Pressure Freescale Semiconductor MPX12 Rev 11, 07/2009 10 kPa Uncompensated MPX12 Silicon Pressure Sensors Series The MPX12 series silicon piezoresistive pressure sensors provide a very 0 to 10 kPa (0 to 1.45 psi) accurate and linear voltage output, directly proportional to the applied 55 mV Full Scale Span pressure. This standard, low cost, uncompensated sensor permits (Typical) manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Freescale's single element Application Examples strain gauge design. • Air Movement Control Features • Environmental Control Systems • Level Indicators • Low Cost • Leak Detection • Patented Silicon Shear Stress Strain Gauge Design • Medical Instrumentation • Ratiometric to Supply Voltage • Industrial Controls • Easy to Use Chip Carrier Package Options • Pneumatic Control Systems • Gauge Options • Robotics • Durable Epoxy Package ORDERING INFORMATION Package Case # of Ports Pressure Type Device Device Name Options No. None Single Dual Gauge Differential Absolute Marking Unibody Package (MPX12 Series) MPX12D Tray 344 • • MPX12D MPX12DP Tray 344C • • MPX12DP MPX12GP Tray 344B • • MPX12GP Small Outline Package (MPXV12 Series) MPXV12DP Tray 1351 • • MPXV12DP MPXV12GP Tray 1369 • • MPXV12GP MPXV12GW6U Rail 1735 • • MPXV12GW MPXV12GW7U Rail 1560 • • MPXV12GW MPAK Package (MPXM12 Series) MPXM12GS Rail 1320A • • MPXM12GS MPXM12GST1 Tape & Reel 1320A • • MPXM12GS © Freescale Semiconductor, Inc., 2007-2009. All rights reserved.

Pressure UNIBODY PACKAGES MPX12D MPX12GP MPX12DP CASE 344-15 CASE 344B-01 CASE 344C-01 SMALL OUTLINE PACKAGES MPXV12DP MPXV12GP MPXV12GW6U MPXV12GW7U CASE 1351-01 CASE 1369-01 CASE 1735-02 CASE 1560-02 MPAK PACKAGE MPXM12GS/GST1 CASE 1320A-02 MPX12 Sensors 2 Freescale Semiconductor

Pressure Operating Characteristics Table1. Operating Characteristics (V = 3.0 Vdc, T = 25°C unless otherwise noted, P1 > P2) S A Characteristic Symbol Min Typ Max Unit Differential Pressure Range(1) P 0 — 10 kPa OP Supply Voltage(2) V — 3.0 6.0 Vdc S Supply Current I — 6.0 — mAdc o Full Scale Span(3) V 45 55 70 mV FSS Offset(4) V 0 20 35 mV off Sensitivity ΔV/ΔP — 5.5 — mV/kPa Linearity — –0.5 — 5.0 %V FSS Pressure Hysteresis(6) (0 to 10 kPa) — — ±0.1 — %V FSS Temperature Hysteresis (–40°C to +125°C) — — ±0.5 — %V FSS Temperature Coefficient of Full Scale Span TCV –0.22 — –0.16 %V /°C FSS FSS Temperature Coefficient of Offset TCV — ±15 — μV/°C off Temperature Coefficient of Resistance TCR 0.21 — 0.27 %Z /°C in Input Impedance Z 400 — 550 Ω in Output Impedance Z 750 — 1250 Ω out Response Time(5) (10% to 90%) t — 1.0 — ms R Warm-Up Time(6) — — 20 — ms Offset Stability(7) — — ±0.5 — %V FSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum related pressure. 4. Offset (V ) is defined as the output voltage at the minimum rated pressure. OFF 5. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX12 Sensors Freescale Semiconductor 3

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 75 kPa MAX Burst Pressure (P1 > P2) P 100 kPa BURST Storage Temperature T –40 to +125 °C STG Operating Temperature T –40 to +125 °C A 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. 3 +V S 2 +V OUT Sensing Element 4 –V OUT 1 GND Figure1. Uncompensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The output voltage of the differential or gauge sensor voltage increases as increasing vacuum is applied to the increases with increasing pressure applied to the pressure vacuum side (P2) relative to the pressure side (P1). side (P1) relative to the vacuum side (P2). Similarly, output MPX12 Sensors 4 Freescale Semiconductor

Pressure Temperature Compensation Figure2 shows the typical output characteristics of the LINEARITY MPX12 series over temperature. Linearity refers to how well a transducer's output follows Because this strain gauge is an integral part of the silicon the equation: V = V + sensitivity x P over the operating OUT OFF diaphragm, there are no temperature effects due to pressure range (Figure3). There are two basic methods for differences in the thermal expansion of the strain gauge and calculating nonlinearity: (1) end point straight line fit or (2) a the diaphragm, as are often encountered in bonded strain least squares best line fit. While a least squares fit gives the gauge pressure sensors. However, the properties of the “best case” linearity error (lower numerical value), the strain gauge itself are temperature dependent, requiring that calculations required are burdensome. the device be temperature compensated if it is to be used Conversely, an end point fit will give the “worst case” error over an extensive temperature range. (often more desirable in error budget calculations) and the Temperature compensation and offset calibration can be calculations are more straightforward for the user. achieved rather simply with additional resistive components, or Freescale’s specified pressure sensor linearities are based by designing your system using the MPX2010D series sensor. on the end point straight line method measured at the Several approaches to external temperature midrange pressure. compensation over both –40 to +125°C and 0 to +80°C ranges are presented in Applications Note AN840. 80 V = 3 V +25°C 70 S DC P1 > P2 -40°C 60 Span c) 50 Range d V (Typ) m ut ( 40 +125°C p ut 30 O 20 10 Offset (Typ) 0 PSI 0 0.3 0.6 0.9 1.2 1.5 kPa 2.0 4.0 6.0 8.0 10 Pressure Differential Figure2. Output vs. Pressure Differential 80 Linearity 70 60 Actual 50 Span (V ) c) FSS Vd 40 m put ( 30 Theoretical ut O 20 Offset 10 (V ) OFF 0 0 Max P Pressure (kPa) OP Figure3. Linearity Specification Comparison MPX12 Sensors Freescale Semiconductor 5

Pressure Stainless Gel Die Coat Die Steel Cap P1 Thermoplastic Wire Bond Case Lead Frame P2 Differential Sensing Die Bond Element Figure4. Cross-Sectional Diagram (not to scale) Figure4 illustrates the differential/gauge die. A gel isolates pressure media. Media other than dry clean air may have the die surface and wire bonds from the environment, while adverse effects on sensor performance and long term allowing the pressure signal to be transmitted to the silicon reliability. Contact the factory for information regarding media diaphragm. compatibility in your application. Operating characteristics, internal reliability and qualification tests are based on use of dry clean air as the PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor Pressure (P1) Side as the Pressure (P1) side and the Vacuum (P2) side. The Part Number Case Type Identifier Pressure (P1) side is the side containing gel which isolates the die from the environment. Freescale’s MPx12 series is MPX12D 344 Stainless Steel Cap designed to operate with positive differential pressure MPX12DP 344C Side with Part Marking applied, P1 > P2. MPX12GP 344B Side with Port Attached The Pressure (P1) side may be identified by using the following table MPXV12DP 1351 Side with Part Marking MPXV12GP 1369 Side with Port MPXV12GW6U 1735 Side with Port MPXV12GW7U 1560 Side with Port MPXM12GS/GST1 1320A Side with Port Attached MPX12 Sensors 6 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS NOTES: C 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. R 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED M 16.00 (0.630). Z 1 4 B –A– 2 3 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.595 0.630 15.11 16.00 N B 0.514 0.534 13.06 13.56 PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 –T– F 0.048 0.064 1.22 1.63 SEATING G 0.100 BSC 2.54 BSC PLANE F J 0.014 0.016 0.36 0.40 J F G Y ML 0.63905 (cid:0) NO0M.725 17.3605 (cid:0) NO1M8.42 D 4 PL N 0.475 0.495 12.07 12.57 0.136 (0.005) M T A M DAMBAR TRIM ZONE: R 0.430 0.450 10.92 11.43 THIS IS INCLUDED Y 0.048 0.052 1.22 1.32 WITHIN DIM. “F” 8 PL Z 0.106 0.118 2.68 3.00 STYLE 1: STYLE 2: STYLE 3: PIN 1.GROUND PIN 1.VCC PIN 1.GND 2.+ OUTPUT 2.– SUPPLY 2.–VOUT 3.+ SUPPLY 3.+ SUPPLY 3.VS 4.– OUTPUT 4.GROUND 4.+VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE (cid:12)(cid:16)(cid:3)(cid:6)(cid:2)(cid:9) (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) –T– –A– (cid:8)(cid:13)(cid:18)(cid:11)(cid:25)(cid:6)(cid:12)(cid:2)(cid:11)(cid:16)(cid:12)(cid:11)(cid:12)(cid:14)(cid:7)(cid:30)(cid:12)(cid:18)(cid:7)(cid:3)(cid:16)(cid:5)(cid:6)(cid:15)(cid:30)(cid:12)(cid:31)(cid:11)(cid:12)(cid:14)(cid:7)(cid:10)(cid:6)(cid:15)(cid:7)(cid:30)(cid:12)(cid:2)(cid:11) (cid:9)(cid:10)(cid:4)(cid:7)(cid:3) U (cid:4)(cid:8)(cid:22)(cid:13)(cid:27) (cid:7)(cid:8)!"(cid:19)(cid:13) (cid:19)(cid:13)(cid:31)(cid:16)(cid:12)(cid:3)(cid:15)(cid:16)(cid:5)(cid:5)(cid:11)(cid:12)(cid:14)(cid:7)(cid:18)(cid:11)(cid:25)(cid:6)(cid:12)(cid:2)(cid:11)(cid:16)(cid:12)(cid:9)(cid:7)(cid:11)(cid:12)(cid:31)#(cid:13) R L H (cid:6)(cid:7)(cid:19)(cid:20)(cid:3)(cid:2) (cid:16)(cid:6)(cid:10)(cid:10)(cid:6)(cid:16)(cid:3)(cid:5)(cid:3)(cid:18)(cid:2) (cid:15)(cid:6)(cid:16) (cid:16)(cid:6)(cid:7) (cid:16)(cid:4)(cid:17) (cid:16)(cid:6)(cid:7) (cid:16)(cid:4)(cid:17) (cid:4) (cid:8)(cid:13)(cid:8)(cid:22)(cid:27) (cid:8)(cid:13)(cid:8)$(cid:27) (cid:19)!(cid:13)(cid:26)" (cid:19)!(cid:13)"(cid:27) N (cid:21) (cid:26)(cid:13)%"(cid:27) (cid:26)(cid:13)$(cid:8)(cid:27) (cid:8)$(cid:13)(cid:22)(cid:26) (cid:8)"(cid:13)(cid:8)% PORT #1 POSITIVE –Q– (cid:19) (cid:26)(cid:13)(cid:21)(cid:26)(cid:27) (cid:26)(cid:13)(cid:21)(cid:19)(cid:27) $(cid:13)$(cid:27) "(cid:13)(cid:19)% PRESSURE (cid:15) (cid:26)(cid:13)(cid:26)(cid:8)% (cid:26)(cid:13)(cid:26)(cid:19)(cid:26) (cid:26)(cid:13)(cid:22)(cid:8) (cid:26)(cid:13)(cid:27)(cid:8) (P1) (cid:22) (cid:26)(cid:13)(cid:26)(cid:22)" (cid:26)(cid:13)(cid:26)%(cid:22) (cid:8)(cid:13)(cid:19)(cid:19) (cid:8)(cid:13)%(cid:21) (cid:8) (cid:26)(cid:13)(cid:8)(cid:26)(cid:26)(cid:7)&(cid:2)(cid:31) (cid:19)(cid:13)(cid:27)(cid:22)(cid:7)&(cid:2)(cid:31) (cid:20) (cid:26)(cid:13)(cid:8)"(cid:19) (cid:26)(cid:13)(cid:8)!(cid:22) (cid:22)(cid:13)%(cid:19) (cid:22)(cid:13)!(cid:21) B (cid:23) (cid:26)(cid:13)(cid:26)(cid:8)(cid:22) (cid:26)(cid:13)(cid:26)(cid:8)% (cid:26)(cid:13)(cid:21)% (cid:26)(cid:13)(cid:22)(cid:8) (cid:24) (cid:26)(cid:13)%!(cid:27) (cid:26)(cid:13)$(cid:19)(cid:27) (cid:8)$(cid:13)%(cid:27) (cid:8)"(cid:13)(cid:22)(cid:19) (cid:11) (cid:12) (cid:13) (cid:14) (cid:10) (cid:26)(cid:13)(cid:19)!(cid:26) (cid:26)(cid:13)(cid:21)(cid:26)(cid:26) $(cid:13)(cid:21)$ $(cid:13)%(cid:19) PIN 1 K (cid:7) (cid:26)(cid:13)(cid:22)(cid:19)(cid:26) (cid:26)(cid:13)(cid:22)(cid:22)(cid:26) (cid:8)(cid:26)(cid:13)%$ (cid:8)(cid:8)(cid:13)(cid:8)" –P– (cid:9) (cid:26)(cid:13)(cid:8)(cid:27)(cid:21) (cid:26)(cid:13)(cid:8)(cid:27)! (cid:21)(cid:13)"! (cid:22)(cid:13)(cid:26)(cid:22) (cid:25) (cid:26)(cid:13)(cid:8)(cid:27)(cid:21) (cid:26)(cid:13)(cid:8)(cid:27)! (cid:21)(cid:13)"! (cid:22)(cid:13)(cid:26)(cid:22) (cid:26)(cid:13)(cid:19)(cid:27)(cid:7)(cid:28)(cid:26)(cid:13)(cid:26)(cid:8)(cid:26)(cid:29)(cid:25) (cid:3) (cid:24) (cid:2) S (cid:18) (cid:26)(cid:13)(cid:19)(cid:21)(cid:26) (cid:26)(cid:13)(cid:19)(cid:27)(cid:26) (cid:27)(cid:13)"(cid:22) %(cid:13)(cid:21)(cid:27) (cid:2) (cid:26)(cid:13)(cid:19)(cid:19)(cid:26) (cid:26)(cid:13)(cid:19)(cid:22)(cid:26) (cid:27)(cid:13)(cid:27)! %(cid:13)(cid:8)(cid:26) J F (cid:26) (cid:26)(cid:13)!(cid:8)(cid:26)(cid:7)&(cid:2)(cid:31) (cid:19)(cid:21)(cid:13)(cid:8)(cid:8)(cid:7)&(cid:2)(cid:31) C G D4 PL (cid:26)(cid:13)(cid:8)(cid:21)(cid:7)(cid:28)(cid:26)(cid:13)(cid:26)(cid:26)(cid:27)(cid:29)(cid:25) (cid:3) (cid:2) (cid:2) (cid:24) (cid:2) (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9) (cid:10)(cid:11)(cid:12)(cid:7)(cid:8)(cid:13)(cid:14)(cid:15)(cid:16)(cid:17)(cid:12)(cid:18) (cid:19)(cid:13)(cid:20)(cid:7)(cid:16)(cid:17)(cid:3)(cid:10)(cid:17)(cid:3) (cid:21)(cid:13)(cid:20)(cid:7)(cid:2)(cid:17)(cid:10)(cid:10)(cid:5)(cid:4) (cid:22)(cid:13)(cid:23)(cid:7)(cid:16)(cid:17)(cid:3)(cid:10)(cid:17)(cid:3) CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX12 Sensors Freescale Semiconductor 7

Pressure PACKAGE DIMENSIONS –A– NOTES: V 1.DIMENSIONING AND TOLERANCING PER ANSI U Y14.5M, 1982. R PORT #1 W L 2.CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS PORT #2 PORT #2 PORT #1 DIM MIN MAX MIN MAX N VA(CPU2U)M P(PO1S)ITIVE PRESSURE AB 10..164855 10..177155 2197..0480 2198..8156 –Q– C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 SEATING B SEATING G 0.100 BSC 2.54 BSC PLANE PLANE H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 PIN 1 1 2 3 4 K 0.695 0.725 17.65 18.42 K –P– L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 –T– –T– 0.25 (0.010) M T Q S S P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 J F R 0.063 0.083 1.60 2.11 C G S 0.220 0.240 5.59 6.10 D 4 PL U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38 STYLE 1: PIN 1.GROUND 2.+ OUTPUT 3.+ SUPPLY 4.– OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE MPX12 Sensors 8 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 9

Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX12 Sensors 10 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B A E e GAGE PLANE 5 4 e/2 .014 (0.35) θ L A1 D DETAIL G 8 1 NOTES: 1. CONTROLLING DIMENSION: INCH. 8X b 2. INTERPRET DIMENSIONS AND TOLERANCES PER F 0.004 (0.1) M C A B ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) B E1 PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. INCHES MILLIMETERS ∅T N K DAIM 0M.3I0N0 M0.3A3X0 M7.1IN1 M7.A62X A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E 0.717 BSC 18.21 BSC A M Ee1 0.406.1500 B0S.C485 11.821.54 BS1C2.32 F 0.245 0.255 6.22 6.47 K 0.120 0.130 3.05 3.30 8X 0.004 (0.1) L 0.061 0.071 1.55 1.80 P M 0.270 0.290 6.86 7.36 DETAIL G N 0.080 0.090 2.03 2.28 P 0.009 0.011 0.23 0.28 C SEATING T 0.115 0.125 2.92 3.17 PLANE θ 0˚ 7˚ 0˚ 7˚ CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 11

Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX12 Sensors 12 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 13

Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX12 Sensors 14 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 15

Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX12 Sensors 16 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX12 Sensors Freescale Semiconductor 17

Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK PACKAGE MPX12 Sensors 18 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK PACKAGE MPX12 Sensors Freescale Semiconductor 19

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