Pressure Freescale Semiconductor MPXV5050VC6T1 Rev 2, 11/2009 High Temperature Accuracy MPXV5050V Integrated Silicon Pressure Sensor Series for Measuring Absolute Pressure, On-Chip Signal Conditioned, -50 to 0 kPa (-7.25 to 0 psi) 0.1 to 4.6 V Output Temperature Compensated and Calibrated The MPXV5050V series sensor integrates on-chip, bipolar op amp circuitry and Application Examples thin film resistor networks to provide a high output signal and temperature • Vacuum Pump Monitoring compensation. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer. The MPXV5050V series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Features • 2.5% Maximum Error over 0° to 85°C • Ideally suited for Microprocessor or Microcontroller-Based Systems • Temperature Compensated from Over -40° to +125°C • Patented Silicon Shear Stress Strain Gauge • Durable Thermoplastic (PPS) Surface Mount Package • Easy-to-Use Chip Carrier Option • Ideal for Automotive and Non-Automotive Applications ORDERING INFORMATION Case # of Ports Pressure Type Device Device Name No. None Single Dual Gauge Differential Absolute Marking Small Outline Package MPXV5050VC6T1 482A • • Vacuum/Gauge MPXV5050V SMALL OUTLINE PACKAGE MPXV5050VC6T1 CASE 482A-01 © Freescale Semiconductor, Inc., 2005, 2009. All rights reserved.

Pressure Operating Characteristics Table1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range P -50 — 0 kPa OP Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current I — 7.0 10 mAdc o Full Scale Output(2) (0 to 85°C) VFSO 4.488 4.6 4.713 Vdc @ V = 5.0 Volts S Full Scale Span(3) (0 to 85°C) VFSS — 4.5 — Vdc @ V = 5.0 Volts S Accuracy(4) (0 to 85°C) — — — ±2.5 %VFSS Sensitivity V/P — 90 — mV/kPa Response Time(5) tR — 1.0 — ms Warm-Up Time(6) — — 20 — ms Offset Stability(7) — — ±0.5 — %VFSS Pressure Offset(8) (0 to 85°C) Voff 0 0.100 0.213 Vdc 1. Device is ratiometric within this specified excitation range. 2. Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure. FSO 3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. 8. Offset (V ) is defined as the output voltage at the minimum rated pressure. off MPXV5050VC6T1 Sensors 2 Freescale Semiconductor

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) P 200 kPa max Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S 2 Thin Film Gain Stage #2 Temperature And 4 Sensing Compensation Ground Vout Element And Reference Gain Stage #1 Shift Circuitry Pins 1, 5, 6, 7, and 8 are no connects 3 GND Figure1. Fully Integrated Pressure Sensor Schematic MPXV5050VC6T1 Sensors Freescale Semiconductor 3

Pressure On-chip Temperature Compensation and Calibration Figure2 illustrates the absolute sensing chip in the basic A fluorosilicone gel isolates the die surface and wire bonds Super Small Outline chip carrier (Case 482A). from the environment, while allowing the pressure signal to Figure3 shows a typical application circuit (output source be transmitted to the silicon diaphragm. The MPXV5050 current operation). series pressure sensor operating characteristics, internal Figure4 shows the sensor output signal relative to reliability and qualification tests are based on use of dry air as pressure input. Typical minimum and maximum output the pressure media. Media other than dry air may have curves are shown for operation over 0° to 85°C temperature adverse effects on sensor performance and long-term range. The output will saturate outside of the rated pressure reliability. Contact the factory for information regarding media range. compatibility in your application. Fluorosilicone Gel Die Coat Die Stainless +5 V Steel Cap P1 OUTPUT V Wire out Bond Thermoplastic Vs Case IPS Lead Frame 1.0 μF 0.01 μF GND 470 pF P2 Die Bond Differential Sensing Element Figure2. Cross Sectional Diagram SSOP (not to scale) Figure3. Typical Application Circuit (Output Source Current Operation) Transfer Function MPXV5050VC Series 5 Transfer Function: V = V x (0.018 x P + 0.92) ± (PE x TM x 0.018 x V) out S s V = 5.0 ± 0.25 vdc 4 s PE = 1.25 TM = 1 Temperature = 0 to 85°C Output Voltage (V) 23 MAX TYPICAL Span Range (Typ) Output Range (Typ) MIN 1 0 –50 –40 –30 –20 –10 0 Offset Pressure (kPa) (Typ) Figure4. Output vs. Absolute Pressure MPXV5050VC6T1 Sensors 4 Freescale Semiconductor

Pressure Transfer Function (MPXV5050V) Nominal Transfer Value: V = V x (0.018 x P + 0.92) OUT S ± (Pressure Error x Temp Multi x 0.018 x V ) S VS = 5.0 ± 0.25 V Temperature Error Band MPXV5050V 4.0 Break Points Temp Multiplier 3.0 –40 3 Temperature 0 to 85 1 Error 2.0 +125 3 Factor 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band MMPPXXVV55005500VV Error Limits for Pressure 1.25 1.00 a) P k or ( 0.75 e Err 0 Pressure (in kPa) ur –50 –40 –30 –20 –10 0 s es –0.75 Pr –1.00 –1.25 Pressure Error (Max) –50 to 0 kPa ±1.25 kPa MPXV5050VC6T1 Sensors Freescale Semiconductor 5

Pressure SURFACE MOUNTING INFORMATION MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE Surface mount board layout is a critical portion of the total solder reflow process. It is always recommended to fabricate design. The footprint for the semiconductor package must be boards with a solder mask layer to avoid bridging and/or the correct size to ensure proper solder connection interface shorting between solder pads, especially on tight tolerances between the board and the package. With the correct pad and/or tight layouts. geometry, the packages will self-align when subjected to a 0.100 TYP 0.660 2.54 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X inch 2.54 mm Figure5. SOP Footprint (Case 482A) MPXV5050VC6T1 Sensors 6 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS -A- D 8 PL 4 0.25 (0.010) M T B S A S NOTES: 5 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. N -B- 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). G 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 8 1 INCHES MILLIMETERS DIM MIN MAX MIN MAX S A 0.415 0.425 10.54 10.79 W B 0.415 0.425 10.54 10.79 C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC V H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 C M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 H V 0.245 0.255 6.22 6.48 J -T- W 0.115 0.125 2.92 3.17 PIN 1 IDENTIFIER SEATING K M PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV5050VC6T1 Sensors Freescale Semiconductor 7

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