Pressure Freescale Semiconductor MP3V5004G Rev 2, 06/2010 Integrated Silicon Pressure Sensor, On-Chip Signal Conditioned, MP3V5004G Temperature Compensated and Series Calibrated 0 to 3.92 kPa (0 to 400 mm H O) 2 0.6 to 3.0 V Output The MP3V5004G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive Typical Applications implanted strain gauge with advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level • Washing Machine Water Level analog output signal that is proportional to the applied pressure. • Ideally Suited for Microprocessor or Features Microcontroller-Based Systems • Temperature Compensated from 10°C to 60°C • Available in Gauge Surface Mount (SMT) Configuration • Durable Thermoplastic (PPS) Package ORDERING INFORMATION Package Case # of Ports Pressure Type Device Name Device Marking Options No. None Single Dual Gauge Differential Absolute Small Outline Package (MP3V5004 Series) MP3V5004GC6U Rail 482A • • MP3V5004G MP3V5004GC6T1 Tape & Reel 482A • • MP3V5004G MP3V5004DP Trays 1351 • • MP3V5004DP MP3V5004GVP Trays 1368 • • MP3V5004GV MP3V5004GP Trays 1369 • • MP3V5004GP SMALL OUTLINE PACKAGES MP3V5004GC6U/6T1 MP3V5004DP MP3V5004GVP MP3V5004GP CASE 482A CASE 1351 CASE 1368 CASE 1369 © Freescale Semiconductor, Inc., 2008, 2010. All rights reserved.

Pressure Operating Characteristics Table1. Operating Characteristics (V = 3.0 Vdc, T = 25°C unless otherwise noted, P1 > P2. S A Characteristic Symbol Min Typ Max Unit Pressure Range POP 0 — 3.92 kPa 400 mm H O 2 Supply Voltage(1) V 2.7 3.0 3.3 V S DC Supply Current I — — 10 mAdc S Span at 306 mm H2O (3 kPa)(2) VFSS — 1.8 — V Offset(3) (4) V 0.45 0.6 0.75 V OFF Sensitivity V/P — 0.6 — V/kPa 5.9 mV/mm H O 2 Accuracy(4) (5) 0 to 100 mm H2O (10 to 60°C) — — — ±1.5 %VFSS 100 to 400 mm H2O (10 to 60°C) — — — ±2.5 %VFSS 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (V ) is defined as the output voltage at the minimum rated pressure. off 4. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Offset Stability: Output deviation, after 1000 temperature cycles, -30° to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 5. Auto-Zero at Factory Installation: Due to the sensitivity of the MP3V5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Auto-zeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ±5°C between auto-zero and measurement. MP3V5004G Sensors 2 Freescale Semiconductor

Pressure Maximum Ratings Table2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) P 16 kPa MAX Storage Temperature TSTG –30 to +100 °C Operating Temperature TA 0 to +85 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. V S 2 Thin Film Gain Stage #2 SEelenmsienngt CToemmppeenrastautrioen aRnedf eGreronucned 4 VOUT and Shift Gain Stage #1 Circuitry 3 Pins 1, 5, 6, 7, and 8 are NO CONNECTS GND Figure1. Fully Integrated Pressure Sensor Schematic MP3V5004G Sensors Freescale Semiconductor 3

Pressure On-chip Temperature Compensation and Calibration The performance over temperature is achieved by from the factory. Contact the factory for information regarding integrating the shear-stress strain gauge, temperature media tolerance in your application. compensation, calibration and signal conditioning circuitry Figure3 shows the recommended decoupling circuit for onto a single monolithic chip. interfacing the output of the MP3V5004G to the A/D input of Figure2 illustrates the gauge configuration in the basic the microprocessor or microcontroller. Proper decoupling of chip carrier (Case 482A). A fluorosilicone gel isolates the die the power supply is recommended. surface and wire bonds from the environment, while allowing Figure4 shows the sensor output signal relative to the pressure signal to be transmitted to the silicon diaphragm. pressure input. Typical, minimum and maximum output The MP3V5004G series sensor operating characteristics curves are shown for operation over a temperature range of are based on the use of dry air as pressure media. Media, 10°C to 60°C using the decoupling circuit shown in Figure3 other than dry air, may have adverse effects on sensor The output will saturate outside of the specified pressure performance and long-term reliability. Internal reliability and range. qualification test for dry air, and other media, are available Fluorosilicone +3 V Die Gel Die Coat Stainless Steel Cap P1 OUTPUT Thermoplas- Vout Wire tic V s Bond IPS Lead Frame 1.0 μF 0.01 μF GND 470 pF P2 Differential Sensing Die Bond Element Figure2. Cross Sectional Diagram SSOP (not to scale) Figure3. Recommended Power Supply Decoupling and Output Filtering. (For additional output filtering, please refer to Application Note AN1646.) 3.0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS VS = 3.0 V ± 0.30 Vdc TEMP = 10 to 60°C 2.0 V) put ( Typical ut O 1.0 Max Min 0.6 2 kPa 4 kPa 200 mm HO 400 mm HO 2 2 Figure4. Output vs. Pressure Differential at ±2.5% V FSS (See Note 5 in Operating Characteristics table) MP3V5004G Sensors 4 Freescale Semiconductor

Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale Semiconductor designates the two sides of the Freescale Semiconductor pressure sensor is designed to pressure sensor as the Pressure (P1) side and the Vacuum operate with positive differential pressure applied, P1 > P2. (P2) side. The Pressure (P1) side is the side containing The Pressure (P1) side may be identified by using the silicone gel which isolates the die from the environment. The table below. Part Number Case Type Pressure (P1) Side Identifier MP3V5004GC6U/T1 482A Side with Port Attached MP3V5004GP 1369 Side with Port Attached MP3V5004DP 1351 Side with Part Marking MP3V5004GVP 1368 Stainless Steel Cap MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGES Surface mount board layout is a critical portion of the total solder reflow process. It is always recommended to fabricate design. The footprint for the semiconductor package must be boards with a solder mask layer to avoid bridging and/or the correct size to ensure proper solder connection interface shorting between solder pads, especially on tight tolerances between the board and the package. With the correct pad and/or tight layouts. geometry, the packages will self-align when subjected to a 0.100 TYP 8X 0.660 2.54 16.76 0.060 TYP 8X 0.300 1.52 7.62 0.100 TYP 8X inch 2.54 mm SCALE 2:1 Figure5. SOP Footprint MP3V5004G Sensors Freescale Semiconductor 5

Pressure PACKAGE DIMENSIONS –A– D8 PL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 4 0.25 (0.010) M T B S A S Y14.5M, 1982. 5 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD N –B– PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. G 8 INCHES MILLIMETERS 1 DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 S B 0.415 0.425 10.54 10.79 W C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 V K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 C S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 H W 0.115 0.125 2.92 3.17 J –T– PIN 1 IDENTIFIER SEATING K M PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MP3V5004G Sensors 6 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 7

Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MP3V5004G Sensors 8 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 9

Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE MP3V5004G Sensors 10 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 11

Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MP3V5004G Sensors 12 Freescale Semiconductor

Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 13

How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Information in this document is provided solely to enable system and software Europe, Middle East, and Africa: implementers to use Freescale Semiconductor products. There are no express or Freescale Halbleiter Deutschland GmbH Technical Information Center implied copyright licenses granted hereunder to design or fabricate any integrated Schatzbogen 7 circuits or integrated circuits based on the information in this document. 81829 Muenchen, Germany +44 1296 380 456 (English) Freescale Semiconductor reserves the right to make changes without further notice to +46 8 52200080 (English) +49 89 92103 559 (German) any products herein. Freescale Semiconductor makes no warranty, representation or +33 1 69 35 48 48 (French) guarantee regarding the suitability of its products for any particular purpose, nor does www.freescale.com/support Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without Japan: limitation consequential or incidental damages. “Typical” parameters that may be Freescale Semiconductor Japan Ltd. provided in Freescale Semiconductor data sheets and/or specifications can and do vary Headquarters in different applications and actual performance may vary over time. All operating ARCO Tower 15F parameters, including “Typicals”, must be validated for each customer application by 1-8-1, Shimo-Meguro, Meguro-ku, customer’s technical experts. Freescale Semiconductor does not convey any license Tokyo 153-0064 Japan under its patent rights nor the rights of others. Freescale Semiconductor products are 0120 191014 or +81 3 5437 9125 not designed, intended, or authorized for use as components in systems intended for support.japan@freescale.com surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product Asia/Pacific: could create a situation where personal injury or death may occur. Should Buyer Freescale Semiconductor China Ltd. purchase or use Freescale Semiconductor products for any such unintended or Exchange Building 23F unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and No. 118 Jianguo Road its officers, employees, subsidiaries, affiliates, and distributors harmless against all Chaoyang District claims, costs, damages, and expenses, and reasonable attorney fees arising out of, Beijing 100022 China directly or indirectly, any claim of personal injury or death associated with such +86 010 5879 8000 unintended or unauthorized use, even if such claim alleges that Freescale support.asia@freescale.com Semiconductor was negligent regarding the design or manufacture of the part. For Literature Requests Only: Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their Fax: +1-303-675-2150 respective owners. LDCForFreescaleSemiconductor@hibbertgroup.com © Freescale Semiconductor, Inc. 2010. All rights reserved. MP3V5004G Rev. 2 06/2010

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: N XP: MPVZ5004GC6U MP3V5004DP MP3V5004GC6T1 MP3V5004GC6U MP3V5004GP MP3V5004GVP MPVZ5004GW6U MPVZ5004G7U MPXV5004GPT1 MPVZ5004G6U MPXV5004GVP MPXV5004GP MPVZ5004GW7U MPXV5004GC7U MPVZ5004G6T1 MPXV5004DP MPXV5004GC6T1 MPXV5004GC6U