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  • 型号: MPX2050DP
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MPX2050DP产品简介:

ICGOO电子元器件商城为您提供MPX2050DP由Freescale Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 MPX2050DP价格参考。Freescale SemiconductorMPX2050DP封装/规格:压力传感器,变送器, 差分 压力 传感器 7.25 PSI(50 kPa) 公型 - 0.19"(4.93mm) 双管 0 mV ~ 40 mV(10V) 4-SIP 模块。您可以下载MPX2050DP参考资料、Datasheet数据手册功能说明书,资料中有MPX2050DP 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

传感器,变送器

描述

IC PRESSURE SENSOR 4-PIN板机接口压力传感器 PRES SEN COMP 50KPA

产品分类

压力传感器,变送器

品牌

Freescale Semiconductor

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

板机接口压力传感器,Freescale Semiconductor MPX2050DPMPX2050

数据手册

点击此处下载产品Datasheet点击此处下载产品Datasheet

产品型号

MPX2050DP

产品种类

板机接口压力传感器

出厂设置

-

单位重量

5.058 g

压力类型

Differential

商标

Freescale Semiconductor

安装风格

Through Hole

封装

Tray

封装/外壳

4-SIP 模块

封装/箱体

Case 344C-01

工作压力

0 kPa to 50 kPa

工作温度

-40°C ~ 125°C

工作电源电压

10 V

工厂包装数量

100

最大工作温度

+ 125 C

最小工作温度

- 40 C

标准包装

400

电压-电源

10 V

端口大小

4.93 mm

端口尺寸

公型,0.194"(4.9276mm)双管

端口类型

Dual Radial Barbed

端子类型

PCB

精度

±0.25%

系列

MPXx2050

输出

0 mV ~ 40 mV

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PDF Datasheet 数据手册内容提取

Pressure Freescale Semiconductor MPX2050 Rev 9, 10/2008 +50 kPa On-Chip Temperature MPX2050 Compensated and Calibrated Series Silicon Pressure Sensors 0 to 50 kPa (0 to 7.25 psi) 40 mV Full Scale Span The MPX2050 series devices are silicon piezoresistive pressure sensors (Typical) providing a highly accurate and linear voltage output, directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Application Examples Features • Pump/Motor Controllers • Temperature Compensated Over 0°C to +85°C • Robotics • Unique Silicon Shear Stress Strain Gauge • Level Indicators • Easy to Use Chip Carrier Package Options • Medical Diagnostics • Ratiometric to Supply Voltage • Pressure Switching • Differential and Gauge Options • Non-Invasive Blood Pressure • ±0.25% Linearity ORDERING INFORMATION Package Case # of Ports Pressure Type Device Name Device Marking Options No. None Single Dual Gauge Differential Absolute Unibody Package (MPX2050 Series) MPX2050D Tray 344 • • MPX2050D MPX2050GP Tray 344B • • MPX2050GP MPX2050DP Tray 344C • • MPX2050DP MPX2050GSX Tray 344F • • MPX2050D PACKAGES MPX2050D MPX2050GP MPX2050DP MPX2050GSX CASE 344-15 CASE 344B-01 CASE 344C-01 CASE 344F-01 © Freescale Semiconductor, Inc., 2002, 2008. All rights reserved.

Pressure Figure1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature 2 +V Sensing Compensation OUT Element andC Ciracluibitrraytion 4 -VOUT 1 GND Figure1. Temperature Compensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The differential voltage output of the sensor is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). MPX2050 Sensors 2 Freescale Semiconductor

Pressure Operating Characteristics Table1. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) Voff -1.0 — 1.0 mV Sensitivity ΔV/ΔP — 0.8 — mV/kPa Linearity(5) — -0.25 — 0.25 %VFSS Pressure Hysteresis(5) (0 to 50 kPa) — — ±0.1 — %VFSS Temperature Hysteresis(5) (-40°C to +125°C) — — ±0.5 — %VFSS Temperature Effect on Full Scale Span(5) TCVFSS -1.0 - 1.0 %VFSS Temperature Effect on Offset(5) TCVoff -1.0 - 1.0 mV Input Impedance Zin 1000 - 2500 Ω Output Impedance Zout 1400 - 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm-Up — — 20 — ms Offset Stability(7) — — ±0.5 — %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 4. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 5. Accuracy (error budget) consists of the following: Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2050 Sensors Freescale Semiconductor 3

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 200 kPa max Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. LINEARITY Linearity refers to how well a transducer's output follows the equation: V = V + sensitivity x P over the operating out off Least Squares Fit pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure2) or (2) Exaggerated a least squares best line fit. While a least squares fit gives the Performance ut Curve “best case” linearity error (lower numerical value), the p Straight Line calculations required are burdensome. Out Least Deviation Conversely, an end point fit will give the “worst case” error ge DeSvqiautaiorne a (often more desirable in error budget calculations) and the olt calculations are more straightforward for the user. Motorola's e V specified pressure sensor linearities are based on the end ativ End Point point straight line method measured at the midrange Rel Straight Line Fit pressure. Offset 0 50 100 Pressure (% Fullscale) Figure2. Linearity Specification Comparison MPX2050 Sensors 4 Freescale Semiconductor

Pressure On-Chip Temperature Compensation and Calibration Figure3 shows the minimum, maximum and typical output The effects of temperature on Full-Scale Span and Offset characteristics of the MPX2050 series at 25°C. The output is are very small and are shown under Operating directly proportional to the differential pressure and is Characteristics. essentially a straight line. 40 VS = 10 Vdc 35 TA = 25°C MPX2050 dc) 30 P1 > P2 TYP V 25 Span m MAX ut ( 20 Range utp 15 (Typ) O 10 MIN 5 0 -5 Offset kPa 0 12.5 25 37.5 50 (Typ) PSI 1.8 3.6 5.4 7.25 Figure3. Output versus Pressure Differential Silicone Stainless Steel Die Coat Die Metal Cover P1 Epoxy Wire Bond Case RTV Die Lead Frame Bond P2 Figure4. Cross-Sectional Diagram (not to scale) Figure4 illustrates the differential or gauge configuration The MPX2050 series pressure sensor operating in the basic chip carrier (Case 344). A silicone gel isolates the characteristics and internal reliability and qualification tests die surface and wire bonds from the environment, while are based on use of dry air as the pressure media. Media allowing the pressure signal to be transmitted to the silicon other than dry air may have adverse effects on sensor diaphragm. performance and long term reliability. Contact the factory for information regarding media compatibility in your application. MPX2050 Sensors Freescale Semiconductor 5

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Table3. Pressure (P1) Side Delineation Pressure (P1) side is the side containing the silicone gel Pressure (P1) Side which isolates the die. The pressure sensor is designed to Part Number Case Type Identifier operate with positive differential pressure applied, P1 > P2. MPX2050D 344 Stainless Steel Cap The Pressure (P1) side may be identified by using the following table. MPX2050DP 344C Side with Part Marking MPX2050GP 344B Side with Port Attached MPX2050GSX 344F Side with Port Attached MPX2050 Sensors 6 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME R Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD M STOP RING. MOLD STOP RING NOT TO EXCEED Z 16.00 (0.630). 1 4 B -A- 2 3 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.595 0.630 15.11 16.00 N B 0.514 0.534 13.06 13.56 PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 -T- F 0.048 0.064 1.22 1.63 SEATING G 0.100 BSC 2.54 BSC PLANE F J 0.014 0.016 0.36 0.40 J G L 0.695 0.725 17.65 18.42 F Y M 30˚ NOM 30˚ NOM D4 PL N 0.475 0.495 12.07 12.57 0.136 (0.005) M T A M DAMBAR TRIM ZONE: R 0.430 0.450 10.92 11.43 THIS IS INCLUDED Y 0.048 0.052 1.22 1.32 WITHIN DIM. "F" 8 PL Z 0.106 0.118 2.68 3.00 STYLE 1: STYLE 2: STYLE 3: PIN 1. GROUND PIN 1. VCC PIN 1. GND 2. + OUTPUT 2. - SUPPLY 2. -VOUT 3. + SUPPLY 3. + SUPPLY 3. VS 4. - OUTPUT 4. GROUND 4. +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: SEATING -T- -A- 1. DIMENSIONING AND TOLERANCING PER ANSI PLANE U Y14.5M, 1982. R L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.145 1.175 29.08 29.85 N B 0.685 0.715 17.40 18.16 PORT #1 -Q- C 0.305 0.325 7.75 8.26 POSITIVE PRESSURE D 0.016 0.020 0.41 0.51 (P1) F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC B H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 1 2 3 4 L 0.290 0.300 7.37 7.62 PIN 1 K N 0.420 0.440 10.67 11.18 -P- P 0.153 0.159 3.89 4.04 0.25 (0.010) M T Q S S QR 00..125330 00..125590 35..8894 46..0345 J F US 0.202.0910 B0S.2C40 5.2539.11 BS6C.10 C G D4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2050 Sensors Freescale Semiconductor 7

Pressure PACKAGE DIMENSIONS -A- NOTES: V U 1. DY1IM4.E5NMS, I1O9N8I2N.G AND TOLERANCING PER ANSI R PORT #1 W L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS PORT #2 PORT #2 PORT #1 DIM MIN MAX MIN MAX N V(PA2C)UUM (PPO1S)ITIVE PRESSURE AB 10..164855 10..177155 2197..0480 2198..8156 -Q- C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 SEATING B SEATING G 0.100 BSC 2.54 BSC PLANE PLANE H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 PIN 1 1 2 3 4 K 0.695 0.725 17.65 18.42 K -P- L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 -T- -T- 0.25 (0.010)M T Q S S P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 J F R 0.063 0.083 1.60 2.11 C G S 0.220 0.240 5.59 6.10 D4 PL U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE -T- NOTES: C A 1. DIMENSIONING AND TOLERANCING PER ANSI -Q- Y14.5M, 1982. E U 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 N D 0.016 0.020 0.41 0.51 V B E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 R G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 PORT #1 PIN 1 K 0.220 0.240 5.59 6.10 POSITIVE -P- N 0.070 0.080 1.78 2.03 PRESSURE P 0.150 0.160 3.81 4.06 (P1) 0.25 (0.010) M T Q M 4 3 2 1 S Q 0.150 0.160 3.81 4.06 R 0.440 0.460 11.18 11.68 S 0.695 0.725 17.65 18.42 K U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.92 J F G D4 PL STYPLINE 11.: GROUND 0.13 (0.005) M T P S Q S 2. V (+) OUT 3. V SUPPLY 4. V (-) OUT CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2050 Sensors 8 Freescale Semiconductor

How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Information in this document is provided solely to enable system and software Freescale Halbleiter Deutschland GmbH Technical Information Center implementers to use Freescale Semiconductor products. There are no express or Schatzbogen 7 implied copyright licenses granted hereunder to design or fabricate any integrated 81829 Muenchen, Germany circuits or integrated circuits based on the information in this document. +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) Freescale Semiconductor reserves the right to make changes without further notice to +33 1 69 35 48 48 (French) any products herein. Freescale Semiconductor makes no warranty, representation or www.freescale.com/support guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any Japan: product or circuit, and specifically disclaims any and all liability, including without Freescale Semiconductor Japan Ltd. limitation consequential or incidental damages. “Typical” parameters that may be Headquarters provided in Freescale Semiconductor data sheets and/or specifications can and do vary ARCO Tower 15F in different applications and actual performance may vary over time. All operating 1-8-1, Shimo-Meguro, Meguro-ku, parameters, including “Typicals”, must be validated for each customer application by Tokyo 153-0064 Japan customer’s technical experts. Freescale Semiconductor does not convey any license 0120 191014 or +81 3 5437 9125 under its patent rights nor the rights of others. Freescale Semiconductor products are support.japan@freescale.com not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, Asia/Pacific: or for any other application in which the failure of the Freescale Semiconductor product Freescale Semiconductor China Ltd. could create a situation where personal injury or death may occur. Should Buyer Exchange Building 23F purchase or use Freescale Semiconductor products for any such unintended or No. 118 Jianguo Road unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and Chaoyang District its officers, employees, subsidiaries, affiliates, and distributors harmless against all Beijing 100022 China claims, costs, damages, and expenses, and reasonable attorney fees arising out of, +86 010 5879 8000 directly or indirectly, any claim of personal injury or death associated with such support.asia@freescale.com unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. Denver, Colorado 80217 All other product or service names are the property of their respective owners. 1-800-441-2447 or +1-303-675-2140 © Freescale Semiconductor, Inc. 2008. All rights reserved. Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPX2050 Rev. 9 10/2008