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M February 1984 M Revised May 2005 7 4 H C T MM74HCT240 (cid:127) MM74HCT244 2 4 0 Inverting Octal 3-STATE Buffer (cid:127) Octal 3-STATE Buffer • M M General Description The MM74HCT240 is an inverting buffer and the 7 MM74HCT244 is a non-inverting buffer. Each device has 4 The MM74HCT240 and MM74HCT244 3-STATE buffers two active low enables (1G and 2G), and each enable inde- H utilize advanced silicon-gate CMOS technology and are pendently controls 4 buffers. C general purpose high speed inverting and non-inverting T All inputs are protected from damage due to static dis- buffers. They possess high drive current outputs which 2 enable high speed operation even when driving large bus charge by diodes to VCC and Ground. 4 4 ctoa plaocwit apnocwees.r TShcehsoett kcyir cdueitvsi caecsh, iewvhei les preeetdasin icnogm tphaer albolwe Features In v power consumption of CMOS. All three devices are TTL (cid:1) TTL input compatible e input compatible and have a fanout of 15 LS-TTL equiva- r (cid:1) Typical propagation delay: 14 ns t lMenMt 7in4pHuCtsT. devices are intended to interface between TTL (cid:1) 3-STATE outputs for connection to system buses ing and NMOS components and standard CMOS devices. (cid:1) Low quiescent current: 80 PA O These parts are also plug-in replacements for LS-TTL (cid:1) High output drive current: 6 mA (min) c devices and can be used to reduce power consumption in ta existing designs. l 3 - S T Ordering Code: A T E Order Number Package Number Package Description B MM74HCT240WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide u MM74HCT240SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide ff e MM74HCT240MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide r MM74HCT240N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide (cid:127) O MM74HCT244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide c t a MM74HCT244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide l MM74HCT244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 3 - S MM74HCT244N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide T Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. A T Connection Diagrams E B Pin Assignments for DIP, SOIC, SOP and TSSOP u f f e r Top View Top View MM74HCT240 MM74HCT244 © 2005 Fairchild Semiconductor Corporation DS005365 www.fairchildsemi.com

4 4 2 T C Truth Tables H 4 MM74HCT240 MM74HCT244 7 M 1G 1A 1Y 2G 2A 2Y 1G 1A 1Y 2G 2A 2Y M L L H L L H L L L L L L (cid:127) 0 L H L L H L L H H L H H 4 2 H L Z H L Z H L Z H L Z T C H H Z H H Z H H Z H H Z H 4 H HIGH Level L LOW Level Z High Impedance 7 M M Logic Diagrams MM74HCT240 MM74HCT244 www.fairchildsemi.com 2

M Absolute Maximum Ratings(Note 1) Recommended Operating M (Note 2) Conditions 74 H Supply Voltage (VCC) (cid:16)0.5 to (cid:14)7.0V Min Max Units C DC Input Voltage (VIN) (cid:16)1.5 to VCC (cid:14)1.5V Supply Voltage (VCC) 4.5 5.5 V T2 DC Output Voltage (VOUT) (cid:16)0.5 to VCC (cid:14)0.5V DC Input or Output Voltage 0 VCC V 40 Clamp Diode Current (IIK, IOK) r20 mA (VIN, VOUT) (cid:127) DC Output Current, per pin (IOUT) r35 mA Operating Temperature Range (TA) (cid:16)40 (cid:14)85 qC M DC VCC or GND Current, per pin (ICC) r70 mA Input Rise or Fall Times M Storage Temperature Range (TSTG) (cid:16)65qC to (cid:14)150qC (tr, tf) 500 ns 74 Power Dissipation (PD) Note 1: Absolute Maximum Ratings are those values beyond which dam- H (Note 3) 600 mW age to the device may occur. C T Note 2: Unless otherwise specified all voltages are referenced to ground. S.O. Package only 500 mW 2 Note 3: Power Dissipation temperature derating — plastic “N” package: (cid:16) 4 Lead Temperature (TL) 12 mW/qC from 65qC to 85qC. 4 (Soldering 10 seconds) 260qC DC Electrical Characteristics VCC 5V r10% (unless otherwise specified) TA 25qC TA (cid:16)40 to 85qC TA (cid:16)55q to 125qC Symbol Parameter Conditions Units Typ Guaranteed Limits VIH Minimum HIGH Level 2.0 2.0 2.0 V Input Voltage VIL Maximum LOW Level 0.8 0.8 0.8 V Input Voltage VOH Minimum HIGH Level VIN-EE VIH or VIL Output Voltage |IOUT| 20 PA VCC VCC(cid:16)0.1 VCC(cid:16)0.1 VCC(cid:16)0.1 V |IOUT| 6.0 mA, VCC 4.5V 4.2 3.98 3.84 3.7 V |IOUT| 7.2 mA, VCC 5.5V 5.2 4.98 4.84 4.7 V VOL Maximum LOW Level VIN VIH or VIL Voltage |IOUT| 20 PA 0 0.1 0.1 0.1 V |IOUT| 6.0 mA, VCC 4.5V 0.2 0.26 0.33 0.4 V |IOUT| 7.2 mA, VCC 5.5V 0.2 0.26 0.33 0.4 V IIN Maximum Input VIN VCC or GND, r0.05 r0.5 r1.0 PA Current VIH or VIL IOZ Maximum 3-STATE VOUT VCC or GND r0.25 r2.5 r10 PA Output Leakage G VIH Current G VIL ICC Maximum Quiescent VIN VCC or GND 4.0 40 160 PA Supply Current IOUT 0 PA VIN 2.4V or 0.5V (Note 4) 0.6 1.0 1.3 1.5 mA Note 4: Measured per input. All other inputs at VCC or GND. 3 www.fairchildsemi.com

4 4 AC Electrical Characteristics 2 T C MM74HCT240, MM74HCT244 VCC 5.0V, tr tf 6 ns, TA 25qC (unless otherwise specified) H Guaranteed Symbol Parameter Conditions Typ Units 4 Limits 7 M tPHL, tPLH Maximum Output CL 45 pF 14 18 ns M Propagation Delay tPZL, tPZH Maximum Output CL 45 pF 20 30 ns (cid:127) 0 Enable Time RL 1 k: 4 2 tPLZ, tPHZ Maximum Output CL 5 pF 16 25 ns CT Disable Time RL 1 k: H AC Electrical Characteristics 4 7 M MM74HCT240, MM74HCT244 VCC 5.0V r 10%, tr tf 6 ns (unless otherwise specified) M TA 25qC TA (cid:16)40 to 85qC TA (cid:16)55q to 125qC Symbol Parameter Conditions Units Typ Guaranteed Limits tPHL, tPLH Maximum Output CL 50 pF 14 20 25 30 ns Propagation Delay CL 150 pF 20 28 35 42 ns tPZH, tPZL Maximum Output RL 1 k: CL 50 pF 21 30 38 45 ns Enable Time CL 150 pF 26 42 53 63 ns tPHZ, tPLZ Maximum Output RL 1 k: 16 25 32 38 ns Disable Time CL 50 pF tTHL, tTLH Maximum Output CL 50 pF 6 12 15 18 ns Rise and Fall Time CIN Maximum Input 10 15 15 15 pF Capacitance COUT Maximum Output 15 20 20 20 pF Capacitance CPD Power Dissipation (per buffer) Capacitance (Note 5) G VCC, G GND 5 pF G GND, G VCC 90 pF Note 5: CPD determines the no load dynamic power consumption, PD CPD VCC2 f (cid:14) ICC VCC, and the no load dynamic current consumption, IS CPD VCC f (cid:14) ICC. www.fairchildsemi.com 4

M Physical Dimensions inches (millimeters) unless otherwise noted M 7 4 H C T 2 4 0 (cid:127) M M 7 4 H C T 2 4 4 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M20B 5 www.fairchildsemi.com

4 4 Physical Dimensions 2 inches (millimeters) unless otherwise noted (Continued) T C H 4 7 M M (cid:127) 0 4 2 T C H 4 7 M M 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D www.fairchildsemi.com 6

M Physical Dimensions inches (millimeters) unless otherwise noted (Continued) M 7 4 H C T 2 4 0 (cid:127) M M 7 4 H C T 2 4 4 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 7 www.fairchildsemi.com

r e Physical Dimensions f inches (millimeters) unless otherwise noted (Continued) f u B E T A T S - 3 l a t c O (cid:127) r e f f u B E T A T S - 3 l a t c O g n 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide ti Package Number N20A r e v n I 4 4 2 T C H 4 7 M M (cid:127) 0 4 2 T C H 4 7 M M Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support which, (a) are intended for surgical implant into the device or system whose failure to perform can be rea- body, or (b) support or sustain life, and (c) whose failure sonably expected to cause the failure of the life support to perform when properly used in accordance with device or system, or to affect its safety or effectiveness. instructions for use provided in the labeling, can be rea- sonably expected to result in a significant injury to the www.fairchildsemi.com user. www.fairchildsemi.com 8

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: MM74HCT244WMX MM74HCT244WM MM74HCT244SJ MM74HCT244MTC MM74HCT244SJX MM74HCT244N MM74HCT244MTCX