Pressure Freescale Semiconductor Document Number: MPX2202 Rev 8, 10/2012 Data Sheet: Technical Data 200 kPa On-Chip Temperature MPX2202 Compensated Silicon Series Pressure Sensors 0 to 200 kPa (0 to 29 psi) The MPX2202 devices series are silicon piezoresistive pressure sensor 40 mV Full Scale providing a highly accurate and linear voltage output directly proportional to (Typical) the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/ motor controllers, robotics, level indicators, medical diagnostics, pressure switching, barometers, altimeters, etc. Application Examples Features • Pump/Motor Controllers • Robotics • Temperature Compensated Over 0C to +85C • Level Indicators • Easy-to-Use Chip Carrier Package Options • Medical Diagnostics • Available in Absolute, Differential and Gauge Configurations • Pressure Switching • Ratiometric to Supply Voltage • Barometers • Available in Easy-to-Use Tape and Reel • Altimeters ORDERING INFORMATION Case # of Ports Pressure Type Device Name Device Marking No. None Single Dual Gauge Differential Absolute Unibody Package (MPX2202 Series) MPX2202A 344 • • MPX2202A MPX2202DP 344C • • MPX2202DP MPX2202AP 344B • • MPX2202AP MPX2202GP 344B • • MPX2202GP MPX2202ASX 344F • • MPX2202A Small Outline Package (MPXV2202 Series) MPXV2202GP 1369 • • MPXV2202GP MPXV2202DP 1351 • • MPXV2202DP MPXV2202GC6TI 482A • • MPXV2202G MPAK Package (MPXM2202 Series) MPXM2202D 1320 • • MPXM2202D MPXM2202DT1 1320 • • MPXM2202D MPXM2202A 1320 • • MPXM2202A MPXM2202GS 1320A • • MPXM2202GS MPXM2202GST1 1320A • • MPXM2202GS MPXM2202AS 1320A • • MPXM2202AS © 2005-2008, 2012 Freescale Semiconductor, Inc. All rights reserved.

Pressure UNIBODY PACKAGES MPX2202A MPX2202AP/GP MPX2202DP MPX2202ASX CASE 344-15 CASE 344B-01 CASE 344C-01 CASE 344F-01 SMALL OUTLINE PACKAGES MPAK MPXV2202DP MPXV2202GP MPXV2202GC6T1 MPXM2202A MPXM2202GS/AS CASE 1351-01 CASE 1369-01 CASE 482A-01 CASE 1320-02 CASE 1320A-02 MPX2202 Sensors 2 Freescale Semiconductor, Inc.

Pressure Operating Characteristics Table1. Operating Characteristics (V = 10 Vdc, T = 25C unless otherwise noted, P1 > P2) S A Characteristics Symbol Min Typ Max Unit Pressure Range(1) Absolute Pressure Range MPX2202A POP 20 — 200 kPa Differential Pressure Range MPX2202D POP 0 — 200 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current I — 6.0 — mAdc o Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) MPX2202D, MPXM2202D/G Series Voff -1.0 — 1.0 mV MPX2202A, MPXM2202A Series -2.0 — 2.0 Sensitivity V/P — 0.2 — mV/kPa Linearity(5) MPXM2202D/G, MPX2202D Series — -0.6 — 0.4 %VFSS MPXM2202A, MPX2202A Series -1.0 — 1.0 Pressure Hysteresis(5) (0 to 200 kPa) — — 0.1 — %VFSS Temperature Hysteresis(5) (-40C to +125C) — — 0.5 — %VFSS Temperature Effect on Full Scale Span(5) TCVFSS -2.0 — 2.0 %VFSS Temperature Effect on Offset(5) TCVoff -1.0 — 1.0 mV Input Impedance Z 1000 — 2500  in Output Impedance Z 1400 — 3000  out Response Time(6) (10% to 90%) tR — 1.0 — ms Warm-Up — — 20 — ms Offset Stability(7) — — 0.5 — %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 4. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 5. Accuracy (error budget) consists of the following: Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2202 Sensors Freescale Semiconductor, Inc. 3

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Max Value Unit Maximum Pressure (P1 > P2) 400 kPa Storage Temperature -40 to 125 C Operating Temperature -40 to 125 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output versus Applied Differential The differential voltage output of the sensor is directly (P1) side relative to the vacuum (P2) side. Similarly, output proportional to the differential pressure applied. voltage increases as increasing vacuum is applied to the The absolute sensor has a built-in reference vacuum. The vacuum (P2) side relative to the pressure (P1) side. output voltage will decrease as vacuum, relative to ambient, Figure1 illustrates a block diagram of the internal circuitry is drawn on the pressure (P1) side. on the stand-alone pressure sensor chip. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure V S 3 Thin Film 2 Temperature +VOUT Sensing Compensation Element 4 and Calibration –V OUT Circuitry 1 GND Figure1. Temperature Compensated and Calibrated Pressure Sensor Schematic MPX2202 Sensors 4 Freescale Semiconductor, Inc.

Pressure On-Chip Temperature Compensation and Calibration 40 VS = 10 V DC 35 TA = 25C 30 P1 > P2 TYP 25 Span )C 20 MAX Range VD (TYP) m 15 put ( 10 MIN ut O 5 0 -5 Offset kPa 0 25 50 75 100 125 150 175 200 (TYP) PSI 7.25 14.5 21.75 29 Pressure Figure2. Output vs. Pressure Differential Figure2 shows the output characteristics of the MPX2202 The effects of temperature on full scale span and offset are series at 25C. The output is directly proportional to the very small and are shown under Operating Characteristics. differential pressure and is essentially a straight line. Differential/Gauge Absolute DSiileic Conoea tGel Die P1 SMteatianll eCsosv Setreel SDiileic oCnoea tGel Die P1 MSteatianll eCsosv SetreelEpoxy Epoxy Case Wire Bond Wire Bond Case Lead Frame Bond Lead Frame Differential/Gauge Element Die Absolute Element Die P2 P2 Bond Figure3. Cross Sectional Diagram (not to scale) Figure3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the Least Least Squares Fit Square pressure signal to be transmitted to the silicon diaphragm. Deviation The MPX2202 series pressure sensor operating Exaggerated characteristics and internal reliability and qualification tests Performance are based on use of dry air as the pressure media. Media Curve Straight Line other than dry air may have adverse effects on sensor utput Deviation O performance and long term reliability. Contact the factory for e g information regarding media compatibility in your application. olta V e LINEARITY ativ End Point Straight Linearity refers to how well a transducer's output follows Rel Line Fit the equation: V = V + sensitivity x P over the operating out off pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure4) or Offset (2)a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the 0 50 100 calculations required are burdensome. Pressure (% Full Scale) Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the Figure4. Linearity Specification Comparison calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. MPX2202 Sensors Freescale Semiconductor, Inc. 5

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor pressure sensor is designed to operate with positive as the Pressure (P1) side and the Vacuum (P2) side. The differential pressure applied, P1 > P2. Pressure (P1) side is the side containing silicone gel which The Pressure (P1) side may be identified by using the isolates the die from the environment. The Freescale MPX following table. Table3. Pressure (P1) Side Delineation Part Number Case Type Pressure (P1) Side Identifier MPX2202A 344 Stainless Steel Cap MPX2202DP 344C Side with Part Marking MPX2202GP/AP 344B Side with Port Attached MPX2202ASX 344F Side with Port Attached MPX2202GP 1369 Side with Port Attached MPX2202DP 1351 Side with Part Marking MPXV2202GP 1369 Side with Port Attached MPXV2202DP 1351 Side with Part Marking MPXV2202GC6TI 482A Side with Port Attached MPXM2202A/ATI/DT/DTI 1320 Side with Part Marking MPXM2202GS/GSTI/AS/ASTI 1320A Side with Port Attached MPX2202 Sensors 6 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS –A– D8 PL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 4 0.25 (0.010) M T B S A S Y14.5M, 1982. 5 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD N –B– PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. G 8 INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 S B 0.415 0.425 10.54 10.79 W C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 V K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 C S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 H W 0.115 0.125 2.92 3.17 J –T– PIN 1 IDENTIFIER SEATING K M PLANE CASE 482A–01 ISSUE A DATE 05/13/98 MPX2202 Sensors Freescale Semiconductor, Inc. 7

Pressure PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME R Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD M STOP RING. MOLD STOP RING NOT TO EXCEED Z 16.00 (0.630). 1 4 B -A- 2 3 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.595 0.630 15.11 16.00 N B 0.514 0.534 13.06 13.56 PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 -T- F 0.048 0.064 1.22 1.63 SEATING G 0.100 BSC 2.54 BSC PLANE F J 0.014 0.016 0.36 0.40 J G L 0.695 0.725 17.65 18.42 F Y M 30˚ NOM 30˚ NOM D4 PL N 0.475 0.495 12.07 12.57 0.136 (0.005) M T A M DAMBAR TRIM ZONE: R 0.430 0.450 10.92 11.43 THIS IS INCLUDED Y 0.048 0.052 1.22 1.32 WITHIN DIM. "F" 8 PL Z 0.106 0.118 2.68 3.00 STYLE 1: STYLE 2: STYLE 3: PIN 1. GROUND PIN 1. VCC PIN 1. GND 2. + OUTPUT 2. - SUPPLY 2. -VOUT 3. + SUPPLY 3. + SUPPLY 3. VS 4. - OUTPUT 4. GROUND 4. +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: SEATING -T- -A- 1. DIMENSIONING AND TOLERANCING PER ANSI PLANE U Y14.5M, 1982. R L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.145 1.175 29.08 29.85 N B 0.685 0.715 17.40 18.16 PORT #1 -Q- C 0.305 0.325 7.75 8.26 POSITIVE PRESSURE D 0.016 0.020 0.41 0.51 (P1) F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC B H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 1 2 3 4 L 0.290 0.300 7.37 7.62 PIN 1 K N 0.420 0.440 10.67 11.18 -P- P 0.153 0.159 3.89 4.04 0.25 (0.010) M T Q S S QR 00..125330 00..125590 35..8894 46..0345 J F US 0.202.0910 B0S.2C40 5.2539.11 BS6C.10 C G D4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2202 Sensors 8 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS -A- NOTES: V U 1. DY1IM4.E5NMS, I1O9N8I2N.G AND TOLERANCING PER ANSI R PORT #1 W L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS PORT #2 PORT #2 PORT #1 DIM MIN MAX MIN MAX N V(PA2C)UUM (PPO1S)ITIVE PRESSURE AB 10..164855 10..177155 2197..0480 2198..8156 -Q- C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 SEATING B SEATING G 0.100 BSC 2.54 BSC PLANE PLANE H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 PIN 1 1 2 3 4 K 0.695 0.725 17.65 18.42 K -P- L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 -T- -T- 0.25 (0.010)M T Q S S P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 J F R 0.063 0.083 1.60 2.11 C G S 0.220 0.240 5.59 6.10 D4 PL U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE NOTES: -A- 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. U 2. CONTROLLING DIMENSION: INCH. -T- SPELAATNIENG L INCHES MILLIMETERS DIM MIN MAX MIN MAX R PORT #2 H A 1.145 1.175 29.08 29.85 VACUUM POSITIVE B 0.685 0.715 17.40 18.16 (P2) PRESSURE C 0.305 0.325 7.75 8.26 N (P1) D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 -Q- G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 B L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 1 2 3 4 K Q 0.153 0.158 3.89 4.04 R 0.230 0.250 5.84 6.35 PIN 1 S 0.220 0.240 5.59 6.10 S U 0.910 BSC 23.11 BSC C F -P- G J 0.25 (0.010) M T Q S D 4 PL STYLE 1: PIN 1. GROUND 0.13 (0.005) M T S S Q S 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344D-01 ISSUE B UNIBODY PACKAGE MPX2202 Sensors Freescale Semiconductor, Inc. 9

Pressure PACKAGE DIMENSIONS CASE 1351-01 PAGE 1 OF 2 ISSUE A SMALL OUTLINE PACKAGE MPX2202 Sensors 10 Freescale Semiconductor, Inc.

Pressure PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2202 Sensors Freescale Semiconductor, Inc. 11

Pressure CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2202 Sensors 12 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2202 Sensors Freescale Semiconductor, Inc. 13

Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2202 Sensors 14 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2202 Sensors Freescale Semiconductor, Inc. 15

Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK MPX2202 Sensors 16 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK MPX2202 Sensors Freescale Semiconductor, Inc. 17

Pressure REVISION HISTORY Revision Revision Description of changes number date 7 01/2012 • In Table 1. Operating Characteristics, in the Characteristic column under Pressure Range, added rows for Absolute Pressure Range MPX2202A and Differential Pressure Range MPX2202D devices 8 10/2012 (cid:129) Deleted references to device nu mber MPXV2022GC6U throughout the document MPX2202 Sensors Freescale Semiconductor, Inc. 18

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: MPX2200GP MPXV2202GP MPXM2202D MPXV2202GC6T1 MPXM2202A MPXM2202GS MPXV2202DP MPX2202AP MPX2200D MPX2200A MPX2200DP MPX2202GP MPX2202ASX MPX2200AP MPXM2202GST1 MPXM2202DT1 MPX2202DP MPXM2202AS MPX2202A MPXV2202GC6U MPXV2202DPT1