Pressure Freescale Semiconductor MPXV4006 Rev 3, 1/2009 +Integrated Silicon Pressure Sensor MPXV4006 On-Chip Signal Conditioned, Series Temperature Compensated and Integrated Calibrated Pressure Sensor 0 to 6 kPa (0 to 0.87 psi) The MPXV4006 series piezoresistive transducers are state-of-the-art 0.2 to 4.8 V Output monolithic silicon pressure sensors designed for the appliance, consumer, health care and industrial market. The analog output can be read directly into the A/D input of Freescale microcontrollers. This transducer combines Application Examples advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is • Washing Machine Water Level proportional to the applied pressure. The axial port has been modified to Measurement (Reference AN1950) accommodate industrial grade tubing. • Ideally Suited for Microprocessor or Microcontroller-Based Systems Features • Appliance Liquid Level and Pressure • 2.5% Maximum Error over +10°C to +60°C with Auto Zero Measurement • 5% Maximum Error over +10°C to +60°C without Auto Zero • Respiratory Equipment • Durable Thermoplastic (PPS) Package • Available in Surface Mount (SMT) or Through-Hole (DIP) Configurations • Available with Standard Fluorosilicone Gel or Media Resistant Gel ORDERING INFORMATION # of Ports Pressure Type Option Package Case Device Device Name Options No. None Single Dual Gauge Differential Absolute Surface Through- Marking Mount Hole Small Outline Package (Media Resistant Gel) (MPVZ4006 Series) MPVZ4006GW6U Rail 1735 • • • MZ4006GW MPVZ4006GW7U Rail 1560 • • • MZ4006GW MPVZ4006G6U Rail 482 • • • MPVZ4006G MPVZ4006G6T1 Tape and 482 • • • MPVZ4006G Reel MPVZ4006G7U Rail 482B • • • MPVZ4006G Small Outline Package (MPXV4006 Series) MPXV4006GC6U Rail 482A • • • MPXV4006G MPXV4006GC6T1 Tape and 482A • • • MPXV4006G Reel MPXV4006GC7U Rail 482C • • • MPXV4006G MPXV4006GP Tray 1369 • • • MPXV4006GP MPXV4006DP Tray 1351 • • • MPXV4006DP © Freescale Semiconductor, Inc., 2006-2009. All rights reserved.

Pressure SMALL OUTLINE PACKAGE SURFACE MOUNT MPVZ4006GW6U MPVZ4006G6U/T1 CASE 1735-01 CASE 482-01 MPXV4006GC6U/C6T1 MPXV4006DP MPXV4006GP CASE 482A-01 CASE 1351-01 CASE 1369-01 SMALL OUTLINE PACKAGE THROUGH-HOLE J MPVZ4006GW7U MPVZ4006G7U MPXV4006GC7U CASE 1560-02 CASE 482B-03 CASE 482C-03 MPXV4006 Sensors 2 Freescale Semiconductor

Pressure Operating Characteristics Table1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range P 0 — 6.0 kPa OP 612 mm H O 2 Supply Voltage(1) V 4.75 5.0 5.25 Vdc S Supply Current I — — 10 mAdc S Full Scale Span(2) V — 4.6 — V FSS Offset(3)(5) V 0.152 0.265 0.378 V off Sensitivity V/P — 766 — mV/kPa 7.511 mV/mm H O 2 Accuracy(4)(5) (10 to 60°C) — — — ±2.46 %V with FSS auto zero — — — ±5.0 %V without FSS auto zero 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 3. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 4. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure, at 25°C. Offset Stability: Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 10° to 60°C, relative to 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006, external mechanical stresses and mounting position can affect the zero pressure output reading. To obtain the 2.46% FSS accuracy, the device output must be “autozeroed'' after installation. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. The specified accuracy assumes a maximum temperature change of ±5°C between autozero and measurement. MPXV4006 Sensors Freescale Semiconductor 3

Pressure Maximum Ratings Table2. Maximum Ratings(1) Parametrics Symbol Value Units Maximum Pressure (P1 > P2) Pmax 24 kPa Storage Temperature Tstg -30° to +100° °C Operating Temperature TA +10° to +60° °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. V 2 S Thin Film Gain Stage #2 4 Temperature and Sensing Compensation Ground Vout Element and Reference Gain Stage #1 Shift Circuitry 3 Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device GND Figure1. Fully Integrated Pressure Sensor Schematic MPXV4006 Sensors 4 Freescale Semiconductor

Pressure On-Chip Temperature Compensation and Calibration The performance over temperature is achieved by qualification test for dry air, and other media, are available integrating the shear-stress strain gauge, temperature from the factory. Contact the factory for information regarding compensation, calibration and signal conditioning circuitry media tolerance in your application. onto a single monolithic chip. Figure3 shows the recommended decoupling circuit for Figure2 illustrates the Differential or Gauge configuration interfacing the output of the integrated sensor to the A/D input in the basic chip carrier (Case 482). A gel die coat isolates the of a microprocessor or microcontroller. Proper decoupling of die surface and wire bonds from the environment, while the power supply is recommended. allowing the pressure signal to be transmitted to the silicon Figure4 and Figure5 shows the sensor output signal diaphragm. relative to pressure input. Typical, minimum and maximum The MPXV4006/MPVZ4006 series sensor operating output curves are shown for operation over a temperature characteristics are based on use of dry air as pressure media. range of 10°C to 60°C using the decoupling circuit shown in Media, other than dry air, may have adverse effects on sensor Figure3. The output will saturate outside of the specified performance and long-term reliability. Internal reliability and pressure range. Fluorosilicone Gel Die Coat Die Stainless Steel Cap +5 V P1 Wire OUTPUT Bond Thermoplastic Vout Case Vs IPS Lead Frame 1.0 μF 0.01 μF GND 470 pF P2 Differential Sensing Die Bond Element Figure3. Recommended Power Supply Decoupling Figure2. Cross Sectional Diagram SOP and Output Filtering Recommendations (not to scale) (For additional output filtering, please refer to Application Note AN1646.) 5.0 5.0 Transfer Function (kPa): Transfer Function (kPa): 4.5 Vout = VS*[(0.1533*P) + 0.053] ± 5.0% VFSS 4.5 Vout = VS*[(0.1533*P) + 0.053] ± 2.46% VFSS 4.0 V = 5.0 Vdc 4.0 V = 5.0 Vdc S S 3.5 TEMP = 10 to 60°C 3.5 TEMP = 10 to 60°C 3.0 3.0 ut (V) 2.5 MAX ut (V) 2.5 MAX TYPICAL utp 2.0 TYPICAL utp 2.0 O O 1.5 1.5 MIN MIN 1.0 1.0 0.5 0.5 0 0 0 2.0 4.0 6.0 0 2.0 4.0 6.0 Differential Pressure (kPa) Differential Pressure (kPa) Figure4. Output versus Pressure Differential Figure5. Output versus Pressure Differential at ±5.0% V (without auto zero, Note 5 in at ±2.46% V (with auto zero, Note 5 in FSS FSS Operating Characteristics) Operating Characteristics) MPXV4006 Sensors Freescale Semiconductor 5

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor designed to operate with positive differential pressure as the Pressure (P1) side and the Vacuum (P2) side. The applied, P1 > P2. Pressure (P1) side is the side containing a gel die coat which The Pressure (P1) side may be identified by using the isolates the die from the environment. The pressure sensor is table below: Table3. Pressure (P1)/Vacuum (P2) Side Identification Table Part Number Case Type Pressure (P1) Side Identifier MPVZ4006GW6U 1735-01 Vertical Port Attached MPVZ4006GW7U 1560-02 Vertical Port Attached MPVZ4006G6U/T1 482-01 Stainless Steel Cap MPVZ4006G7U 482B-03 Stainless Steel Cap MPXV4006GC6U/T1 482A Vertical Port Attached MPXV4006GC7U 482C-03 Vertical Port Attached MPXV4006GP 1369-01 Side with Port Attached MPXV4006DP 1351-01 Side with Part Marking MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder pads. 0.100 TYP 0.660 2.54 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X inch 2.54 mm Figure6. SOP Footprint (Case 482) MPXV4006 Sensors 6 Freescale Semiconductor

Pressure CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 7

Pressure CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 Sensors 8 Freescale Semiconductor

Pressure CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 9

Pressure CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV4006 Sensors 10 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS -A- D8 PL 4 0.25 (0.010) M T B S A S 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. -B- 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. G 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 8 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 1 INCHES MILLIMETERS S DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.212 0.230 5.38 5.84 N D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 C H J 0.009 0.011 0.23 0.28 J K 0.061 0.071 1.55 1.80 -T- M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 PIN 1 IDENTIFIER SEATING S 0.709 0.725 18.01 18.41 K M PLANE CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A- NOTES: 4 1. DIMENSIONING AND TOLERANCING PER 5 ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE -B- MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). G 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 8 1 D8 PL 6. DFOIMREMNESDIO PNA SR ATLOL ECLE.NTER OF LEAD WHEN 0.25 (0.010)M T B S A S INCHES MILLIMETERS DETAIL X DIM MIN MAX MIN MAX S A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.210 0.220 5.33 5.59 N PIN 1 IDENTIFIER D 0.026 0.034 0.66 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 C M 0˚ 15˚ 0˚ 15˚ -T- SPELAATNIENG NS 00..450450 00..451650 1103..2792 1104..5242 K M J DETAIL X CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 11

Pressure PACKAGE DIMENSIONS –A– D8 PL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 4 0.25 (0.010) M T B S A S Y14.5M, 1982. 5 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD N –B– PROTRUSION. 4. MAXIMUM MOLD PROTRUSIO(cid:0)N 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. G 8 INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 S B 0.415 0.425 10.54 10.79 W C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 V K 0.061(cid:0) 0.071(cid:0) 1.55(cid:0) 1.80(cid:0) M 0 7 0 7 N 0.444 0.448 11.28 11.38 C S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 H W 0.115 0.125 2.92 3.17 J –T– PIN 1 IDENTIFIER SEATING K M PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 Sensors 12 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 13

Pressure PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPXV4006 Sensors 14 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 15

Pressure PACKAGE DIMENSIONS CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 Sensors 16 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 17

Pressure PACKAGE DIMENSIONS CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 Sensors 18 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI –A– Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 3. DIMENSION A AND B DO NOT INCLUDE MOLD 5 PROTRUSION. 4. MAXIMUM MOLD PROTRUSIO(cid:0)N 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. N –B– 6. DIMENSION S TO CENTER OF LEAD WHEN D8 PL FORMED PARALLEL. G 8 0.25 (0.010) M T B S A S INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX DETAIL X A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 S W C 0.500 0.520 12.70 13.21 D 0.026 0.034 0.66 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100(cid:0) 0.120(cid:0) 2.54(cid:0) 3.05(cid:0) V PIN 1 M 0 15 0 15 IDENTIFIER N 0.444 0.448 11.28 11.38 S 0.540 0.560 13.72 14.22 C V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 –T– SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 19

Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.006 (0.15) C A B A E GAGE e PLANE 5 4 e/2 .014 (0.35) θ L A1 D DETAIL G 8 1 NOTES: 8X b 1. CONTROLLING DIMENSION: INCH. F 0.004 (0.1) M C A B STYPLINE 11.: GND STYPLINE 12.: N/C 2. IANSTMEER PYR14E.T5 MD,I M19E9N4S.IONS AND TOLERANCES PER 2. +Vout 2. Vs 3. Vs 3. GND 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE 4. -Vout 4. Vout MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR B E1 56.. NN//CC 56.. NN//CC PPRERO TSRIDUES.IONS SHALL NOT EXCEED 0.006 (0.152) 7. N/C 7. N/C 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR 8. N/C 8. N/C PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. INCHES MILLIMETERS N ∅T DIM MIN MAX MIN MAX A 0.370 0.390 9.39 9.91 A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E 0.680 0.700 17.27 17.78 A M E1 0.465 0.485 11.81 12.32 e 0.100 BSC 2.54 BSC F 0.240 0.260 6.10 6.60 K 0.115 0.135 2.92 3.43 L 0.040 0.060 1.02 1.52 8X 0.004 (0.1) M 0.270 0.290 6.86 7.37 P K N 0.160 0.180 4.06 4.57 DETAIL G P 0.009 0.011 0.23 0.28 C SPELAATNIENG Tθ 0.101˚0 0.173˚0 2.07˚9 3.73˚0 CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE MPXV4006 Sensors 20 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B A E e GAGE PLANE 5 4 e/2 .014 (0.35) θ L A1 D DETAIL G 8 1 NOTES: 1. CONTROLLING DIMENSION: INCH. 8X b 2. INTERPRET DIMENSIONS AND TOLERANCES PER F 0.004 (0.1) M C A B ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) B E1 PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. INCHES MILLIMETERS ∅T N K DAIM 0M.3I0N0 M0.3A3X0 M7.1IN1 M7.A62X A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E 0.717 BSC 18.21 BSC A M Ee1 0.406.1500 B0S.C485 11.821.54 BS1C2.32 F 0.245 0.255 6.22 6.47 K 0.120 0.130 3.05 3.30 8X 0.004 (0.1) L 0.061 0.071 1.55 1.80 P M 0.270 0.290 6.86 7.36 DETAIL G N 0.080 0.090 2.03 2.28 P 0.009 0.011 0.23 0.28 C SEATING T 0.115 0.125 2.92 3.17 PLANE θ 0˚ 7˚ 0˚ 7˚ CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 21

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: MPVZ4006GW6U MPVZ4006G6U MPXV4006GC6U MPXV4006DP MPXV4006GP MPVZ4006GW7U MPXV4006GC7U MPVZ4006G6T1 MPXV4006GC6T1