Pressure Freescale Semiconductor MPX2050 Rev 9, 10/2008 +50 kPa On-Chip Temperature MPX2050 Compensated and Calibrated Series Silicon Pressure Sensors 0 to 50 kPa (0 to 7.25 psi) 40 mV Full Scale Span The MPX2050 series devices are silicon piezoresistive pressure sensors (Typical) providing a highly accurate and linear voltage output, directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Application Examples Features • Pump/Motor Controllers • Temperature Compensated Over 0°C to +85°C • Robotics • Unique Silicon Shear Stress Strain Gauge • Level Indicators • Easy to Use Chip Carrier Package Options • Medical Diagnostics • Ratiometric to Supply Voltage • Pressure Switching • Differential and Gauge Options • Non-Invasive Blood Pressure • ±0.25% Linearity ORDERING INFORMATION Package Case # of Ports Pressure Type Device Name Device Marking Options No. None Single Dual Gauge Differential Absolute Unibody Package (MPX2050 Series) MPX2050D Tray 344 • • MPX2050D MPX2050GP Tray 344B • • MPX2050GP MPX2050DP Tray 344C • • MPX2050DP MPX2050GSX Tray 344F • • MPX2050D PACKAGES MPX2050D MPX2050GP MPX2050DP MPX2050GSX CASE 344-15 CASE 344B-01 CASE 344C-01 CASE 344F-01 © Freescale Semiconductor, Inc., 2002, 2008. All rights reserved.

Pressure Figure1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature 2 +V Sensing Compensation OUT Element andC Ciracluibitrraytion 4 -VOUT 1 GND Figure1. Temperature Compensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The differential voltage output of the sensor is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). MPX2050 Sensors 2 Freescale Semiconductor

Pressure Operating Characteristics Table1. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) Voff -1.0 — 1.0 mV Sensitivity ΔV/ΔP — 0.8 — mV/kPa Linearity(5) — -0.25 — 0.25 %VFSS Pressure Hysteresis(5) (0 to 50 kPa) — — ±0.1 — %VFSS Temperature Hysteresis(5) (-40°C to +125°C) — — ±0.5 — %VFSS Temperature Effect on Full Scale Span(5) TCVFSS -1.0 - 1.0 %VFSS Temperature Effect on Offset(5) TCVoff -1.0 - 1.0 mV Input Impedance Zin 1000 - 2500 Ω Output Impedance Zout 1400 - 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm-Up — — 20 — ms Offset Stability(7) — — ±0.5 — %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 4. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 5. Accuracy (error budget) consists of the following: Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2050 Sensors Freescale Semiconductor 3

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 200 kPa max Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. LINEARITY Linearity refers to how well a transducer's output follows the equation: V = V + sensitivity x P over the operating out off Least Squares Fit pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure2) or (2) Exaggerated a least squares best line fit. While a least squares fit gives the Performance ut Curve “best case” linearity error (lower numerical value), the p Straight Line calculations required are burdensome. Out Least Deviation Conversely, an end point fit will give the “worst case” error ge DeSvqiautaiorne a (often more desirable in error budget calculations) and the olt calculations are more straightforward for the user. Motorola's e V specified pressure sensor linearities are based on the end ativ End Point point straight line method measured at the midrange Rel Straight Line Fit pressure. Offset 0 50 100 Pressure (% Fullscale) Figure2. Linearity Specification Comparison MPX2050 Sensors 4 Freescale Semiconductor

Pressure On-Chip Temperature Compensation and Calibration Figure3 shows the minimum, maximum and typical output The effects of temperature on Full-Scale Span and Offset characteristics of the MPX2050 series at 25°C. The output is are very small and are shown under Operating directly proportional to the differential pressure and is Characteristics. essentially a straight line. 40 VS = 10 Vdc 35 TA = 25°C MPX2050 dc) 30 P1 > P2 TYP V 25 Span m MAX ut ( 20 Range utp 15 (Typ) O 10 MIN 5 0 -5 Offset kPa 0 12.5 25 37.5 50 (Typ) PSI 1.8 3.6 5.4 7.25 Figure3. Output versus Pressure Differential Silicone Stainless Steel Die Coat Die Metal Cover P1 Epoxy Wire Bond Case RTV Die Lead Frame Bond P2 Figure4. Cross-Sectional Diagram (not to scale) Figure4 illustrates the differential or gauge configuration The MPX2050 series pressure sensor operating in the basic chip carrier (Case 344). A silicone gel isolates the characteristics and internal reliability and qualification tests die surface and wire bonds from the environment, while are based on use of dry air as the pressure media. Media allowing the pressure signal to be transmitted to the silicon other than dry air may have adverse effects on sensor diaphragm. performance and long term reliability. Contact the factory for information regarding media compatibility in your application. MPX2050 Sensors Freescale Semiconductor 5

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Table3. Pressure (P1) Side Delineation Pressure (P1) side is the side containing the silicone gel Pressure (P1) Side which isolates the die. The pressure sensor is designed to Part Number Case Type Identifier operate with positive differential pressure applied, P1 > P2. MPX2050D 344 Stainless Steel Cap The Pressure (P1) side may be identified by using the following table. MPX2050DP 344C Side with Part Marking MPX2050GP 344B Side with Port Attached MPX2050GSX 344F Side with Port Attached MPX2050 Sensors 6 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME R Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD M STOP RING. MOLD STOP RING NOT TO EXCEED Z 16.00 (0.630). 1 4 B -A- 2 3 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.595 0.630 15.11 16.00 N B 0.514 0.534 13.06 13.56 PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 -T- F 0.048 0.064 1.22 1.63 SEATING G 0.100 BSC 2.54 BSC PLANE F J 0.014 0.016 0.36 0.40 J G L 0.695 0.725 17.65 18.42 F Y M 30˚ NOM 30˚ NOM D4 PL N 0.475 0.495 12.07 12.57 0.136 (0.005) M T A M DAMBAR TRIM ZONE: R 0.430 0.450 10.92 11.43 THIS IS INCLUDED Y 0.048 0.052 1.22 1.32 WITHIN DIM. "F" 8 PL Z 0.106 0.118 2.68 3.00 STYLE 1: STYLE 2: STYLE 3: PIN 1. GROUND PIN 1. VCC PIN 1. GND 2. + OUTPUT 2. - SUPPLY 2. -VOUT 3. + SUPPLY 3. + SUPPLY 3. VS 4. - OUTPUT 4. GROUND 4. +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: SEATING -T- -A- 1. DIMENSIONING AND TOLERANCING PER ANSI PLANE U Y14.5M, 1982. R L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.145 1.175 29.08 29.85 N B 0.685 0.715 17.40 18.16 PORT #1 -Q- C 0.305 0.325 7.75 8.26 POSITIVE PRESSURE D 0.016 0.020 0.41 0.51 (P1) F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC B H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 1 2 3 4 L 0.290 0.300 7.37 7.62 PIN 1 K N 0.420 0.440 10.67 11.18 -P- P 0.153 0.159 3.89 4.04 0.25 (0.010) M T Q S S QR 00..125330 00..125590 35..8894 46..0345 J F US 0.202.0910 B0S.2C40 5.2539.11 BS6C.10 C G D4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2050 Sensors Freescale Semiconductor 7

Pressure PACKAGE DIMENSIONS -A- NOTES: V U 1. DY1IM4.E5NMS, I1O9N8I2N.G AND TOLERANCING PER ANSI R PORT #1 W L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS PORT #2 PORT #2 PORT #1 DIM MIN MAX MIN MAX N V(PA2C)UUM (PPO1S)ITIVE PRESSURE AB 10..164855 10..177155 2197..0480 2198..8156 -Q- C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 SEATING B SEATING G 0.100 BSC 2.54 BSC PLANE PLANE H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 PIN 1 1 2 3 4 K 0.695 0.725 17.65 18.42 K -P- L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 -T- -T- 0.25 (0.010)M T Q S S P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 J F R 0.063 0.083 1.60 2.11 C G S 0.220 0.240 5.59 6.10 D4 PL U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE -T- NOTES: C A 1. DIMENSIONING AND TOLERANCING PER ANSI -Q- Y14.5M, 1982. E U 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 N D 0.016 0.020 0.41 0.51 V B E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 R G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 PORT #1 PIN 1 K 0.220 0.240 5.59 6.10 POSITIVE -P- N 0.070 0.080 1.78 2.03 PRESSURE P 0.150 0.160 3.81 4.06 (P1) 0.25 (0.010) M T Q M 4 3 2 1 S Q 0.150 0.160 3.81 4.06 R 0.440 0.460 11.18 11.68 S 0.695 0.725 17.65 18.42 K U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.92 J F G D4 PL STYPLINE 11.: GROUND 0.13 (0.005) M T P S Q S 2. V (+) OUT 3. V SUPPLY 4. V (-) OUT CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2050 Sensors 8 Freescale Semiconductor

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