Pressure Freescale Semiconductor MPX5700 Data Sheet: Technical Data Rev 10, 10/2012 Integrated Silicon Pressure Sensor MPX5700 On-Chip Signal Conditioned, Series Temperature Compensated and Calibrated 0 to 700 kPa (0 to 101.5 psi) 15 to 700 kPa (2.18 to 101.5 psi) 0.2 to 4.7 V Output The MPX5700 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features • 2.5% Maximum Error over 0 to 85C • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Available in Absolute, Differential and Gauge Configurations • Patented Silicon Shear Stress Strain Gauge • Durable Epoxy Unibody Element ORDERING INFORMATION Case # of Ports Pressure Type Device Device Name No. None Single Dual Gauge Differential Absolute Name Unibody Package (MPX5700 Series) MPX5700A 867 • • MPX5700A MPX5700AP 867B • • MPX5700AP MPX5700AS 867E • • MPX5700A MPX5700ASX 867F • • MPX5700A MPX5700D 867 • • MPX5700D MPX5700DP 867C • • MPX5700DP MPX5700GP 867B • • MPX5700GP MPX5700GP1(1) 867B • • MPX5700GP MPX5700GS 867E • • MPX5700D 1. MPX5700GP1 has 90 degree lead form. UNIBODY PACKAGES MPX5700A/D MPX5700AP/GP/GP1 MPX5700DP MPX5700AS/GS MPX5700ASX CASE 867-08 CASE 867B-04 CASE 867C-05 CASE 867E-03 CASE 867F-03 © 2007-2009, 2012 Freescale Semiconductor, Inc. All rights reserved.

Pressure Operating Characteristics Table1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) Gauge, Differential: MPX5700D P 0 — 700 kPa OP Absolute: MPX5700A 15 — 700 Supply Voltage(2) V 4.75 5.0 5.25 Vdc S Supply Current I — 7.0 10 mAdc O Zero Pressure Offset(3) Gauge, Differential (0 to 85C) V 0.088 0.2 0.313 Vdc off Absolute (0 to 85C) 0.184 — 0.409 Full Scale Output(4) (0 to 85C) V 4.587 4.7 4.813 Vdc FSO Full Scale Span(5) (0 to 85C) V — 4.5 — Vdc FSS Accuracy(6) (0 to 85C) — — — 2.5 %V FSS Sensitivity V/P — 6.4 — mV/kPa Response Time(7) t — 1.0 — ms R Output Source Current at Full Scale Output I — 0.1 — mAdc O+ Warm-Up Time(8) — — 20 — ms 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 4. Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure. FSO 5. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 6. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V , at 25°C. FSS 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. MPX5700 Sensors 2 Freescale Semiconductor, Inc.

Pressure Maximum Ratings Table2. Maximum Ratings(1) Parametrics Symbol Value Unit Maximum Pressure(2) (P2  1 Atmosphere) P1 2800 kPa max Storage Temperature T -40 to +125 C stg Operating Temperature T -40 to +125 C A 1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa. Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S 3 Thin Film Gain Stage #2 Temperature and 1 Sensing Compensation Ground Vout Element and Reference Gain Stage #1 Shift Circuitry 2 Pins 4, 5, and 6 are no connects GND Figure1. Fully Integrated Pressure Sensor Schematic MPX5700 Sensors Freescale Semiconductor, Inc. 3

Pressure On-chip Temperature Compensation and Calibration Figure3. illustrates both the Differential/Gauge and the performance and long-term reliability. Contact the factory for Absolute Sensing Chip in the basic chip carrier (Case 867). information regarding media compatibility in your application. Afluorosilicone gel isolates the die surface and wire bonds Figure2. shows the sensor output signal relative to from the environment, while allowing the pressure signal to pressure input. Typical, minimum, and maximum output be transmitted to the sensor diaphragm. (For use of the curves are shown for operation over a temperature range of MPX5700D in a high-pressure cyclic application, consult the 0 to 85C using the decoupling circuit shown in . The output factory.) will saturate outside of the specified pressure range. The MPX5700 series pressure sensor operating shows the recommended decoupling circuit for interfacing characteristics, and internal reliability and qualification tests the output of the integrated sensor to the A/D input of a are based on use of dry air as the pressure media. Media, microprocessor or microcontroller. Proper decoupling of the other than dry air, may have adverse effects on sensor power supply is recommended. 5.0 Transfer Function: 4.5 V = V *(0.0012858*P+0.04) ± Error out S 4.0 V = 5.0 Vdc S Temperature = 0 to 85°C 3.5 Typical V) 3.0 put ( 2.5 Out Maximum Minimum 2.0 1.5 1.0 0.5 0 0 100 200 300 400 500 600 700 800 Differential Pressure (kPa) Figure2. Output vs. Pressure Differential Fluoro Silicone Fluoro Silicone Stainless Steel Stainless Steel Die Coat Die Coat Metal Cover Metal Cover Die Die Wire Bond P1 Wire Bond P1 Lead Frame RTV Die Lead Frame RTV Die P2 P2 Epoxy Case Bond Epoxy Case Bond DIFFERENTIAL/GAUGE ELEMENT ABSOLUTE ELEMENT Figure3. Cross-Sectional Diagrams (not to scale) +5 V V Output out V s IPS 1.0 F 0.01 F GND 470 pF Figure4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5700 Sensors 4 Freescale Semiconductor, Inc.

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor pressure sensor is designed to operate with positive as the Pressure (P1) side and the Vacuum (P2) side. The differential pressure applied, P1 > P2. Pressure (P1) side is the side containing fluorosilicone gel The Pressure (P1) side may be identified by using the which protects the die from harsh media. The Freescale MPX following table. Pressure (P1) Part Number Case Type Side Identifier MPX5700A/D 867 Stainless Steel Cap MPX5700DP 867C Side with Part Marking MPX5700GP/AP 867B Side with Port Attached MPX5700GS/AS 867E Side with Port Attached MPX5700ASX 867F Side with Port Attached MPX5700 Sensors Freescale Semiconductor, Inc. 5

Pressure PACKAGE DIMENSIONS C NOTES: R 1. DIMENSIONING AND TOLERANCING PER POSITIVE PRESSURE ANSI Y14.5M, 1982. (P1) 2. CONTROLLING DIMENSION: INCH. M 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED B -A- 16.00 (0.630). INCHES MILLIMETERS N DIM MIN MAX MIN MAX L PIN 1 A 0.595 0.630 15.11 16.00 SPELAATNIENG -T- 1 2 3 4 5 6 BC 00..521040 00..523240 153..0086 153..5596 D 0.027 0.033 0.68 0.84 J G F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC S F J 0.014 0.016 0.36 0.40 D6 PL L 0.695 0.725 17.65 18.42 0.136 (0.005) M T A M M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 S 0.090 0.105 2.29 2.66 STYLE 1: STYLE 2: STYLE 3: PIN 1. VOUT PIN 1. OPEN PIN 1. OPEN 2. GROUND 2. GROUND 2. GROUND 3. VCC 3. -VOUT 3. +VOUT 4. V1 4. VSUPPLY 4. +VSUPPLY 5. V2 5. +VOUT 5. -VOUT 6. VEX 6. OPEN 6. OPEN CASE 867-08 ISSUE N BASIC ELEMENT NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. P 2. CONTROLLING DIMENSION: INCH. -A- 0.25 (0.010) M T Q M INCHES MILLIMETERS U X DIM MIN MAX MIN MAX W L A 1.145 1.175 29.08 29.85 R B 0.685 0.715 17.40 18.16 V C 0.405 0.435 10.29 11.05 PRPPEOOSSSRITUTI RV#EE1 PPOORRTT ##21 VPAOCSUITUIMVE (P2) DF 00..002478 00..003634 01..6282 01..8643 (P1) N PRESSURE (P1) G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 -Q- K 0.695 0.725 17.65 18.42 PORT #2 L 0.290 0.300 7.37 7.62 VACUUM (P2) N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 B Q 0.153 0.159 3.89 4.04 PIN 1 R 0.063 0.083 1.60 2.11 S 0.220 0.240 5.59 6.10 K U 0.910 BSC 23.11 BSC 1 2 3 4 5 6 V 0.182 0.194 4.62 4.93 C W 0.310 0.330 7.87 8.38 S X 0.248 0.278 6.30 7.06 SEATING -T- -T- SEATING PLANE PLANE G D 6 PL STYLE 1: J F 0.13 (0.005) M A M PIN 12.. VGORUOTUND 3. VCC 4. V1 5. V2 6. VEX CASE 867C-05 ISSUE F PRESSURE AND VACUUM SIDES PORTED (DP) MPX5700 Sensors 6 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) MPX5700 Sensors Freescale Semiconductor, Inc. 7

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) MPX5700 Sensors 8 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS C A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.690 0.720 17.53 18.28 -B- V B 0.245 0.255 6.22 6.48 PIN 1 C 0.780 0.820 19.81 20.82 D 0.027 0.033 0.69 0.84 E 0.178 0.186 4.52 4.72 F 0.048 0.064 1.22 1.63 PORT #1 6 5 4 3 2 1 G 0.100 BSC 2.54 BSC POSITIVE J 0.014 0.016 0.36 0.41 PRESSU(PR1E) K S K 0.345 0.375 8.76 9.53 N 0.300 0.310 7.62 7.87 S 0.220 0.240 5.59 6.10 V 0.182 0.194 4.62 4.93 J G N E F STYLE 1: D6 PL PIN 1. VOUT 2. GROUND -T- 0.13 (0.005) M T B M 3. VCC 4. V1 5. V2 6. VEX CASE 867E-03 ISSUE D PRESSURE SIDE PORTED (AS, GS) -T- NOTES: C A 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. E U -Q- 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 V N D 0.027 0.033 0.68 0.84 B E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 R G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 PORT #1 PIN 1 K 0.220 0.240 5.59 6.10 POSITIVE -P- N 0.070 0.080 1.78 2.03 PRESSURE (P1) 0.25 (0.010) M T Q M 6 5 4 3 2 1 P 0.150 0.160 3.81 4.06 Q 0.150 0.160 3.81 4.06 S R 0.440 0.460 11.18 11.68 K S 0.695 0.725 17.65 18.42 U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.93 J D6 PL G 0.13 (0.005) M T P S Q S STYLE 1: PIN 1. VOUT 2. GROUND F 3. VCC 4. V1 5. V2 6. VEX CASE 867F-03 ISSUE D PRESSURE SIDE AXIAL PORT (ASX) MPX5700 Sensors Freescale Semiconductor, Inc. 9

Pressure Table 3. Revision History Revision Revision Description of changes number date 10 10/2012 • On page 1, added a table note to the Ordering Information table indicating that the device MPX5700GP1 has 90 degree lead form. MPX5700 Sensors 10 Freescale Semiconductor, Inc.

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: MPX5700DP MPX5700GP MPX5700GS MPX5700ASX MPX5700AS MPX5700AP MPX5700GP1 MPX5700A MPX5700D