MP45DT02 MEMS audio sensor omnidirectional digital microphone Datasheet - production data Description The MP45DT02 is a compact, low-power, to)p- s port, omnidirectional, digital MEMS microphone. ( The MP45DT02 is built with a sensicngt element and an IC interface with stereo cuapability. d The sensing element, capaoble of detecting acoustic waves, is manrufactured using a P specialized silicon micromachining process to produce audio seensors. t e The IC interface is manufactured using a CMOS l o process that allows designing a dedicated circuit s able to provide a digital signal externally in PDM b O format. HLGA (4.72 x 3.76 mm) 6LD - The MP45DT02 has an acoustic overload point of ) 120 dBSPL with a best on the market 61 dB Features s signal-to-noise ratio and -26 dB sensitivity. ( t • Single supply voltage c The MP45DT02 is available in an SMD-compliant • Low power consumption u metal (M) or plastic package and is guaranteed to d • 120 dBSPL acoustic ooverload point operate over an extended temperature range • Omnidirectional sernsitivity from -30 °C to +85 °C. P • PDM single-bit output with option for stereo The MP45DT02’s digital output and package size configuratioen • HLGA epatckage (SMD-compliant) plastic or (1.25 mm thick) make this device the best solution for laptop and portable computing metlal • sECoOPACK®, RoHS, and “Green” compliant applications. b Table 1: Device summary O Applications Order code Temp. range [°C] Package Packing • Mobile terminals HLGA • Laptop and notebook computers MP45DT02 -30 to +85 4.72x3.76 6LD Tray • Portable media players HLGA • VoIP MP45DT02TR -30 to +85 Tape and reel 4.72x3.76 6LD • Speech recognition • A/V eLearning devices HLGA MP45DT02TR-M -30 to +85 Tape and reel • Gaming and virtual reality input devices 4.72x3.76 6LD • Digital still and video cameras • Antitheft systems January 2016 DocID018658 Rev 8 1/15 This is information on a product in full production. www.st.com

Contents MP45DT02 Contents 1 Pin description ................................................................................ 3 2 Acoustic and electrical specifications ........................................... 4 2.1 Acoustic and electrical characteristics ............................................... 4 2.2 Timing characteristics ....................................................................... 5 2.3 Frequency response ......................................................................... 6 3 Sensing element .............................................................................. 7 4 Absolute maximum ratings ............................................................. 8 ) s 5 Functionality .........................................................................(........... 9 t c 5.1 L/R channel selection ...................................................u..................... 9 d 6 Application recommendations ...............................o...................... 10 r P 7 Package information ..................................................................... 11 e 7.1 Soldering information .........................t............................................. 11 e 7.2 HLGA (4.72 x 3.76 mm) 6L (plasotilc) package information ............... 12 s 7.3 HLGA (4.72 x 3.76 mm) 6L b(metal) package information ................ 13 O 8 Revision history ................. ........................................................... 14 - ) s ( t c u d o r P e t e l o s b O 2/15 DocID018658 Rev 8

MP45DT02 Pin description 1 Pin description Figure 1: Pin connections Vdd 6 11 GND DOUT 55 2 LR ) s CLK 44 33 GND t( c u d o r P (BOTTOM VIEW) e t e Table 2: Pin description l o Pin Pin n° s Function name b O 1 GND 0 V supply Left/right channel s-election; ) 2 LR MIC1 LR is cosnnected to GND or Vdd and MIC2 LR is connected to Vdd or GND (see Figur(e 5: "MP45DT02 electrical connections for stereo configuration") t c 3 GND 0 Vu supply d 4 CLK Synchronization input clock o 5 DOrUT Left/right PDM data output P 6 Vdd Power supply e t e l o s b O DocID018658 Rev 8 3/15

Acoustic and electrical specifications MP45DT02 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise noted. Table 3: Acoustic and electrical characteristics Symbol Parameter Test Min. Typ. (1) Max. Unit condition Vdd Supply voltage 1.64 1.8 3.6 V Current consumption in No load on ) Idd 0.65 s mA normal mode data line ( t c Current consumption in IddPdn power-down mode (2) 20 d u µA Scc Short-circuit current 1 o 10 mA r AOP Acoustic overload point P 120 dBSPL So Sensitivity -29 e -26 -23 dBFS t A-weighted e SNR Signal-to-noise ratio l 61 dB @1 kHz, 1 Pa o s Guaranteebd by PSR Power supply rejection designO (3) -70 dBFS Clock Input clock frequency (4) 1 2.4 3.25 MHz - TWK Wake-up time (5) s ) Guaranteed by 10 ms ( design t c Operating temperature Top u -30 +85 °C range d Low olevel logic VIOL P inrput/output voltage Iout = 1 mA -0.3 0.35xVdd V tVIeOH Hinipguht /loeuvtepl ulot gviocl tage Iout = 1 mA 0.65xVdd Vdd+0.3 V e l o Notes: s b (1)Typical specifications are not guaranteed. O (2)Input clock in static mode. (3)Test signal: 217 Hz square wave, 100 mVpp on Vdd pin. (4)Duty cycle: min = 40% max = 60%. (5)Time from the first clock edge to valid output data. Table 4: Distortion specifications Parameter Test condition Value Distortion 100 dBSPL (50 Hz - 4 kHz) < 1% THD + N Distortion 115 dBSPL (1 kHz) < 5% THD + N 4/15 DocID018658 Rev 8

MP45DT02 Acoustic and electrical specifications 2.2 Timing characteristics Table 5: Timing characteristics Parameter Description Min Max Unit fCLK Clock frequency for normal mode 1 3.25 MHz fPD Clock frequency for power-down mode 0.23 MHz TCLK Clock period for normal mode 308 1000 ns TR,EN Data enabled on DATA line, L/R pin = 1 30 (1) ns TR,DIS Data disabled on DATA line, L/R pin = 1 16(1)(2) ns TL,EN Data enabled on DATA line, L/R pin = 0 30(1) ns TL,DIS Data disabled on DATA line, L/R pin = 0 16(1)(2) ns ) s Notes: ( t (1)From design simulations c u (2)In order to measure the disable time, a 1 kΩ pull-down resistor must be added to the DOdUT pin. o r P Figure 2: Timing waveforms e t e l o s b O - ) s ( t c u d o r P e t e l o s b O DocID018658 Rev 8 5/15

Acoustic and electrical specifications MP45DT02 2.3 Frequency response Figure 3: Typical frequency response normalized at 1 kHz ) s ( t c u d o r P e t e l o s b O - ) s ( t c u d o r P e t e l o s b O 6/15 DocID018658 Rev 8

MP45DT02 Sensing element 3 Sensing element The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates. Omron Corporation supplies this element for STMicroelectronics. ) s ( t c u d o r P e t e l o s b O - ) s ( t c u d o r P e t e l o s b O DocID018658 Rev 8 7/15

Absolute maximum ratings MP45DT02 4 Absolute maximum ratings Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 6: Absolute maximum ratings Symbol Ratings Maximum value Unit Vdd Supply voltage -0.3 to 6 V Vin Input voltage on any control pin -0.3 to Vdd +0.3 V TSTG Storage temperature range -40 to +125 s )°C ESD Electrostatic discharge protection 2 (HBM) ( kV t c u d o r P e t e l o s b O - ) s ( t c u d o r P e t e l o s b O 8/15 DocID018658 Rev 8

MP45DT02 Functionality 5 Functionality 5.1 L/R channel selection The L/R digital pad lets the user select the DOUT signal pattern as explained in Table 7: "L/R channel selection". The L/R pin must be connected to Vdd or GND. Table 7: L/R channel selection L/R CLK low CLK high GND Data valid High impedence Vdd High impedence Data valid ) s ( t c u d o r P e t e l o s b O - ) s ( t c u d o r P e t e l o s b O DocID018658 Rev 8 9/15

Application recommendations MP45DT02 6 Application recommendations Figure 4: MP45DT02 electrical connections Vdd 10 µF 100nF 1 6 ) s C ( L/R 2 PVIEW 5 Dout ODE u ct TO C d o CLK 3 4 r P e t e l o Figure 5: MP45DT02 electrical connections for stereo configuration s b O Vdd - 10 µ F ) s 100nF ( t c MICu1 MIC2 d o 1 6 1 6 r P W e t e 2 TOPVIE 5 Dout Vdd 2 TOPVIEW 5 Dout l o 3 4 3 4 s b O CLK CODEC Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as near as possible to pin 6 of the device (common design practice). The L/R pin must be connected to Vdd or GND (refer to Table 7: "L/R channel selection"). 10/15 DocID018658 Rev 8

MP45DT02 Package information 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 Soldering information The HLGA (4.72 x 3.76 x 1.25) mm package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. Landing pattern and soldering recommendations are available at www.st.com. ) s Figure 6: Recommended soldering profile limits ( t c u d o r P e t e l o s b O - ) s ( t c u d o r P Table 8: Recommended soldering profile limits e Description Parameter Pb free t e ol Average ramp rate TL to TP 3 °C/sec max s Preheat b TSMIN 150 °C Minimum temperature O TSMAX 200 °C Maximum temperature tS 60 sec to 120 sec Time (TSMIN to TSMAX) Ramp-up rate TSMAX to TL Time maintained above liquidus temperature tL 60 sec to 150 sec Liquidus temperature TL 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t25 °C) to peak temperature 8 minutes max DocID018658 Rev 8 11/15

Package information MP45DT02 7.2 HLGA (4.72 x 3.76 mm) 6L (plastic) package information Figure 7: HLGA (4.72 x 3.76 mm) 6-lead package outline Pin1indicator A1 N4 E1 //KC K C 2 R1 D 3 1 D N N 1D 1L ) KE s ( t c K E2 E KD 1 N2 u G d * 7 o L2 r P e 8287552_A t e Table 9: HLGA (4.72 x 3.76 mm) 6-leald package mechanical data o s mm. Symbol b Min. O Typ. Max. A1 1.125 - 1.250 1.375 D1 4.67)0 4.720 4.770 s ( D2 t 1.320 c R1 u 0.750 0.840 0.930 d E1 3.710 3.760 3.810 o Er2 1.880 P L1 3.200 3.300 3.400 e t L2 2.250 2.350 2.450 e ol N1 1.550 1.650 1.750 s N2 1.075 1.175 1.275 b O N3 1.350 1.450 1.550 N4 0.865 0.965 1.065 G1 0.810 0.910 1.010 K 0.050 12/15 DocID018658 Rev 8

MP45DT02 Package information 7.3 HLGA (4.72 x 3.76 mm) 6L (metal) package information Figure 8: HLGA (4.72 x 3.76 mm) 6-lead package outline and mechanical data ) s ( t c u d o r P e t e Dimensionsareinmillimeterunlesslotherwisespecified GeneralToleranceis+/-0.15mmunolessotherwisespecified s b OUTERDIMENSIONS O ITEM DIMENSION[mm] TOLERANCE[mm] Length[L] - 4.72 ±0.1 Width[W] ) 3.76 ±0.1 Height[H] s 1.25 ±0.1 ( t c u 8499123_A d o Note: The MEMS microphone metal cap can exhibit some level of variation in color when r the devicPe is subjected to a thermal process. e t e l o s b O DocID018658 Rev 8 13/15

Revision history MP45DT02 8 Revision history Table 10: Document revision history Date Revision Changes 28-Mar-2011 1 Initial release Added max. peak temperature TP to 21-Oct-2011 2 Added min. and max. sensitivity So to Table 3: "Acoustic and electrical characteristics" Document status promoted from preliminary to production data 01-Mar-2012 3 Updated SNR to 61 dB ("Description" and Table 3: "Acoustic and electrical characteristics") ) s 07-May-2012 4 Added VIOL, VIOH to Table 3: "Acoustic and electrical chara(cteristics" t c 05-Jul-2012 5 Added Section 4: "Sensing element" u Added new package "Figure 8: "HLGA (4.72 x 3d.76 mm) 6-lead 21-Mar-2014 6 package outline and mechanical data" o r Updated "Figure 3: Typical frequency rPesponse normalized at 1 17-Jun-2014 7 kHz" e t Added footnote concerning edisable time to Table 5: "Timing 26-Jan-2016 8 characteristics" l o s b O - ) s ( t c u d o r P e t e l o s b O 14/15 DocID018658 Rev 8

MP45DT02 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. ) No license, express or implied, to any intellectual property right is granted by ST herein. s ( ct u Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. d o r P ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. e t e Information in this document supersedes and replaces information previously supplied inl any prior versions of this document. o s b © 2016 STMicroelectronOics – All rights reserved - ) s ( t c u d o r P e t e l o s b O DocID018658 Rev 8 15/15