Pressure Freescale Semiconductor MPX5100 Rev 13, 05/2010 Integrated Silicon Pressure Sensor MPX5100 On-Chip Signal Conditioned, MPXV5100 Temperature Compensated and Series Calibrated 0 to 100 kPa (0 to 14.5 psi) The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic 15 to 115 kPa (2.2 to 16.7 psi) silicon pressure sensor designed for a wide range of applications, but particularly 0.2 to 4.7 V Output those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog Typical Applications output signal that is proportional to the applied pressure. • Patient Monitoring Features • Process Control • Pump/Motor Control • 2.5% Maximum Error over 0° to 85°C • Pressure Switching • Ideally suited for Microprocessor or Microcontroller-Based Systems • Patented Silicon Shear Stress Strain Gauge • Available in Absolute, Differential and Gauge Configuration • Durable Epoxy Unibody Element • Easy-to-Use Chip Carrier Option ORDERING INFORMATION Case # of Ports Pressure Type Device Device Name No. None Single Dual Gauge Differential Absolute Marking Unibody Package (MPX5100 Series) MPX5100A 867 • • MPX5100A MPX5100AP 867B • • MPX5100AP MPX5100D 867 • • MPX5100D MPX5100DP 867C • • MPX5100DP MPX5100GP 867B • • MPX5100GP Small Outline Package (MPXV5100 Series) MPXV5100GC6U 482A • • MPXV5100G MPXV5100GC7U 482C • • MPXV5100G MPXV5100DP 1351 • • MPXV5100DP MPXV5100GP 1369 • • MPXV5100GP © Freescale Semiconductor, Inc., 2005-2010. All rights reserved.

Pressure UNIBODY PACKAGES MPX5100A/D MPX5100AP/GP MPX5100DP CASE 867-08 CASE 867B-04 CASE 857C-05 SMALL OUTLINE PACKAGES MPXV5100GC6U MPXV5100GC7U MPXV5100DP MPXV5100GP CASE 482A-01 CASE 482C-03 CASE 1351-01 CASE 1369-01 MPX5100 Sensors 2 Freescale Semiconductor

Pressure Operating Characteristics Table1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure5 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP kPa Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G 0 — 100 Absolute: MPX5100A 15 — 115 Supply Voltage(2) VS 4.75 5.0 5.25 VDC Supply Current I — 7.0 10 mAdc O Minimum Pressure Offset(3) (0 to 85°C) VOFF 0.088 0.20 0.313 VDC @ V = 5.0 V S Full Scale Output(4) Differential and Absolute (0 to 85°C) VFSO 4.587 4.700 4.813 VDC @ V = 5.0 V S Full Scale Span(5) Differential and Absolute (0 to 85°C) VFSS — 4.500 — VDC @ V = 5.0 V S Accuracy(6) — — — ±2.5 %VFSS Sensitivity V/P — 45 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output I — 0.1 — mAdc O+ Warm-Up Time(8) — — 20 — ms Offset Stability(9) — — ±0.5 — %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (V ) is defined as the output voltage at the minimum rated pressure. OFF 4. Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure. FSO 5. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V at 25°C. FSS 7. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX5100 Sensors Freescale Semiconductor 3

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 400 kPa max Storage Temperature Tstg -40° to +125° °C Operating Temperature TA -40° to +125° °C 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Unibody Package. V S 3 Thin Film Gain Stage #2 Temperature and V out Sensing Compensation Ground 1 Element and Reference Gain Stage #1 Shift Circuitry 2 Pins 4, 5, and 6 are NO CONNECTS. GND Figure1. Fully Integrated Pressure Sensor Schematic for Unibody Package Devices Figure2 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Small Outline Package. V S 2 Thin Film Gain Stage #2 Temperature and V out Sensing Compensation Ground 4 Element and Reference Gain Stage #1 Shift Circuitry 3 Pins 1 and 5-8 are NO CONNECTS. GND Figure2. Fully Integrated Pressure Sensor Schematic for Small Outline Package Devices MPX5100 Sensors 4 Freescale Semiconductor

Pressure On-chip Temperature Compensation and Calibration Figure3 shows the sensor output signal relative to the environment, while allowing the pressure signal to be pressure input. Typical, minimum, and maximum output transmitted to the sensor diaphragm. curves are shown for operation over a temperature range of The MPX5100 series pressure sensor operating 0° to 85°C using the decoupling circuit shown in Figure5. The characteristics, and internal reliability and qualification tests output will saturate outside of the specified pressure range. are based on use of dry air as the pressure media. Media, Figure4 illustrates both the Differential/Gauge and the other than dry air, may have adverse effects on sensor Absolute Sensing Chip in the basic chip carrier (Case 867). A performance and long-term reliability. Contact the factory for fluorosilicone gel isolates the die surface and wire bonds from information regarding media compatibility in your application. 5 Vout = VS*(0.009*P+0.04) ± (Pressure Error * Temperature Factor * 0.009 * VS) 4 VS = 5.0 V ± 0.25 Vdc PE = 2.5 V) TM = 1 Output Voltage ( 32 TEMMAPX = 0 to 85°C TYP Span Range (Typ) ut Range (Typ) 1 utp MIN O 0 0 0 0 0 0 0 0 0 0 0 0 0 1 2 3 4 5 6 7 8 9 0 1 (Typ) 1 1 Pressure (kPa) Offset Figure3. Output vs. Pressure Differential Fluorosilicone Gel Fluorosilicone Stainless Steel Die Coat Stainless Steel Gel Die Coat Die Metal Cover Die Metal Cover Epoxy Plastic Epoxy Plastic Wire Bond Case Wire Bond Case Lead Frame Differential/Gauge Element Die Bond Lead Frame Absolute Element Die Bond Figure4. Cross Sectional Diagrams (not to scale) Figure5 shows the recommended decoupling circuit for of a microprocessor or microcontroller. Proper decoupling of interfacing the output of the integrated sensor to the A/D input the power supply is recommended. +5.0 V VOUT OOUUTTPPUUTT Vs IIPPSS 1.0 μF 0.01 μF GND 470 pF Figure5. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) MPX5100 Sensors Freescale Semiconductor 5

Pressure Transfer Function (MPX5100D, MPX5100G, MPXV5100G Nominal Transfer Value: V = V (P x 0.009 + 0.04) OUT S ± (Pressure Error x Temp. Mult. x 0.009 x V ) S V = 5.0 V ± 0.25 V S Temperature Error Multiplier MPX5100D/MPX5100G/MPXV5100G Series Break Points Temp Multiplier 4.0 - 40 3 0 to 85°C 1 3.0 +125° 3 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in °C Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error Band MPX5100D/MPX5100G/MPXV5100G Series Error Limits for Pressure 3.0 2.0 1.0 a) P or (k 0.0 0 20 40 60 80 100 120 Pressure in kPa Err -1.0 -2.0 -3.0 Pressure Error (max) 0 to 100 kPa ± 2.5 kPa MPX5100 Sensors 6 Freescale Semiconductor

Pressure Transfer Function (MPX5100A) Nominal Transfer Value: V = V (P x 0.009 - 0.095) OUT S ± (Pressure Error x Temp. Mult. x 0.009 x V ) S V = 5.0 V ± 0.25 V S Temperature Error Multiplier MPX5100A Series Break Points Temp Multiplier 4.0 - 40 3 0 to 85°C 1 3.0 +125° 3 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 130 140 Temperature in °C Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error Band MPX5100A Series Error Limits for Pressure 3.0 2.0 1.0 a) P or (k 0.0 0 20 40 60 80 100 130 Pressure in kPa Err -1.0 -2.0 -3.0 Pressure Error (max) 15 to 115 kPa ± 2.5 kPa MPX5100 Sensors Freescale Semiconductor 7

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor sensor is designed to operate with positive differential as the Pressure (P1) side and the Vacuum (P2) side. The pressure applied, P1 > P2. Pressure (P1) side is the side containing fluoro silicone gel The Pressure (P1) side may be identified by using the which protects the die from harsh media. The MPX pressure table below. Part Number Case Type Pressure (P1) Side Identifier MPX5100A, MPX5100D 867 Stainless Steel Cap MPX5100DP 867C Side with Part Marking MPX5100AP, MPX5100GP 867B Side with Port Attached MPXV5100GC6U 482A Side with Port Attached MPXV5100GC7U 482C Side with Port Attached MPXV5100DP 1351 Side with Part Marking MPXV5100GP 1369 Side with Port Attached SURFACE MOUNTING INFORMATION Minimum Recommended Footprint for Surface Mounted Applications Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder Figure6. Small Outline Package Footprint MPX5100 Sensors 8 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS –A– D8 PL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 4 0.25 (0.010) M T B S A S Y14.5M, 1982. 5 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD N –B– PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. G 8 INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 S B 0.415 0.425 10.54 10.79 W C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 V K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 C S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 H W 0.115 0.125 2.92 3.17 J –T– PIN 1 IDENTIFIER SEATING K M PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER -A- ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 3. DIMENSION A AND B DO NOT INCLUDE 5 MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. N -B- 6. DIMENSION S TO CENTER OF LEAD WHEN D8 PL FORMED PARALLEL. G 8 0.25 (0.010) M T B S A S INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX DETAIL X A 0.415 0.425 10.54 10.79 S B 0.415 0.425 10.54 10.79 W C 0.500 0.520 12.70 13.21 D 0.026 0.034 0.66 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 V PIN 1 M 0˚ 15˚ 0˚ 15˚ IDENTIFIER N 0.444 0.448 11.28 11.38 S 0.540 0.560 13.72 14.22 C V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 -T- SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX5100 Sensors Freescale Semiconductor 9

Pressure NOTES: 1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. P 2.CONTROLLING DIMENSION: INCH. –A– 0.25 (0.010) M T Q M INCHES MILLIMETERS X U DIM MIN MAX MIN MAX W L A 1.145 1.175 29.08 29.85 R B 0.685 0.715 17.40 18.16 V C 0.405 0.435 10.29 11.05 PORT #1 PORT #2 VACUUM (P2) D 0.027 0.033 0.68 0.84 PRPEOSSSITUIRVEE PORT #1 POSITIVE F 0.048 0.064 1.22 1.63 (P1) N PRESSURE (P1) G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 –Q– K 0.695 0.725 17.65 18.42 PORT #2 L 0.290 0.300 7.37 7.62 VACUUM (P2) N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 B Q 0.153 0.159 3.89 4.04 PIN 1 R 0.063 0.083 1.60 2.11 S 0.220 0.240 5.59 6.10 K U 0.910 BSC 23.11 BSC 1 2 3 4 5 6 V 0.182 0.194 4.62 4.93 C W 0.310 0.330 7.87 8.38 S X 0.248 0.278 6.30 7.06 SEATING –T– –T– SEATING PLANE PLANE G D6 PL STYLE 1: J F 0.13 (0.005) M A M PIN 12..GVORUOTUND 3.VCC 4.V1 5.V2 6.VEX CASE 867-08 ISSUE N UNIBODY PACKAGE C NOTES: R 1. DIMENSIONING AND TOLERANCING PER POSITIVE PRESSURE ANSI Y14.5M, 1982. (P1) 2. CONTROLLING DIMENSION: INCH. M 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED B -A- 16.00 (0.630). INCHES MILLIMETERS N DIM MIN MAX MIN MAX L PIN 1 A 0.595 0.630 15.11 16.00 SPELAATNIENG -T- 1 2 3 4 5 6 BC 00..521040 00..523240 153..0086 153..5596 D 0.027 0.033 0.68 0.84 J G F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC S F J 0.014 0.016 0.36 0.40 D6 PL L 0.695 0.725 17.65 18.42 0.136 (0.005) M T A M M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 S 0.090 0.105 2.29 2.66 STYLE 1: STYLE 2: STYLE 3: PIN 1. VOUT PIN 1. OPEN PIN 1. OPEN 2. GROUND 2. GROUND 2. GROUND 3. VCC 3. -VOUT 3. +VOUT 4. V1 4. VSUPPLY 4. +VSUPPLY 5. V2 5. +VOUT 5. -VOUT 6. VEX 6. OPEN 6. OPEN CASE 867C-05 ISSUE F UNIBODY PACKAGE MPX5100 Sensors 10 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5100 Sensors Freescale Semiconductor 11

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5100 Sensors 12 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5100 Sensors Freescale Semiconductor 13

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5100 Sensors 14 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5100 Sensors Freescale Semiconductor 15

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5100 Sensors 16 Freescale Semiconductor

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: MPXV5100GP MPXV5100GC7U MPX5100D MPX5100A MPXV5100DP MPX5100DP MPXV5100GC6U MPX5100GP MPX5100AP