Freescale Semiconductor Document Number: MPxx5004 Data Sheet: Technical Data Rev. 12.1, 05/2015 , MPxx5004 0 to 3.92 kPa, Differential MPXV5004 and Gauge, Integrated Pressure MPVZ5004 Sensor Freescale’s MPxx5004 series piezoresistive transducer is a state-of-the-art Top view monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced DNC 5 4 VOUT micromachining techniques, thin-film metallization, and bipolar processing to DNC 6 3 GND provide an accurate, high level analog output signal that is proportional to the applied pressure. DNC 7 2 VS DNC 8 1 DNC Features • 1.5% maximum error for 0 to 100 mm H O over +10°C to +60 °C with 2 autozero Pin 1 identification, notch on first pin or chamfered corner. • 2.5% maximum error for 100 to 400 mm H O over +10 °C to +60 °C with 2 autozero Pinout • 6.25% maximum error for 0 to 400 mm H O over 10 °C to +60 °C without 2 autozero • Temperature compensated over 10 °C to 60 °C • Available in gauge surface mount (SMT) or through-hole (DIP) configurations • Durable thermoplastic (PPS) package Applications • Washing machine water level • Ideally suited for microprocessor or microcontroller-based systems • Appliance liquid level and pressure measurement • Respiratory equipment Small outline packages, through-hole MPVZ5004G7U MPXV5004GC7U MPVZ5004GW7U Case 98ASB17758C Case 98ASB17759C Case 98ASA10611D Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2006-2009, 2015 Freescale Semiconductor, Inc. All rights reserved.

Small outline packages, surface mount MPVZ5004G6U/6T1 MPXV5004GC6T1/6U, MPVZ5004GC6U MPXV5004DP Case 98ASB17756C Case 98ASB17757C Case 98ASA99255D MPXV5004GVP MPVZ5004GW6U MPXV5004GP/GPT1 Case 98ASA99302D Case 98ASA10686D Case 98ASA99303D Ordering Information # of Ports Pressure type Device Part number Shipping Package None Single Dual Gauge Differential Absolute marking Small outline package (MPXV5004 series) MPXV5004DP Tray 98ASA99255D • • MPXV5004DP MPXV5004GC6T1 Reel 98ASB17757C • • MPXV5004G MPXV5004GC6U Rail 98ASB17757C • • MPXV5004G MPXV5004GC7U Rail 98ASB17759C • • MPXV5004G MPXV5004GP Tray 98ASA99303D • • MPXV5004GP MPXV5004GPT1 Reel 98ASA99303D • • MPXV5004GP MPXV5004GVP Tray 98ASA99302D • • MPXV5004GVP Small outline package (Media resistant gel) (MPVZ5004 series) MPVZ5004G6T1 Reel 98ASB17756C • • MPVZ5004G MPVZ5004G6U Rail 98ASB17756C • • MPVZ5004G MPVZ5004G7U Rail 98ASB17758C • • MPVZ5004G MPVZ5004GC6U Rail 98ASB17757C • • MPVZ5004G MPVZ5004GW6U Rail 98ASA10686D • • MZ5004GW MPVZ5004GW7U Rail 98ASA10611D • • MZ5004GW MPxx5004 Sensors 2 Freescale Semiconductor, Inc.

Contents 1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.1 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Pressure (P1)/Vacuum (P2) side identification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.3 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Related Documentation The MPXV5004G device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. In the Keyword search box at the top of the page, enter the device number MPXV5004G. 3. In the Refine Your Result pane on the left, click on the Documentation link. MPxx5004 Sensors Freescale Semiconductor, Inc. 3

1 General Description 1.1 Block diagram Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S Thin Film Gain Stage #2 Temperature and ESleenmseinngt Compensation Ground VOUT and Calibration Reference Circuitry Shift Circuitry Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. GND Figure1. Integrated pressure sensor schematic 1.2 Pinout DNC 5 4 V OUT DNC 6 3 GND DNC 7 2 V S DNC 8 1 DNC Pin 1 identification, notch on first pin or chamfered corner. Figure2. Device pinout (top view) Table1. Pin functions Pin Name Function 1 DNC Do not connect to external circuitry or ground. Pin 1 is notated by the notch in the lead or chamfered corner. 2 V Voltage supply S 3 GND Ground 4 V Output voltage OUT 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. MPxx5004 Sensors 4 Freescale Semiconductor, Inc.

2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table2. Maximum ratings(1) Rating Symbol Value Unit Maximum pressure (P1 > P2) P 16 kPa MAX Storage temperature T –30 to +100 °C STG Operating temperature T 0 to +85 °C A 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.2 Operating characteristics Table3. Operating characteristics (V = 5.0 V , T = 25°C unless otherwise noted, P1 > P2) S DC A Characteristic Symbol Min Typ Max Units 3.92 kPa Pressure range P 0 — OP 400 mm H O 2 Supply voltage(1) V 4.75 5.0 5.25 V S DC Supply current I — — 10 mAdc S Span @ 306 mm H O (3 kPa)(2) — 3.0 — 2 V V Full-scale span @ 400 mm H O (3.92 kPa)(2) FSS — 3.92 — 2 Offset(3) V 0.75 1.0 1.25 V OFF Sensitivity V/P — 1.0 — V/kPa %V with Accuracy (4) (5) 0 to 100 mm H O (10 °C to 60°C) — — — ±1.5 FSS 2 autozero %V with 100 to 400 mm H O (10 °C to 60°C) — — — ±2.5 FSS 2 autozero %V without 0 to 400 mm H O (10 °C to 60°C) — — — ±6.25 FSS 2 autozero 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 4. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure, using endpoint method, over the specified pressure range. Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 10°C to 60°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10°C to 60°C, relative to 25°C. Variation from nominal: The variation from nominal values, for offset or full-scale span, as a percent of V , at 25°C. FSS 5. Autozero at factory installation: Due to the sensitivity of the MPxx5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ±5°C between autozero and measurement. MPxx5004 Sensors Freescale Semiconductor, Inc. 5

3 On-chip Temperature Compensation and Calibration The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure3 illustrates the gauge configuration in the basic chip carrier (case 98ASB17756C). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPxx5004 series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure4 shows the recommended decoupling circuit for interfacing the output of the MPxx5004 to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10°C to 60°C using the decoupling circuit shown in Figure4. The output will saturate outside of the specified pressure range. Fluorosilicone Stainless Gel Die Coat Die Steel Cap P1 Thermoplastic Wire Bond Case Lead Frame P2 Differential Sensing Element Die Bond Figure3. Cross-sectional diagram (not to scale) +5 V OUTPUT V OUT V S IPS 1.0 μF 0.01 μF GND 470 pF Figure4. Recommended power supply decoupling and output filtering (For additional output filtering, please refer to AN1646.) MPxx5004 Sensors 6 Freescale Semiconductor, Inc.

5.0 TRANSFER FUNCTION: V = V *[(0.2*P) + 0.2] ± 6.25% V out S FSS 4.0 V = 5.0 Vdc S TEMP = 10 °C to 60°C 3.0 ut (V) MAX TYPICAL utp 2.0 O MIN 1.0 0 0 1.0 2.0 3.0 4.0 Differential Pressure (kPa) Figure5. Output vs. pressure differential at ±6.25% V (without autozero, Table3, note 5) FSS 5.0 TRANSFER FUNCTION: V = V *[(0.2*P) + 0.2] ± 2.5% V out S FSS 4.0 V = 5.0 Vdc S TEMP = 10 to 60°C 3.0 V) MAX ut ( TYPICAL utp 2.0 O MIN 1.0 0 0 1.0 2.0 3.0 4.0 Differential Pressure (kPa) Figure6. Output vs. pressure differential at ±2.5% V (with autozero, Table3, note 5) FSS MPxx5004 Sensors Freescale Semiconductor, Inc. 7

4 Package Information 4.1 Pressure (P1)/Vacuum (P2) side identification Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The pressure (P1) side may be identified by using the table below. Table4. Pressure (P1)/Vacuum (P2) side identification table Part number Case number Pressure (P1) side identifier MPXV5004DP 98ASA99255D Side with part marking MPXV5004GC6U/6T1, 98ASB17757C Side with port attached MPVZ5004GC6U MPXV5004GC7U 98ASB17759C Side with port attached MPXV5004GP/GPT1 98ASA99303D Side with port attached MPXV5004GVP 98ASA99302D Stainless steel cap MPVZ5004G6U/6T1 98ASB17756C Stainless steel cap MPVZ5004G7U 98ASB17758C Stainless steel cap MPVZ5004GW6U 98ASA10686D Vertical port attached MPVZ5004GW7U 98ASA10611D Vertical port attached 4.2 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 6X 0.660 2.54 16.76 0.060 TYP 8X 0.300 1.52 7.62 0.100 TYP 8X inch 2.54 mm SCALE 2:1 Figure7. SOP footprint (case 98ASB17756C) MPxx5004 Sensors 8 Freescale Semiconductor, Inc.

4.3 Package Dimensions This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17756C.pdf. Case 98ASB17756C, small outline package, surface mount MPxx5004 Sensors Freescale Semiconductor, Inc. 9

This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf. –A– D8 PL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 4 0.25 (0.010) M T B S A S Y14.5M, 1982. 5 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD N –B– PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. G 8 INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 S B 0.415 0.425 10.54 10.79 W C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 V K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 C S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 H W 0.115 0.125 2.92 3.17 J –T– PIN 1 IDENTIFIER SEATING K M PLANE Case 98ASB17757C, small outline package, through-hole This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17758C.pdf. –A– NOTES: 4 1. DIMENSIONING AND TOLERANCING PER ANSI 5 Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD –B– PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). G 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 8 1 D8 PL 6. DFOIMREMNESDIO PNA RSA TLOL ECLE.NTER OF LEAD WHEN 0.25 (0.010) M T B S A S INCHES MILLIMETERS DETAIL X DIM MIN MAX MIN MAX S A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.210 0.220 5.33 5.59 N PIN 1 IDENTIFIER D 0.026 0.034 0.66 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 C M 0 15 0 15 –T– SPELAATNIENG NS 00..450450 00..451650 1103..2792 1104..5242 K M J DETAIL X Case 98ASB17758C, small outline package, through-hole MPxx5004 Sensors 10 Freescale Semiconductor, Inc.

This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17759C.pdf. FREESCALE D Case 98ASB17759C, small outline package, through-hole MPxx5004 Sensors Freescale Semiconductor, Inc. 11

This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99255D.pdf. PAGE 1 OF 2 Case 98ASA99255D, small outline package, surface mount MPxx5004 Sensors 12 Freescale Semiconductor, Inc.

PAGE 2 OF 2 Case 98ASA99255D, small outline package, surface mount MPxx5004 Sensors Freescale Semiconductor, Inc. 13

This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99302D.pdf. PAGE 1 OF 3 Case 98ASA99302D, small outline package, surface mount MPxx5004 Sensors 14 Freescale Semiconductor, Inc.

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This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99303D.pdf. PAGE 1 OF 2 PAGE 1 OF 2 Case 98ASA99303D, small outline package MPxx5004 Sensors Freescale Semiconductor, Inc. 17

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This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA10611D.pdf. PAGE 1 OF 3 Case 98ASA10611D, small outline package MPxx5004 Sensors Freescale Semiconductor, Inc. 19

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This drawing is available at http://cache.freescale.com/files/shared/doc/package_info/98ASA10686D.pdf PAGE 1 OF 3 Case 98ASA10686D, small outline package MPxx5004 Sensors 22 Freescale Semiconductor, Inc.

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5 Revision History Table5. Revision history Revision Revision Description number date • Updated format. 12.1 05/2015 • Table 3: Updated Full-scale span Typ value, was 4.0 to 3.92. Updated Linearity defintion in note 4. • Updated package drawings with current versions. MPxx5004 Sensors Freescale Semiconductor, Inc. 25

How to Reach Us: Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright Home Page: freescale.com licenses granted hereunder to design or fabricate any integrated circuits based on the Web Support: information in this document. freescale.com/support Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2006-2009, 2015 Freescale Semiconductor, Inc. Document Number: MPxx5004 Rev. 12.1 05/2015

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: MPVZ5004GC6U MPVZ5004GW6U MPVZ5004G7U MPXV5004GPT1 MPVZ5004G6U MPXV5004G6U MPXV5004GVP MPXV5004GP MPVZ5004GW7U MPXV5004GC7U MPVZ5004G6T1 MPXV5004G7U MPXV5004DP MPXV5004GC6T1 MPXV5004GC6U