Pressure Freescale Semiconductor MPX10 Rev 14, 10/2008 + 10 kPa Uncompensated MPX10 Silicon Pressure Sensors Series The MPX10 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output, directly proportional to the applied 0 to 10 kPa (0 to 1.45 psi) pressure. These standard, low cost, uncompensated sensors permit 35 mV Full Scale Span manufacturers to design and add their own external temperature (Typical) compensation and signal conditioning networks. Compensation techniques are simplified because of the predictability of Freescale's single element strain gauge design. Application Examples • Air Movement Control Features • Environmental Control Systems • Low Cost • Level Indicators • Patented Silicon Shear Stress Strain Gauge Design • Leak Detection • Ratiometric to Supply Voltage • Medical Instrumentation • Differential and Gauge Options • Industrial Controls • Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount • Pneumatic Control Systems Package • Robotics ORDERING INFORMATION Package Case # of Ports Pressure Type Device Device Name Options No. None Single Dual Gauge Differential Absolute Marking Unibody Package (MPX10 Series) MPX10D Tray 344 • • MPX10D MPX10DP Tray 344C • • MPX10DP MPX10GP Tray 344B • • MPX10GP Small Outline Package (MPXV10G Series) MPXV10GC6U Rail 482A • • MPXV10G MPXV10GC7U Rail 482C • • MPXV10G SMALL OUTLINE PACKAGE UNIBODY PACKAGE MPXV10GC6U MPXV10GC7U MPX10D MPX10GP MPX10DP CASE 482A-01 CASE 482C-03 CASE 344-15 CASE 344B-01 CASE 344C-01 © Freescale Semiconductor, Inc., 2007-2008. All rights reserved.

Pressure Operating Characteristics Table1. Operating Characteristics (V = 3.0 Vdc, T = 25°C unless otherwise noted, P1 > P2) S A Characteristic Symbol Min Typ Max Units Differential Pressure Range(1) P 0 — 10 kPa OP Supply Voltage(2) V — 3.0 6.0 V S DC Supply Current I — 6.0 — mAdc O Full Scale Span(3) V 20 35 50 mV FSS Offset(4) V 0 20 35 mV OFF Sensitivity ΔV/ΔΡ — 3.5 — mV/kPa Linearity — –1.0 — 1.0 %V FSS Pressure Hysteresis (0 to 10 kPa) — — ±0.1 — %VFSS Temperature Hysteresis — — ±0.5 — %VFSS Temperature Coefficient of Full Scale Span TCV –0.22 — –0.16 %V /°C FSS FSS Temperature Coefficient of Offset TCVOFF — ±15 — µV/°C Temperature Coefficient of Resistance TCR 0.21 — 0.27 %Z /°C IN Input Impedance ZIN 400 — 550 Ω Output Impedance ZOUT 750 — 1250 Ω Response Time(5) (10% to 90%) t — 1.0 — ms R Warm-Up Time(6) — — 20 — ms Offset Stability(7) — — ±0.5 — %V FSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (V ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the FSS minimum rated pressure. 4. Offset (V ) is defined as the output voltage at the minimum rated pressure. OFF 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX10 Sensors 2 Freescale Semiconductor

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) P 75 kPa MAX Burst Pressure (P1 > P2) P 100 kPa BURST Storage Temperature TSTG –40 to +125 °C Operating Temperature TA –40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. 3 +V S 2 +V OUT Sensing Element 4 –V OUT 1 GND Figure1. Uncompensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The output voltage of the differential or gauge sensor voltage increases as increasing vacuum is applied to the increases with increasing pressure applied to the pressure vacuum side (P2) relative to the pressure side (P1). side (P1) relative to the vacuum side (P2). Similarly, output MPX10 Sensors Freescale Semiconductor 3

Pressure Temperature Compensation Figure2 shows the typical output characteristics of the “best case” linearity error (lower numerical value), the MPX10 series over temperature. calculations required are burdensome. Because this strain gauge is an integral part of the silicon Conversely, an end point fit will give the “worst case” error diaphragm, there are no temperature effects due to (often more desirable in error budget calculations) and the differences in the thermal expansion of the strain gauge and calculations are more straightforward for the user. the diaphragm, as are often encountered in bonded strain Freescale’s specified pressure sensor linearities are based gauge pressure sensors. However, the properties of the on the end point straight line method measured at the strain gauge itself are temperature dependent, requiring that midrange pressure. the device be temperature compensated if it is to be used Figure4 illustrates the differential or gauge configuration over an extensive temperature range. in the basic chip carrier (Case 344). A silicone gel isolates the Temperature compensation and offset calibration can be die surface and wire bonds from the environment, while achieved rather simply with additional resistive components, allowing the pressure signal to be transmitted to the silicon or by designing your system using the MPX2010D series diaphragm. sensor. The MPX10 series pressure sensor operating characteristics and internal reliability and qualification tests LINEARITY are based on use of dry air as the pressure media. Media Linearity refers to how well a transducer’s output follows other than dry air may have adverse effects on sensor the equation: Vout = Voff + sensitivity x P over the operating performance and long term reliability. Contact the factory for pressure range (Figure3). There are two basic methods for information regarding media compatibility in your calculating nonlinearity: 1) end point straight line fit or 2) a application.Refer to application note AN3728, for more least squares best line fit. While a least squares fit gives the information regarding media compatibility. 80 70 MPX10 V = 3 V S DC +25°C 60 P1 > P2 -40°C c) 50 d V Span m ut ( 40 Range Outp 30 +125°C (Typ) 20 10 Offset (Typ) 0 PSI 0 0.3 0.6 0.9 1.2 1.5 kPa 2.0 4.0 6.0 8.0 10 Pressure Differential Figure2. Output vs. Pressure Differential 70 Linearity 60 50 Silicone Stainless Steel mVdc) 40 Actual (SVpan) Die Coat Die P1 Metal Cover Epoxy put ( 30 FSS Wire Bond Case ut Theoretical O 20 Offset 10 (V ) Lead Frame RTV Die OFF Bond 0 P2 0 Max P Pressure (kPa) OP Figure3. Linearity Specification Comparison Figure4. Unibody Package — Cross-Sectional Diagram (Not to Scale) MPX10 Sensors 4 Freescale Semiconductor

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Part Number Case Type Pressure (P1) Side Identifier Pressure (P1) side is the side containing silicone gel which MPX10D 344 Stainless Steel Cap isolates the die from the environment. The pressure sensor is designed to operate with positive differential pressure MPX10DP 344C Side with Part Marking applied, P1 > P2. MPX10GP 344B Side with Port Attached The Pressure (P1) side may be identified by using the following table. MPXV10GC6U 482A Side with Port Attached MPXV10GC7U 482C Side with Port Attached MPX10 Sensors Freescale Semiconductor 5

Pressure PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME R Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD M STOP RING. MOLD STOP RING NOT TO EXCEED Z 16.00 (0.630). 1 4 B -A- 2 3 INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.595 0.630 15.11 16.00 N B 0.514 0.534 13.06 13.56 PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 -T- F 0.048 0.064 1.22 1.63 SEATING G 0.100 BSC 2.54 BSC PLANE F J 0.014 0.016 0.36 0.40 J G L 0.695 0.725 17.65 18.42 F Y M 30˚ NOM 30˚ NOM D4 PL N 0.475 0.495 12.07 12.57 0.136 (0.005) M T A M DAMBAR TRIM ZONE: R 0.430 0.450 10.92 11.43 THIS IS INCLUDED Y 0.048 0.052 1.22 1.32 WITHIN DIM. "F" 8 PL Z 0.106 0.118 2.68 3.00 STYLE 1: STYLE 2: STYLE 3: PIN 1. GROUND PIN 1. VCC PIN 1. GND 2. + OUTPUT 2. - SUPPLY 2. -VOUT 3. + SUPPLY 3. + SUPPLY 3. VS 4. - OUTPUT 4. GROUND 4. +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: SEATING -T- -A- 1. DIMENSIONING AND TOLERANCING PER ANSI PLANE U Y14.5M, 1982. R L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS DIM MIN MAX MIN MAX A 1.145 1.175 29.08 29.85 N B 0.685 0.715 17.40 18.16 PORT #1 -Q- C 0.305 0.325 7.75 8.26 POSITIVE PRESSURE D 0.016 0.020 0.41 0.51 (P1) F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC B H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 1 2 3 4 L 0.290 0.300 7.37 7.62 PIN 1 K N 0.420 0.440 10.67 11.18 -P- P 0.153 0.159 3.89 4.04 0.25 (0.010) M T Q S S QR 00..125330 00..125590 35..8894 46..0345 J F US 0.202.0910 B0S.2C40 5.2539.11 BS6C.10 C G D4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX10 Sensors 6 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS -A- NOTES: V U 1. DY1IM4.E5NMS, I1O9N8I2N.G AND TOLERANCING PER ANSI R PORT #1 W L 2. CONTROLLING DIMENSION: INCH. H INCHES MILLIMETERS PORT #2 PORT #2 PORT #1 DIM MIN MAX MIN MAX N V(PA2C)UUM (PPO1S)ITIVE PRESSURE AB 10..164855 10..177155 2197..0480 2198..8156 -Q- C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 SEATING B SEATING G 0.100 BSC 2.54 BSC PLANE PLANE H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 PIN 1 1 2 3 4 K 0.695 0.725 17.65 18.42 K -P- L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 -T- -T- 0.25 (0.010)M T Q S S P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 J F R 0.063 0.083 1.60 2.11 C G S 0.220 0.240 5.59 6.10 D4 PL U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPX10 Sensors Freescale Semiconductor 7

Pressure PACKAGE DIMENSIONS CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX10 Sensors 8 Freescale Semiconductor

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