Freescale Semiconductor Document Number: MPXH6300A Data Sheet: Technical Data Rev. 6.0, 09/2015 MPXH6300A, 20 to 300 kPa, Absolute, Integrated, Pressure Sensor MPXH6300A Freescale's MPXH6300A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip Super small outline package integration make the Freescale pressure sensor a logical and economical choice for the system designer. The MPXH6300A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXH6300A6U/6T1 MPXH6300AC6U/6T1 Case 98ARH99066A Case 98ARH99089A Features • Improved accuracy at high temperature • Available in super small outline package Top view • 1.5% maximum error over 0 °C to 85°C • Fully calibrated and compensated DNC 5 4 V • Ideally suited for microprocessor or microcontroller-based systems OUT DNC 6 3 GND • Temperature compensated from -40°C to +125°C DNC 7 2 V S • Durable thermoplastic surface mount package DNC 8 1 DNC • Package porting and mounting options enable tube attachment for liquefied natural gas (LPG) or remote sensing applications Typical applications Pin 1 identification, • Fuel injected car engines chamfered corner. • Vehicles powered by green gases (for example LPG and CNG) Pinout • Small engines • Industrial controls Ordering information # of Ports Pressure type Device Part number Shipping Package None Single Dual Gauge Differential Absolute marking MPXH6300A6U Rail 98ARH99066A • • MPXH6300A MPXH6300A6T1 Tape and Reel 98ARH99066A • • MPXH6300A MPXH6300AC6U Rail 98ARH99089A • • MPXH6300A MPXH6300AC6T1 Tape and Reel 98ARH99089A • • MPXH6300A Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2007, 2010, 2012, 2015 Freescale Semiconductor, Inc. All rights reserved.

Contents 1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Pressure (P1)/Vacuum (P2) Side Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.3 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Related Documentation The MPXH6300A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. In the Keyword search box at the top of the page, enter the device number MPXH6300A. 3. In the Refine Your Result pane on the left, click on the Documentation link. MPXH6300A Sensors 2 Freescale Semiconductor, Inc.

1 General Description 1.1 Block diagram Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S Thin Film Gain Stage #2 Temperature and ESleenmseinngt Compensation Ground VOUT and Reference Gain Stage #1 Shift Circuitry Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. GND Figure1. Integrated pressure sensor block diagram 1.2 Pinout DNC 5 4 V OUT DNC 6 3 GND DNC 7 2 V S DNC 8 1 DNC Pin 1 identification, chamfered corner. Figure2. Device pinout (top view) Table1. Pin functions Pin Name Function 1 DNC Do not connect to external circuitry or ground. Pin 1 is notated by chamfered corner. 2 V Voltage supply S 3 GND Ground 4 V Output voltage OUT 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. MPXH6300A Sensors Freescale Semiconductor, Inc. 3

2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table2. Maximum ratings(1) Parametrics Symbol Value Units Maximum pressure (P1 > P2) Pmax 1200 kPa Storage temperature Tstg -40 to +125 °C Operating temperature TA -40 to +125 °C Output source current @ full-scale output(2) Io+ 0.5 mAdc Output sink current @ minimum pressure offset(2) Io- -0.5 mAdc 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.Maximum output current is controlled by effective impedance from V to GND or V to V in the application circuit. OUT OUT S 2.2 Operating characteristics Table3. Operating characteristics (V = 5.1 V , T = 25 °C unless otherwise noted, P1 > P2.) S DC A Characteristic Symbol Min Typ Max Unit Pressure range POP 20 — 304 kPa Supply voltage(1) VS 4.74 5.1 5.46 VDC Supply current IO — 6.0 10 mAdc Minimum pressure offset(2) (0 to 85°C) @ VS = 5.1 Volts VOFF 0.241 0.306 0.371 VDC Full-scale output(3) (0 to 85°C) @ VS = 5.1 Volts VFSO 4.847 4.912 4.977 VDC Full-scale span(4) (0 to 85°C) @ VS = 5.1 Volts VFSS 4.476 4.606 4.736 VDC Accuracy(5) (0 to 85°C) — — — ±1.5 %VFSS Sensitivity V/P — 16.2 — mV/kPa Response time(6) tR — 1.0 — ms Warm-up time(7) — — 20 — ms Offset stability(8) — — ±0.25 — %VFSS 1.Device is ratiometric within this specified excitation range. 2.Offset (V ) is defined as the output voltage at the minimum rated pressure. OFF 3.Full-scale output (V ) is defined as the output voltage at the maximum or full-rated pressure. FSO 4.Full-scale span (V ) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the FSS minimum rated pressures 5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C TcSpan: Output deviation over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C. Variation from Nominal: The variation from nominal values, for offset or full-scale span, as a percent of V , at 25°C. FSS 6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. MPXH6300A Sensors 4 Freescale Semiconductor, Inc.

3 On-chip Temperature Compensation and Calibration Figure3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A). Figure4 shows a typical application circuit (output source current operation). Figure5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXH6300A pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluorosilicone Gel Die Coat Stainless Steel Die Cap P1 Thermoplastic Wire Bond Case Lead frame Absolute Element Die Bond Sealed Vacuum Reference Figure3. Cross-sectional diagram (not-to-scale) +5.1 V V S VOUT To ADC 100 nF 1 μF GND 47 pF 51 K Figure4. Recommended power supply decoupling and output filtering MPXH6300A Sensors Freescale Semiconductor, Inc. 5

5.0 Transfer Function: 4.5 V = V *(.00318*P-.00353) ± Error OUT S 4.0 V = 5.1 Vdc S Temperature = 0 to 85°C 3.5 s) 3.0 olt V ut ( 2.5 MAX TYP p ut 2.0 O 1.5 1.0 MIN 0.5 0 05050505050505050504 23568912457801346790 11111122222223 Pressure (Reference to Sealed Vacuum) in kPa Figure5. Output vs. absolute pressure Nominal Transfer Value: V = V x (0.00318 x P - 0.00353) out S ± (Pressure Error x Temp Factor x 0.00318 x V ) S V = 5.1 ± 0.36 Vdc S Figure6. Transfer function 4.0 Break Points or ct Temp Multiplier a F 3.0 or -40 3 Err 0 to 85 1 ure 2.0 125 3 at er p m e 1.0 T 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C. Figure7. Temperature error band 4.0 Error Limits for Pressure 3.0 a) 2.0 P k or ( 1.0 Err 0.0 Pressure (in kPa) e 20 60 100 140 180 220 260 300 sur -1.0 s e Pr -2.0 -3.0 Pressure Error (Max) 20 to 304 (kPa) ±4.0 (kPa) -4.0 Figure8. Pressure error band MPXH6300A Sensors 6 Freescale Semiconductor, Inc.

4 Package Information 4.1 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.050 0.387 1.27 9.83 TYP 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X inch 1.35 mm Figure9. SSOP footprint MPXH6300A Sensors Freescale Semiconductor, Inc. 7

4.2 Package Dimensions This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf. Case 98ARH99066A, super small outline package, surface mount MPXH6300A Sensors 8 Freescale Semiconductor, Inc.

Case 98ARH99066A, super small outline package, surface mount MPXH6300A Sensors Freescale Semiconductor, Inc. 9

Case 98ARH99066A, super small outline package, surface mount MPXH6300A Sensors 10 Freescale Semiconductor, Inc.

This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf. Case 98ARH99089A, super small outline package, surface mount MPXH6300A Sensors Freescale Semiconductor, Inc. 11

Case 98ARH99089A, super small outline package, surface mount MPXH6300A Sensors 12 Freescale Semiconductor, Inc.

5 Revision History Table4. Revision history Revision Revision Description number date 5.1 05/2012 • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H. • Corrected figure 4. 6.0 09/2015 • Updated format. MPXH6300A Sensors Freescale Semiconductor, Inc. 13

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