NXP Semiconductors Document Number: MPXV7002 Data Sheet: Technical Data Rev 4, 03/2017 MPXV7002 Integrated Silicon MPXV7002 Pressure Sensor On-Chip Signal -2 to +2 kPa (-0.3 to +0.3 psi) Conditioned, Temperature 0.5 to 4.5 V Output Compensated and Calibrated The MPXV7002 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin- film metallization, and bipolar processing to provide an accurate, high level MPXV7002GC6U/C6T1 analog output signal that is proportional to the applied pressure. CASE 482A Features • 2.5% Typical Error over +10°C to +60°C with Auto Zero • 6.25% Maximum Error over +10°C to +60°C without Auto Zero • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Thermoplastic (PPS) Surface Mount Package MPXV7002GP MPXV7002DP • Temperature Compensated over +10° to +60°C CASE 1369 CASE 1351 • Patented Silicon Shear Stress Strain Gauge Small Outline Package • Available in Differential and Gauge Configurations Top view N/C 5 4 VOUT N/C 6 3 GND N/C 7 2 VS N/C 8 1 N/C Pinout (Style 2, case number 98ASA99255D) ORDERING INFORMATION Package Case # of Ports Pressure Type Device Device Name Options No. None Single Dual Gauge Differential Absolute Marking Small Outline Package (MPXV7002 Series) MPXV7002GC6U Rails 482A • • MPXV7002G MPXV7002GC6T1 Tape & Reel 482A • • MPXV7002G MPXV7002GP Trays 1369 • • MPXV7002G MPXV7002DP Trays 1351 • • MPXV7002DP MPXV7002DPT1 Tape & Reel 1351 • • MPXV7002DP © NXP B.V. 2017. All rights reserved.

Contents 1 Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 On-Chip Temperature Compensation, Calibration and Signal Conditioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Pressure (P1)/Vacuum (P2) Side Identification Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Minimum Recommended Footprint for Surface Mounted Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Related Documentation The MPXV7002 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the MPXV7002 web page at http://www.nxp.com/products/:MPXV7002. 2. Click the Documentation tab. MPXV7002 Sensors 2 NXP B.V.

1 Operating Characteristics Table1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure3 required to meet specification.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) P –2.0 — 2.0 kPa OP Supply Voltage(2) V 4.75 5.0 5.25 Vdc S Supply Current I — — 10 mAdc o Pressure Offset(3) (10 to 60°C) V 0.25 0.5 0.75 Vdc off @ V = 5.0 Volts S Full Scale Output(4) (10 to 60°C) V 4.25 4.5 4.75 Vdc FSO @ V = 5.0 Volts S Full Scale Span(5) (10 to 60°C) V 3.5 4.0 4.5 V Vdc FSS @ V = 5.0 Volts S Accuracy(6) (10 to 60°C) — — ±2.5(7) ±6.25 %V FSS Sensitivity V/P — 1.0 —- V/kPa Response Time(8) t — 1.0 —- ms R Output Source Current at Full Scale Output I — 0.1 —- mAdc O+ Warm-Up Time(9) — — 20 —- ms 1.1.0 kPa (kiloPascal) equals 0.145 psi. 2.Device is ratiometric within this specified excitation range. 3.Offset (V ) is defined as the output voltage at the minimum rated pressure. off 4.Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure. FSO 5.Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 6.Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V , at 25°C. FSS 7.Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zero pressure output reading. Auto zero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between auto zero and measurement. 8.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 9.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. MPXV7002 Sensors NXP B.V. 3

2 Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 75 kPa max Storage Temperature T –30 to +100 °C stg Operating Temperature T 10 to 60 °C A 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V 2 S Thin Film Gain Stage #2 Temperature and Sensing Compensation Ground Vout 4 Element and Reference Gain Stage #1 Shift Circuitry Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device GND 3 Figure1. Integrated Pressure Sensor Schematic MPXV7002 Sensors 4 NXP B.V.

3 On-Chip Temperature Compensation, Calibration and Signal Conditioning The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPXV7002 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10° to 60°C using the decoupling circuit shown in Figure3. The output will saturate outside of the specified pressure range. Fluoro Silicone Stainless Gel Die Coat Die Steel Cap P1 Thermoplastic Wire Bond Case Lead Frame P2 Differential Sensing Die Bond Element Figure2. Cross-Sectional Diagram SOP (not to scale) +5 V OUTPUT V out V s IPS 1.0 μF 0.01 μF GND 470 pF Figure3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) MPXV7002 Sensors NXP B.V. 5

5.0 Transfer Function: V = V × (0.2 × P(kPa)+0.5) ± 6.25% V out S FSS 4.0 VS = 5.0 Vdc T = 10 to 60°C V) A e ( g 3.0 a Volt TYPICAL ut MAX p ut 2.0 O MIN 1.0 0 -2 -1 0 1 2 Differential Pressure (kPa) Figure4. Output versus Pressure Differential 4 Pressure (P1)/Vacuum (P2) Side Identification Table NXP designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media. The Pressure (P1) side may be identified by using the following table: Pressure (P1) Part Number Case Type Side Identifier MPXV7002GC6U/GC6T1 482A-01 Side with Port Attached MPXV7002GP 1369-01 Side with Port Attached MPXV7002DP 1351-01 Side with Part Marking 5 Minimum Recommended Footprint for Surface Mounted Applications Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 0.660 2.54 16.76 0.060 TYP 8X 0.300 1.52 7.62 0.100 TYP 8X inch 2.54 mm SCALE 2:1 Figure5. Small Outline Package Footprint MPXV7002 Sensors 6 NXP B.V.

6 Package Dimensions –A– D8 PL NOTES: 1.DIMENSIONING AND TOLERANCING PER ANSI 4 0.25 (0.010)M T B S A S Y14.5M, 1982. 5 2.CONTROLLING DIMENSION: INCH. 3.DIMENSION A AND B DO NOT INCLUDE MOLD N –B– PROTRUSION. 4.MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5.ALL VERTICAL SURFACES 5 TYPICAL DRAFT. G 8 INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 S B 0.415 0.425 10.54 10.79 W C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 V K 0.061 0.071 1.55 1.80 M 0 7 0 7 C N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 H W 0.115 0.125 2.92 3.17 J –T– K M PIN 1 IDENTIFIER SPELAATNIENG CASE 482A–01 ISSUE A DATE 05/13/98 CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV7002 Sensors NXP B.V. 7

CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPXV7002 Sensors 8 NXP B.V.

CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPXV7002 Sensors NXP B.V. 9

CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV7002 Sensors 10 NXP B.V.

CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV7002 Sensors NXP B.V. 11

7 Revision History Table 1. Revision History Document ID Release Date Data sheet status Change notice Supercedes MPXV7002 Rev. 4 2017 March Technical data — MPXV7002 Rev. 3.0 • Added MPXV7002DPT1 to the Ordering Information table on page 1. • Updated Pressure offset min, typ, max values from 2.25, 2.5 and 2.75 to 0.25, 0.5 and 0.75 respectively in Table1 on page3. Modifications • The format of this data sheet has been redesigned to comply with current identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. • Updated package outlines 98ASA99303D and 98ASA99255D in Section6, “Package Dimensions” to comply with current identity guidelines of NXP Semiconductors. MPXV7002 Rev. 3.0 2015 January Technical data — MPXV7002 Rev. 2.0 MPXV7002 Rev. 2.0 2009 January Technical data — MPXV7002 Rev. 1.0 MPXV7002 Rev. 1.0 2008 September Technical data — MPXV7002 Rev. 0 MPXV7002 Rev. 0 2005 September Technical data — — MPXV7002 Sensors 12 NXP B.V.

How to Reach Us: Information in this document is provided solely to enable system and software Home Page: implementers to use NXP products. There are no expressed or implied copyright NXP.com licenses granted hereunder to design or fabricate any integrated circuits based on the Web Support: information in this document. NXP reserves the right to make changes without further http://www.nxp.com/support notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation, consequential or incidental damages. "Typical" parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each customer application by the customer's technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.nxp.com/terms-of-use.html. NXP, the NXP logo, Freescale, the Freescale logo, and the Energy Efficient Solutions logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. © NXP B.V. 2017. All rights reserved. MPXV7002 Rev 4 03/2017

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