MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Rev. 8.0 — 25 July 2017 Data sheet: technical data 1 General description The MPX4250A/MPXA4250A Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The MPX4250A/MPXA4250A piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on-chip integration make the NXP sensor a logical and economical choice for the automotive system engineer. 2 Features • 1.5 % maximum error over 0 °C to 85 °C • Specifically designed for intake manifold absolute pressure sensing in engine control systems • Patented silicon shear stress strain gauge • Temperature compensated over –40 °C to +125 °C • Offers reduction in weight and volume compared to existing hybrid modules • Durable epoxy unibody element or thermoplastic small outline, surface mount package • Ideal for non-automotive applications • Available in three small outline packages and two unibody packages MPXA4250A6U MPXA4250AC6U/C6T1 MPX4250A MPX4250AP 98ASB17756C 98ASB17757C 98ASB42793B 98ASB42796B CASE 482-01 CASE 482A-01 CASE 867-08 CASE 867B-04 Figure 1. Small outline and unibody packages 3 Typical applications • Turbo boost engine control • Ideally suited for microprocessor or microcontroller-based systems

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 4 Ordering information Table 1. Ordering information Package Package # of Ports Pressure type Device Device name Options Name None Single Dual Gauge Differential Absolute marking Small outline package (MPXA4250A series) MPXA4250A6U Rail 98ASB17756C • • MPXA4250A MPXA4250AC6U Rail 98ASB17757C • • MPXA4250A MPXA4250AC6T1 Tape and Reel 98ASB17757C • • MPXA4250A Unibody package (MPX4250A series) MPX4250A Tray 98ASB42793B • • MPX4250A MPX4250AP Tray 98ASB42796B • • MPX4250A 5 Block diagram V CC 2 (Small outline package) 3 (Unibody) Sensing Thin Film Gain Stage #2 Element Temperature and Ground V Compensation Reference OUT and Shift 1 (Unibody) Gain Stage #1 Circuitry 4 (Small outline package) 2 (Unibody) Pins 4, 5 and 6 are NO CONNECTS GND 3 (Small outline package) for unibody package devices. Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices. Figure 2. Block diagram 6 Pinning information 6.1 Pinning MPX4250A MPXA4250A (unibody) (SOP) DNC 1 5 DNC VCC 2 6 DNC GND 3 7 DNC VOUT 4 8 DNC 1 2 3 4 5 6 T D C C C C VOU GN VC DN DN DN Figure 3. Pinning diagram MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 2 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 6.2 Pin description Table 2. Pin descriptions — Unibody package Symbol Pin Description V 1 Output voltage OUT GND 2 Ground V 3 Voltage supply CC DNC 4 Do not connect to external circuitry or ground DNC 5 Do not connect to external circuitry or ground DNC 6 Do not connect to external circuitry or ground Table 3. Pin descriptions — Small outline package Symbol Pin Description DNC 1 Do no connect to external circuitry or ground V 2 Voltage supply CC GND 3 Ground V 4 Output voltage OUT DNC 5 Do not connect to external circuitry or ground DNC 6 Do not connect to external circuitry or ground DNC 7 Do not connect to external circuitry or ground DNC 8 Do not connect to external circuitry or ground 7 Mechanical and electrical specifications 7.1 Maximum ratings Table 4. Maximum ratings T = 25 °C unless otherwise noted. Exposure beyond the specified limits may cause permanent A damage or degradation to the device. Rating Symbol Value Unit Maximum pressure (P1 > P2) P 1000 kPa MAX Storage temperature T –40 to +125 °C STG Operating temperature T –40 to +125 °C A Figure 2 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 3 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 7.2 Operating characteristics Table 5. Operating characteristics (V = 5.1 Vdc, T = 25 °C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 5 CC A required to meet electrical specifications.) Symbol Characteristic Min Typ Max Unit [1] P Pressure range 20 — 250 kPa OP [2] V Supply voltage 4.85 5.1 5.35 Vdc CC I Supply current — 7.0 10 mAdc o [3] V Minimum pressure offset (0 °C to 85 °C) 0.133 0.204 0.274 Vdc off [4] V Full scale output (0 °C to 85 °C) 4.826 4.896 4.966 Vdc FSO [5] V Full scale span (0 °C to 85 °C) — 4.692 — Vdc FSS [6] — Accuracy (0 °C to 85 °C) — — ±1.5 %V FSS ΔV/ΔP Sensitivity — 20 —- mV/kPa [7] t Response time — 1.0 —- ms R I Output source current at full scale output — 0.1 —- mAdc o+ [8] — Warm-up time — 20 —- ms [9] — Offset stability — ± 0.5 —- %V FSS [1] 1.0 kPa (kiloPascal) equals 0.145 psi. [2] Device is ratiometric within this specified excitation range. [3] Offset (Voff) is defined as the output voltage at the minimum rated pressure. [4] Full scale output (VFSO) is defined as the output voltage at the maximum or full rated pressure. [5] Full scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. [6] Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero pressure applied. • Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 °C. • TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C. Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25 °C. [7] Response time is defined as the time for the incremental change in the output to go from 10 % to 90 % of its final value when subjected to a specified step change in pressure. [8] Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. [9] Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. 8 On-chip temperature compensation and calibration Figure 4 illustrates the absolute pressure sensing chip in the basic chip carrier (98ASB42793B). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4250A/MPXA4250A pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long- MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 4 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated term reliability. Contact the factory for information regarding media compatibility in your application. Figure 5 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Figure 6 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 °C to 85 °C using the decoupling circuit shown in Figure 5. The output will saturate outside of the specified pressure range. Fluoro silicone Stainless steel die coat Die metal cover P1 Wire bond Epoxy case Lead frame RTV die bond Sealed vacuum reference Figure 4. Cross sectional diagram (not to scale)   +5.1 V Vout Output VCC IPS 1.0 µF 0.01 µF GND 470 pF For additional output filtering, please refer to Application Note AN1646 Figure 5. Recommended power supply decoupling and output filtering   5.0 Transfer Function: 4.5 Vout = VCCx (P x 0.004 – 0.04) ± Error 4.0 VCC = 5.1 Vdc 3.5 Temperature = 0 °C to 85 °C Volts) 3.0 MAX TYP ut ( 2.5 p ut 2.0 O 1.5 MIN 1.0 0.5 0 01020304050607080090100110120130140150160170180190200210220230240250260 Pressure in kPa Figure 6. Output versus absolute pressure   MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 5 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Nominal transfer value: VOUT = VCC x (P × 0.004 – 0.04) ± (Pressure error × Temp. Factor × 0.004 x VCC) VCC = 5.1 ± 0.25 Vdc Figure 7. Transfer function   4.0 Temp °C Multiplier 3.0 –40 3 Temperature 0 to 85 1 error factor 2.0 +125 3 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C Note: The temperature multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Figure 8. Temperature error band   Figure 9. Pressure error band 9 Package information 9.1 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct Footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 6 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 0.100 TYP 8X 0.660 2.54 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X inch 2.54 mm SCALE 2:1 Figure 10. SOP footprint (Case 482) MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 7 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 9.2 Package description Figure 11. Package name 98ASB15576C, Case 482-01 Issue O, Small outline package MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 8 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated –A– D8 PL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 4 0.25 (0.010) M T B S A S Y14.5M, 1982. 5 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. N –B– 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. G 8 INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 S B 0.415 0.425 10.54 10.79 W C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 V K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 C S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 H W 0.115 0.125 2.92 3.17 J –T– PIN 1 IDENTIFIER SEATING K M PLANE Figure 12. Package name 98ASB17757C, Case 482A-01, Issue A, small outline package   Figure 13. Package name 98ASB42793B, Case 867-08, Issue N, unibody package MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 9 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 10 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Figure 14. Package name 98ASB42796B, Case 867B-04, Issue J MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 11 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 10 Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supercedes MPX4250A v.8.0 20170725 Technical data — MPX4250A v.7.0 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Updated the document title from "Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated" to "0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated." • Added Figure 1 "Small outline and unibody packages" in Section 2 "Features". • Updated Table 1 "Ordering information" in Section 4 "Ordering information". • Revised Figure 2 "Block diagram " in Section 5 "Block diagram" as follows: – Changed VS to VCC • Added pinning illustration as Figure 3 "Pinning diagram" in Section 6.1 • Added pin descriptions in Table 2 "Pin descriptions — Unibody package" and Table 3 "Pin descriptions — Small outline package" in Section 6.2. • Changed VS to VCC in the description and within the body of Table 5 "Operating characteristics" in Section 7.2 "Operating characteristics". • Updated the figures in Section 8 "On-chip temperature compensation and calibration" as follows: – Figure 4 "Cross sectional diagram (not to scale)" – Figure 5 "Recommended power supply decoupling and output filtering" – Figure 6 "Output versus absolute pressure" – Figure 7 "Transfer function" – Figure 9 "Pressure error band" • Updated the figures and figure titles in Section 9.2 "Package description" as follows: – Figure 11 "Package name 98ASB15576C, Case 482-01 Issue O, Small outline package" – Figure 12 "Package name 98ASB17757C, Case 482A-01, Issue A, small outline package" – Figure 13 "Package name 98ASB42793B, Case 867-08, Issue N, unibody package" – Figure 14 "Package name 98ASB42796B, Case 867B-04, Issue J" MPX4250A v.7.0 20090131 Technical data — MPX4250A v.6.0 MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 12 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 11 Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition [short] Data sheet: product_preview Development This document contains certain information on a product under development. NXP reserves the right to change or discontinue this product without notice. {short] Data sheet: advance information Qualification This document contains information on a new product. Specifications and information herein are subject to change without notice. [short] Data sheet: technical data Production This document contains the product specification. NXP Semiconductors reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior 11.2 Definitions to the publication hereof. Draft — The document is a draft version only. The content is still under Applications — Applications that are described herein for any of these internal review and subject to formal approval, which may result in products are for illustrative purposes only. NXP Semiconductors makes modifications or additions. NXP Semiconductors does not give any no representation or warranty that such applications will be suitable representations or warranties as to the accuracy or completeness of for the specified use without further testing or modification. Customers information included herein and shall have no liability for the consequences are responsible for the design and operation of their applications and of use of such information. products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product Short data sheet — A short data sheet is an extract from a full data sheet design. It is customer’s sole responsibility to determine whether the NXP with the same product type number(s) and title. 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NXP does not accept any liability in this Semiconductors product is deemed to offer functions and qualities beyond respect. those described in the technical data data sheet. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) 11.3 Disclaimers operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Limited warranty and liability — Information in this document is believed Characteristics sections of this document is not warranted. Constant or to be accurate and reliable. However, NXP Semiconductors does not repeated exposure to limiting values will permanently and irreversibly affect give any representations or warranties, expressed or implied, as to the the quality and reliability of the device. accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an Terms and conditions of commercial sale — NXP Semiconductors information source outside of NXP Semiconductors. In no event shall NXP products are sold subject to the general terms and conditions of commercial Semiconductors be liable for any indirect, incidental, punitive, special or sale, as published at http://www.nxp.com/profile/terms, unless otherwise consequential damages (including - without limitation - lost profits, lost agreed in a valid written individual agreement. In case an individual savings, business interruption, costs related to the removal or replacement agreement is concluded only the terms and conditions of the respective of any products or rework charges) whether or not such damages are based agreement shall apply. NXP Semiconductors hereby expressly objects to on tort (including negligence), warranty, breach of contract or any other applying the customer’s general terms and conditions with regard to the legal theory. Notwithstanding any damages that customer might incur for purchase of NXP Semiconductors products by customer. any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited No offer to sell or license — Nothing in this document may be interpreted in accordance with the Terms and conditions of commercial sale of NXP or construed as an offer to sell products that is open for acceptance or Semiconductors. the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 13 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated applications. Unless otherwise agreed in writing, the product is not designed, Translations — A non-English (translated) version of a document is for authorized or warranted to be suitable for use in life support, life-critical or reference only. The English version shall prevail in case of any discrepancy safety-critical systems or equipment, nor in applications where failure or between the translated and English versions. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or 11.4 Trademarks applications and therefore such inclusion and/or use is at the customer's own risk. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior Freescale — is a trademark of NXP B.V. authorization from competent authorities. NXP — is a trademark of NXP B.V. MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 14 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Tables Tab. 1. Ordering information ..........................................2 Tab. 4. Maximum ratings ...............................................3 Tab. 2. Pin descriptions — Unibody package ................3 Tab. 5. Operating characteristics ...................................4 Tab. 3. Pin descriptions — Small outline package ........3 Tab. 6. Revision history ...............................................12 Figures Fig. 1. Small outline and unibody packages .................1 Fig. 10. SOP footprint (Case 482) ..................................7 Fig. 2. Block diagram ...................................................2 Fig. 11. Package name 98ASB15576C, Case Fig. 3. Pinning diagram ................................................2 482-01 Issue O, Small outline package .............8 Fig. 4. Cross sectional diagram (not to scale) ..............5 Fig. 12. Package name 98ASB17757C, Case Fig. 5. Recommended power supply decoupling 482A-01, Issue A, small outline package ..........9 and output filtering ............................................5 Fig. 13. Package name 98ASB42793B, Case Fig. 6. Output versus absolute pressure ......................5 867-08, Issue N, unibody package ....................9 Fig. 7. Transfer function ...............................................6 Fig. 14. Package name 98ASB42796B, Case Fig. 8. Temperature error band ....................................6 867B-04, Issue J .............................................10 Fig. 9. Pressure error band ..........................................6 MPx4250A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved. Data sheet: technical data Rev. 8.0 — 25 July 2017 15 / 16

NXP Semiconductors MPX4250A, MPXA4250A 20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Contents 1 General description ............................................1 2 Features ...............................................................1 3 Typical applications ............................................1 4 Ordering information ..........................................2 5 Block diagram .....................................................2 6 Pinning information ............................................2 6.1 Pinning ...............................................................2 6.2 Pin description ...................................................3 7 Mechanical and electrical specifications ..........3 7.1 Maximum ratings ...............................................3 7.2 Operating characteristics ...................................4 8 On-chip temperature compensation and calibration ............................................................4 9 Package information ...........................................6 9.1 Minimum recommended footprint for surface mounted applications .........................................6 9.2 Package description ..........................................8 10 Revision history ................................................12 11 Legal information ..............................................13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2017. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 July 2017 Document identifier: MPx4250A

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: MPXAZ4250AC6T1 MPX4250GP MPXA4250AC6T1 MPXA4250A6U MPX4250A MPX4250AP MPXA4250AC6U