Pressure Freescale Semiconductor MPX2010 Rev 13, 10/2008 +10 kPa On-Chip Temperature MPX2010 Compensated and Calibrated Series Silicon Pressure Sensors 0 to 10 kPa (0 to 1.45 psi) The MPX2010 series silicon piezoresistive pressure sensors provide a very 25 mV Full Scale accurate and linear voltage output directly proportional to the applied pressure. (Typical) These sensors house a single monolithic silicon die with the strain gauge and thin film resistor network integrated. The sensor is laser trimmed for precise span, offset calibration and temperature compensation. Application Examples Features • Respiratory Diagnostics • Temperature Compensated over 0°C to +85°C • Air Movement Control • Ratiometric to Supply Voltage • Controllers • Differential and Gauge Options • Pressure Switching • Available in Easy-to-Use Tape & Reel ORDERING INFORMATION Package Case # of Ports Pressure Type Device Name Device Marking Options No. None Single Dual Gauge Differential Absolute Small Outline Package (MPXV2010 Series) MPXV2010GP Tray 1369 • • MPXV2010GP MPXV2010DP Tray 1351 • • MPXV2010DP Unibody Package (MPX2010 Series) MPX2010D Tray 344 • • MPX2010D MPX2010DP Tray 344C • • MPX2010DP MPX2010GP Tray 344B • • MPX2010GP MPX2010GS Tray 344E • • MPX2010D MPX2010GSX Tray 344F • • MPX2010D MPAK Package (MPXM2010 Series) MPXM2010D Rail 1320 • • MPXM2010D MPXM2010DT1 Tape and Reel 1320 • • MPXM2010D MPXM2010GS Rail 1320A • • MPXM2010GS MPXM2010GST1 Tape and Reel 1320A • • MPXM2010GS SMALL OUTLINE PACKAGES MPAK PACKAGES MPXV2010GP MPXV2010DP MPXM2010D/DT1 MPXM2010GS/GST1 CASE 1369-01 CASE 1351-01 CASE 1320-02 CASE 1320A-02 UNIBODY PACKAGES MPX2010D MPX2010GP MPX2010DP MPX2010GS MPX2010GSX CASE 344-15 CASE 344B-01 CASE 344C-01 CASE 344E-01 CASE 344F-01 © Freescale Semiconductor, Inc., 2005-2008. All rights reserved.

Pressure Operating Characteristics Table1. Operating Characteristics (V = 10 V , T = 25°C unless otherwise noted, P1 > P2) S DC A Characteristic Symbol Min Typ Max Units Pressure Range(1) P 0 — 10 kPa OP Supply Voltage(2) V — 10 16 V S DC Supply Current I — 6.0 — mAdc O Full Scale Span(3) V 24 25 26 mV FSS Offset(4) V –1.0 — 1.0 mV OFF Sensitivity ΔV/ΔΡ — 2.5 — mV/kPa Linearity — –1.0 — 1.0 %V FSS Pressure Hysteresis (0 to 10 kPa) — — ±0.1 — %VFSS Temperature Hysteresis (–40°C to +125°C) — — ±0.5 — %VFSS Temperature Coefficient on Full Scale Span TCV –1.0 — 1.0 %V FSS FSS Temperature Coefficient on Offset TCV –1.0 — 1.0 mV OFF Input Impedance ZIN 1300 — 2550 Ω Output Impedance ZOUT 1400 — 3000 Ω Response Time(5) (10% to 90%) t — 1.0 — ms R Warm-Up Time — — 20 — ms Offset Stability(6) — — ±0.5 — %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device at a different range may induce additional error due to device self-heating. 3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 4. Offset (V ) is defined as the output voltage at the minimum rated pressure. OFF 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2010 Sensors 2 Freescale Semiconductor

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 75 kPa MAX Burst Pressure (P1 > P2) P 100 kPa BURST Storage Temperature TSTG –40 to +125 °C Operating Temperature TA –40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output versus Applied Differential Pressure The output voltage of the differential or gauge sensor Figure1. shows a block diagram of the internal circuitry on increases with increasing pressure applied to the pressure the stand-alone pressure sensor chip. side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). V S 3 Thin Film 2 Temperature +VOUT Sensing Compensation Element and Calibration 4 –V OUT Circuitry 1 GND Figure1. Temperature Compensated and Calibrated Pressure Sensor Schematic MPX2010 Sensors Freescale Semiconductor 3

Pressure On-Chip Temperature Compensation and Calibration Figure2. shows the output characteristics of the MPX2010 performance and long term reliability. Contact the factory for series at 25°C. The output is directly proportional to the information regarding media compatibility in your application. differential pressure and is essentially a straight line. LINEARITY The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. Linearity refers to how well a transducer's output follows This performance over temperature is achieved by having the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating both the shear stress strain gauge and the thin-film resistor nonlinearity: (1) end point straight line fit (see Figure4.) or circuitry on the same silicon diaphragm. Each chip is (2)a least squares best line fit. While a least squares fit gives dynamically laser trimmed for precise span and offset calibration and temperature compensation. the “best case” linearity error (lower numerical value), the Figure3. illustrates the differential/gauge die in the basic calculations required are burdensome. chip carrier (Case 344). A silicone gel isolates the die surface Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the and wire bonds from the environment, while allowing the calculations are more straightforward for the user. pressure signal to be transmitted to the silicon diaphragm. Freescale’s specified pressure sensor linearities are based The MPX2010 series pressure sensor operating on the end point straight line method measured at the characteristics and internal reliability and qualification tests midrange pressure. are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor V = 10 Vdc 30 S TA = 25°C 25 P1 > P2 20 TYP Vdc) 15 aMAX Span m Range ut ( 10 (Typical) p ut O 5 MIN 0 –5 Offset kPa 2.5 5 7.5 10 (Typical) PSI 0.362 0.725 1.09 1.45 Figure2. Output vs. Pressure Differential Least Least Squares Fit Square Deviation Exaggerated Performance Stainless Steel Curve Straight Line DSiieli cCoonaet Die Metal Cover utput Deviation O P1 Epoxy e g Wire Bond Case olta V e v ati End Point Straight Rel Line Fit Lead Frame RTV Die Bond P2 Offset 0 50 100 Pressure (% Full Scale) Figure3. Unibody Package: Cross Sectional Diagram Figure4. Linearity Specification Comparison (not to scale) MPX2010 Sensors 4 Freescale Semiconductor

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor Table3. Pressure (P1) Side Delineation as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which Case Part Number Pressure (P1) Side Identifier isolates the die from the environment. The pressure sensor is Type designed to operate with positive differential pressure MPX2010D 344 Stainless Steel Cap applied, P1 > P2. The Pressure (P1) side may be identified by using the MPX2010DP 344C Side with Part Marking following table. MPX2010GP 344B Side with Port Attached MPX2010GS 344E Side with Port Attached MPX2010GSX 344F Side with Port Attached MPXV2010GP 1369 Side with Port Attached MPXV2010DP 1351 Side with Part Marking MPXM2010D/DTI 1320 Side with Part Marking MPXM2010GS/GSTI 1320A Side with Port Attached MPX2010 Sensors Freescale Semiconductor 5

Pressure PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME R Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD M STOP RING. MOLD STOP RING NOT TO EXCEED Z 16.00 (0.630). 1 4 B -A- 2 3 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.595 0.630 15.11 16.00 N B 0.514 0.534 13.06 13.56 PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 -T- F 0.048 0.064 1.22 1.63 SEATING G 0.100 BSC 2.54 BSC PLANE F J 0.014 0.016 0.36 0.40 J G L 0.695 0.725 17.65 18.42 F Y M 30˚ NOM 30˚ NOM D4 PL N 0.475 0.495 12.07 12.57 0.136 (0.005) M T A M DAMBAR TRIM ZONE: R 0.430 0.450 10.92 11.43 THIS IS INCLUDED Y 0.048 0.052 1.22 1.32 WITHIN DIM. "F" 8 PL Z 0.106 0.118 2.68 3.00 STYLE 1: STYLE 2: STYLE 3: PIN 1. GROUND PIN 1. VCC PIN 1. GND 2. + OUTPUT 2. - SUPPLY 2. -VOUT 3. + SUPPLY 3. + SUPPLY 3. VS 4. - OUTPUT 4. GROUND 4. +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: SEATING -T- -A- 1. DIMENSIONING AND TOLERANCING PER ANSI PLANE U Y14.5M, 1982. R L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.145 1.175 29.08 29.85 N B 0.685 0.715 17.40 18.16 PORT #1 -Q- C 0.305 0.325 7.75 8.26 POSITIVE PRESSURE D 0.016 0.020 0.41 0.51 (P1) F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC B H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 1 2 3 4 L 0.290 0.300 7.37 7.62 PIN 1 K N 0.420 0.440 10.67 11.18 -P- P 0.153 0.159 3.89 4.04 0.25 (0.010) M T Q S S QR 00..125330 00..125590 35..8894 46..0345 J F US 0.202.0910 B0S.2C40 5.2539.11 BS6C.10 C G D4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2010 Sensors 6 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS -A- NOTES: V U 1. DY1IM4.E5NMS, I1O9N8I2N.G AND TOLERANCING PER ANSI R PORT #1 W L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS PORT #2 PORT #2 PORT #1 DIM MIN MAX MIN MAX N V(PA2C)UUM (PPO1S)ITIVE PRESSURE AB 10..164855 10..177155 2197..0480 2198..8156 -Q- C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 SEATING B SEATING G 0.100 BSC 2.54 BSC PLANE PLANE H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 PIN 1 1 2 3 4 K 0.695 0.725 17.65 18.42 K -P- L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 -T- -T- 0.25 (0.010)M T Q S S P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 J F R 0.063 0.083 1.60 2.11 C G S 0.220 0.240 5.59 6.10 D4 PL U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE CASE 344E-01 ISSUE B UNIBODY PACKAGE MPX2010 Sensors Freescale Semiconductor 7

Pressure PACKAGE DIMENSIONS -T- NOTES: C A 1. DIMENSIONING AND TOLERANCING PER ANSI -Q- Y14.5M, 1982. E U 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 N D 0.016 0.020 0.41 0.51 V B E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 R G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 PORT #1 PIN 1 K 0.220 0.240 5.59 6.10 POSITIVE -P- N 0.070 0.080 1.78 2.03 PRESSURE P 0.150 0.160 3.81 4.06 (P1) 0.25 (0.010) M T Q M 4 3 2 1 S Q 0.150 0.160 3.81 4.06 R 0.440 0.460 11.18 11.68 S 0.695 0.725 17.65 18.42 K U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.92 J F G D4 PL STYPLINE 11.: GROUND 0.13 (0.005) M T P S Q S 2. V (+) OUT 3. V SUPPLY 4. V (-) OUT CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2010 Sensors 8 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2010 Sensors Freescale Semiconductor 9

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2010 Sensors 10 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2010 Sensors Freescale Semiconductor 11

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2010 Sensors 12 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK MPX2010 Sensors Freescale Semiconductor 13

Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE A MPAK MPX2010 Sensors 14 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK MPX2010 Sensors Freescale Semiconductor 15

Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE A MPAK MPX2010 Sensors 16 Freescale Semiconductor

How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Information in this document is provided solely to enable system and software Freescale Halbleiter Deutschland GmbH Technical Information Center implementers to use Freescale Semiconductor products. There are no express or Schatzbogen 7 implied copyright licenses granted hereunder to design or fabricate any integrated 81829 Muenchen, Germany circuits or integrated circuits based on the information in this document. +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) Freescale Semiconductor reserves the right to make changes without further notice to +33 1 69 35 48 48 (French) any products herein. Freescale Semiconductor makes no warranty, representation or www.freescale.com/support guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any Japan: product or circuit, and specifically disclaims any and all liability, including without Freescale Semiconductor Japan Ltd. limitation consequential or incidental damages. “Typical” parameters that may be Headquarters provided in Freescale Semiconductor data sheets and/or specifications can and do vary ARCO Tower 15F in different applications and actual performance may vary over time. All operating 1-8-1, Shimo-Meguro, Meguro-ku, parameters, including “Typicals”, must be validated for each customer application by Tokyo 153-0064 Japan customer’s technical experts. Freescale Semiconductor does not convey any license 0120 191014 or +81 3 5437 9125 under its patent rights nor the rights of others. Freescale Semiconductor products are support.japan@freescale.com not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, Asia/Pacific: or for any other application in which the failure of the Freescale Semiconductor product Freescale Semiconductor China Ltd. could create a situation where personal injury or death may occur. Should Buyer Exchange Building 23F purchase or use Freescale Semiconductor products for any such unintended or No. 118 Jianguo Road unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and Chaoyang District its officers, employees, subsidiaries, affiliates, and distributors harmless against all Beijing 100022 China claims, costs, damages, and expenses, and reasonable attorney fees arising out of, +86 010 5879 8000 directly or indirectly, any claim of personal injury or death associated with such support.asia@freescale.com unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. Denver, Colorado 80217 All other product or service names are the property of their respective owners. 1-800-441-2447 or +1-303-675-2140 © Freescale Semiconductor, Inc. 2008. All rights reserved. Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPX2010 Rev. 13 10/2008

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: MPX2010D MPXM2010DT1 MPXV2010DP MPX2010DP MPXV2010GP MPXM2010D MPXM2010GST1 MPXM2010GS MPX2010GSX MPX2010GP