Effective July 2017 Technical Data 4112 Supersedes March 2007 MP2A MICRO-PAC PLUS™ Low profile toroid power inductors Applications • Mobile phones • Tablets and e-readers • GPS systems • Battery power devices • Notebook and laptop power • Hand held devices • Media players Environmental data SMD Device • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • High performance, low profile, surface (ambient plus self-temperature rise) mount power inductors • Solder reflow temperature: • Small footprint and closed magnetic field J-STD-020 (latest revision) compliant construction ensure low EMI • Low DCR and high efficiency Pb • Frequency range up to 500 kHz • Molybdenum permalloy (MPP) core material

MP2A Technical Data 4112 MICRO-PAC PLUS™ Low profile toroid power inductors Effective July 2017 Product specifications Part Inductance OCL(1) DCR(2) IRMS(3) ISAT(4) Volt(5) Number µH µH±20% typ. (A) (A) µsec (rated) Ω MP2A-R47-R 0.47 0.47 0.024 3.52 5.80 1.20 MP2A-R68-R 0.68 0.68 0.027 3.31 4.83 1.27 MP2A-1R0-R 1.00 1.21 0.067 2.11 3.63 2.00 MP2A-1R5-R 1.50 1.54 0.073 2.02 3.22 2.09 MP2A-2R2-R 2.20 2.30 0.086 1.87 2.64 2.26 MP2A-3R3-R 3.30 3.21 0.098 1.75 2.23 2.42 MP2A-4R7-R 4.70 4.86 0.117 1.60 1.81 2.64 MP2A-6R8-R 6.80 6.85 0.136 1.49 1.53 2.84 MP2A-8R2-R 8.20 8.54 0.167 1.34 1.54 3.15 MP2A-100-R 10.00 10.02 0.179 1.29 1.42 3.26 MP2A-150-R 15.00 15.18 0.217 1.18 1.16 3.59 MP2A-220-R 22.00 21.40 0.311 0.98 0.97 4.30 MP2A-330-R 33.00 32.74 0.476 0.79 0.79 5.32 MP2A-470-R 47.00 46.48 0.727 0.64 0.66 6.57 MP2A-680-R 68.00 68.53 1.108 0.52 0.54 8.11 MP2A-820-R 82.00 81.15 1.463 0.45 0.50 9.32 MP2A-101-R 100.00 99.65 2.015 0.39 0.45 10.94 Notes: (1) Open Circuit Inductance Test Parameters: 100 kHz, .25 Vrms, 0.0 Adc. (4)Peak current for approximately 30% rolloff at +20 °C. (2)DCR limits +20 °C. (5)Applied Volt-Time product (V-µs) across the inductor. This value (3)RMS current for an approximate ∆T of 40 °C without core loss. It is represents the applied V-µs at 300 kHz necessary to generate a core recommended that the temperature of the part not exceed +125 °C. loss equal to 10% of the total losses for 40 °C temperature rise. Dimensions- mm TOP VIEW 1 PCB PAD LAYOUT SIDE VIEW SCHEMATIC 1.05 5.2 1 7.5 YWW MAX 5.88 MAX 5.40 7.50 XXX 1.8 MAX 2 2.00 2 yww = Date Code xxx = Inductance value per family chart Do not route traces or vias underneath the inductor Packaging information- mm Parts packaged on 13" Diameter reel, 3,900 parts per reel. ACTUAL SIZE MICRO-PAC PLUS Ao=5.6mm A1=2.3mm Bo=8.5mm B1=6.3mm Ko=2.1mm 2 www.eaton.com/electronics

MP2A Technical Data 4112 MICRO-PAC PLUS™ Low profile toroid power inductors Effective July 2017 Core loss IRMS DERATING WITH CORE LOSS 0 20 m) 4500 u 60 m xi 70 a m 80 ms( 500KH4z00KHz300KHz200KHz 100KHz Ir 90 m 92 o r 94 f s 95 se 96 s o 97 L of 98 % 99 10 20 30 40 50 60 80 100 200 300 400 500 600 800 1000 % of Applied Volt-µ-seconds Inductance characteristics OCL vs. Isat 100% 90% 80% 70% L C 60% O of 50% % 40% 30% 20% 10% 0% 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100%110%120%130%140%150%160% %ofIsat www.eaton.com/electronics 3

MP2A Technical Data 4112 MICRO-PAC PLUS™ Low profile toroid power inductors Effective July 2017 Solder Reflow Profile TP TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Max. Ramp Down Rate = 6°C/s Package mm3 mm3 Thickness <350 >_350 TL <2.5mm 235°C 220°C Preheat t A >_2.5mm 220°C 220°C e Tsmax atur TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) per Volume Volume Volume Tem Tsmin ts Package mm3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak (cid:129)Temperature min.(Tsmin) 100°C 150°C (cid:129)Temperature max.(Tsmax) 150°C 200°C (cid:129)Time (Tsminto Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmaxto Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tpto Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. *Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Compan. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injuy to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4112 All other trademarks are property July 2017 of their respective owners.