Pressure Freescale Semiconductor MPX2053 Data Sheet: Technical Data Rev 9, 10/2012 50 kPa On-Chip Temperature MPX2053 Compensated and Calibrated Series Silicon Pressure Sensors 0 to 50 kPa (0 to 7.25 psi) The MPX2053 series devices are silicon piezoresistive pressure sensors 40 mV Full Scale that provide a highly accurate and linear voltage output directly proportional to the (Typical) applied pressure. A single, monolithic silicon diaphragm with the strain gauge and an integrated thin-film resistor network. Precise span and offset calibration with temperature compensation are achieved by laser trimming. Application Examples Features • Temperature Compensated Over 0C to +85C • Pump/Motor Control • Easy-to-Use Chip Carrier Package Options • Robotics • Ratiometric to Supply Voltage • Level Detectors • Gauge Ported and Non Ported Options • Medical Diagnostics • Available in Easy-to-Use Tape & Reel • Pressure Switching • Differential and Gauge Pressure Options • Blood Pressure Measurement ORDERING INFORMATION # of Ports Pressure Type Device Name Case No. Device Marking None Single Dual Gauge Differential Absolute Small Outline Package (MPXV2053G Series) MPXV2053GP 1369 • • MPXV2053GP MPXV2053DP 1351 • • MPXV2053DP Unibody Package (MPX2053 Series) MPX2053D 344 • • MPX2053D MPX2053DP 344C • • MPX2053DP MPX2053GP 344B • • MPX2053GP MPAK Package (MPXM2053 Series) MPXM2053D 1320 • • MPXM2053D MPXM2053DT1 1320 • • MPXM2053D MPXM2053GS 1320A • • MPXM2053GS MPXM2053GST1 1320A • • MPXM2053GS © 2005-2009, 2012 Freescale Semiconductor Inc. All rights reserved.

Pressure UNIBODY PACKAGES MPX2053D MPX2053GP MPX2053DP CASE 344-15 CASE 344B-01 CASE 344C-01 SMALL OUTLINE PACKAGES MPXV2053GP MPXV2053DP CASE 1369-01 CASE 1351-01 MPAK PACKAGES MPXM2053D/DT1 MPXM2053GS/GST1 CASE 1320-02 CASE 1320A-02 MPX2053 Sensors Freescale Semiconductor, Inc. 2

Pressure Operating Characteristics Table1. Operating Characteristics (V = 10 V , T = 25°C unless otherwise noted, P1 > P2) S DC A Characteristic Symbol Min Typ Max Units Pressure Range(1) P 0 — 50 kPa OP Supply Voltage(2) V — 10 16 V S DC Supply Current I — 6.0 — mAdc O Full Scale Span(3) V 38.5 40 41.5 mV FS Offset(4) — –1.0 — 1.0 mV Sensitivity — V/P — 0.8 — Non-Linearity — –0.6 — 0.4 %V FS Pressure Hysteresis (0 to 50 kPa) — — 0.1 — %V FS Temperature Hysteresis (-40° to 125°C) — — 0.5 — %V FS Temperature Coefficient of Full Scale TCV –2.0 — 2.0 %V FS FS Temperature Coefficient of Offset TCV –1.0 — 1.0 mV OFF Input Impedance Z 1000 — 2500  IN Output Impedance Z 1400 — 3000  OUT Response Time(5) (10% to 90%) t — 1.0 — ms R Warm-Up Time — — 20 — ms Offset Stability(6) — — 0.5 — %V FS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 4. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Maximum Ratings Table2. Maximum Ratings(1) Rating Max Value Unit Supply Voltage 16 V Pressure (P1 > P2) 200 kPa Storage Temperature –40 to +125 C Operating Temperature Range –40 to +125 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX2053 Sensors 3 Freescale Semiconductor, Inc.

Pressure Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S 3 Thin Film X-ducer Temperature 2 V Sensing Compensation out+ Element and 4 V Calibration out- 1 GND Figure1. Temperature Compensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The differential voltage output of the sensor is directly side relative to the vacuum side. Similarly, output voltage proportional to the differential pressure applied. increases as increasing vacuum is applied to the vacuum The output voltage of the differential or gauge sensor side relative to the pressure side. increases with increasing pressure applied to the pressure On-Chip Temperature Compensation and Calibration Figure2 shows the minimum, maximum and typical output A silicone gel isolates the die surface and wire bonds from characteristics of the MPX2053 series at 25C. The output is the environment, while allowing the pressure signal to be directly proportional to the differential pressure and is transmitted to the silicon diaphragm. essentially a straight line. 40 V = 10 Vdc S 35 TA = 25C c) 30 TYP d V 25 SPAN m MAX ut ( 20 R(ATNYPG)E utp 15 O 10 MIN 5 0 -5 OFFSET kPa 0 12.5 25 37.5 50 (TYP) PSI 1.8 3.6 5.4 7.25 Figure2. Output vs. Pressure Differential MPX2053 Sensors Freescale Semiconductor, Inc. 4

Pressure LINEARITY Conversely, an end point fit will give the “worst case” error Linearity refers to how well a transducer's output follows (often more desirable in error budget calculations) and the the equation: V = V + sensitivity x P over the operating calculations are more straightforward for the user. The out off pressure range. There are two basic methods for calculating specified pressure sensor linearities are based on the end nonlinearity: (1) end point straight line fit (see Figure3) or point straight line method measured at the midrange (2)a least squares best line fit. While a least squares fit gives pressure. the “best case” linearity error (lower numerical value), the calculations required are burdensome. Least Least Squares Fit Square Exaggerated Deviation Performance Straight Line ut p ut O e g a olt V e ativ End Point Rel Straight Line Fit OFFSET 0 50 100 Pressure (% Full scale) Figure3. Linearity Specification Comparison Figure4 illustrates the differential or gauge configuration are based on use of dry air as the pressure media. Media in the basic chip carrier (Case 344). A silicone gel isolates the other than dry air may have adverse effects on sensor die surface and wire bonds from the environment, while performance and long term reliability. Contact the factory for allowing the pressure signal to be transmitted to the silicon information regarding media compatibility in your application. diaphragm. Refer to application note AN3728, for more information The MPX2053 series pressure sensor operating regarding media compatibility. characteristics and internal reliability and qualification tests Stainless Steel Silicone Metal Cover Die Coat Die P1 Epoxy Wire Bond Case Lead Frame RTV Die Bond P2 Figure4. Unibody Package — Cross-Sectional Diagram (Not to Scale) MPX2053 Sensors 5 Freescale Semiconductor, Inc.

PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME R Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD M STOP RING. MOLD STOP RING NOT TO EXCEED Z 16.00 (0.630). 1 4 B -A- 2 3 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.595 0.630 15.11 16.00 N B 0.514 0.534 13.06 13.56 PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 -T- F 0.048 0.064 1.22 1.63 SEATING G 0.100 BSC 2.54 BSC PLANE F J 0.014 0.016 0.36 0.40 J G L 0.695 0.725 17.65 18.42 F Y M 30˚ NOM 30˚ NOM D4 PL N 0.475 0.495 12.07 12.57 0.136 (0.005) M T A M DAMBAR TRIM ZONE: R 0.430 0.450 10.92 11.43 THIS IS INCLUDED Y 0.048 0.052 1.22 1.32 WITHIN DIM. "F" 8 PL Z 0.106 0.118 2.68 3.00 STYLE 1: STYLE 2: STYLE 3: PIN 1. GROUND PIN 1. VCC PIN 1. GND 2. + OUTPUT 2. - SUPPLY 2. -VOUT 3. + SUPPLY 3. + SUPPLY 3. VS 4. - OUTPUT 4. GROUND 4. +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: SEATING -T- -A- 1. DIMENSIONING AND TOLERANCING PER ANSI PLANE U Y14.5M, 1982. R L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.145 1.175 29.08 29.85 N B 0.685 0.715 17.40 18.16 PORT #1 -Q- C 0.305 0.325 7.75 8.26 POSITIVE PRESSURE D 0.016 0.020 0.41 0.51 (P1) F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC B H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 1 2 3 4 L 0.290 0.300 7.37 7.62 PIN 1 K N 0.420 0.440 10.67 11.18 -P- P 0.153 0.159 3.89 4.04 0.25 (0.010) M T Q S S QR 00..125330 00..125590 35..8894 46..0345 J F US 0.202.0910 B0S.2C40 5.2539.11 BS6C.10 C G D4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2053 Sensors 6 Freescale Semiconductor, Inc.

PACKAGE DIMENSIONS -A- NOTES: V U 1. DY1IM4.E5NMS, I1O9N8I2N.G AND TOLERANCING PER ANSI R PORT #1 W L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS PORT #2 PORT #2 PORT #1 DIM MIN MAX MIN MAX N V(PA2C)UUM (PPO1S)ITIVE PRESSURE AB 10..164855 10..177155 2197..0480 2198..8156 -Q- C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 SEATING B SEATING G 0.100 BSC 2.54 BSC PLANE PLANE H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 PIN 1 1 2 3 4 K 0.695 0.725 17.65 18.42 K -P- L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 -T- -T- 0.25 (0.010)M T Q S S P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 J F R 0.063 0.083 1.60 2.11 C G S 0.220 0.240 5.59 6.10 D4 PL U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE MPX2053 Sensors Freescale Semiconductor, Inc. 7

PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2053 Sensors Freescale Semiconductor, Inc. 8

PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2053 Sensors 9 Freescale Semiconductor, Inc.

PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE D SMALL OUTLINE PACKAGE MPX2053 Sensors Freescale Semiconductor, Inc. 10

PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE D SMALL OUTLINE PACKAGE MPX2053 Sensors Freescale Semiconductor, Inc. 11

PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1320-02 ISSUE B MPX2053 Sensors Freescale Semiconductor, Inc. 12

PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1320-02 ISSUE B MPX2053 Sensors Freescale Semiconductor, Inc. 13

Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 PAGE 1 OF 2 CASE 1320A-02 ISSUE A MPX2053 Sensors Freescale Semiconductor, Inc. 14

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1320A-02 ISSUE A MPX2053 Sensors 15 Freescale Semiconductor, Inc.

Pressure Table3. Revision History Revision Revision Description of changes number date 9 10/2012 • Deleted references to device number MPXV2053GVP throughout the document MPX2053 Sensors Freescale Semiconductor, Inc. 16

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