Pressure Freescale Semiconductor MPX5010 Data Sheet: Technical Data Rev 13, 10/2012 Integrated Silicon Pressure Sensor MPX5010 On-Chip Signal Conditioned, MPXV5010 Temperature Compensated and MPVZ5010 Calibrated Series 0 to 10 kPa (0 to 1.45 psi) The MPxx5010 series piezoresistive transducers are state-of-the-art (0 to 1019.78 mm H O) monolithic silicon pressure sensors designed for a wide range of applications, 2 0.2 to 4.7 V Output but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high Application Examples level analog output signal that is proportional to the applied pressure. The • Hospital Beds axial port has been modified to accommodate industrial grade tubing. • HVAC Features • Respiratory Systems • Process Control • 5.0% Maximum Error over 0 to 85C • Washing Machine Water Level • Ideally Suited for Microprocessor or Microcontroller-Based Systems Measurement (Reference AN1950) • Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package • Ideally Suited for Microprocessor or • Temperature Compensated over -40 to +125C Microcontroller-Based Systems • Patented Silicon Shear Stress Strain Gauge • Appliance Liquid Level and Pressure • Available in Differential and Gauge Configurations Measurement • Available in Surface Mount (SMT) or Through-hole (DIP) Configurations ORDERING INFORMATION # of Ports Pressure Type Device Device Name Case No. None Single Dual Gauge Differential Absolute Marking Unibody Package (MPX5010 Series) MPX5010DP 867C • • MPX5010DP MPX5010GP 867B • • MPX5010GP MPX5010GS 867E • • MPX5010D MPX5010GSX 867F • • MPX5010D Small Outline Package (MPXV5010 Series) MPXV5010DP 1351 • • MPXV5010DP MPXV5010G6U 482 • • MPXV5010G MPXV5010GC6T1 482A • • MPXV5010G MPXV5010GC6U 482A • • MPXV5010G MPXV5010GC7U 482C • • MPXV5010G MPXV5010GP 1369 • • MPXV5010GP Small Outline Package (Media Resistant Gel) (MPVZ5010 Series) MPVZ5010G6U 482 • • MPVZ5010G MPVZ5010G7U 482B • • MPVZ5010G MPVZ5010GW6U 1735 • • MZ5010GW MPVZ5010GW7U 1560 • • MZ5010GW © 2007-2009, 2012 Freescale Semiconductor, Inc. All rights reserved.

Pressure SMALL OUTLINE PACKAGES SURFACE MOUNT MPXV5010GC6U/C6T1 MPXV5010G6U, MPXV5010DP MPXV5010GP MPVZ5010GW6U CASE 482A-01 MPVZ5010G6U CASE 1351-01 CASE 1369-01 CASE 1735-01 CASE 482-01 SMALL OUTLINE PACKAGES THROUGH-HOLE J MPVZ5010G7U MPXV5010GC7U MPVZ5010GW7U CASE 482B-03 CASE 482C-03 CASE 1560-02 UNIBODY PACKAGES MPX5010GP MPX5010DP MPX5010GS MPX5010GSX CASE 867B-04 CASE 867C-05 CASE 867E-03 CASE 867F-03 MPX5010 Sensors 2 Freescale Semiconductor, Inc.

Pressure Operating Characteristics Table1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Symbol Min Typ Max Unit Pressure Range P 0 — 10 kPa OP 1019.78 mm H O 2 Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current I — 5.0 10 mAdc o Minimum Pressure Offset(2) (0 to 85C) Voff 0 0.2 0.425 Vdc @ V = 5.0 Volts S Full Scale Output(3) (0 to 85C) VFSO 4.475 4.7 4.925 Vdc @ V = 5.0 Volts S Full Scale Span(4) (0 to 85C) VFSS 4.275 4.5 4.725 Vdc @ V = 5.0 Volts S Accuracy(5) (0 to 85C) — — — 5.0 %VFSS Sensitivity V/P — 450 — mV/mm 4.413 mV/mm H O 2 Response Time(6) tR — 1.0 — ms Output Source Current at Full Scale Output I — 0.1 — mAdc O+ Warm-Up Time(7) — — 20 — ms Offset Stability(8) — — 0.5 — %VFSS 1. Device is ratiometric within this specified excitation range. 2. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 3. Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure. FSO 4. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V , at 25°C. FSS 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX5010 Sensors Freescale Semiconductor, Inc. 3

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 40 kPa max Storage Temperature T –40 to +125 C stg Operating Temperature T –40 to +125 C A 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S 2 (SOP) 3 (Unibody) Thin Film Gain Stage #2 Temperature and Sensing Compensation Ground Vout 14 ((USOniPbo)dy) Element and Reference Gain Stage #1 Shift Circuitry 2 (Unibody) Pins 1 and 5 through 8 are NO CONNECTS 3 (SOP) for small outline package. GND Pins 4, 5, and 6 are NO CONNECTS for unibody package. Figure1. Fully Integrated Pressure Sensor Schematic MPX5010 Sensors 4 Freescale Semiconductor, Inc.

Pressure ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION The performance over temperature is achieved by other than dry air, may have adverse effects on sensor integrating the shear-stress strain gauge, temperature performance and long-term reliability. Contact the factory for compensation, calibration and signal conditioning circuitry information regarding media compatibility in your application. onto a single monolithic chip. Figure4 shows the recommended decoupling circuit for Figure3 illustrates the Differential or Gauge configuration interfacing the integrated sensor to the A/D input of a in the basic chip carrier (Case 482). A fluorosilicone gel microprocessor or microcontroller. Proper decoupling of the isolates the die surface and wire bonds from the environment, power supply is recommended. while allowing the pressure signal to be transmitted to the Figure5 shows the sensor output signal relative to sensor diaphragm. pressure input. Typical, minimum, and maximum output The MPxx5010G series pressure sensor operating curves are shown for operation over a temperature range of characteristics, and internal reliability and qualification tests 0 to 85C using the decoupling circuit shown in Figure4. The are based on use of dry air as the pressure media. Media, output will saturate outside of the specified pressure range. Fluoro Silicone Stainless Gel Die Coat Die Steel Cap +5 V P1 Thermoplastic OUTPUT Wire Bond Case Vout V s Lead IPS Frame 1.0 F 0.01 F GND 470 pF P2 Differential Sensing Die Bond Element Figure2. Cross-Sectional Diagram SOP Figure3. Recommended Power Supply Decoupling (not to scale) and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) 5.0 Transfer Function (kPa): V = V (0.09 P + 0.04) ± 5.0% V out S FSS 4.0 V = 5.0 Vdc S TEMP = 0 to 85C 3.0 V) ut ( MAX TYPICAL utp 2.0 O MIN 1.0 0 0 2.0 4.0 6.0 8.0 10 Differential Pressure (kPa) Figure4. Output vs. Pressure Differential MPX5010 Sensors Freescale Semiconductor, Inc. 5

Pressure Transfer Function Nominal Transfer Value: V = V x (0.09 x P + 0.04) out S ± (Pressure Error x Temp. Factor x 0.09 x V ) S V = 5.0 V  0.25 Vdc S Temperature Error Band 4.0 Temp Multiplier 3.0 –40 3 Temperature 0 to 85 1 Error 2.0 +125 3 Factor 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to –40C and from 85 to 125C. Pressure Error Band 0.5 0.4 0.3 0.2 Pressure 0.1 Pressure (kPa) Error 0 (kPa) 0 1 2 3 4 5 6 7 8 9 10 –0.1 –0.2 –0.3 –0.4 –0.5 Pressure Error (Max) 0 to 10 (kPa) ±0.5 (kPa) MPX5010 Sensors 6 Freescale Semiconductor, Inc.

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor sensor is designed to operate with positive differential as the Pressure (P1) side and the Vacuum (P2) side. The pressure applied, P1 > P2. Pressure (P1) side is the side containing fluorosilicone gel The Pressure (P1) side may be identified by using the which protects the die from harsh media. The MPX pressure table below: Pressure (P1) Part Number Case Type Side Identifier MPX5010DP 867C Side with Part Marking MPX5010GP 867B Side with Port Attached MPX5010GS 867E Side with Port Attached MPX5010GSX 867F Side with Port Attached MPXV5010G6U 482 Stainless Steel Cap MPXV5010GC6U/6T1 482A Side with Port Attached MPXV5010GC7U 482C Side with Port Attached MPXV5010GP 1369 Side with Port Attached MPXV5010DP 1351 Side with Part Marking MPVZ5010G6U 482 Stainless Steel Cap MPVZ5010G7U 482B Stainless Steel Cap MPVZ5010GW6U 1735 Vertical Port Attached MPVZ5010GW7U 1560 Vertical Port Attached MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder pads. 0.100 TYP 8X 0.660 2.54 16.76 0.060 TYP 8X 0.300 1.52 7.62 0.100 TYP 8X inch 2.54 mm SCALE 2:1 Figure5. SOP Footprint (Case 482) MPX5010 Sensors Freescale Semiconductor, Inc. 7

Pressure PACKAGE DIMENSIONS -A- D8 PL 4 0.25 (0.010) M T B S A S 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. -B- 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. G 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 8 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 1 INCHES MILLIMETERS S DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.212 0.230 5.38 5.84 N D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 C H J 0.009 0.011 0.23 0.28 J K 0.061 0.071 1.55 1.80 -T- M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 PIN 1 IDENTIFIER SEATING S 0.709 0.725 18.01 18.41 K M PLANE CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE –A– D8 PL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 4 0.25 (0.010) M T B S A S Y14.5M, 1982. 5 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD N –B– PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. G 8 INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 S B 0.415 0.425 10.54 10.79 W C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 V K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 C S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 H W 0.115 0.125 2.92 3.17 J –T– PIN 1 IDENTIFIER SEATING K M PLANE CASE 482A-0 ISSUE A SMALL OUTLINE PACKAGE MPX5010 Sensors 8 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS -A- NOTES: 4 1. DIMENSIONING AND TOLERANCING PER 5 ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE -B- MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). G 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 8 1 D8 PL 6. DFOIMREMNESDIO PNA SR ATLOL ECLE.NTER OF LEAD WHEN 0.25 (0.010)M T B S A S INCHES MILLIMETERS DETAIL X DIM MIN MAX MIN MAX S A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.210 0.220 5.33 5.59 N PIN 1 IDENTIFIER D 0.026 0.034 0.66 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 C M 0˚ 15˚ 0˚ 15˚ -T- SPELAATNIENG NS 00..450450 00..451650 1103..2792 1104..5242 K M J DETAIL X CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI –A– Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 3. DIMENSION A AND B DO NOT INCLUDE MOLD 5 PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. N –B– 6. DIMENSION S TO CENTER OF LEAD WHEN D8 PL FORMED PARALLEL. G 8 0.25 (0.010) M T B S A S INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX DETAIL X A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 S W C 0.500 0.520 12.70 13.21 D 0.026 0.034 0.66 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 V PIN 1 M 0 15 0 15 IDENTIFIER N 0.444 0.448 11.28 11.38 S 0.540 0.560 13.72 14.22 C V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 –T– SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 9

Pressure PACKAGE DIMENSIONS -T- NOTES: C A 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. E U -Q- 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 V N D 0.027 0.033 0.68 0.84 B E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 R G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 PORT #1 PIN 1 K 0.220 0.240 5.59 6.10 POSITIVE -P- N 0.070 0.080 1.78 2.03 PRESSURE (P1) 0.25 (0.010) M T Q M 6 5 4 3 2 1 P 0.150 0.160 3.81 4.06 Q 0.150 0.160 3.81 4.06 S R 0.440 0.460 11.18 11.68 K S 0.695 0.725 17.65 18.42 U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.93 J D6 PL G 0.13 (0.005) M T P S Q S STYLE 1: PIN 1. VOUT 2. GROUND F 3. VCC 4. V1 5. V2 6. VEX CASE 867F-03 ISSUE D UNIBODY PACKAGE MPX5010 Sensors 10 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 11

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5010 Sensors 12 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 13

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5010 Sensors 14 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 15

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors 16 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 1560-03 ISSUE C SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 17

Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5010 Sensors 18 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 19

Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors 20 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 21

Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors 22 Freescale Semiconductor, Inc.

Pressure Table3. Revision History Revision Revision Description of changes number date 13 10/2012 • Deleted references to device number MPVZ5010G6T1, MPVZ5010G6U/T1 and MPVZ5010G6U/ 6T1 throughout the document MPX5010 Sensors Freescale Semiconductor, Inc. 23

How to Reach Us: Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright Home Page: licenses granted hereunder to design or fabricate any integrated circuits based on the freescale.com information in this document. Web Support: Freescale reserves the right to make changes without further notice to any products freescale.com/support herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale, the Freescale logo, Energy Efficient Solutions logo, are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Xtrinsic is a trademark of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. MPX5010 Rev. 13 10/2012