Pressure Freescale Semiconductor MPXV7007 Rev 3, 10/2012 Data Sheet: Technical Data Integrated Silicon Pressure Sensor MPXV7007 On-Chip Signal Conditioned, Series Temperature Compensated and Calibrated -7 to 7 kPa (-1 to 1 psi) 0.5 to 4.5 V Output The MPXV7007 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D Application Examples inputs. This transducer combines advanced micromachining techniques, thin- film metallization, and bipolar processing to provide an accurate, high level • Hospital Beds analog output signal that is proportional to the applied pressure. • HVAC • Respiratory Systems Features • Process Control • 5.0% Maximum Error Over 0 to 85C • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Temperature Compensated Over –40 to +125C • Thermoplastic (PPS) Surface Mount Package • Patented Silicon Shear Stress Strain Gauge • Available in Differential and Gauge Configurations ORDERING INFORMATION Package Case # of Ports Pressure Type Device Device Name Options No. None Single Dual Gauge Differential Absolute Marking Small Outline Package MPXV7007DP Trays 1351 • • MPXV7007DP MPXV7007DPT1 Tape & Reel 1351 • • MPXV7007DP MPXV7007GC6U Rails 482A • • MPXV7007G MPXV7007GC6T1 Tape & Reel 482A • • MPXV7007G MPXV7007GP Trays 1369 • • MPXV7007GP SMALL OUTLINE PACKAGE MPXV7007GC6U/C6T1 MPXV7007GP MPXV7007DP/DPT1 CASE 482A-01 CASE 1369-01 CASE 1351-01 Table1. Pin Numbers(1) 1 2 3 4 5 6 7 8 N/C Vs Gnd Vout N/C N/C N/C N/C 1.Pins 1, 5, 6, 7 and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. © 2005, 2009, 2011, 2012 Freescale Semiconductor, Inc. All rights reserved.

Pressure Operating Characteristics Table2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure3 re- quired to meet specification.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP -7 — 7 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current I — 7.0 10 mAdc o Minimum Pressure Offset(3) (0 to 85C) Voff 0.33 0.5 0.67 Vdc @ V = 5.0 Volts S Full Scale Output(4) (0 to 85C) VFSO 4.3 4.5 4.7 Vdc @ V = 5.0 Volts S Full Scale Span(5) (0 to 85C) VFSS — 4.0 — Vdc @ V = 5.0 Volts S Accuracy(6) (0 to 85C) — — — 5.0 %VFSS Sensitivity V/P — 286 —- mV/kPa Response Time(7) tR — 1.0 —- ms Output Source Current at Full Scale Output I — 0.1 —- mAdc O+ Warm-Up Time(8) — — 20 —- ms Offset Stability(9) — — 0.5 —- %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 4. Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure. FSO 5. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V , at 25C. FSS 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXV7007 Sensors 2 Freescale Semiconductor, Inc.

Pressure Maximum Ratings Table3. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure P 75 kPa max Storage Temperature T –40 to +125 C stg Operating Temperature T –40 to +125 C A 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. 2 V S Thin Film Gain Stage #2 Temperature and 4 Sensing Compensation Ground Vout Element and Reference Gain Stage #1 Shift Circuitry Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device GND 3 Figure1. Integrated Pressure Sensor Schematic MPXV7007 Sensors Freescale Semiconductor, Inc. 3

Pressure ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by performance and long-term reliability. Contact the factory for integrating the shear-stress strain gauge, temperature information regarding media compatibility in your application. compensation, calibration and signal conditioning circuitry Figure3 shows the recommended decoupling circuit for onto a single monolithic chip. interfacing the integrated sensor to the A/D input of a Figure2 illustrates the Differential or Gauge configuration microprocessor or microcontroller. Proper decoupling of the in the basic chip carrier (Case 482). A fluorosilicone gel power supply is recommended. isolates the die surface and wire bonds from the environment, Figure4 shows the sensor output signal relative to while allowing the pressure signal to be transmitted to the pressure input. Typical, minimum, and maximum output sensor diaphragm. curves are shown for operation over a temperature range of The MPXV7007 series pressure sensor operating 0 to 85C using the decoupling circuit shown in Figure3. The characteristics, and internal reliability and qualification tests output will saturate outside of the specified pressure range. are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor Fluoro Silicone Stainless Gel Die Coat Die Steel Cap P1 Thermoplastic Wire Bond Case Lead Frame P2 Differential Sensing Die Bond Element Figure2. Cross-Sectional Diagram SOP (not to scale) +5 V OUTPUT V out V s IPS 1.0 F 0.01 F GND 470 pF Figure3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) MPXV7007 Sensors 4 Freescale Semiconductor, Inc.

Pressure 5.0 Transfer Function: 4.5 V = V *(0.057*P+0.5) ± ERROR out S 4.0 V = 5.0 Vdc S 3.5 TEMP = 0º to 85ºC 3.0 ut (V) 2.5 MAX TYPICAL p ut 2.0 O MIN 1.5 1.0 0.5 0 -7 0 7 Differential Pressure (kPa) Figure4. Output versus Pressure Differential Transfer Function Nominal Transfer Value: V = V x (0.057 x P + 0.5) out S ± (Pressure Error x Temp. Factor x 0.057 x V ) S V = 5.0 V  0.25 Vdc S Temperature Error Band MPXV7007 SERIES 4.0 Temp Multiplier 3.0 –40º 3 Temperature 0º to 85º 1 Error 2.0 +125º 3 Factor 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in ºC NOTE: The Temperature Multiplier is a linear response from 0º to –40ºC and from 85º to 125ºC. MPXV7007 Sensors Freescale Semiconductor, Inc. 5

Pressure Pressure Error Band 0.5 0.4 0.3 0.2 Pressure 0.1 Pressure (kPa) Error 0 (kPa) -7 0 +7 –0.1 –0.2 –0.3 –0.4 –0.5 Pressure Error (Max) - 7 to 7 (kPa) ±0.5 (kPa) PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor sensor is designed to operate with both positive and negative as the Pressure (P1) side and the Vacuum (P2) side. The differential pressure applied, P1 > P2 or P1 < P2. Pressure (P1) side is the side containing fluoro silicone gel The Pressure (P1) side may be identified by using the which protects the die from harsh media. The pressure following table: Pressure (P1) Part Number Case Type Side Identifier MPXV7007GC6U/C6T1 482A Side with Port Attached MPXV7007GP 1369 Side with Port Attached MPXV7007DP/DPT1 1351 Side with Part Marking MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder pads. 0.100 TYP 8X 0.660 2.54 16.76 0.060 TYP 8X 0.300 1.52 7.62 0.100 TYP 8X inch 2.54 mm SCALE 2:1 Figure5. Small Outline Package Footprint MPXV7007 Sensors 6 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS -A- D 8 PL 4 0.25 (0.010) M T B S A S NOTES: 5 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. N -B- 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). G 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 8 1 INCHES MILLIMETERS DIM MIN MAX MIN MAX S A 0.415 0.425 10.54 10.79 W B 0.415 0.425 10.54 10.79 C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC V H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 C M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 H V 0.245 0.255 6.22 6.48 J -T- W 0.115 0.125 2.92 3.17 PIN 1 IDENTIFIER SEATING K M PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV7007 Sensors Freescale Semiconductor, Inc. 7

Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.006 (0.15) C A B A E GAGE e PLANE 5 4 e/2 .014 (0.35) θ L A1 D DETAIL G 8 1 NOTES: 8X b 1. CONTROLLING DIMENSION: INCH. F 0.004 (0.1) M C A B STYPLINE 11.: GND STYPLINE 12.: N/C 2. IANSTMEER PYR14E.T5 MD,I M19E9N4S.IONS AND TOLERANCES PER 2. +Vout 2. Vs 3. Vs 3. GND 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE 4. -Vout 4. Vout MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR B E1 56.. NN//CC 56.. NN//CC PPRERO TSRIDUES.IONS SHALL NOT EXCEED 0.006 (0.152) 7. N/C 7. N/C 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR 8. N/C 8. N/C PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. INCHES MILLIMETERS N ∅T DIM MIN MAX MIN MAX A 0.370 0.390 9.39 9.91 A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E 0.680 0.700 17.27 17.78 A M E1 0.465 0.485 11.81 12.32 e 0.100 BSC 2.54 BSC F 0.240 0.260 6.10 6.60 K 0.115 0.135 2.92 3.43 L 0.040 0.060 1.02 1.52 8X 0.004 (0.1) M 0.270 0.290 6.86 7.37 P K N 0.160 0.180 4.06 4.57 DETAIL G P 0.009 0.011 0.23 0.28 C SPELAATNIENG Tθ 0.101˚0 0.173˚0 2.07˚9 3.73˚0 CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE MPXV7007 Sensors 8 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B A E e GAGE PLANE 5 4 e/2 .014 (0.35) θ L A1 D DETAIL G 8 1 NOTES: 1. CONTROLLING DIMENSION: INCH. 8X b 2. INTERPRET DIMENSIONS AND TOLERANCES PER F 0.004 (0.1) M C A B ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) B E1 PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. INCHES MILLIMETERS ∅T N K DAIM 0M.3I0N0 M0.3A3X0 M7.1IN1 M7.A62X A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E 0.717 BSC 18.21 BSC A M Ee1 0.406.1500 B0S.C485 11.821.54 BS1C2.32 F 0.245 0.255 6.22 6.47 K 0.120 0.130 3.05 3.30 8X 0.004 (0.1) L 0.061 0.071 1.55 1.80 P M 0.270 0.290 6.86 7.36 DETAIL G N 0.080 0.090 2.03 2.28 P 0.009 0.011 0.23 0.28 C SEATING T 0.115 0.125 2.92 3.17 PLANE θ 0˚ 7˚ 0˚ 7˚ CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE MPXV7007 Sensors Freescale Semiconductor, Inc. 9

Pressure Table4. Revision History Revision Revision Description of changes number date 3 10/2012 • Deleted references to device numbers MPXV7007G6T1/U, MPXV7007G6U/T1 and MPXV7007GPT1 throughout the document, deleted Case 482-01 Issue O Small Outline Package diagram on page 7 MPXV7007 Sensors 10 Freescale Semiconductor, Inc.

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: MPXV7007GP MPXV7007DP MPXV7007GC6T1 MPXV7007GC6U MP3V7007DP MPXV7007DPT1 MP3V7007GC6U MP3V7007GP