Pressure Freescale Semiconductor MPXV7025 Rev 6, 10/2012 Data Sheet: Technical Data Integrated Silicon Pressure Sensor MPXV7025 On-Chip Signal Conditioned, Series Temperature Compensated and Calibrated -25 to 25 kPa (-3.6 to 3.6 psi) 0.2 to 4.7 V Output The MPXV7025 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D Application Examples inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to • Respiratory Systems provide an accurate, high level analog output signal that is proportional to the • Process Control applied pressure. • Patient Monitoring Features • Remote Monitoring Devices • 5.0% Maximum Error Over 0 to 85C • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Temperature Compensated Over –40 to +125C • Thermoplastic (PPS) Surface Mount Package • Patented Silicon Shear Stress Strain Gauge • Available in Differential and Gauge Configurations ORDERING INFORMATION Package Case # of Ports Pressure Type Device Device Name Options No. None Single Dual Gauge Differential Absolute Marking Small Outline Package (MPXV7025 Series) MPXV7025GC6U Rails 482A • • MPXV7025G MPXV7025GC6T1 Tape & Reel 482A • • MPXV7025G MPXV7025GP Trays 1369 • • MPXV7025GP MPXV7025DP Trays 1351 • • MPXV7025DP Small Outline Package (Media Resistant Gel) (MPVZ7025 Series) MPVZ7025GC6U Rails 482A • • MPVZ7025G MPVZ7025GP Trays 1369 • • MPVZ7025GP MPVZ7025G6U Rails 482 • • MPVZ7025G MPVZ7025DP Trays 1351 • • MPVZ7025DP SMALL OUTLINE PACKAGE MPXV7025GC6U/T1 MPVZ7025G6U MPXV7025GP MPXV7025DP MPVZ7025GC6U CASE 482-01 MPVZ7025GP MPVZ7025DP CASE 482A-01 CASE 1369-01 CASE 1351-01 © 2007-2009, 2012 Freescale Semiconductor, Inc. All rights reserved.

Pressure Operating Characteristics Table1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP -25 — 25 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current I — 7.0 10 mAdc o Minimum Pressure Offset(3) (0 to 85C) Voff 0.116 0.25 0.384 Vdc @ V = 5.0 Volts S Full Scale Output(4) (0 to 85C) VFSO 4.610 4.75 4.890 Vdc @ V = 5.0 Volts S Full Scale Span(5) (0 to 85C) VFSS — 4.5 — Vdc @ V = 5.0 Volts S Accuracy (0 to 85C) — — — 5.0 %V FSS Sensitivity V/P — 90 —- mV/kPa Response Time(6) tR — 1.0 —- ms Output Source Current at Full Scale Output I — 0.1 —- mAdc o+ Warm-Up Time(7) — — 20 —- ms Offset Stability(8) — — 0.5 —- %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 4. Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure. FSO 5. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXV7025 Sensors 2 Freescale Semiconductor, Inc.

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 200 kPa max Storage Temperature T –40 to +125 C stg Operating Temperature T –40 to +125 C A 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. 2 V S Thin Film Gain Stage #2 Temperature and Sensing Compensation Ground Vout 4 Element and Reference Gain Stage #1 Shift Circuitry Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device GND 3 Figure1. Integrated Pressure Sensor Schematic MPXV7025 Sensors Freescale Semiconductor, Inc. 3

Pressure On-chip Temperature Compensation and Calibration The MPXV7025 series pressure sensor operating curves are shown for operation over a temperature range of characteristics, and internal reliability and qualification tests 0 to 85C using the decoupling circuit shown in Figure3. The are based on use of dry air as the pressure media. Media, output will saturate outside of the specified pressure range. other than dry air, may have adverse effects on sensor Figure3 shows the recommended decoupling circuit for performance and long-term reliability. Contact the factory for interfacing the output of the integrated sensor to the A/D input information regarding media compatibility in your application. of a microprocessor or microcontroller. Proper decoupling of Figure2 shows the sensor output signal relative to the power supply is recommended. pressure input. Typical, minimum, and maximum output 5.0 Transfer Function: 4.5 V = V *(0.018*P+0.5) ± ERROR out S 4.0 V = 5.0 Vdc S 3.5 TEMP = 0 to 85°C TYPICAL 3.0 V) ut ( 2.5 MAX p ut 2.0 O MIN 1.5 1.0 0.5 0 -25 0 25 Differential Pressure (kPa) Figure2. Output versus Pressure Differential +5 V OUTPUT V out V s IPS 1.0 F 0.01 F GND 470 pF Figure3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) MPXV7025 Sensors 4 Freescale Semiconductor, Inc.

Pressure Transfer Function Nominal Transfer Value: V = V (P x 0.018 + 0.5) out S ± (Pressure Error x Temp. Factor x 0.018 x V ) S V = 5.0 V  0.25 Vdc S Temperature Error Band MPXV7025 SERIES 4.0 Temp Multiplier 3.0 –40 3 Temperature 0 to 85 1 Error 2.0 +125 3 Factor 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in (cid:31)C NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure Error Band Error Limits for Pressure 3.0 2.0 a) kP 1.0 or ( e Err 0.0 -25 0 25 Pressure (in kPa) ur s –1.0 s e Pr –2.0 –3.0 Pressure Error (Max) -25 to 25 (kPa) ±1.25 (kPa) MPXV7025 Sensors Freescale Semiconductor, Inc. 5

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor sensor is designed to operate with positive differential as the Pressure (P1) side and the Vacuum (P2) side. The pressure applied, P1 > P2. Pressure (P1) side is the side containing fluorosilicone gel The Pressure (P1) side may be identified by using the which protects the die from harsh media. The pressure following table: Pressure (P1) Part Number Case Type Side Identifier MPXV7025GC6U/C6T1, MPVZ7025GC6U 482A Side with Port Attached MPXV7025GP, MPVZ7025GP 1369 Side with Port Attached MPXV7025DP, MPVZ7025DP 1351 Side with Part Marking MPVZ7025G6U 482 Side with Part Marking MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder pads. 0.100 TYP 8X 0.660 2.54 16.76 0.060 TYP 8X 0.300 1.52 7.62 0.100 TYP 8X inch 2.54 mm SCALE 2:1 Figure4. Small Outline Package Footprint MPXV7025 Sensors 6 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS -A- D 8 PL 4 0.25 (0.010) M T B S A S NOTES: 5 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. N -B- 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). G 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 8 1 INCHES MILLIMETERS DIM MIN MAX MIN MAX S A 0.415 0.425 10.54 10.79 W B 0.415 0.425 10.54 10.79 C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC V H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 C M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 H V 0.245 0.255 6.22 6.48 J -T- W 0.115 0.125 2.92 3.17 PIN 1 IDENTIFIER SEATING K M PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE -A- D8 PL 4 0.25 (0.010) M T B S A S 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. -B- 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. G 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 8 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 1 INCHES MILLIMETERS S DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.212 0.230 5.38 5.84 N D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 C H J 0.009 0.011 0.23 0.28 J K 0.061 0.071 1.55 1.80 -T- M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 PIN 1 IDENTIFIER SEATING S 0.709 0.725 18.01 18.41 K M PLANE CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE MPXV7025 Sensors Freescale Semiconductor, Inc. 7

Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.006 (0.15) C A B A E GAGE e PLANE 5 4 e/2 .014 (0.35) θ L A1 D DETAIL G 8 1 NOTES: 8X b 1. CONTROLLING DIMENSION: INCH. F 0.004 (0.1) M C A B STYPLINE 11.: GND STYPLINE 12.: N/C 2. IANSTMEER PYR14E.T5 MD,I M19E9N4S.IONS AND TOLERANCES PER 2. +Vout 2. Vs 3. Vs 3. GND 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE 4. -Vout 4. Vout MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR B E1 56.. NN//CC 56.. NN//CC PPRERO TSRIDUES.IONS SHALL NOT EXCEED 0.006 (0.152) 7. N/C 7. N/C 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR 8. N/C 8. N/C PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. INCHES MILLIMETERS N ∅T DIM MIN MAX MIN MAX A 0.370 0.390 9.39 9.91 A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E 0.680 0.700 17.27 17.78 A M E1 0.465 0.485 11.81 12.32 e 0.100 BSC 2.54 BSC F 0.240 0.260 6.10 6.60 K 0.115 0.135 2.92 3.43 L 0.040 0.060 1.02 1.52 8X 0.004 (0.1) M 0.270 0.290 6.86 7.37 P K N 0.160 0.180 4.06 4.57 DETAIL G P 0.009 0.011 0.23 0.28 C SPELAATNIENG Tθ 0.101˚0 0.173˚0 2.07˚9 3.73˚0 CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE MPXV7025 Sensors 8 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B A E e GAGE PLANE 5 4 e/2 .014 (0.35) θ L A1 D DETAIL G 8 1 NOTES: 1. CONTROLLING DIMENSION: INCH. 8X b 2. INTERPRET DIMENSIONS AND TOLERANCES PER F 0.004 (0.1) M C A B ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) B E1 PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. INCHES MILLIMETERS ∅T N K DAIM 0M.3I0N0 M0.3A3X0 M7.1IN1 M7.A62X A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E 0.717 BSC 18.21 BSC A M Ee1 0.406.1500 B0S.C485 11.821.54 BS1C2.32 F 0.245 0.255 6.22 6.47 K 0.120 0.130 3.05 3.30 8X 0.004 (0.1) L 0.061 0.071 1.55 1.80 P M 0.270 0.290 6.86 7.36 DETAIL G N 0.080 0.090 2.03 2.28 P 0.009 0.011 0.23 0.28 C SEATING T 0.115 0.125 2.92 3.17 PLANE θ 0˚ 7˚ 0˚ 7˚ CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE MPXV7025 Sensors Freescale Semiconductor, Inc. 9

Pressure Table3. Revision History Revision Revision Description of changes number date 6 10/2012 • Deleted references to device number MPVZ7025GC6T1 and MPVZ7025G6T1 throughout the document MPXV7025 Sensors 10 Freescale Semiconductor, Inc.

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