Pressure Freescale Semiconductor MPX5050 Rev 11, 03/2010 Integrated Silicon Pressure Sensor MPX5050 On-Chip Signal Conditioned, MPXV5050 Temperature Compensated and MPVZ5050 Calibrated Series The MPXx5050 series piezoresistive transducer is a state-of-the-art 0 to 50 kPa (0 to 7.25 psi) monolithic silicon pressure sensor designed for a wide range of applications, 0.2 to 4.7 V Output but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features • 2.5% Maximum Error over 0° to 85°C • Ideally suited for Microprocessor or Microcontroller-Based Systems • Temperature Compensated Over -40° to +125°C • Patented Silicon Shear Stress Strain Gauge • Durable Epoxy Unibody Element • Easy-to-Use Chip Carrier Option ORDERING INFORMATION Case # of Ports Pressure Type Device Device Name No. None Single Dual Gauge Differential Absolute Marking Unibody Package (MPX5050 Series) MPX5050D 867 • • MPX5050D MPX5050DP 867C • • MPX5050DP MPX5050GP 867B • • MPX5050GP MPX5050GP1 867B • • MPX5050GP Small Outline Package (MPXV5050 Series) MPXV5050GP 1369 • • MPXV5050GP MPXV5050DP 1351 • • MPXV5050DP MPXV5050GC6U 482A • • MPXV5050G MPXV5050GC6T1 482A • • MPXV5050G Small Outline Package (Media Resistant Gel) (MPVZ5050 Series) MPVZ5050GW7U 1560 • • MZ5050GW © Freescale Semiconductor, Inc., 2007-2010. All rights reserved.

Pressure UNIBODY PACKAGES MPX5050D MPX5050GP MPX5050DP CASE 867-08 CASE 867B-04 CASE 857C-05 SMALL OUTLINE PACKAGES MPVZ5050GW7U MPXV5100GC6U MPXV5050DP MPXV5050GP CASE 1560-03 CASE 482A-01 CASE 1351-01 CASE 1369-01 MPX5050 Sensors 2 Freescale Semiconductor

Pressure Operating Characteristics Table1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current I — 7.0 10 mAdc o Minimum Pressure Offset(3) (0 to 85°C) Voff 0.088 0.2 0.313 Vdc @ V = 5.0 Volts S Full Scale Output(4) (0 to 85°C) VFSO 4.587 4.7 4.813 Vdc @ V = 5.0 Volts S Full Scale Span(5) (0 to 85°C) VFSS — 4.5 — Vdc @ V = 5.0 Volts S Accuracy(6) (0 to 85°C) — — — ±2.5 %VFSS Sensitivity V/P — 90 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output I — 0.1 — mAdc o+ Warm-Up Time(8) — — 20 — ms Offset Stability(9) — — ±0.5 — %VFSS 1.1.0 kPa (kiloPascal) equals 0.145 psi. 2.Device is ratiometric within this specified excitation range. 3.Offset (V ) is defined as the output voltage at the minimum rated pressure. off 4.Full Scale Output (V ) is defined as the output voltage at the maximum or full rated pressure. FSO 5.Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 6.Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V at 25°C. FSS 7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX5050 Sensors Freescale Semiconductor 3

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 200 kPa max Storage Temperature T -40° to +125° °C stg Operating Temperature T -40° to +125° °C A 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S Thin Film Gain Stage #2 Temperature and Sensing Compensation Ground Vout Element and Reference Gain Stage #1 Shift Circuitry Pins 4, 5, and 6 are NO CONNECTS for Unibody Device GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device Figure1. Fully Integrated Pressure Sensor Schematic MPX5050 Sensors 4 Freescale Semiconductor

Pressure On-chip Temperature Compensation and Calibration Figure3 illustrates the Differential/Gauge Sensing Chip in factory for information regarding media compatibility in your the basic chip carrier (Case 867). A fluorosilicone gel isolates application. the die surface and wire bonds from the environment, while Figure2 shows the sensor output signal relative to allowing the pressure signal to be transmitted to the sensor pressure input. Typical, minimum, and maximum output diaphragm. curves are shown for operation over a temperature range of The MPX5050/MPXV5050G series pressure sensor 0° to 85°C using the decoupling circuit shown in Figure4. The operating characteristics, and internal reliability and output will saturate outside of the specified pressure range. qualification tests are based on use of dry air as the pressure Figure4 shows the recommended decoupling circuit for media. Media, other than dry air, may have adverse effects on interfacing the output of the integrated sensor to the A/D input sensor performance and long-term reliability. Contact the of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. 5.0 Transfer Function: 4.5 V = V *(0.018*P+0.04) ± ERROR out S 4.0 V = 5.0 Vdc S 3.5 TEMP = 0 to 85°C TYPICAL 3.0 V) ut ( 2.5 MAX p ut 2.0 O MIN 1.5 1.0 0.5 0 0 5 10 15 20 25 30 35 40 45 50 55 Differential Pressure (kPa) Figure2. Output vs. Pressure Differential Fluorosilicone Stainless Steel Gel Die Coat Metal Cover Die Epoxy Plastic P1 Wire Bond Case Die Lead Frame Differential/Gauge Element Bond P2 Figure3. Cross-Sectional Diagram (not to scale) +5 V OUTPUT V out V s IPS 1.0 μF 0.01 μF GND 470 pF Figure4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5050 Sensors Freescale Semiconductor 5

Pressure Transfer Function Nominal Transfer Value: V = V (P x 0.018 + 0.04) out S ± (Pressure Error x Temp. Factor x 0.018 x V ) S V = 5.0 V ± 0.25 Vdc S Temperature Error Band 4.0 Temp Multiplier 3.0 –40 3 Temperature 0 to 85 1 Error 2.0 +125 3 Factor 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure Error Band Error Limits for Pressure 3.0 2.0 a) kP 1.0 or ( Err 0.0 Pressure (in kPa) e 0 10 20 30 40 50 60 ur s –1.0 s e Pr –2.0 Pressure Error (Max) –3.0 0 to 50 (kPa) ±1.25 (kPa) PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor sensor is designed to operate with positive differential as the Pressure (P1) side and the Vacuum (P2) side. The pressure applied, P1 > P2. Pressure (P1) side is the side containing fluorosilicone gel The Pressure (P1) side may be identified by using the which protects the die from harsh media. The MPX pressure table below: Part Number Case Type Pressure (P1) Side Identifier MPX5050D 867 Stainless Steel Cap MPX5050DP 867C Side with Part Marking MPX5050GP 867B Side with Port Attached MPXV5050GP 1369 Side with Port Attached MPXV5050DP 1351 Side with Part Marking MPXV5050GC6U/T1 482A Vertical Port Attached MPX5050 Sensors 6 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS –A– D8 PL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 4 0.25 (0.010) M T B S A S Y14.5M, 1982. 5 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD N –B– PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. G 8 INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 S B 0.415 0.425 10.54 10.79 W C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 V K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 C S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 H W 0.115 0.125 2.92 3.17 J –T– PIN 1 IDENTIFIER SEATING K M PLANE CASE 482A-01 ISSUE A UNIBODY PACKAGE C NOTES: R 1. DIMENSIONING AND TOLERANCING PER POSITIVE PRESSURE ANSI Y14.5M, 1982. (P1) 2. CONTROLLING DIMENSION: INCH. M 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED B -A- 16.00 (0.630). INCHES MILLIMETERS N DIM MIN MAX MIN MAX L PIN 1 A 0.595 0.630 15.11 16.00 SPELAATNIENG -T- 1 2 3 4 5 6 BC 00..521040 00..523240 153..0086 153..5596 D 0.027 0.033 0.68 0.84 J G F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC S F J 0.014 0.016 0.36 0.40 D6 PL L 0.695 0.725 17.65 18.42 0.136 (0.005) M T A M M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 S 0.090 0.105 2.29 2.66 STYLE 1: STYLE 2: STYLE 3: PIN 1. VOUT PIN 1. OPEN PIN 1. OPEN 2. GROUND 2. GROUND 2. GROUND 3. VCC 3. -VOUT 3. +VOUT 4. V1 4. VSUPPLY 4. +VSUPPLY 5. V2 5. +VOUT 5. -VOUT 6. VEX 6. OPEN 6. OPEN CASE 867-08 ISSUE N UNIBODY PACKAGE MPX5050 Sensors Freescale Semiconductor 7

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Pressure PACKAGE DIMENSIONS NOTES: 1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. P 2.CONTROLLING DIMENSION: INCH. –A– 0.25 (0.010) M T Q M INCHES MILLIMETERS U X DIM MIN MAX MIN MAX W L A 1.145 1.175 29.08 29.85 R B 0.685 0.715 17.40 18.16 V C 0.405 0.435 10.29 11.05 PORT #1 PORT #2 VACUUM (P2) D 0.027 0.033 0.68 0.84 PRPEOSSSITUIRVEE PORT #1 POSITIVE F 0.048 0.064 1.22 1.63 (P1) N PRESSURE (P1) G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 –Q– K 0.695 0.725 17.65 18.42 PORT #2 L 0.290 0.300 7.37 7.62 VACUUM (P2) N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 B Q 0.153 0.159 3.89 4.04 PIN 1 R 0.063 0.083 1.60 2.11 S 0.220 0.240 5.59 6.10 K U 0.910 BSC 23.11 BSC 1 2 3 4 5 6 V 0.182 0.194 4.62 4.93 C W 0.310 0.330 7.87 8.38 S X 0.248 0.278 6.30 7.06 SEATING –T– –T– SEATING PLANE PLANE G D6 PL STYLE 1: J F 0.13 (0.005) M A M PIN 12..GVORUOTUND 3.VCC 4.V1 5.V2 6.VEX CASE 867C-05 ISSUE F UNIBODY PACKAGE MPX5050 Sensors 10 Freescale Semiconductor

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