Microchip Technology Inc. DS70632C-page 33

MRF24WB0MA/MRF24WB0MB READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480)792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager Total Pages Sent ________ RE: Reader Response From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: MRF24WB0MA/MRF24WB0MB Literature Number: DS70632C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70632C-page 34  2010-2013 Microchip Technology Inc.

MRF24WB0MA/MRF24WB0MB PRODUCT IDENTIFICATION SYSTEM To order parts, including industrial, or obtain information, for e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. M X T -X Examples: Device Module Module Tape and Temperature a) MRF24WB0MA/RM = Industrial temp. tray Type Reel Range b) MRF24WB0MB/RM = Industrial temp. tray Device MR24WB0MA/MRF24WB0MB; VDD range 2.7V to 3.6V Temperature Range -40C to +85C (Industrial Temp)  2010-2013 Microchip Technology Inc. DS70632C-page 35

MRF24WB0MA/MRF24WB0MB NOTES: DS70632C-page 36  2010-2013 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, ensure that your application meets with your specifications. PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology WARRANTIES OF ANY KIND WHETHER EXPRESS OR Incorporated in the U.S.A. and other countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries. the buyer’s risk, and the buyer agrees to defend, indemnify and Analog-for-the-Digital Age, Application Maestro, BodyCom, hold harmless Microchip from any and all damages, claims, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, suits, or expenses resulting from such use. No licenses are dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, conveyed, implicitly or otherwise, under any Microchip ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial intellectual property rights. Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2010-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-226-3 QUALITY MANAGEMENT  SYSTEM  Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and CERTIFIED BY DNV  Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures == ISO/TS 16949 == are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping     devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2010-2013 Microchip Technology Inc. DS70632C-page 37

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