MP34DT01 MEMS audio sensor omnidirectional digital microphone Datasheet - production data Description The MP34DT01 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. The IC interface is manufactured using a CMOS Features process that allows designing a dedicated circuit • Single supply voltage able to provide a digital signal externally in PDM • Low power consumption format. • 120 dBSPL acoustic overload point The MP34DT01 has an acoustic overload point of • 63 dB signal-to-noise ratio 120 dBSPL with a 63 dB signal-to-noise ratio and • Omnidirectional sensitivity –26 dBFS sensitivity. • –26 dBFS sensitivity • PDM output The MP34DT01 is available in a top-port, SMD- • HCLGA package compliant, EMI-shielded package and is guaranteed to operate over an extended − Top-port design temperature range from -40 °C to +85 °C. − SMD-compliant − EMI-shielded Table 1: Device summary − ECOPACK®, RoHS, and “Green” Temp. compliant Order codes Package Packing range [°C] HCLGA Applications MP34DT01 -40 to +85 (3x4 x1 mm) Tray • Mobile terminals 4LD • Laptop and notebook computers HCLGA • Portable media players Tape MP34DT01TR -40 to +85 (3x4x1 mm) • VoIP and reel 4LD • Speech recognition • A/V eLearning devices • Gaming and virtual reality input devices • Digital still and video cameras • Antitheft systems February 2015 DocID022331 Rev 12 1/20 This is information on a product in full production. www.st.com

Contents MP34DT01 Contents 1 Pin description ................................................................................ 5 2 Acoustic and electrical specifications ........................................... 6 2.1 Acoustic and electrical characteristics ............................................... 6 2.2 Timing characteristics ....................................................................... 7 2.3 Frequency response ......................................................................... 8 3 Carrier tape mechanical specifications ......................................... 9 4 Process recommendations ........................................................... 10 5 Sensing element ............................................................................ 12 6 Absolute maximum ratings ........................................................... 13 7 Functionality .................................................................................. 14 7.1 L/R channel selection ...................................................................... 14 8 Package information ..................................................................... 15 8.1 Soldering information ...................................................................... 15 8.2 HCLGA package information........................................................... 16 9 Revision history ............................................................................ 19 2/20 DocID022331 Rev 12

MP34DT01 List of tables List of tables Table 1: Device summary ........................................................................................................................... 1 Table 2: Pin description .............................................................................................................................. 5 Table 3: Acoustic and electrical characteristics .......................................................................................... 6 Table 4: Distortion specifications ................................................................................................................ 6 Table 5: Timing characteristics ................................................................................................................... 7 Table 6: Frequency response mask for digital microphones ...................................................................... 8 Table 7: Absolute maximum ratings ......................................................................................................... 13 Table 8: L/R channel selection ................................................................................................................. 14 Table 9: Recommended soldering profile limits ........................................................................................ 15 Table 10: HCLGA (3 x 4 x 1 mm) 4-lead package dimensions ................................................................ 17 Table 11: Document revision history ........................................................................................................ 19 DocID022331 Rev 12 3/20

List of figures MP34DT01 List of figures Figure 1: Pin connections ........................................................................................................................... 5 Figure 2: Timing waveforms ....................................................................................................................... 7 Figure 3: Frequency response and mask ................................................................................................... 8 Figure 4: Carrier tape without microphone (top view) ................................................................................. 9 Figure 5: Carrier tape with microphone (top view) ...................................................................................... 9 Figure 6: Recommended picking area ...................................................................................................... 10 Figure 7: Recommended picker design .................................................................................................... 11 Figure 8: Recommended soldering profile limits ...................................................................................... 15 Figure 9: HCLGA (3 x 4 x 1 mm) 4-lead package outline ......................................................................... 16 Figure 10: Land pattern............................................................................................................................. 18 4/20 DocID022331 Rev 12

MP34DT01 Pin description 1 Pin description Figure 1: Pin connections Table 2: Pin description Pin # Pin name Function 1 Vdd Power supply 2 LR Left/Right channel selection 3 CLK Synchronization input clock 4 DOUT Left/Right PDM data output 5 (ground ring) GND 0 V supply DocID022331 Rev 12 5/20

Acoustic and electrical specifications MP34DT01 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise noted. Table 3: Acoustic and electrical characteristics Symbol Parameter Test condition Min. Typ. (1) Max. Unit Vdd Supply voltage 1.64 1.8 3.6 V Current consumption in normal Idd Mean value 0.6 mA mode Current consumption in power- IddPdn down mode (2) 20 µA Scc Short-circuit current 1 10 mA AOP Acoustic overload point 120 dBSPL So Sensitivity -29 -26 -23 dBFS A-weighted at 1 kHz, SNR Signal-to-noise ratio 63 dB 1 Pa PSR Power supply rejection Guaranteed by design -70 dBFS Clock Input clock frequency (3) 1 2.4 3.25 MHz Ton Turn-on time (4) Guaranteed by design 10 ms Top Operating temperature range -40 +85 °C Low-level logic input/output VIOL voltage Iout = 1 mA -0.3 0.35xVdd V High-level logic input/output VIOH voltage Iout = 1 mA 0.65xVdd Vdd+0.3 V Notes: (1)Typical specifications are not guaranteed. (2)Input clock in static mode. (3)Duty cycle: min = 40% max = 60%. (4)Time from the first clock edge to valid output data. Table 4: Distortion specifications Parameter Test condition Value Distortion 100 dBSPL (50 Hz - 4 kHz) < 1% THD + N Distortion 115 dBSPL (1 kHz) < 5% THD + N 6/20 DocID022331 Rev 12

MP34DT01 Acoustic and electrical specifications 2.2 Timing characteristics Table 5: Timing characteristics Parameter Description Min. Max. Unit fCLK Clock frequency for normal mode 1 3.25 MHz fPD Clock frequency for power-down mode 0.23 MHz TCLK Clock period for normal mode 308 1000 ns TR,EN Data enabled on DATA line, L/R pin = 1 18 (1) ns TR,DIS Data disabled on DATA line, L/R pin = 1 16(1) ns TL,EN Data enabled on DATA line, L/R pin = 0 18(1) ns TL,DIS Data disabled on DATA line, L/R pin = 0 16(1) ns Notes: (1)From design simulations Figure 2: Timing waveforms DocID022331 Rev 12 7/20

Acoustic and electrical specifications MP34DT01 2.3 Frequency response Figure 3: Frequency response and mask Table 6: Frequency response mask for digital microphones Frequency / Hz (1) Lower limit Upper limit Unit 100...4000 -2 +2 dBr 1 kHz 4000...10000 -2 +4 dBr 1 kHz Notes: (1)At T = 20 °C and acoustic stimulus = 1 Pa (94 dB SPL) 8/20 DocID022331 Rev 12

MP34DT01 Carrier tape mechanical specifications 3 Carrier tape mechanical specifications Figure 4: Carrier tape without microphone (top view) Figure 5: Carrier tape with microphone (top view) DocID022331 Rev 12 9/20

Process recommendations MP34DT01 4 Process recommendations To ensure a consistent manufacturing process it is strongly advised to comply with the following recommendations: • The recommended pick-up area for the MP34DT01 package must be defined using the worst case (ie. no device alignment during the picking process). This area has been defined considering all the tolerances of the components involved (reel, package, sound inlet). The picker tolerance shall be considered as well. • To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the component on the inlet area • For the package outline please refer to Figure 5: "Carrier tape with microphone (top view)". Nozzle shape, size, and placement accuracy are the other key factors to consider when deciding on the coordinates for picking. • Device alignment before picking is highly recommended. • A vacuum force greater than 7 psi must be avoided • 1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm • All recommended dimensions (device safe-picking area) do not include the pick-and- place equipment tolerances Figure 6: Recommended picking area To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle. The following picker ensures that the holes for the vacuum and the air stream are ALWAYS away from the porthole of the device (4 vacuum ports located at each corner of the device). The recommended nozzle also has a recess, in the form of a cross, which guarantees that the porthole is always left at atmospheric pressure. By using the recommended nozzle, the membrane will not suffer any sudden air disturbances during the picking or placing of the devices in the tape and reel. 10/20 DocID022331 Rev 12

MP34DT01 Process recommendations Figure 7: Recommended picker design DocID022331 Rev 12 11/20

Sensing element MP34DT01 5 Sensing element The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates. Omron Corporation supplies this element for STMicroelectronics. 12/20 DocID022331 Rev 12

MP34DT01 Absolute maximum ratings 6 Absolute maximum ratings Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 7: Absolute maximum ratings Symbol Ratings Maximum value Unit Vdd Supply voltage -0.3 to 6 V Vin Input voltage on any control pin -0.3 to Vdd +0.3 V TSTG Storage temperature range -40 to +125 °C ESD Electrostatic discharge protection 2 (HBM) kV DocID022331 Rev 12 13/20

Functionality MP34DT01 7 Functionality 7.1 L/R channel selection The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 8: "L/R channel selection". The L/R pin must be connected to Vdd or GND. Table 8: L/R channel selection L/R CLK low CLK high GND Data valid High impedance Vdd High impedance Data valid 14/20 DocID022331 Rev 12

MP34DT01 Package information 8 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 8.1 Soldering information The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. Land pattern and soldering recommendations are available at www.st.com. Figure 8: Recommended soldering profile limits Table 9: Recommended soldering profile limits Description Parameter Pb free Average ramp rate TL to TP 3 °C/sec max Preheat TSMIN 150 °C Minimum temperature TSMAX 200 °C Maximum temperature tS 60 sec to 120 sec Time (TSMIN to TSMAX) Ramp-up rate TSMAX to TL Time maintained above liquids temperature tL 60 sec to 150 sec Liquids temperature TL 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t25 °C) to peak temperature 8 minutes max DocID022331 Rev 12 15/20

Package information MP34DT01 8.2 HCLGA package information Figure 9: HCLGA (3 x 4 x 1 mm) 4-lead package outline Note: The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected to thermal processes. 16/20 DocID022331 Rev 12

MP34DT01 Package information Table 10: HCLGA (3 x 4 x 1 mm) 4-lead package dimensions mm Symbol Min. Typ. Max. A 0.90 1.00 1.10 A1 0.00 - 0.05 b 0.35 0.45 0.50 D 3.90 4.00 4.10 D1 3.05 3.10 3.15 D2 3.75 3.80 3.85 D3 0.30 0.50 0.70 E 2.90 3.00 3.10 E1 2.05 2.10 2.15 E2 2.75 2.80 2.85 E3 -0.20 0.00 0.20 e1 1.30 1.35 1.40 e2 0.80 0.85 0.90 h 0.25 0.30 0.35 L 0.90 0.95 1.00 L1 - 0.10 - N 4 R1 0.30 0.40 0.50 R2 - 0.40 - aaa 0.15 ccc 0.10 eee 0.08 DocID022331 Rev 12 17/20

Package information MP34DT01 Figure 10: Land pattern 0.85 1.30 5 GND 3 0. 85 0. 0.40 K R 5 CL L 0.9 D D 0 N N 3 G G 2. T U d O d V D 0.35 GND Pad + solder paste 18/20 DocID022331 Rev 12

MP34DT01 Revision history 9 Revision history Table 11: Document revision history Date Revision Changes 06-Oct-2011 1 Initial release 18-Nov-2011 2 Removed “stereo” from title, Section "Features", and Section "Description" 29-Nov-2011 3 Updated Section "Features" and Section "Description" Updated 04-Jan-2012 4 Added So limits to Table 3: "Acoustic and electrical characteristics" Minor textual updates Updated Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package outline" Pin 1 indicator removed from top view of package on page 1 and Figure 1: "Pin 23-Mar-2012 5 connections" Updated Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package dimensions" Updated maximum supply voltage in Table 3: "Acoustic and electrical 06-Apr-2012 6 characteristics" 07-May-2012 7 Added VIOL, VIOH to Table 3: "Acoustic and electrical characteristics" 18-May-2012 8 Updated Table 5: "Timing characteristics" Added Section 5: "Sensing element" 05-Jul-2012 9 Added Figure 10: "Land pattern" Updated temperature range to -40 to +85 °C throughout datasheet Updated dimension T2 in Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package 21-Feb-2013 10 dimensions" Updated - Figure 3: "Frequency response and mask" - Table 6: "Frequency response mask for digital microphones" - HCLGA mechanical data Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package 07-Jun-2013 11 outline" and Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package dimensions" Added - Section 3: "Carrier tape mechanical specifications" - Section 4: "Process recommendations" Minor textual updates 27-Feb-2015 12 Added note below Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package outline" DocID022331 Rev 12 19/20

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