Pressure Freescale Semiconductor Document Number: MPX2102 Rev 9, 01/2012 100 kPa On-Chip Temperature MPX2102 Compensated Silicon Series Pressure Sensors 0 to 100 kPa (0 to 14.5 psi) 40 mV Full Scale The MPX2102 series devices are silicon piezoresistive pressure sensors (Typical) providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Application Examples • Pump/Motor Control Features • Robotics • Temperature Compensated Over 0°C to +85°C • Level Detectors • Medical Diagnostics • Easy-to-Use Chip Carrier Package Options • Pressure Switching • Available in Absolute, Differential and Gauge Configurations • Barometers • Absolute, Differential and Gauge Options • Altimeters ORDERING INFORMATION Package Case # of Ports Pressure Type Device Name Device Marking Options No. None Single Dual Gauge Differential Absolute Unibody Package (MPX2102 Series) MPX2102A Tray 344 • • MPX2102A MPX2102AP Tray 344B • • MPX2102AP MPX2102ASX Tray 344F • • MPX2102A MPX2102DP Tray 344C • • MPX2102DP MPX2102GP Tray 344B • • MPX2102GP MPX2102GVP Tray 344D • • MPX2102GVP Small Outline Package (MPXV2102G Series) MPXV2102GP Tray 1369 • • MPXV2102GP MPAK Package (MPXM2102 Series) MPXM2102A Rail 1320 • • MPXM2102A MPXM2102AT1 Tape and Reel 1320 • • MPXM2102A MPXM2102AS Rail 1320A • • MPXM2102AS MPXM2102AST1 Tape and Reel 1320A • • MPXM2102AS MPXM2102D Rail 1320 • • MPXM2102D MPXM2102DT1 Tape and Reel 1320 • • MPXM2102D MPXM2102GS Rail 1320A • • MPXM2102GS MPXM2102GST1 Tape and Reel 1320A • • MPXM2102GS © 2005-2008, 2010, 2012 Freescale Semiconductor, Inc. All rights reserved.

Pressure UNIBODY PACKAGES MPX2102A MPX2102AP/GP MPX2102DP MPX2102GVP MPX2102ASX CASE 344 CASE 344B CASE 344C CASE 344D CASE 344F SMALL OUTLINE PACKAGE MPAK MPXV2102GP MPXM2102A/ATI MPXM2102AS/AST1 CASE 1369 MPXM2102D/DT1 MPXM2102GS/AS CASE 1320 CASE 1320A MPX2102 Sensors 2 Freescale Semiconductor, Inc.

Pressure Operating Characteristics Table1. Operating Characteristics (V = 10 V , T = 25°C unless otherwise noted, P1 > P2) S DC A Characteristic Symbol Min Typ Max Units Pressure Range(1) Absolute Pressure Range MPX2102A POP 20 — 100 kPa Differential Pressure Range MPX2102D POP 0 — 100 kPa Supply Voltage(2) VS — 10 16 VDC Supply Current I — 6.0 — mAdc O Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) MPX2102D Series VOFF -1.0 — 1.0 mV MPX2102A Series -2.0 — 2.0 MPXM2102D/G Series VOFF -1.0 — 1.0 mV MPXM2102A Series -2.0 — 2.0 Sensitivity ΔV/ΔΡ — 0.4 — mV/kPa Linearity(5) MPX2102D Series — -0.6 — 0.4 %VFSS MPX2102A Series — -1.0 — 1.0 MPXM2102D/G Series — -0.6 — 0.4 %VFSS MPXM2102A Series — -1.0 — 1.0 Pressure Hysteresis(5) (0 to 100 kPa) — — ±0.1 — %VFSS Temperature Hysteresis(5)(-40°C to +125°C) — — ±0.5 — %VFSS Temperature Coefficient of Full Scale Span(5) TCVFSS -2.0 — 2.0 %VFSS Temperature Coefficient of Offset(5) TCVOFF -1.0 — 1.0 mV Input Impedance Z 1000 — 2500 W IN Output Impedance Z 1400 — 3000 W OUT Response Time(6) (10% to 90%) tR — 1.0 — ms Warm-Up Time — — 20 — ms Offset Stability(7) — — ±0.5 — %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum related pressure. 4. Offset (V ) is defined as the output voltage at the minimum rated pressure. OFF 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25°C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time from the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2102 Sensors Freescale Semiconductor, Inc. 3

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 400 kPa MAX Storage Temperature T -40 to +125 °C STG Operating Temperature T -40 to +125 °C A 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output vs. Applied Differential The differential voltage output of the sensor is directly (P1) side relative to the vacuum (P2) side. Similarly, output proportional to the differential pressure applied. voltage increases as increasing vacuum is applied to the The absolute sensor has a built-in reference vacuum. The vacuum (P2) side relative to the pressure (P1) side. output voltage will decrease as vacuum, relative to ambient, Figure1 illustrates a block diagram of the internal circuitry is drawn on the pressure (P1) side. on the stand-alone pressure sensor chip. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure V S 3 Thin Film X-ducer Temperature 2 + V Sensing Compensation OUT Element and 4 Calibration - VOUT Circuitry 1 GND Figure1. Temperature Compensated Pressure Sensor Schematic MPX2102 Sensors 4 Freescale Semiconductor, Inc.

Pressure On-Chip Temperature Compensation and Calibration Figure2 shows the output characteristics of the MPX2102 The effects of temperature on Full Scale Span and Offset series at 25°C. The output is directly proportional to the are very small and are shown under Operating differential pressure and is essentially a straight line. Characteristics. 40 VS = 10 VDC TA = 25°C 35 MPX2102 30 P1 > P2 TYP 25 Span )C 20 MAX Range VD (TYP) m 15 put ( 10 MIN ut O 5 0 -5 Offset kPa 0 25 50 75 100 (TYP) PSI 3.62 7.25 10.88 14.5 Figure2. Output vs. Pressure Differential Silicone Gel DDiifeferential/Gauge Stainless Steel Silicone Gel AbDsoielute MSteatianll eCsosv Setreel Die Coat P1 Metal Cover Die Coat P1 Epoxy Epoxy Case Wire Bond Wire Bond Case Lead Frame Bond Lead Frame Differential/GaugeElement Die Absolute Element Die P2 P2 Bond Figure3. Cross Sectional Diagrams (Not to Scale) Figure3 illustrates the absolute sensing configuration Freescale’s specified pressure sensor linearities are based (right) and the differential or gauge configuration in the basic on the end point straight line method measured at the chip carrier (Case 344). A silicone gel isolates the die surface midrange pressure. and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. Least Squares Fit The MPX2102 series pressure sensor operating Least Square characteristics and internal reliability and qualification tests Exaggerated Deviation are based on use of dry air as the pressure media. Media Performance other than dry air may have adverse effects on sensor Curve Straight Line performance and long term reliability. Contact the factory for Deviation information regarding media compatibility in your application. ut p ut O LINEARITY e g a Linearity refers to how well a transducer's output follows olt End Point Straight V the equation: V = V + sensitivity x P over the operating e Line Fit OUT OFF v pressure range. There are two basic methods for calculating elati R nonlinearity: (1) end point straight line fit (see Figure4) or (2) a least squares best line fit. While a least squares fit gives the Offset “best case” linearity error (lower numerical value), the calculations required are burdensome. 0 50 100 Conversely, an end point fit will give the “worst case” error Pressure (% Full scale) (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Figure4. Linearity Specification Comparison MPX2102 Sensors Freescale Semiconductor, Inc. 5

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Table3. Pressure (P1) Side Delineation Pressure (P1) side is the side containing the silicone gel Case Pressure (P1) Side which isolates the die. The differential or gauge sensor is Part Number Type Identifier designed to operate with positive differential pressure MPX2102A 344 Stainless Steel Cap applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. MPX2102DP 344C Side with Part Marking The Pressure (P1) side may be identified by using Table3. MPX2102AP, 344B Side with Port Attached MPX2102GP MPX2102GVP 344D Stainless Steel Cap MPX2102ASX 344F Side with Port Marking MPXV2102GP 1369 Side with Port Attached MPXM2102A, MPX2102ATI, 1320 Stainless Steel Cap MPXM2102D, MPXM2102DT1 MPXM2102AS, MPXM2102GS, 1320A Side with Port Attached MPXM2102ASTI, MPXM2102GSTI MPX2102 Sensors 6 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME R Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD M STOP RING. MOLD STOP RING NOT TO EXCEED Z 16.00 (0.630). 1 4 B -A- 2 3 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.595 0.630 15.11 16.00 N B 0.514 0.534 13.06 13.56 PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 -T- F 0.048 0.064 1.22 1.63 SEATING G 0.100 BSC 2.54 BSC PLANE F J 0.014 0.016 0.36 0.40 J G L 0.695 0.725 17.65 18.42 F Y M 30˚ NOM 30˚ NOM D4 PL N 0.475 0.495 12.07 12.57 0.136 (0.005) M T A M DAMBAR TRIM ZONE: R 0.430 0.450 10.92 11.43 THIS IS INCLUDED Y 0.048 0.052 1.22 1.32 WITHIN DIM. "F" 8 PL Z 0.106 0.118 2.68 3.00 STYLE 1: STYLE 2: STYLE 3: PIN 1. GROUND PIN 1. VCC PIN 1. GND 2. + OUTPUT 2. - SUPPLY 2. -VOUT 3. + SUPPLY 3. + SUPPLY 3. VS 4. - OUTPUT 4. GROUND 4. +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: SEATING -T- -A- 1. DIMENSIONING AND TOLERANCING PER ANSI PLANE U Y14.5M, 1982. R L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.145 1.175 29.08 29.85 N B 0.685 0.715 17.40 18.16 PORT #1 -Q- C 0.305 0.325 7.75 8.26 POSITIVE PRESSURE D 0.016 0.020 0.41 0.51 (P1) F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC B H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 1 2 3 4 L 0.290 0.300 7.37 7.62 PIN 1 K N 0.420 0.440 10.67 11.18 -P- P 0.153 0.159 3.89 4.04 0.25 (0.010) M T Q S S QR 00..125330 00..125590 35..8894 46..0345 J F US 0.202.0910 B0S.2C40 5.2539.11 BS6C.10 C G D4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2102 Sensors 7 Freescale Semiconductor, Inc.

Pressure 16 PACKAGE DIMENSIONS -A- NOTES: V U 1. DY1IM4.E5NMS, I1O9N8I2N.G AND TOLERANCING PER ANSI R PORT #1 W L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS PORT #2 PORT #2 PORT #1 DIM MIN MAX MIN MAX N V(PA2C)UUM (PPO1S)ITIVE PRESSURE AB 10..164855 10..177155 2197..0480 2198..8156 -Q- C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 SEATING B SEATING G 0.100 BSC 2.54 BSC PLANE PLANE H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 PIN 1 1 2 3 4 K 0.695 0.725 17.65 18.42 K -P- L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 -T- -T- 0.25 (0.010)M T Q S S P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 J F R 0.063 0.083 1.60 2.11 C G S 0.220 0.240 5.59 6.10 D4 PL U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE NOTES: -A- 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. U 2. CONTROLLING DIMENSION: INCH. -T- SPELAATNIENG L INCHES MILLIMETERS DIM MIN MAX MIN MAX R PORT #2 H A 1.145 1.175 29.08 29.85 VACUUM POSITIVE B 0.685 0.715 17.40 18.16 (P2) PRESSURE C 0.305 0.325 7.75 8.26 N (P1) D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 -Q- G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 B L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 1 2 3 4 K Q 0.153 0.158 3.89 4.04 R 0.230 0.250 5.84 6.35 PIN 1 S 0.220 0.240 5.59 6.10 S U 0.910 BSC 23.11 BSC C F -P- G J 0.25 (0.010) M T Q S D 4 PL STYLE 1: PIN 1. GROUND 0.13 (0.005) M T S S Q S 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344D-01 ISSUE B UNIBODY PACKAGE MPX2102 Sensors Freescale Semiconductor, Inc. 8

Pressure PACKAGE DIMENSIONS -T- NOTES: C A 1. DIMENSIONING AND TOLERANCING PER ANSI -Q- Y14.5M, 1982. E U 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 N D 0.016 0.020 0.41 0.51 V B E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 R G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 PORT #1 PIN 1 K 0.220 0.240 5.59 6.10 POSITIVE -P- N 0.070 0.080 1.78 2.03 PRESSURE P 0.150 0.160 3.81 4.06 (P1) 0.25 (0.010) M T Q M 4 3 2 1 S Q 0.150 0.160 3.81 4.06 R 0.440 0.460 11.18 11.68 S 0.695 0.725 17.65 18.42 K U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.92 J F G D4 PL STYPLINE 11.: GROUND 0.13 (0.005) M T P S Q S 2. V (+) OUT 3. V SUPPLY 4. V (-) OUT CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2102 Sensors 9 Freescale Semiconductor, Inc.

Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2102 Sensors Freescale Semiconductor, Inc. 10

Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2102 Sensors 11 Freescale Semiconductor, Inc.

Pressure CASE 1320-02 ISSUE B MPAK MPX2102 Sensors 12 Freescale Semiconductor, Inc.

Pressure CASE 1320-02 ISSUE B MPAK MPX2102 Sensors Freescale Semiconductor, Inc. 13

Pressure PIN 4 PIN 1 CASE 1320A-02 ISSUE A MPAK MPX2102 Sensors 14 Freescale Semiconductor, Inc.

Pressure CASE 1320A-02 ISSUE A MPAK MPX2102 Sensors Freescale Semiconductor, Inc. 15

Pressure REVISION HISTORY Revision Revision Description of changes number date 9 01/2012 • In Table 1. Operating Characteristics, in the Characteristic column under Pressure Range, added rows for Absolute Pressure Range MPX2102A and Differential Pressure Range MPX2102D devices MPX2102 Sensors Freescale Semiconductor, Inc. 16

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